CN209169140U - New energy automobile power copper base plate - Google Patents
New energy automobile power copper base plate Download PDFInfo
- Publication number
- CN209169140U CN209169140U CN201821738009.2U CN201821738009U CN209169140U CN 209169140 U CN209169140 U CN 209169140U CN 201821738009 U CN201821738009 U CN 201821738009U CN 209169140 U CN209169140 U CN 209169140U
- Authority
- CN
- China
- Prior art keywords
- copper
- micro
- channel
- heat pipe
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010949 copper Substances 0.000 title claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 14
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000002791 soaking Methods 0.000 claims abstract description 13
- 238000013461 design Methods 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 229910000906 Bronze Inorganic materials 0.000 claims description 7
- 239000010974 bronze Substances 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 7
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000010426 asphalt Substances 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 208000030208 low-grade fever Diseases 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 3
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000005323 electroforming Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a new energy automobile power copper base plate, including aluminium nitride base plate and the little heat pipe of silicon copper, the last fixed surface of aluminium nitride base plate installs the epoxy board, the both sides of epoxy board all are provided with the little heat pipe of silicon copper, the lower part of the little heat pipe of silicon copper is connected with the surface of aluminium nitride base plate, the upper portion of epoxy board sets up the copper apron, be provided with the power groove on the inner wall of copper apron, the little heat pipe of silicon copper includes silicon substrate and air chamber, the upper portion of silicon substrate is provided with the air chamber, be provided with horizontal microchannel and vertical microchannel on the upper surface of silicon substrate, cross design between horizontal microchannel and the vertical microchannel, the surface of air chamber still is provided with the soaking copper apron, and the device utilizes the inside parallel water conservancy diversion structure of soaking copper apron can reduce the equilibrium temperature of little heat pipe, meanwhile, the temperature difference between the connecting plates is reduced, the temperature uniformity is improved, and the service life of a power supply device is prolonged.
Description
Technical field
The utility model relates to new-energy automobile field, specially a kind of new-energy automobile power supply copper base.
Background technique
For example, patent name is that a kind of COB thermoelectricity separates the practical of compound copper base application No. is 201720516529.8
New patent:
Its substrate body is a kind of copper component with high thermal conductivity effect, is provided with positive pole connector on wiring board
With power cathode connector, solder mask is by electric heating welding line road plate, and temperature is lower when use, and power consumption is few, no chemical component
Volatilization, energy conservation and environmental protection, light stability, intensity are high.
But existing new-energy automobile power supply copper base has the following deficiencies:
(1) existing to be used for new-energy automobile power supply copper base, base material is epoxy resin, the thermal conductivity of organic material
Rate is low, and heat-resisting quantity is poor, does not adapt to high density, high-power encapsulation requirement, is normally only used in small-power encapsulation；
(2) existing power supply copper base thermal conductivity is poor, and the main heat sink channel on surface limits the quick biography of heat
It leads and spreads and it is necessary to very high heat is handled in the encapsulation of very little, package cooling is bad, and chip temperature can be made to increase,
Cause stress distribution unevenness, photoelectric conversion rate to reduce, shortens the working life of power supply apparatus.
Summary of the invention
In order to overcome the shortcomings of prior art, the utility model provides a kind of new-energy automobile power supply copper base, energy
The problem of effective solution background technique proposes.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of new-energy automobile power supply copper base, including aluminium nitride substrate and copper silicon micro heat pipe, the aluminium nitride substrate
Upper surface is fixedly installed with epoxy resin board, and the two sides of the epoxy resin board are provided with copper silicon micro heat pipe, and the copper silicon is micro-
The lower part of heat pipe is connected with the surface of aluminium nitride substrate, and copper cover board, the copper cover board is arranged in the top of the epoxy resin board
Inner wall on be provided with power slot, the copper silicon micro heat pipe includes silicon substrate and air chamber, and the top of the silicon substrate is provided with
Air chamber, is provided with laterally micro- channel and longitudinal micro- channel on the upper surface of the silicon substrate, the micro- channel of the transverse direction and longitudinal direction
The intersection of cross-over design between micro- channel, the micro- channel of transverse direction and longitudinal micro- channel is provided with casting in bronze plate, the casting in bronze
The inside of air chamber is arranged in plate, and the outer surface of the air chamber is additionally provided with soaking copper cover board.
Further, the micro- channel of the transverse direction and longitudinal micro- channel are all made of cavity structure design.
Further, parallel channel structure is set on the inner wall of the soaking copper cover board, and 500 μm of ditch road width, structure is wide by 500
μm。
Further, the inside of the silicon substrate uses trapezoidal channel structure.
