CN111092071A - LED circuit board module capable of emitting light from back of circuit board and manufacturing method thereof - Google Patents
LED circuit board module capable of emitting light from back of circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN111092071A CN111092071A CN201811299551.7A CN201811299551A CN111092071A CN 111092071 A CN111092071 A CN 111092071A CN 201811299551 A CN201811299551 A CN 201811299551A CN 111092071 A CN111092071 A CN 111092071A
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- Prior art keywords
- cup
- circuit board
- led
- welding leg
- light
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 238000001746 injection moulding Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011324 bead Substances 0.000 claims description 40
- 238000005452 bending Methods 0.000 claims description 15
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED circuit board module capable of emitting light from the back of a circuit board and a manufacturing method thereof, in particular to an LED circuit board module capable of emitting light from the back of the circuit board and capable of emitting light from the back of the circuit board through holes in the circuit board or a light-transmitting material, wherein a metal plate is punched and electroplated, then a cup is formed in an injection molding mode, then the metal at two sides is bent towards the direction of a cup opening to form a welding leg which is parallel to or exceeds the cup opening, or the metal at the two sides is bent towards the direction of the cup opening and then is bent to form a welding leg wrapping the cup opening plastic, or the metal is bent towards the direction of the cup opening and then is bent towards the opposite direction of the cup opening to form two wing-shaped welding legs, or the welding leg is directly extended into a wing shape at the middle part of the injection molding mode, then an LED chip.
Description
Technical Field
The invention relates to the field of LEDs and application thereof, in particular to an LED circuit board module capable of emitting light from the back of a circuit board and a manufacturing method thereof.
Background
The leg of traditional LED paster support is all at the bottom of the cup, and the back is welded on the circuit board to the lamp pearl of making, and the cup mouth is towards the circuit board, and the luminous direction of LED is outside luminous back to the circuit board, but some application needs the luminous direction of LED lamp pearl towards the circuit board direction, and is luminous towards the circuit board, and the circuit board at this moment is light-permeable material or has bored a logical unthreaded hole, and this kind of application is generally used in keyboard lamp, or pastes lamp area and display screen etc. on window glass.
In order to meet the requirements of the market, the LED circuit board module capable of emitting light from the back of the circuit board solves the problem that the traditional LED lamp cannot meet the condition that the light emitting direction faces the direction of the circuit board.
Disclosure of Invention
The invention relates to an LED circuit board module capable of emitting light from the back of a circuit board and a manufacturing method thereof, in particular to an LED circuit board module capable of emitting light from the back of the circuit board and capable of emitting light from the back of the circuit board through holes in the circuit board or a light-transmitting material, wherein a metal plate is punched and electroplated, a cup is formed by injection molding, then the metal at two sides is bent towards the direction of a cup opening to form a welding leg which is parallel to or exceeds the cup opening, or the metal plate is bent towards the direction of the cup opening and then bent to form a welding leg wrapping the cup opening plastic, or the metal plate is bent towards the direction of the cup opening and then bent towards the opposite direction of the cup opening to form two wing-shaped welding legs, or the welding leg directly extends out to form a wing shape at the middle part of injection molding, then an LED chip is packaged to form an LED lamp bead.
The invention provides a method for manufacturing an LED circuit board module capable of emitting light from the back of a circuit board, which comprises the following steps of punching and electroplating a metal plate, then carrying out injection molding to form a cup, then bending the metal on two sides outside the cup towards the direction of a cup opening to form a welding leg which is flush with or exceeds the cup opening, or bending the metal towards the direction of the cup opening and then bending the metal towards the cup opening to form a welding leg which is coated with cup opening plastic, or bending the metal towards the direction of the cup opening and then bending the metal towards the opposite direction of the cup opening to form two wing-shaped welding legs, or directly extending the welding leg into a wing shape at the middle part of injection molding, then packaging an LED chip on a welding spot at the bottom of the cup by using a support to manufacture an LED lamp bead with the welding leg on the surface of the cup opening, welding the cup opening towards the circuit board by using the lamp bead to the circuit board, wherein the light-emitting part.
