CN107191796A - A kind of great power LED cooling lamp and a kind of preparation method of non-homogeneous wetability patterned surface - Google Patents

A kind of great power LED cooling lamp and a kind of preparation method of non-homogeneous wetability patterned surface Download PDF

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Publication number
CN107191796A
CN107191796A CN201710450605.4A CN201710450605A CN107191796A CN 107191796 A CN107191796 A CN 107191796A CN 201710450605 A CN201710450605 A CN 201710450605A CN 107191796 A CN107191796 A CN 107191796A
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super
heat pipe
great power
power led
led
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CN107191796B (en
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蒋翔
黄鹏
朱琦
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South China University of Technology SCUT
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South China University of Technology SCUT
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a kind of great power LED cooling lamp and a kind of preparation method of non-homogeneous wetability patterned surface, the LED thermal louvers include gravity force heat pipe radiator, LED line base board and LED light source module.Wherein gravity force heat pipe radiator includes the condensation segment on top and the evaporator section of bottom.Condensation segment includes heat pipe, trapezoidal fin and cover plate.With cover plate bottom surface through super-hydrophobic processing on the inside of heat pipe, with superhydrophobic characteristic.Evaporator section is cylindrical cavity, and cavity floor is connected with LED line base board by bolt, and heat-exchange working medium is filled with cavity, and cavity floor surface is handled through non-homogeneous wetability, is divided into super-hydrophobic region and super hydrophilic region, and the super-hydrophobic region is radial.LED thermal louvers of the present invention are simple in construction, fast response time, and heat-sinking capability is strong, effectively high-powered LED lamp can be maintained to run at normal temperatures, strengthen its luminous efficiency and increase the service life.

Description

A kind of great power LED cooling lamp and a kind of system of non-homogeneous wetability patterned surface Preparation Method
Technical field
The invention belongs to technical field of LED illumination, and in particular to a kind of great power LED cooling lamp and a kind of non-homogeneous wetting The preparation method of property patterned surface.
Background technology
New Solid lighting source LED（Light Emitting Diode）It is all with energy-conserving and environment-protective, service life length etc. Many advantages, are acknowledged as forth generation lighting source.LED illumination is applied and prospect of industrial development is tempting, but LED will be realized really greatly Scale extensive use, still has many problems to need solution, radiating is exactly one of one of difficult point, key and key problem.Mesh Preceding LED photoelectric transformation efficiency is also relatively poor, and only 10%~15% input electric energy is converted into luminous energy, remaining 85%~90% energy Amount is mainly converted into heat energy in the form of the lattice vibration that non-radiative recombination occurs, and raises LED temperature, and the rise meeting of temperature Produce following harmful effect：Luminous intensity reduction, luminous dominant wavelength skew, serious reduction LED life-span, accelerate LED light decay Deng.Therefore the performance and its reliability of LED product, whether be heavily dependent on has good heat dissipation design, low thermal resistance, Radiating is well future developing trend and the important embodiment of product competitiveness of great power LED.
Gravity assisted heat pipe technology has just occurred early in decades ago, and its basic functional principle is：Filled out in closed heat pipe The heat-exchange working medium filled in a certain amount of low boiling heat-exchange working medium, pipe absorbs the heat that bottom is transmitted, and Temperature of Working is raised and vaporized For steam, the steam of vaporization is assembled at liquid level makes pressure rise at liquid level, and steam rises to the upper of heat pipe under differential pressure action End is condensation segment part, and steam in condensation segment condensation release latent heat and passes to the external world, steam itself condensation liquefaction, condensation by heat pipe Liquid is back to heated evaporator section along heat pipe inner wall under gravity, and participates in heat absorption again, so moves in circles, by changing The continuous phase transistion of hot working fluid, is constantly transferred to condensation segment by the evaporator section of high temperature by heat and is then passed to the external world.By then passing through Phase-change heat transfer, so pipe internal thermal resistance is small, heat transfer efficiency is high.
