CN209132718U - A kind of power supply jig of standard PCIE subcard and OCP subcard - Google Patents
A kind of power supply jig of standard PCIE subcard and OCP subcard Download PDFInfo
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- CN209132718U CN209132718U CN201822224770.0U CN201822224770U CN209132718U CN 209132718 U CN209132718 U CN 209132718U CN 201822224770 U CN201822224770 U CN 201822224770U CN 209132718 U CN209132718 U CN 209132718U
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- subcard
- connector
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- pcie
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 58
- 230000005611 electricity Effects 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
The utility model is for problems of the prior art, innovation proposes the power supply jig of a kind of standard PCIE subcard and OCP subcard, power input is connect with PSU, power output end is connect with standard PCIE subcard and/or OCP subcard, it include: the first connector, power conversion unit and the second connector group, the second connector group includes various types standard PCIE connector and OCP connector, this programme can reduce dependence of the subcard to be measured to mainboard, greatly simplify the build process of PCIE subcard and OCP subcard PIV test platform, it is applicable to various types of standard PCIE subcards and OCP subcard, it avoids because the complexity of connection be easy to cause poor contact problem between a board, it does not need frequently to replace adapter, it improves work efficiency.
Description
Technical field
The utility model relates to subcards for electrical domain, more particularly, to the power supply of a kind of standard PCIE subcard and OCP subcard
Jig.
Background technique
The present invention relates to servers for electrical domain, and in particular to the PCIE (Peripheral of server master board
Component Interconnect Express, i.e., a kind of high speed serialization computer expansion bus standard) standard subcard and OCP
(Open Compute Project, i.e., open calculating project) standard subcard power supply testing field.With cloud computing, big data
Development, the PCIE interface card and OCP card of various functions emerge one after another.Such as network interface card, Raid card (Redundant Array of
Independent Disks, a kind of that the independent physical hard disk of muti-piece differently combined to form a logic is hard
Disk), HBA card (optical fiber storage card), FPGA (Field-Programmable Gate Array, i.e. field programmable gate array)
Accelerator card, intelligent network adapter etc..For system manufacturer, after the subcard for developing these standards PCIE interface, need to carry out
The PIV of subcard tests (Power Integrity test).PIV (Power Integrity Validation, the Power Integrity of subcard
Test) test need to build test platform, for on subcard related device power.
The PIV test platform of prior art Plays PCIE subcard are as follows: as shown in Figure 1, it is necessary first to prepare one piece and have
Then subcard, that is, PCIE subcard 13 is mounted on mainboard 11 by the mainboard 11 of PCIE slot, mainboard also needs to install CPU0 processing
Device and CPU1 processor are finally switched on to mainboard 11.If the PCIE slot 111 on mainboard 11 is X24, but PCIE to be measured
Subcard 13 is X8 or X16, and X24 is also needed to turn the adapter 12 of the PCIE of X16+X8 at this time, and the adapter 12 of X24 is inserted in master
On plate on 11 X24 slot 111, then the PCIE subcard 13 of X16 to be measured or X8 is inserted on adapter 12.
The prior art relies primarily on the existing hardware resource in laboratory and is built, and needs using adapter, process and device
It is more complicated cumbersome.Also, during the test, the complexity of connection be easy to cause poor contact between a board, thus shadow
Ring test result.Secondly, if PCIE subcard to be measured is other interfaces, it is also necessary to mainboard or PCIE adapter are re-replaced,
It is unfavorable for improving efficiency.
Summary of the invention
The utility model in order to solve the problems in the existing technology, innovation propose a kind of standard PCIE subcard and
The power supply jig of OCP subcard, it is simple and easy, be applicable to various types of standard PCIE subcards and OCP subcard, avoid because
It is be easy to cause poor contact problem between a board for the complexity of connection, does not need frequently to replace adapter, improves work
Efficiency.