Compared with prior art, the utility model has the beneficial effects that
(1) the new-energy automobile power supply copper base of the utility model is inhaled using the capillary of microelectroforming technology production minute yardstick
Wick-containing structure, and plate is designed according to the principle of the package dimension of power supply mould group, the transporting direction of hot-fluid and reduction interface resistance
The macro-size of heat pipe, can be with advantage easy to process, energy using the superior thermal conductivity that red copper cover board can give full play to copper
Multilayered structure is enough made, the unmanageable capillary dimensions of conventional method can be processed；
(2) the new-energy automobile power supply copper base of the utility model, using the flow-guiding structure of soaking copper cover board interior parallel
It can reduce the equilibrium temperature of micro heat pipe, while reducing the temperature difference between connecting plate, improve uniform temperature, extend power supply apparatus
Service life.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the copper silicon micro heat pipe structural schematic diagram of the utility model；
Fig. 3 is the silicon substrate structural schematic diagram of the utility model.
Figure label:
1- aluminium nitride substrate；2- epoxy resin board；3- copper silicon micro heat pipe；4- copper cover board；5- power slot；
301- silicon substrate；302- casting in bronze plate；303- air chamber；304- soaking copper cover board；
The lateral micro- channel of 30101-；The longitudinal micro- channel of 30102-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1 to Figure 3, the utility model provides a kind of new-energy automobile power supply copper base, including aluminum-nitride-based
Plate 1 and copper silicon micro heat pipe 3, the upper surface of aluminium nitride substrate 1 are fixedly installed with epoxy resin board 2, and the two sides of epoxy resin board 2 are equal
Be provided with copper silicon micro heat pipe 3, the lower part of copper silicon micro heat pipe 3 is connected with the surface of aluminium nitride substrate 1, epoxy resin board 2 it is upper
Copper cover board 4 is arranged in portion, is provided with power slot 5 on the inner wall of copper cover board 4.
In the present embodiment, Heat Conduction Material using aluminium nitride substrate 1 as power supply copper base, mechanical strength be can serve as
Good for support member, processability, dimensional accuracy is high；Surface is smooth, non-microcracked, bending etc.；Thermal coefficient is big, thermal expansion coefficient
Match with chip materials such as Si and GaAs, heat resistance is good；Dielectric constant is low, and dielectric loss is small, insulation resistance and insulation
It is high to destroy electricity, performance is stablized under high temperature, high humidity, high reliablity；Chemical stability is good, no hygroscopicity；Oil resistant, resistance toization
Learn drug；It is nontoxic, nuisanceless, alpha ray discharging amount is small；Crystal structure is stablized, and is not susceptible to change in use temperature range；It is former
Rich material resources.
In the present embodiment, 3 composing base of aluminium nitride substrate 1 and copper silicon micro heat pipe has high heat conductance, high intensity, high electricity
Resistance rate, density it is small and with the excellent properties such as the thermal expansion coefficient that matches.
Copper silicon micro heat pipe 3 includes silicon substrate 301 and air chamber 303, and the inside of silicon substrate 301 uses trapezoidal channel structure,
The top of silicon substrate 301 is provided with air chamber 303, and laterally micro- channel 30101 and longitudinal direction are provided on the upper surface of silicon substrate 301
Micro- channel 30102, laterally cross-over design between micro- channel 30101 and longitudinal micro- channel 30102, laterally micro- channel 30101 and vertical
The intersection of micro- channel 30102 is provided with casting in bronze plate 302, the inside of air chamber 303, air chamber is arranged in casting in bronze plate 302
303 outer surface is additionally provided with soaking copper cover board 304, and laterally micro- channel 30101 and longitudinal micro- channel 30102 are all made of cavity knot
Structure designs, and parallel channel structure is arranged on the inner wall of soaking copper cover board 304,500 μm of ditch road width, structure is 500 μm wide.
In the present embodiment, copper silicon micro heat pipe 3 is made of silicon substrate 301 and 304 two parts of soaking copper cover board, and material can be the same as can
Different, the two is packaged into closed air chamber 303 by the methods of splicing or bonding, and copper silicon micro heat pipe 3 is without traditional suction
Wick-containing, the capillary pressure difference generated after contacting capillary structure using the working medium under minute yardstick is as the power of reflux, working medium and micro- knot
The contact property of structure material, micro-structure can all flow back to influence degree of working medium meniscus radius etc. to working medium and generate significant shadow
It rings, influences the suction exchange capability of heat of heat pipe evaporator section, the influence for despumation particle to micro heat pipe hot property, micro heat pipe indirectly
The vacuum degree for needing heat pipe air chamber to reache a certain level when perfusion guarantees without incoagulable gas.