Due to the high-heat conductive efficency and simple structure of gravity assisted heat pipe, it is set more and more to be applied, in great power LED Field is also such.But in actual applications we have found that there are still many problems, such as hot intraductal working medium evaporative condenser Afterwards, because the adhesive force of heat pipe inner wall is too strong, condensing droplet is caused to adhere in heat pipe inner wall and flow downward, so that in condensation segment One layer of wall formation very thick liquid film hinders heat transfer, and is also easy to cause the heat-exchange working medium of bottom evaporator section to reduce or even dry Dry up, so that LED temperature is drastically raised, making the luminous efficiency of chip reduces or even burn.And it was found that with high-power The extension of LED stream times, the increase for the heating face temperature being immersed in saturation temperature state liquid, i.e. heating surface and During temperature difference increase between saturated liquid, the vaporization nucleus calculation of working medium will increase, and bubble parameters speed is also accelerated, the heat exchange in working medium Nucleate boiling is entered by free convection.Increased with the continuation of temperature difference, the gentle bubble coarsening rate of vaporization nucleus calculation further increases Plus, so that a large amount of bubbles converge in heating surface aggregation, form one layer of vapor film.Heat must could be passed by this layer of vapor film It is delivered in liquid main flow.Because the thermal conductivity factor of steam is small, so heat transfer coefficient declines suddenly, great power LED is also resulted in Temperature steeply rise so as to burning.
The content of the invention
It is an object of the invention to overcome deficiency present in above-mentioned technology there is provided a kind of great power LED cooling lamp, this dissipates The advantage of thermolamp is that toggle speed is fast, working medium circulation speed is fast, uniform temperature is good, heat transfer efficiency is high, great power LED can be maintained long Time is run at normal temperatures, strengthens its luminous efficiency and extends its service life.The present invention also provides a kind of super hydrophilic/thin simultaneously The preparation method on water patterns surface.
The purpose of the present invention is achieved through the following technical solutions.
A kind of great power LED cooling lamp, the great power LED cooling lamp include gravity force heat pipe radiator, LED line base board and LED light source module, the gravity force heat pipe radiator is joined directly together with LED line base board and connect, and LED light source module is arranged in LED line On base board；The gravity force heat pipe radiator includes the condensation segment on top and the evaporator section of bottom；The condensation segment include heat pipe, Handled on the inside of cover plate and trapezoidal fin, heat pipe with cover plate bottom surface through super hydrophobic surface, with superhydrophobic characteristic；Evaporator section is post Shape cavity, the cavity floor is joined directly together with LED line base board, and heat-exchange working medium, cavity floor surface warp are filled with cavity Non-homogeneous wetability patterned process, the surface is divided into super-hydrophobic region and super hydrophilic region, and the super-hydrophobic region is spoke Penetrate shape.
It is preferred that, the cover plate center is provided with topping up aspirating hole, will be evacuated for filling heat-exchange working medium and in cavity.
It is preferred that, the cover plate is copper coin, and the connection of cover plate and heat pipe is used in instantaneous high-temperature welding technology, the cover plate Centre is provided with pumping topping up hole, heat-exchange working medium will be irrigated in pipe and uses rubber ring seal after vacuumizing.
It is preferred that, the heat-exchange working medium is water, or the azeotropic mixture that water and other low-boiling point materials are constituted.The heat exchange work Matter loading is the 40% ~ 60% of evaporation cavity volume.
It is preferred that, the heat pipe is hollow cylinder, and material used is red copper, and heat pipe inner wall is carved with spiral shape conduit, groove Depth is 3 ~ 5mm.
It is preferred that, the evaporator section bottom plate is bolted to connection with LED-baseplate, and heat conduction is filled between bottom plate and substrate Insulating cement, to drive the air between bottom plate and substrate away, reduces interface resistance.
It is preferred that, the LED-baseplate is aluminium base, and the bonding way between LED chip and aluminium base is common for Sillim's alloy Crystalline substance welding, so can effectively reduce the thermal resistance of LED encapsulation.
It is preferred that, the cover plate is covered at the top of the heat pipe of condensation segment, is distributed with outside the heat pipe and at the top of cover plate trapezoidal Fin, the trapezoidal fin is made through roll extrusion.