According to the present invention, there is also provided an LED circuit board module emitting light from the back surface of a circuit board, comprising: LED lamp beads; a circuit board; the LED chip mounting structure is characterized in that an LED lamp bead is welded on a circuit board, an injection molding resin material of the LED lamp bead forms a cup on one hand, and fixes a positive and negative electrode metal sheet circuit on the other hand, the positive and negative electrodes of the metal sheet circuit at the bottom of the cup are exposed for packaging an LED chip, the positive and negative electrode metal sheet circuit is bent towards the direction of the cup mouth outside the cup to form a welding leg close to the cup mouth, the welding leg wraps the cup mouth, or the welding leg is tightly attached to the side surface of the cup mouth and is flush with or exceeds the cup mouth, or the welding leg is bent back to the cup mouth at the cup mouth to form a wing-shaped welding leg, or the welding leg directly extends out to form a wing shape at the middle part of injection molding, the welding leg of the manufactured LED chip mounting bracket is tightly attached to the cup mouth or close to the cup mouth, the chip is fixed on a metal on the cup bottom and is; the lamp base is welded on the surface of the circuit board at the cup mouth, light emitted by the lamp beads passes through the circuit board and is emitted towards the back of the circuit board, and the light-emitting position of the lamp beads on the circuit board is made of light-transmitting materials or is provided with holes for light to pass through.
According to a preferred embodiment of the invention, the LED circuit board module capable of emitting light from the back of the circuit board is characterized in that the module is used for manufacturing a light-emitting keyboard, an LED strip and an LED display screen.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of an LED holder with a solder leg on a cup surface.
FIG. 2 is a schematic cross-sectional view of an LED bracket with solder legs attached to the side of a cup opening and aligned with the cup opening.
FIG. 3 is a schematic cross-sectional view of an LED bracket with a leg that can be bent to wrap the cup opening.
FIG. 4 is a schematic cross-sectional view of an LED support with the solder legs bent back toward the cup rim at the cup rim to form a wing solder leg.
Fig. 5 is a schematic cross-sectional view of an LED mount with solder fillets extending directly from the middle of the injection molding.
FIG. 6 is a schematic cross-sectional view of an LED chip packaged on an LED support with solder legs attached to the side of a cup opening and flush with the cup opening.
Fig. 7 is a schematic cross-sectional view of the LED chip packaged on the LED support with the solder legs being bent to wrap the cup opening.
Fig. 8 is a schematic cross-sectional view of an LED chip after being packaged on an LED support with solder fillets.
Fig. 9 is a schematic cross-sectional view of the LED chip packaged on the LED support with the solder leg directly extending from the middle of the injection molding.
FIG. 10 is a schematic cross-sectional view of the LED lamp bead of FIG. 6 soldered on a light-transmitting circuit board.
FIG. 11 is a schematic cross-sectional view of the LED lamp bead of FIG. 6 welded on a circuit board, and a light hole is formed on the circuit board corresponding to the light emitting position of the LED lamp bead.
FIG. 12 is a schematic cross-sectional view of the LED lamp bead of FIG. 7 soldered on a light-transmitting circuit board.
Fig. 13 is a schematic cross-sectional view of the LED lamp bead of fig. 7 welded on a circuit board, and a light hole is formed on the circuit board corresponding to the light emitting position of the LED lamp bead.
FIG. 14 is a schematic cross-sectional view of the LED lamp bead of FIG. 8 soldered on a light-transmitting circuit board.
FIG. 15 is a schematic cross-sectional view of the LED lamp bead of FIG. 8 welded on a circuit board, and a light hole is formed on the circuit board corresponding to the light emitting position of the LED lamp bead.