On the one hand the utility model provides the power supply jig of a kind of standard PCIE subcard and OCP subcard, power input
Connect with PSU, output end is connect with standard PCIE subcard and/or OCP subcard, comprising: the first connector, voltage conversion unit with
And the second connector group, the power input of the power supply jig are connect by the first connector with PSU, the output of the PSU
Enable end is directly grounded on power supply jig, and the power output end of the power supply jig passes through the second connector group and standard PCIE
Subcard and/or the connection of OCP subcard；The power input of the voltage conversion unit is connect with the first connector, and the voltage turns
The power output end for changing unit is connect with the second connector group.
In conjunction with this aspect, in this aspect in the first possible implementation, the voltage conversion unit includes: the first electricity
Press conversion chip, second voltage conversion chip and tertiary voltage conversion chip, the power supply of the first voltage conversion chip defeated
Enter end to connect with the first connector, the power output end of the first voltage conversion chip is connect with the second connector group；It is described
The power input of second voltage conversion chip is connect with the first connector, the power output end of the second voltage conversion chip
It is connect with the second connector group；The power input of the tertiary voltage conversion chip is connect with the first connector, the third
The power output end of voltage conversion chip is connect with the second connector group.
In conjunction with this aspect, in second of this aspect possible implementation, the first voltage conversion chip is P12V_
STBY turns P3V3_AUX chip, and output end is connect with the P3V3_AUX golden finger of the second connector group；The second voltage turns
Changing chip is that P12V turns P3V3_PCIE chip, and output end is connect with the P3V3_PCIE golden finger of the second connector group；It is described
Tertiary voltage conversion chip is that P12V turns P12V_PCIE chip, the P12V_PCIE golden finger of output end and the second connector group
Connection.
In conjunction with this aspect, in this aspect in the third possible implementation, first connector is PSU connector.
In conjunction with this aspect, in the 4th kind of possible implementation of this aspect, the PSU connector is the connection of CRPS power supply
Device.
In conjunction with this aspect, in the 5th kind of possible implementation of this aspect, the second connector group includes that PCIE connects
Connect device group and OCP connector.
In conjunction with this aspect, in the 6th kind of possible implementation of this aspect, the PCIE connector group includes:
PCIEX24 connector, PCIEX16 connector, PCIEX8 connector, PCIEX4 connector.
The technical solution adopted in the utility model includes following technical effect:
For the utility model for problems of the prior art, innovation proposes a kind of standard PCIE subcard and OCP subcard
Power supply jig, power input connect with PSU, and output end is connect with standard PCIE subcard and/or OCP subcard, comprising: first
Connector, voltage conversion unit and the second connector group, the second connector group include the PCIE connection of various types standard
Device and OCP connector, this programme can reduce dependence of the subcard to be measured to mainboard, greatly simplify PCIE subcard and OCP subcard
The build process of PIV test platform is applicable to various types of standard PCIE subcards and OCP subcard, avoids because even
The complexity connect be easy to cause poor contact problem between a board, does not need frequently to replace adapter, improve work efficiency.
For the utility model for problems of the prior art, innovation proposes a kind of standard PCIE subcard and OCP subcard
Power supply jig, wherein the power input of tertiary voltage conversion chip is connect with the first connector, tertiary voltage conversion
The power output end of chip is connect with the second connector group, by tertiary voltage conversion chip (Efuse chip) from functional right
P12V_PCIE does overcurrent protection, avoids clamp short circuit caused by maloperation in doing PIV test process, or even cause jig plate
It burns, improves the reliability in entire PIV test process.
General description and following detailed description more than it should be understood that be only it is exemplary and explanatory, not
The utility model can be limited.
Detailed description of the invention
Illustrate the utility model embodiment or technical solution in the prior art to become apparent from, below will to embodiment or
Attached drawing needed to be used in the description of the prior art is briefly described, it is clear that, for those of ordinary skill in the art
Speech, without creative efforts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the PIV test platform of prior art Plays PCIE subcard；
Fig. 2 is a kind of knot of the power supply jig embodiment one of standard PCIE subcard and OCP subcard in the utility model
Structure schematic diagram；
Fig. 3 is a kind of knot of the power supply jig embodiment two of standard PCIE subcard and OCP subcard in the utility model
Structure schematic diagram；
Fig. 4 is a kind of knot of the power supply jig embodiment three of standard PCIE subcard and OCP subcard in the utility model
Structure schematic diagram.
Specific embodiment
In order to clarify the technical characteristics of the invention, below by specific embodiment, and its attached drawing is combined, to this reality
It is described in detail with novel.Following disclosure provides many different embodiments or example is used to realize the utility model
Different structure.In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.In addition,
The utility model can in different examples repeat reference numerals and/or letter.This repetition is for simplified and clear mesh
, the relationship between discussed various embodiments and/or setting itself is not indicated.It should be noted that illustrated in the accompanying drawings
Component is not drawn necessarily to scale.The description to known assemblies and treatment technology and process is omitted to avoid not in the utility model
Necessarily limit the utility model.
Embodiment one
As shown in Fig. 2, the power supply jig 22 of a kind of standard PCIE subcard and OCP subcard, power input and PSU21 connect
It connects, output end is connect with standard PCIE subcard and/or OCP subcard 23, comprising: the first connector 221, voltage conversion unit 222
And the second connector group 223, the power input of power supply jig 22 are connect by the first connector 221 with PSU21, PSU21
Output enable end power supply jig 22 on be directly grounded, power supply jig 22 power output end pass through the second connector group 223
It is connect with standard PCIE subcard and/or OCP subcard 23；The power input of voltage conversion unit 222 and the first connector 221 connect
It connects, the power output end of voltage conversion unit 222 is connect with the second connector group 223.
Wherein, the CRPS power supply of PSU selection standard, the first connector are PSU connector, and PSU connector uses standard
CRPS power connector；The output enable end of PSU is directly grounded on jig plate, is had after guaranteeing PSU on insertion jig plate
P12V and P12VSB voltage output.This programme can reduce dependence of the subcard to be measured to mainboard, greatly simplify PCIE subcard and OCP
The build process of subcard PIV test platform is applicable to various types of standard PCIE subcards and OCP subcard, avoid because
It is be easy to cause poor contact problem between a board for the complexity of connection, does not need frequently to replace adapter, improves work
Efficiency.
Embodiment two
As shown in figure 3, the power supply jig 22 of a kind of standard PCIE subcard and OCP subcard, power input and PSU21 connect
It connects, output end is connect with standard PCIE subcard and/or OCP subcard 23, comprising: the first connector 221, voltage conversion unit 222
And the second connector group 223, the power input of power supply jig 22 are connect by the first connector 221 with PSU21, PSU21
Output enable end power supply jig 22 on be directly grounded, power supply jig 22 power output end pass through the second connector group 223
It is connect with standard PCIE subcard and/or OCP subcard 23；Voltage conversion unit 222 includes: first voltage conversion chip 2221,
Two voltage conversion chips 2222 and tertiary voltage conversion chip 2223, the power input of the first voltage conversion chip 2221
End is connect with the first connector 221, and the power output end of first voltage conversion chip 2221 is connect with the second connector group 223；
The power input of second voltage conversion voltage chips 2222 is connect with the first connector 221, second voltage conversion chip 2222
Power output end connect with the second connector group 223；The power input of tertiary voltage conversion chip 2223 is connect with first
Device 221 connects, and the power output end of tertiary voltage conversion module 2223 is connect with the second connector group 223.
First voltage conversion chip 2221 is that P12V_STBY turns P3V3_AUX chip, output end and the second connector group
223 P3V3_AUX golden finger connection；Second voltage conversion chip 2222 is that P12V turns P3V3_PCIE chip, output end with
The P3V3_PCIE golden finger of second connector group 223 connects；Tertiary voltage conversion chip 2223 is that P12V turns P12V_PCIE core
Piece, output end are connect with the P12V_PCIE golden finger of the second connector group 223.