It is preferred that, the height of the trapezoidal fin is 1.5 ~ 2cm, and fin thickness is the Notch angle between 0.5 ~ 1mm, fin For 30 °.
It is preferred that, material used in the gravity force heat pipe radiator is red copper.
It is preferred that, heat pipe inner wall and the cover plate bottom surface is handled through super hydrophobic surface, and water droplet is in super hydrophobic surface processing Contact angle on rear heat pipe inner wall and cover plate bottom surface is 150 ° ~ 180 °.
It is preferred that, the technique of the super hydrophobic surface processing is electrochemical deposition method, is thin using myristic acid ethanol solution Aqua, using the step of electrochemical deposition method one in metal red copper surface constructing super-drainage layer, forms super hydrophobic surface.
It is preferred that, the evaporator section backplate surface is handled through non-homogeneous wetability, super hydrophilic region is divided into after processing and super The contact angle of hydrophobic region, the super hydrophilic region and water droplet is 0 ° ~ 5 °, and the contact angle of the super-hydrophobic region and water droplet is 150°~180°。
A kind of preparation method of non-homogeneous wetability patterned surface, comprises the following steps：
（1）Carry out super hydrophilic processing：Copper base after polishing is cleaned 20 minutes with acetone and hydrochloric ultrasonic wave successively and rushed again with water Wash, then using copper base as anode and cathode, add by CuCl2It is electrolysed in the electrolyte of solution and concentrated hydrochloric acid mixed solution composition Deposition, will now form cathode plate wash clean after the completion of micro-nano coarse structure, electrolytic deposition with water on tough cathode, put Enter in vacuum drying chamber and dry, be then placed in sintering furnace and be sintered, micro-nano coarse structure and substrate are tight after processing Close combination, the super hydrophilic layer as substrate；
（2）Cover super hydrophilic layer：By polytetrafluoroethylene (PTFE) with 1:3 ~ 4 mass ratio is diluted in electronics fluorination liquid, then uniformly It is applied to step（1）In the super hydrophilic layer surface of gained copper coin, 90 ~ 150 DEG C are toasted 60 ~ 90 minutes in placement baking oven, then poly- The upper spin coating thickness of tetrafluoroethene layer is 1 ~ 3 μm of positive photoresist；
（3）The acquisition of patterning：By step（2）Gained scribbles the copper coin of positive photoresist under the covering of radial mask, uses Intensity is 180 ~ 220mj/cm2Ultraviolet light 1.5 ~ 2 hours, the polytetrafluoroethylene (PTFE) of exposed portion by oxygen plasma and It is removed after developer processing, exposes the super hydrophilic layer of copper coin, the positive-tone photo for being covered by the mask part is washed with acetone Glue, then obtain the super-hydrophobic layer covered by polytetrafluoroethylene (PTFE), obtains non-homogeneous wetability patterned surface.
Compared with prior art, the invention has the advantages that：
1st, for great power LED cooling problem, gravity heat-pipe type LED thermal louvers of the present invention are followed by the heat-exchange working medium in evaporation cavity The evaporation and condensation of ring back and forth, make full use of the latent heat of phase change of phase transition process, heat are delivered into top condensation segment from thermal source, and lead to Cross outside radiating fin to distribute, realize the efficient conduction of LED junction temperature, effectively the temperature of control LED chip.
2nd, the condensate liquid for traditional gravity heat pipe is difficult reflux problem and easily causes the dry problem of working medium, weight of the invention Power heat pipe-type LED thermal louvers form super-hydrophobic layer in heat pipe inner wall using the step of electrodeposition process one, and are carved with spiral shell in heat pipe inner wall Spin slot road, can so make the working medium for condensing in heat pipe inner wall reduce the adhesive force with inwall, and rapid rundown makes condensate liquid fast Speed backflow.Spiral channel can play increasing heat exchange area, guide droplet flow, strengthen the effect of heat exchange.
