CN209104151U - A kind of LED circuit board mould group from wiring board back side illuminated - Google Patents
A kind of LED circuit board mould group from wiring board back side illuminated Download PDFInfo
- Publication number
- CN209104151U CN209104151U CN201821805989.3U CN201821805989U CN209104151U CN 209104151 U CN209104151 U CN 209104151U CN 201821805989 U CN201821805989 U CN 201821805989U CN 209104151 U CN209104151 U CN 209104151U
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- CN
- China
- Prior art keywords
- cup
- rim
- led
- wiring board
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a kind of LED circuit board mould groups from wiring board back side illuminated, specifically, after metal plate punching plating, injection molding forms cup, then the metal on both sides is towards the bending of rim of a cup direction, form leg concordant with rim of a cup or beyond rim of a cup, or towards bending forms and is wrapped in the legs of rim of a cup plastics again after the bending of rim of a cup direction, or towards after the bending of rim of a cup direction again towards the opposite direction bending of rim of a cup, form two wing legs, or leg has directly been stretched out at wing at the intermediate position of injection molding, then LED lamp bead of the leg at rim of a cup is made in packaging LED chips, mould group is made in lamp bead weldering in the circuit board, the light of the module lamp pearl of the utility model either passes through translucent material by the hole on wiring board, it is issued across wiring board from the back side of wiring board.
Description
Technical field
The utility model relates to LED and its application fields, and in particular to a kind of LED circuit board from wiring board back side illuminated
Mould group.
Background technique
The leg of traditional LED patch support is all in bottom of a cup portion, and after manufactured lamp bead is soldered on wiring board, rim of a cup is backwards to line
Road plate, LED light emission direction shine outwardly backwards to wiring board, but certain applications need LED lamp bead light emission direction towards wiring board side
To, towards wiring board in shine, wiring board at this time is translucent material or is drilled with a light hole, and this application is usually to be used in key
On disk lamp or the light bar being attached on window-glass and display screen etc..
In order to meet the needs of above market, a kind of LED circuit board mould from wiring board back side illuminated of the utility model
Group solves the problems, such as that traditional LED light is not able to satisfy light emission direction towards wiring board direction, and the utility model is by LED patch branch
The leg of frame is all disposed within rim of a cup face, is adjacent to rim of a cup or close to rim of a cup, after being welded on wiring board, LED lamp bead light emission direction
Towards wiring board direction.
Utility model content
The utility model relates to a kind of LED circuit board mould groups from wiring board back side illuminated, specifically, metal plate is rushed
After cutting plating, injection molding forms cup, and then the metal on both sides forms weldering concordant with rim of a cup or beyond rim of a cup towards the bending of rim of a cup direction
Foot or towards after the bending of rim of a cup direction again bending formed be wrapped in rim of a cup plastics leg or towards after the bending of rim of a cup direction again
Towards the opposite direction bending of rim of a cup, forms two wing legs or leg and directly stretch out at the intermediate position of injection molding at wing, then
LED lamp bead of the leg at rim of a cup is made in packaging LED chips, mould group is made in lamp bead weldering in the circuit board, this is practical new
The light of the module lamp pearl of type either passes through translucent material by the hole on wiring board, sends out across wiring board from the back side of wiring board
Out.
A kind of LED circuit board mould group from wiring board back side illuminated is provided according to the utility model, comprising: LED lamp bead;
Wiring board;It is characterized in that, LED lamp bead is welded on wiring board, on the one hand the casting resin material of LED lamp bead forms cup, separately
On the one hand fixed positive and negative anodes sheet metal circuit is played, sheet metal circuit exposes in the positive and negative anodes of bottom of a cup is used for packaging LED chips, positive and negative
Pole sheet metal circuit, towards the bending of rim of a cup direction, is formed close to the leg of rim of a cup, leg wraps rim of a cup or weldering outside cup
Foot abutting rim of a cup side is concordant with rim of a cup or exceeds rim of a cup or leg at rim of a cup backwards to rim of a cup bending, and formation is the wing
Shape leg or leg directly stretch out at the intermediate position of injection molding at wing, and the leg of manufactured LED patch support is all in rim of a cup
Face, is adjacent to rim of a cup or close to rim of a cup, chip is fixed on the metal in bottom of a cup and connects conducting, cup with bottom of a cup positive and negative anodes metal
In have encapsulation mucilage sealing live chip;Lamp base is soldered in PCB surface at rim of a cup, and the light that lamp bead issues passes through wiring board towards line
Road back issues, and wiring board is that translucent material either has hole to pass through for light at the lamp bead place of shining.
A preferred embodiment according to the present utility model, a kind of LED circuit board mould from wiring board back side illuminated
Group, which is characterized in that the mould group is for making illuminated keyboard, LED light strip, LED light bar, LED display.
In the description below to the drawings and specific embodiments, one or more embodiments of the utility model will be illustrated
Details.
Detailed description of the invention
By reading this specification in conjunction with the following drawings, the feature, objects and advantages of the utility model will become more to show
And be clear to, it is as follows to the brief description of accompanying drawing.