In the present embodiment, single layer capillary laterally micro- channel 30101 and longitudinal micro- channel are made using micro- electrocasting method
30102, due to the up rightness of photoresist exposure, leading to cross sectional shape is meniscus rectangle.
In the present embodiment, silicon substrate 301 uses chromium plate film mask, and figure minimum differentiates 8 μm of line width；Pattern uses SU-8
Negative photoresist production, 20 μm of minimum exposure line width；Micro- electrotyping forming guarantee structural intergrity and the line width of uniformity are not
Preferably less than 50 μm, comprehensively considering the limitation of technique, we select 50 μm as minimum channel line width, and maximum target glue is 20 μm thick,
Depth-to-width ratio is close to 4.
In the present embodiment, setting silicon substrate 301 having a size of 40mm × 20mm, micro- channel structure size range be 34mm ×
14mm, two sides respectively stay 3mm surplus for encapsulating, and negative photoresist is more conducive to make big depth or deep width relative to positive photoresist
Bigger structure, electroforming depth is relatively large, and selection makes electroforming pattern using negtive photoresist SU-8, and 200 μm of thickness, it is heavy to be higher than
Lamination thickness, prevented plating.
In the present embodiment, soaking copper cover board 304 only designs a kind of cavity structure, because micro- soaking plate is longitudinal heat transfer, because
The inner surface structure of this cover board is designed as lattice structure, and structure promotes droplets form drop in addition to water conservancy diversion can also provide on copper cover board
The wedge angle fallen.
In the present embodiment, using the capillary wick structure of microelectroforming technology production minute yardstick, and according to power supply mould group
The macro-size of the principle design flat-plate heat pipe of package dimension, the transporting direction of hot-fluid and reduction interface resistance, uses silicon base
It is to make electroforming pattern for the ease of use MEMS approach, while being convenient for making electrode according to power supply chip specifications design；Using
The superior thermal conductivity that red copper cover board can give full play to copper can be with advantage easy to process；The advantage of micro- electroforming is the micro- ruler of structure
Very little controllable, pattern can design according to demand, can make multilayered structure, can process the unmanageable capillary dimensions of conventional method
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (4)
1. a kind of new-energy automobile power supply copper base, including aluminium nitride substrate (1) and copper silicon micro heat pipe (3), it is characterised in that: institute
The upper surface for stating aluminium nitride substrate (1) is fixedly installed with epoxy resin board (2), and the two sides of the epoxy resin board (2) are respectively provided with
Have copper silicon micro heat pipe (3), the lower part of the copper silicon micro heat pipe (3) is connected with the surface of aluminium nitride substrate (1), the asphalt mixtures modified by epoxy resin
Copper cover board (4) are arranged in the top of rouge plate (2), are provided with power slot (5) on the inner wall of the copper cover board (4), the copper silicon low-grade fever
Managing (3) includes silicon substrate (301) and air chamber (303), and the top of the silicon substrate (301) is provided with air chamber (303), described
Laterally micro- channel (30101) and longitudinal micro- channel (30102), the micro- ditch of transverse direction are provided on the upper surface of silicon substrate (301)
Cross-over design between road (30101) and longitudinal micro- channel (30102), the micro- channel of transverse direction (30101) and longitudinal micro- channel
(30102) intersection is provided with casting in bronze plate (302), and the casting in bronze plate (302) is arranged in the inside of air chamber (303), institute
The outer surface for stating air chamber (303) is additionally provided with soaking copper cover board (304).
2. a kind of new-energy automobile power supply copper base according to claim 1, it is characterised in that: the micro- channel of transverse direction
(30101) and longitudinal micro- channel (30102) is all made of cavity structure design.
3. a kind of new-energy automobile power supply copper base according to claim 1, it is characterised in that: the soaking copper cover board
(304) parallel channel structure is set on inner wall, and 500 μm of ditch road width, structure is 500 μm wide.
4. a kind of new-energy automobile power supply copper base according to claim 1, it is characterised in that: the silicon substrate (301)
Inside use trapezoidal channel structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821738009.2U CN209169140U (en) | 2018-10-25 | 2018-10-25 | New energy automobile power copper base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821738009.2U CN209169140U (en) | 2018-10-25 | 2018-10-25 | New energy automobile power copper base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209169140U true CN209169140U (en) | 2019-07-26 |
Family
ID=67335087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821738009.2U Expired - Fee Related CN209169140U (en) | 2018-10-25 | 2018-10-25 | New energy automobile power copper base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209169140U (en) |
-
2018
- 2018-10-25 CN CN201821738009.2U patent/CN209169140U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190726 Termination date: 20211025 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |