CN201435405Y - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN201435405Y CN201435405Y CN2009200150037U CN200920015003U CN201435405Y CN 201435405 Y CN201435405 Y CN 201435405Y CN 2009200150037 U CN2009200150037 U CN 2009200150037U CN 200920015003 U CN200920015003 U CN 200920015003U CN 201435405 Y CN201435405 Y CN 201435405Y
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- Prior art keywords
- led
- colloid layer
- fluorescent powder
- encapsulating structure
- packaging structure
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Abstract
The utility model discloses an LED packaging structure, which comprises a substrate (2), an LED chip (3), a colloid layer (4) encapsulated on top of the LED chip (3), and a fluorescent powder colloidlayer (5) encapsulated on top of the colloid layer (4). The high power LED packaging structure brings that the LED product does not generate light spots, achieves highly promoted light flux, is not easy to pollute, has uniform light colour and is stable in the manufacturing process.
Description
Technical field
The utility model relates to the LED encapsulation field, particularly the encapsulating structure of a kind of LED.
Background technology
Tradition multicore sheet white light encapsulating structure, as shown in Figure 1, comprising: substrate, led chip, the led chip top is encapsulation phosphor gel 1 (being the mixture of colloid and fluorescent material) directly.There is following shortcoming in this encapsulating structure: there is hot spot in (1); Because the luminous intensity difference of each angle of led chip, and phosphor gel is directly filled and is made the fluorescent material concentration unanimity of each angle, and not matching with LED blue chip lighting angle causes product blue hot spot of appearance in the stronger zone of LED blue chip luminous intensity.(2) luminous flux is not high, because directly the embedding phosphor gel makes that the thickness of fluorescent colloid is too high, the light phase mutual interference that between the fluorescent powder grain it is inspired causes the luminous efficiency of fluorescent material to reduce.(3) it is wayward to be subjected to polluting (because phosphor gel directly contacts with extraneous) (4) manufacturing process easily, unstable product quality, because direct embedding fluorescent powder colloid, the injecting glue amount of fluorescent powder colloid there are differences in process of production and be that colour temperature is inconsistent because of phosphor gel exists deposited phenomenon to cause the photochromic of product.
The utility model content
In order to overcome above-mentioned the deficiencies in the prior art, the utility model provides the encapsulating structure of a kind of LED, comprising: substrate 2, and led chip 3, described led chip 3 tops encapsulation colloid layer 4, described colloid layer 4 tops encapsulate a fluorescent powder colloid layer 5.
Described fluorescent powder colloid layer 5 top encapsulate a transparent optical layer 6.
Described fluorescent powder colloid layer 5 is a fluorescent powder colloid thin slice.
Described colloid layer 4 adopts silica gel or epoxy resin to make.
Advantage of the present utility model is:
1, by using the encapsulating structure of the LED that the utility model provides, the LED product does not have hot spot and produces.
2, by using the encapsulating structure of the LED that the utility model provides, the luminous flux of LED product has very big lifting.
3, by using the encapsulating structure of the LED that the utility model provides, the LED product is not vulnerable to pollute.
4, by using the encapsulating structure of the LED that the utility model provides, the LED product is photochromic evenly, and manufacture process is stable.
Description of drawings
Fig. 1 is a prior art LED encapsulating structure;
Fig. 2 is the encapsulating structure of the utility model specific embodiment LED.
The accompanying drawing sign
1 phosphor gel, 2 substrate 3LED chips, 4 colloid layers, 5 fluorescent powder colloid layers, 6 transparent optical layer
Embodiment
Below in conjunction with a specific embodiment and accompanying drawing a minute utility model is made a detailed explanation.
The encapsulating structure of a kind of LED that present embodiment provides as Fig. 2, comprising: substrate 2, and led chip 3, described led chip 3 tops encapsulation colloid layer 4, described colloid layer 4 tops encapsulate a luminescent coating 5.Described fluorescent powder colloid layer 5 top encapsulate a transparent optical layer 6.Described fluorescent powder colloid layer 5 is a fluorescent powder colloid thin slice.Described colloid layer 4 adopts silica gel or epoxy resin to make.
By using the encapsulating structure of the LED that this implementation column provides, the LED product does not have hot spot and produces; Luminous flux has very big lifting; Be not vulnerable to pollute; Photochromic even, manufacture process is stable.
Claims (4)
1, the encapsulating structure of a kind of LED comprises: substrate (2), and led chip (3),
It is characterized in that led chip (3) top encapsulation colloid layer (4), described colloid layer (4) top encapsulation one fluorescent powder colloid layer (5).
2, encapsulating structure according to claim 1 is characterized in that, described fluorescent powder colloid layer (5) top encapsulation one transparent optical layer (6).
3, encapsulating structure according to claim 1 and 2 is characterized in that, described fluorescent powder colloid layer (5) is a fluorescent powder colloid thin slice.
4, encapsulating structure according to claim 1 and 2 is characterized in that, described colloid layer (4) adopts silica gel or epoxy resin to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200150037U CN201435405Y (en) | 2009-06-29 | 2009-06-29 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200150037U CN201435405Y (en) | 2009-06-29 | 2009-06-29 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201435405Y true CN201435405Y (en) | 2010-03-31 |
Family
ID=42054221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200150037U Expired - Fee Related CN201435405Y (en) | 2009-06-29 | 2009-06-29 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201435405Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power light emitting diode (LED) bracket and method for packaging LEDs by using same |
| CN104966775A (en) * | 2015-07-07 | 2015-10-07 | 宏齐光电子(深圳)有限公司 | White light LED and white light LED manufacturing method |
-
2009
- 2009-06-29 CN CN2009200150037U patent/CN201435405Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097573A (en) * | 2010-12-03 | 2011-06-15 | 东莞市胤腾光电科技有限公司 | High-power light emitting diode (LED) bracket and method for packaging LEDs by using same |
| CN104966775A (en) * | 2015-07-07 | 2015-10-07 | 宏齐光电子(深圳)有限公司 | White light LED and white light LED manufacturing method |
| CN104966775B (en) * | 2015-07-07 | 2020-01-21 | 宏齐光电子(深圳)有限公司 | White light LED and white light LED manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20100827 Address after: 116300 Liaoning city in Dalian Province, the western suburbs of Wafangdian City City Industrial Park nineo-nine Park Patentee after: Dalian Nineo-Nine Manufacture Co., Ltd. Address before: 116300 Liaoning city in Dalian Province, the western suburbs of Wafangdian City City Industrial Park nineo-nine Park Patentee before: Dalian Nineo-Nine Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100331 Termination date: 20140629 |
|
| EXPY | Termination of patent right or utility model |