Fig. 1 is a kind of floor map of leg in the LED support in rim of a cup face.
Fig. 2 is the schematic cross-section that leg is close to the rim of a cup side LED support concordant with rim of a cup.
Fig. 3 be leg can bending wrap rim of a cup LED support schematic cross-section.
Fig. 4 is leg rim of a cup bending backwards at rim of a cup, forms the schematic cross-section of the LED support of wing leg.
Fig. 5 is the schematic cross-section for the LED support that leg directly stretches out at the intermediate position of injection molding.
Fig. 6 is that the section being close on the LED support concordant with rim of a cup of rim of a cup side after packaging LED chips in leg is illustrated
Figure.
Fig. 7 be leg can bending wrap rim of a cup LED support on schematic cross-section after packaging LED chips.
Fig. 8 is the schematic cross-section on the LED support of wing leg after packaging LED chips.
Fig. 9 is that the section in leg on the LED support that the intermediate position of injection molding is directly stretched out after packaging LED chips is illustrated
Figure.
Figure 10 is that the LED lamp bead of " Fig. 6 " is welded on the schematic cross-section on light transmission wiring board.
Figure 11 is that the LED lamp bead of " Fig. 6 " is welded in the circuit board, and LED lamp bead, which shines, to be located to be provided on corresponding wiring board
The schematic cross-section of loophole.
Figure 12 is that the LED lamp bead of " Fig. 7 " is welded on the schematic cross-section on light transmission wiring board.
Figure 13 is that the LED lamp bead of " Fig. 7 " is welded in the circuit board, and LED lamp bead, which shines, to be located to be provided on corresponding wiring board
The schematic cross-section of loophole.
Figure 14 is that the LED lamp bead of " Fig. 8 " is welded on the schematic cross-section on light transmission wiring board.
Figure 15 is that the LED lamp bead of " Fig. 8 " is welded in the circuit board, and LED lamp bead, which shines, to be located to be provided on corresponding wiring board
The schematic cross-section of loophole.
Figure 16 is that the LED lamp bead of " Fig. 9 " is welded in the circuit board, and LED lamp bead is inlayed in the hole of assist side setting, LED
The schematic cross-section that the light of lamp bead transmitting is gone out from wiring board back side illuminaton.
Specific embodiment
The utility model will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some preferred implementation sides
Formula, claim to the utility model simultaneously do not have any restrictions.
1, iron plate band mold is punched into the blank of LED bracket entire volume on the high velocity ram machine of the auspicious 45T of rainbow, by design
Circuit.
2, electroplate processing will be carried out at LED support entire volume blank circuit with the plating line of Aomei spy.
3, it is molded on day essence injection molding machine with injection mold, forms the fixation to backbone metal, and form cup.
4, the bracket of injection molding is punched metal with punching Bending Mould on the high velocity ram machine of the auspicious 25T of rainbow, thrust again
(as shown in Figure 1, Figure 2, some positions, while the metal leg 1 outside bending carrier cup form relatively independent single bracket after bending
Shown in Fig. 3, Fig. 4, Fig. 5), single bracket includes: positive and negative anodes sheet metal circuit 1;The high score being moulded on electric metal piece circuit
Sub- resin material 2, which is characterized in that on the one hand the resin material 2 of injection molding forms cup, on the other hand play fixed positive and negative anodes sheet metal
Circuit, sheet metal circuit 1 bottom of a cup positive and negative anodes expose, be used for packaging LED chips, positive and negative anodes sheet metal circuit 1 outside cup
Through being formed close to the leg of rim of a cup towards the bending of rim of a cup direction, according to design, leg can bending wrap the leg 1.2 of rim of a cup
(as shown in Figure 3) or leg be close to the leg 1.1 (as shown in Figure 2) concordant with rim of a cup or beyond rim of a cup in rim of a cup side or
For leg backwards to rim of a cup bending at rim of a cup, formation is wing leg 1.3 (as shown in Figure 4) or leg in injection molding
Intermediate position directly stretches out leg 1.4 (as shown in Figure 5) and leg is made all in rim of a cup face, is adjacent to rim of a cup or close to rim of a cup
LED patch support.
5, on helping light DB382 bonder, by 3 die bond of LED chip on the positive and negative anodes sheet metal circuit 1 of bottom of a cup, baking
3 bonding wire of LED chip is connected to positive and negative anodes sheet metal circuit 1 with metal wire 4 then by ASM-AB350 bonding equipment by solidification
It is upper that glue 5 is then encapsulated by dispenser point, LED chip 3 and metal wire 4 are encapsulated in carrier cup, baking-curing, are made
LED lamp bead (as shown in Fig. 6, Fig. 7, Fig. 8, Fig. 9) at leg in rim of a cup face, then splits into single lamp bead, then large with dazzling
XSFG2013-15050 light splitting machine is screened, and non-defective unit is filtered out, and defective products is directly scrapped, then by the non-defective unit filtered out with dazzling
Large braider tape package.