3rd, it is difficult to drip for drop at the top of condensation segment to form the problem of thicker liquid film influence is conducted heat, the present invention is on heat pipe top Portion's cover inner surface carries out super-hydrophobic processing, the drop for condensing in top is reduced the contact area with cover plate and is gathered rapidly Collect and drip.
4th, slow for heat pipe toggle speed present in present technology, evaporating area is also easy to produce asking for film boiling influence heat transfer Topic, the present invention patterns non-homogeneous wetability processing by being carried out to evaporator section, and super-hydrophobic region can be contained substantial amounts of in the early stage Nucleation site, promotes the formation of bubble, and bubble departs from wall and rises to liquid level to take away heat, and which improves startup Speed.And with the rising of temperature, bubble is more and more, super hydrophilic region can drive the unnecessary bubble of wall nucleation site, Prevent bubble from connecting to form liquid film, so as to improve critical heat flux density.And due to exist jointly on surface super-hydrophobic region and Super hydrophilic region, the place having a common boundary in hydrophilic area and hydrophobic region, surface tension of liquid variable gradient is larger, produces stronger Marangoni effects, so as to promote liquid internal to flow, lift turbulivity, augmentation of heat transfer.
5th, LED thermal louvers of the present invention are simple in construction, fast response time, and heat-sinking capability is strong, can effectively maintain high-powered LED lamp Run at normal temperatures, strengthen its luminous efficiency and increase the service life.
Brief description of the drawings
Fig. 1 is the structural representation of great power LED cooling lamp of the present invention.
Fig. 2 is the sectional view of great power LED cooling lamp condensation segment of the present invention.
Fig. 3 is the structural representation of non-homogeneous wetability patterned surface of the invention.
Fig. 4 is the structural representation of great power LED cooling lamp spiral channel of the present invention.
Fig. 5 is drop in radial patterning and non-homogeneous wettable surfaces' evaporation time curve map of pattern-free.
Embodiment：
The implementation of the present invention is specifically described with accompanying drawing with reference to example, but embodiments of the present invention are not limited to This.
Embodiment 1
The present invention great power LED cooling lamp structural representation as shown in Figure 1, Figure 2, Figure 4 shows, including lampshade 1, LED chip 2, Fixing bolt 3, heat-exchange working medium 4, condensation segment 5, spiral channel 6, cover plate 7, topping up aspirating hole 8, trapezoidal fin 9, evaporator section 10, bottom Plate 11 and LED line base board 12.LED chip 2 is connected on LED line base board 12 by way of Sillim's alloy eutectic welding； LED line base board 12 is fixedly connected by fixing bolt 3 with bottom plate 11, fills exhausted between circuit base plate 12 and evaporator section bottom plate 11 Edge heat-conducting glue；The backplate surface is handled through non-homogeneous wetability, and the surface is divided into super hydrophilic region 14 and radial super thin Aqua region 13（As shown in Figure 3）；Evaporator section bottom plate is collectively constituted in evaporation cavity, the evaporation cavity with cylindricality evaporator section 10 and filled Heat-exchange working medium 4 is filled with, cylindrical cavity can be cylindrical or prismatic.The heat pipe for condensation is connected with evaporator section, The heat pipe inner wall is through super-hydrophobic processing, and condensation segment inwall, which is carved with outside spiral channel 6, the heat pipe, is distributed with trapezoidal fin 9；It is cold Cover plate 7 is provided with the top of solidifying heat pipe, the cover plate center, which is provided with topping up aspirating hole 8, to be used to fill heat-exchange working medium 4 and by cavity It is evacuated, filling working medium simultaneously uses after vacuumizing and is connected with trapezoidal fin 9 on the outside of rubber ring seal, cover plate.
The described height of trapezoidal fin 9 is 2cm, and fin thickness is that the Notch angle between 1mm, fin is 30 °, fin distribution On the outside of heat pipe and on the outside of cover plate and vertical with heat pipe and cover plate, the fin is made through roll extrusion.
The heat-exchange working medium 4 is water, and heat-exchange working medium loading is the 60% of evaporation cavity volume.
The material that the bottom plate 11, evaporator section 10, condensation segment 5 and cover plate 7 are used is the red copper of high thermal conductivity coefficient, it Between connected mode weld to ensure intensity and good sealing for high-temperature fusion.