2221 output voltage of first voltage conversion chip is used for the P3V3_AUX of the second connector group 223 on power supply jig
Golden finger power supply, by selecting chip MPQ8632-4 to realize, but is not limited to MPQ8632-4 model, exports current design 3A, defeated
Voltage is 3.3V out.
2222 output voltage of second voltage conversion chip is used to convert P3V3_PCIE for the P12V of PSU, for power supply
The P3V3_PCIE golden finger power supply of the second connector group 223, by selecting chip TPS53319 to realize, but is not limited on jig
TPS53319 model, designing circuitry 6A, output voltage 3.3V.Because P3V3_AUX and P3V3_PCIE are distributed in subcard
Different golden fingers, and function is different, realizes so being respectively necessary for respectively different voltage conversion chips.
2223 output voltage of tertiary voltage conversion chip is used to convert P12V_PCIE for the P12V of PSU, for power supply
The P12V_PCIE golden finger power supply of second connector group 223 on jig, by selecting Efuse chip MP5023 to realize, but it is unlimited
In MP5023 model, design over-current protection point is 20A.Because the main power output electric current of the P12V of PSU is larger, over-current protection point ratio
It is higher, but the maximum current demand of each PCIe card is 12A, so needing own by Efuse chip on jig plate
Function overcurrent protection is done to P12V_PCIE, avoid clamp short circuit caused by maloperation in doing PIV test process, or even make
It is burnt at jig plate, improves the reliability in entire test process.
Embodiment three
As shown in figure 4, the power supply jig 22 of a kind of standard PCIE subcard and OCP subcard, power input and PSU21 connect
It connects, output end is connect with standard PCIE subcard and/or OCP subcard 23, comprising: the first connector 221, voltage conversion unit 222
And the second connector group 223, the power input of power supply jig 22 are connect by the first connector 221 with PSU21, PSU21
Output enable end power supply jig 22 on be directly grounded, power supply jig 22 power output end pass through the second connector group 223
It is connect with standard PCIE subcard and/or OCP subcard 23；The power input of voltage conversion unit 222 and the first connector 221 connect
It connects, the power output end of voltage conversion unit 222 is connect with the second connector group 223.
Wherein the second connector group 223 includes including PCIE connector group 2231 and OCP connector 2232.PCIE connection
Device group 2231 includes: PCIEX24 connector 22311, PCIEX16 connector 22312, PCIEX8 connector 22313, PCIEX4 company
Connect device 22314.PCIEX24 connector 22311 is used to connect the PCIEX24 subcard in standard PCIE subcard and/or OCP subcard 23
231, PCIEX16 connectors 22312 are used to connect the PCIEX16 subcard 232 in standard PCIE subcard and/or OCP subcard 23,
PCIEX8 connector 22313 is used to connect the PCIEX8 subcard 233 in standard PCIE subcard and/or OCP subcard 23, and PCIEX4 connects
It connects device 22314 and is used for connecting the PCIEX4 subcard 234 in standard PCIE subcard and/or OCP subcard 23, OCP connector 2232
OCP subcard 235 in connection standard PCIE subcard and/or OCP subcard 23.
The PCIE slot of various interfaces is planted on power supply jig 22, the value volume and range of product of power supply pin is the same, only
It is that current needs size is variant.Therefore, after the completion of jig design of powering is implemented, for PCIE subcard to be measured and OCP
Card, is separately mounted on corresponding PCIE connector and OCP connector according to its specification, can carry out subcard and carry out PIV survey
Examination, it is no longer necessary to which mainboard, PCIE pinboard and the installation of CPU with fixed slot etc. can be compatible with various types of
PCIE and OCP subcard, it is easy to operate.Therefore this programme can reduce dependence of the subcard to be measured to mainboard, greatly simplify PCIE
The build process of card and OCP subcard PIV test platform, is applicable to various types of standard PCIE subcards and OCP subcard, keeps away
Exempt from not needing frequently to replace adapter because the complexity of connection be easy to cause poor contact problem between a board, improve
Working efficiency.