6, on the wiring board of light transmission 7, using traditional SMT patch mode, with steel mesh by paste solder printing in light transmission route
On the corresponding pad of plate 7, then leg is close to the rim of a cup side LED lamp bead 6.1 concordant with rim of a cup and is mounted onto light transmission wiring board 7
It (as shown in Figure 10) or is that leg bending is wrapped to the attachment of LED lamp bead 6.2 of rim of a cup to (such as Figure 12 on light transmission wiring board 7
It is shown) or be the rim of a cup bending backwards at rim of a cup by leg, light transmission is arrived in the attachment of LED lamp bead 6.3 for forming wing leg
On wiring board 7 (as shown in figure 14), Reflow Soldering welding is crossed, the LED circuit board mould group from wiring board back side illuminated is fabricated to;
LED lamp bead is either corresponded in assist side 7.1 and is shone and locates providing holes 7.2, is shone for LED lamp bead across hole
7.2 project from 7.1 back side of wiring board, and making step is as follows: in assist side 7.1, using traditional SMT patch mode, using
Steel mesh is close to the rim of a cup side LED light concordant with rim of a cup by the corresponding pad of paste solder printing assist side 7.1, then by leg
In the attachment to wiring board 7.1 of pearl 6.1, the luminous place of LED lamp bead 6.1 against hole 7.2 (as shown in figure 11) or is by leg
Bending wraps in the attachment to wiring board 7.1 of LED lamp bead 6.2 of rim of a cup, and the luminous place of LED lamp bead 6.2 is against hole 7.2 (as schemed
Shown in 13) or be the rim of a cup bending backwards at rim of a cup by leg, line is arrived in the attachment of LED lamp bead 6.3 for forming wing leg
On road plate 7.1, the luminous place of LED lamp bead 6.2, or will be straight at the intermediate position of injection molding against hole 7.2 (as shown in figure 15)
It connects in the attachment to wiring board 7.1 of LED lamp bead 6.4 for stretching out leg, LED lamp bead 6.4 inlays the hole 7.2 of the setting of assist side 7.1
In, the light that LED lamp bead 6.4 emits shines out from 7.1 back of route, crosses Reflow Soldering welding, is fabricated to from route back
Luminous LED circuit board mould group.
It is in conjunction with attached drawing that a kind of specific embodiment of LED circuit board mould group from wiring board back side illuminated is practical to this above
It is novel to be described in detail.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes
Some specific embodiments to the scope of the utility model, especially the scope of the claims, and do not have any restrictions.
Claims (3)
1. a kind of LED circuit board mould group from wiring board back side illuminated, comprising:
LED lamp bead;
Wiring board;
It is characterized in that, LED lamp bead is welded on wiring board, on the one hand the casting resin material of LED lamp bead forms cup, another party
Fixed positive and negative anodes sheet metal circuit is played in face, and sheet metal circuit exposes in the positive and negative anodes of bottom of a cup is used for packaging LED chips, positive and negative anodes gold
Belong to piece circuit outside cup towards the bending of rim of a cup direction, is formed close to the leg of rim of a cup, leg wraps rim of a cup or leg is tight
Patch rim of a cup side is concordant with rim of a cup or exceeds rim of a cup or leg at rim of a cup backwards to rim of a cup bending, and formation is wing weldering
Foot or leg have directly been stretched out at the intermediate position of injection molding at wing, and the leg of manufactured LED patch support is all in rim of a cup
Face, is adjacent to rim of a cup or close to rim of a cup, chip is fixed on the metal in bottom of a cup and connects conducting, cup with bottom of a cup positive and negative anodes metal
In there is encapsulation mucilage sealing to live chip, lamp base is soldered in PCB surface at rim of a cup, and the light that lamp bead issues passes through wiring board towards line
Road back issues, and wiring board is that translucent material either has hole to pass through for light at the lamp bead place of shining.
2. a kind of LED circuit board mould group from wiring board back side illuminated according to claim 1, which is characterized in that described
Mould group for making illuminated keyboard, LED light strip, LED light bar, LED display.
3. a kind of LED circuit board mould group from wiring board back side illuminated according to claim 1, which is characterized in that described
The amount of the leg number of LED, which is greater than, is less than or equal to 10 equal to 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821805989.3U CN209104151U (en) | 2018-10-24 | 2018-10-24 | A kind of LED circuit board mould group from wiring board back side illuminated |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821805989.3U CN209104151U (en) | 2018-10-24 | 2018-10-24 | A kind of LED circuit board mould group from wiring board back side illuminated |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209104151U true CN209104151U (en) | 2019-07-12 |
Family
ID=67158096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821805989.3U Withdrawn - After Issue CN209104151U (en) | 2018-10-24 | 2018-10-24 | A kind of LED circuit board mould group from wiring board back side illuminated |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209104151U (en) |
-
2018
- 2018-10-24 CN CN201821805989.3U patent/CN209104151U/en not_active Withdrawn - After Issue
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20190712 Effective date of abandoning: 20220117 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20190712 Effective date of abandoning: 20220117 |