The internal face super hydrophobic surface handling process of heat pipe 5 and cover plate 7 is electrodeposition process, is concretely comprised the following steps：Take 0.05mol/L CuCl2Ethanol solution 300ml is placed in reactor, then by 300ml concentration be 0.05mol/L Ethyl Myristates Alcoholic solution is added in reactor as water-repelling agent and stirred, using platinum electrode as negative electrode, and copper pipe and copper cover plate are as anode, between electrode Distance is 2cm, and voltage is 25V, is electrolysed 120 minutes using electrochemical deposition method, a step in copper surface constructing super-drainage layer, Super hydrophobic surface is formed, it is 167 ° that experiment, which measures water droplet in the contact angle of wall,.
In the present embodiment, the preparation method of the non-homogeneous wetability patterned surface comprises the following steps：
（1）Carry out super hydrophilic processing：Copper base after polishing is cleaned with acetone and hydrochloric ultrasonic wave successively spend again within 20 minutes from Sub- water is rinsed, using the substrate after cleaning as anode and cathode, adds the CuCl for 0.1mol/L by concentration2Solution and 2mol/L's Electrolytic deposition is carried out in the electrolyte of HCl mixed solutions composition, copper base is as negative electrode and anode, in the voltage that voltage is 25V Lower electrolytic deposition 30 minutes, will now form after the completion of micro-nano coarse structure, electrolytic deposition on tough cathode and use deionized water Cathode plate is washed down totally, is put into vacuum drying chamber and dries, be then put into the copper coin for having formed micro-nano coarse structure It is sintered in sintering furnace, sintering temperature is 800 DEG C, the time is 2 hours, now micro nano structure will be close with substrate With reference to the super hydrophilic layer as substrate.
（2）Cover super hydrophilic layer：By polytetrafluoroethylene (PTFE) with 1:3 mass ratio is diluted in electronics fluorination liquid, with gained Mixed solution be uniformly applied to step（1）In the super hydrophilic layer surface of gained copper coin, 100 DEG C of bakings 90 in baking oven are then placed Minute.Then spin coating thickness is 1 μm of positive photoresist on polytetrafluoroethylene floor.
（3）The acquisition of patterning：By the copper coin for scribbling positive photoresist under the covering of radial mask, it is with intensity 180mj/cm2Ultraviolet light 1.5 hours, after the polytetrafluoroethylene (PTFE) of exposed portion is by oxygen plasma and developer processing It is removed, exposes the super hydrophilic layer of copper coin, the positive photoresist for being covered by the mask part is washed with acetone, then obtain by gathering The super-hydrophobic layer of tetrafluoroethene covering, so obtains non-homogeneous wetability patterned surface.
The operation principle of great power LED cooling lamp of the present invention is as follows：
The energization work of LED chip 2 lights and produces heat, and heat reaches LED line base board 12 by die bonding material, then Conducted by LED line base board by thermal plastic insulation to evaporator section bottom plate 11, the heat-exchange working medium 4 filled in evaporation cavity absorbs heat Amount temperature raises and produces bubble.The non-homogeneous wetability patterned surface of evaporator section plate inner surface is acted on here In substantial amounts of nucleation site is contained in super-hydrophobic region 13 in the early stage, promotes the formation of bubble, and bubble departs from wall and rises to liquid level So as to which heat be taken away, which improves toggle speed.With the rising of temperature, bubble is more and more, and super hydrophilic region can To drive the unnecessary bubble of wall nucleation site, prevent bubble from connecting to form liquid film, so as to improve critical heat flux density.It is non-homogeneous Another effect of wetability patterned surface is that the place having a common boundary in hydrophilic area and hydrophobic region, surface tension of liquid changes Gradient is larger, produces stronger Marangoni effects, so as to promote liquid internal to flow, lifts turbulivity, augmentation of heat transfer promotees Enter evaporation.Because radial pattern can greatly increase the border in super hydrophilic region and super-hydrophobic region, that is, it can increase Strong Marangoni effects, so super-hydrophobic region uses radial pattern in the present invention.Fig. 5 exists for the drop that experiment is measured Non-homogeneous wettable surfaces' evaporation time curve map of radial patterning and pattern-free, it is evident that radial patterning can promote Enter the evaporation of drop.