It is above-mentioned although specific embodiments of the present invention are described with reference to the accompanying drawings, but it is not practical new to this
The limitation of type protection scope, those skilled in the art should understand that, based on the technical solution of the present invention, ability
Field technique personnel do not need to make the creative labor the various modifications or changes that can be made still in the protection model of the utility model
Within enclosing.
Claims (7)
1. the power supply jig of a kind of standard PCIE subcard and OCP subcard, power input are connect with PSU, output end and standard
PCIE subcard and the connection of OCP subcard, characterized in that it include: the first connector, voltage conversion unit and the second connector group,
The power input of the power supply jig is connect by the first connector with PSU, and the output enable end of the PSU is in power supply jig
On be directly grounded, the power output end of the power supply jig is connected by the second connector group and standard PCIE subcard and OCP subcard
It connects；The power input of the voltage conversion unit is connect with the first connector, the power output end of the voltage conversion unit
It is connect with the second connector group.
2. the power supply jig of standard PCIE subcard according to claim 1 and OCP subcard, characterized in that the voltage turns
Changing unit includes: first voltage conversion chip, second voltage conversion chip and tertiary voltage conversion chip, the first voltage
The power input of conversion chip is connect with the first connector, and the power output end of the first voltage conversion chip and second connects
Connect the connection of device group；The power input of the second voltage conversion chip is connect with the first connector, the second voltage conversion
The power output end of chip is connect with the second connector group；The power input of the tertiary voltage conversion chip is connect with first
Device connection, the power output end of the tertiary voltage conversion chip are connect with the second connector group.
3. the power supply jig of standard PCIE subcard according to claim 2 and OCP subcard, characterized in that first electricity
Pressure conversion chip is that P12V_STBY turns P3V3_AUX chip, the P3V3_AUX golden finger company of output end and the second connector group
It connects；The second voltage conversion chip is that P12V turns P3V3_PCIE chip, the P3V3_ of output end and the second connector group
The connection of PCIE golden finger；The tertiary voltage conversion chip is that P12V turns P12V_PCIE chip, output end and the second connector
The P12V_PCIE golden finger connection of group.
4. the power supply jig of standard PCIE subcard according to claim 1 or 2 and OCP subcard, characterized in that described first
Connector is PSU connector.
5. the power supply jig of standard PCIE subcard according to claim 4 and OCP subcard, characterized in that the PSU connection
Device is CRPS power connector.
6. the power supply jig of standard PCIE subcard according to claim 1 or 2 and OCP subcard, characterized in that described second
Connector group includes PCIE connector group and OCP interface connector.
7. the power supply jig of standard PCIE subcard according to claim 6 and OCP subcard, characterized in that the PCIE connects
Connecing device group includes: PCIEX24 connector, PCIEX16 connector, PCIEX8 connector, PCIEX4 connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822224770.0U CN209132718U (en) | 2018-12-28 | 2018-12-28 | A kind of power supply jig of standard PCIE subcard and OCP subcard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822224770.0U CN209132718U (en) | 2018-12-28 | 2018-12-28 | A kind of power supply jig of standard PCIE subcard and OCP subcard |
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| Publication Number | Publication Date |
|---|---|
| CN209132718U true CN209132718U (en) | 2019-07-19 |
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| CN201822224770.0U Expired - Fee Related CN209132718U (en) | 2018-12-28 | 2018-12-28 | A kind of power supply jig of standard PCIE subcard and OCP subcard |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110489368A (en) * | 2019-08-10 | 2019-11-22 | 苏州浪潮智能科技有限公司 | A kind of high density Ruler ssd system |
-
2018
- 2018-12-28 CN CN201822224770.0U patent/CN209132718U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110489368A (en) * | 2019-08-10 | 2019-11-22 | 苏州浪潮智能科技有限公司 | A kind of high density Ruler ssd system |
| CN110489368B (en) * | 2019-08-10 | 2021-10-22 | 苏州浪潮智能科技有限公司 | High-density Ruler ssd system |
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Granted publication date: 20190719 Termination date: 20201228 |