Working medium after vaporization rises to condensation cavity under pressure differential effect, and because empty cavity temperature is relatively low, working medium is cold Solidifying cavity wall face exothermic condensation is into drop and is back to realization circulation in evaporation cavity under gravity, and condensation heat is by heat pipe and outside The radiating fin in portion reaches the external world.For lifting heat transfer effect, super-hydrophobic processing is carried out in condensation segment inwall, and in heat pipe inner wall Spiral channel is carved with, the working medium for condensing in heat pipe inner wall is reduced the adhesive force with inwall, rapid rundown makes cold Lime set flows back rapidly.Spiral channel can play increasing heat exchange area, guide droplet flow, strengthen the effect of heat exchange.
It should be pointed out that embodiments of the present invention and being not restricted to the described embodiments, other are any without departing from the present invention Technical scheme and improvement, should be equivalent substitute mode, be included within protection scope of the present invention.

Claims (10)

1. a kind of great power LED cooling lamp, it is characterised in that the great power LED cooling lamp includes gravity force heat pipe radiator, LED Circuit base plate and LED light source module, the gravity force heat pipe radiator are joined directly together with LED line base board and connect, LED light source module cloth Put on LED line base board；The gravity force heat pipe radiator includes the condensation segment on top and the evaporator section of bottom；The condensation segment Including heat pipe, cover plate and trapezoidal fin, handled on the inside of heat pipe with cover plate bottom surface through super hydrophobic surface, with superhydrophobic characteristic； Evaporator section is cylindrical cavity, and the cavity floor is joined directly together with LED line base board, and heat-exchange working medium, cavity are filled with cavity Backplate surface is through non-homogeneous wetability patterned process, and the surface is divided into super-hydrophobic region and super hydrophilic region, described super thin Aqua region is radial.
2. a kind of great power LED cooling lamp according to claim 1, it is characterised in that the cover plate center is provided with topping up Aspirating hole, will be evacuated for filling heat-exchange working medium and in cavity.
3. a kind of great power LED cooling lamp according to claim 1, it is characterised in that the heat pipe is hollow cylinder, Heat pipe inner wall is carved with spiral channel, and groove depth is 3 ~ 5mm.
4. a kind of great power LED cooling lamp according to claim 1, it is characterised in that the cover plate is covered in condensation segment At the top of heat pipe, trapezoidal fin is distributed with outside the heat pipe and at the top of cover plate, the trapezoidal fin is made through roll extrusion.
5. a kind of great power LED cooling lamp according to claim 4, it is characterised in that the height of the trapezoidal fin is 1.5 ~ 2cm, fin thickness is that the Notch angle between 0.5 ~ 1mm, fin is 30 °.
6. a kind of great power LED cooling lamp according to claim 1, it is characterised in that the gravity force heat pipe radiator institute It is red copper with material.
7. a kind of great power LED cooling lamp according to claim 1, it is characterised in that heat pipe inner wall and the cover plate bottom Face is handled through super hydrophobic surface, and heat pipe inner wall of the water droplet after super hydrophobic surface processing and the contact angle on cover plate bottom surface are 150°~180°。
8. a kind of great power LED cooling lamp according to claim 1, it is characterised in that the super hydrophobic surface processing Technique is electrochemical deposition method, using myristic acid ethanol solution as water-repelling agent, using the step of electrochemical deposition method one in metal red copper Surface construction super-hydrophobic layer, forms super hydrophobic surface.
9. a kind of great power LED cooling lamp according to claim 1, it is characterised in that the evaporator section backplate surface warp Non-homogeneous wetability processing, is divided into super hydrophilic region and super-hydrophobic region, contact of the super hydrophilic region with water droplet after processing Angle is 0 ° ~ 5 °, and the contact angle of the super-hydrophobic region and water droplet is 150 ° ~ 180 °.
10. a kind of preparation side of the non-homogeneous wetability patterned surface of great power LED cooling lamp for described in claim 1 Method, it is characterised in that comprise the following steps：
（1）Carry out super hydrophilic processing：Copper base after polishing is cleaned with acetone and hydrochloric ultrasonic wave successively and rinsed again with water, then Using copper base as anode and cathode, add by CuCl2Electrolytic deposition is carried out in the electrolyte of solution and concentrated hydrochloric acid mixed solution composition, It will now be formed cathode plate wash clean after the completion of micro-nano coarse structure, electrolytic deposition with water, be put into true on tough cathode Dried in empty drying box, be then placed in sintering furnace and be sintered, micro-nano coarse structure and substrates into intimate knot after processing Close, the super hydrophilic layer as substrate；
（2）Cover super hydrophilic layer：By polytetrafluoroethylene (PTFE) with 1:3 ~ 4 mass ratio is diluted in electronics fluorination liquid, then uniformly It is applied to step（1）In the super hydrophilic layer surface of gained copper coin, 90 ~ 150 DEG C are toasted 60 ~ 90 minutes in placement baking oven, then poly- The upper spin coating thickness of tetrafluoroethene layer is 1 ~ 3 μm of positive photoresist；
（3）The acquisition of patterning：By step（2）Gained scribbles the copper coin of positive photoresist under the covering of radial mask, uses Intensity is 180 ~ 220mj/cm2Ultraviolet light 1.5 ~ 2 hours, the polytetrafluoroethylene (PTFE) of exposed portion by oxygen plasma and It is removed after developer processing, exposes the super hydrophilic layer of copper coin, the positive-tone photo for being covered by the mask part is washed with acetone Glue, then obtain the super-hydrophobic layer covered by polytetrafluoroethylene (PTFE), i.e., non-homogeneous wetability patterned surface.
CN201710450605.4A 2017-06-15 2017-06-15 High-power LED heat dissipation lamp and preparation method of non-uniform wettability patterned surface Active CN107191796B (en)

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CN108150975A (en) * 2017-11-27 2018-06-12 安徽西马新能源技术有限公司 A kind of household LED radiating subassemblies
CN108931489A (en) * 2018-09-10 2018-12-04 复旦大学 A kind of difference absorption spectrum system based on glyoxal concentration in LED light source measurement atmosphere
CN111578755A (en) * 2020-06-04 2020-08-25 中国科学院工程热物理研究所 Gravity heat pipe for enhancing heat transfer based on piezoelectric technology
CN112833693A (en) * 2021-02-26 2021-05-25 华南理工大学 Preparation method of aluminum flat heat pipe and aluminum flat heat pipe

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Publication number Priority date Publication date Assignee Title
CN107833870A (en) * 2017-10-31 2018-03-23 华南理工大学 A kind of heat abstractor and its heat sink preparation method for high-power chip
CN107833870B (en) * 2017-10-31 2020-01-14 华南理工大学 Heat dissipation device for high-power chip and heat dissipation plate preparation method thereof
CN108150975A (en) * 2017-11-27 2018-06-12 安徽西马新能源技术有限公司 A kind of household LED radiating subassemblies
CN108931489A (en) * 2018-09-10 2018-12-04 复旦大学 A kind of difference absorption spectrum system based on glyoxal concentration in LED light source measurement atmosphere
CN108931489B (en) * 2018-09-10 2020-12-22 复旦大学 Differential absorption spectrum system for measuring concentration of glyoxal in atmosphere based on LED light source
CN111578755A (en) * 2020-06-04 2020-08-25 中国科学院工程热物理研究所 Gravity heat pipe for enhancing heat transfer based on piezoelectric technology
CN111578755B (en) * 2020-06-04 2021-09-03 中国科学院工程热物理研究所 Gravity heat pipe for enhancing heat transfer based on piezoelectric technology
CN112833693A (en) * 2021-02-26 2021-05-25 华南理工大学 Preparation method of aluminum flat heat pipe and aluminum flat heat pipe

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