Fig. 16 is a schematic cross-sectional view of the LED lamp bead of fig. 9 soldered on a circuit board, the LED lamp bead embedded in a hole formed in the circuit board, and light emitted by the LED lamp bead irradiated from the back of the circuit board.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
1. And punching and cutting the iron plate strip into a prototype circuit of the whole roll of the LED bracket according to the design on a rainbow 45T high-speed punching machine by using a die.
2. And carrying out surface silver plating treatment on the whole coiled prototype circuit of the LED bracket by using an Oumet plating line.
3. And (3) performing injection molding on the sunfine injection molding machine by using an injection mold to form the fixation of the bracket metal and form the cup.
4. Punching metal on the injection-molded bracket by using a punching and bending die on a high-speed punching machine of an iridescent 25T, punching some parts again, bending a metal welding leg 1 outside a bracket cup at the same time, and forming a relatively independent single bracket after bending (as shown in figures 1, 2, 3, 4 and 5), wherein the single bracket comprises: positive and negative electrode sheet metal circuits 1; the polymer resin material 2 injected on the electric sheet metal circuit is characterized in that the injected resin material 2 forms a cup on one hand and fixes a positive and negative sheet metal circuit on the other hand, the sheet metal circuit 1 is exposed at the positive and negative poles of the cup bottom, used for packaging LED chips, the positive and negative metal sheet circuits 1 are bent towards the cup mouth outside the cup to form welding feet close to the cup mouth, according to the design, the welding leg can be bent to wrap the welding leg 1.2 of the cup mouth (as shown in figure 3), or the welding leg is tightly attached to the side surface of the cup mouth and is flush with the cup mouth or exceeds the welding leg 1.1 of the cup mouth (as shown in figure 2), or the welding leg is bent back to the cup mouth to form a wing-shaped welding leg 1.3 (as shown in figure 4), or the welding leg directly extends out of the welding leg 1.4 (as shown in figure 5) at the middle part of the injection molding to form the LED patch bracket with the welding leg on the cup mouth surface and tightly attached to the cup mouth or close to the cup mouth.
5. On a crystal fixing machine of the Youmi DB382, fixing a crystal of an LED chip 3 on a positive and negative sheet metal circuit 1 at the bottom of a cup, baking and curing, connecting a bonding wire of the LED chip 3 to the positive and negative sheet metal circuit 1 by a metal bonding wire 4 through an ASM-AB350 bonding machine, dispensing and packaging glue 5 through a dispensing machine, packaging the LED chip 3 and the metal bonding wire 4 in a support cup, baking and curing to manufacture LED lamp beads with welding feet on the cup surface (as shown in fig. 6, 7, 8 and 9), folding and dividing into single lamp beads, screening by a dazzling XS2013-15050 light splitting machine, screening out good products, directly scrapping the defective products, and packaging the screened good products by a dazzling braiding machine.
6. On a light-transmitting circuit board 7, adopting a traditional SMT (surface mount technology) pasting mode, printing solder paste on a corresponding bonding pad of the light-transmitting circuit board 7 by using a steel mesh, pasting a welding foot on the side surface of a cup opening and pasting an LED lamp bead 6.1 with the same level as the cup opening on the light-transmitting circuit board 7 (as shown in figure 10), or pasting an LED lamp bead 6.2 with the cup opening covered by bending the welding foot on the light-transmitting circuit board 7 (as shown in figure 12), or bending the welding foot at the cup opening back to the cup opening to form a wing-shaped welding foot, pasting an LED lamp bead 6.3 on the light-transmitting circuit board 7 (as shown in figure 14), and manufacturing an LED circuit board module capable of emitting light from the back of the circuit board through reflow soldering;
or a hole 7.2 is arranged on the circuit board 7.1 corresponding to the light-emitting position of the LED lamp bead and used for emitting light from the back of the circuit board 7.1 through the hole 7.2, and the manufacturing steps are as follows: on a circuit board 7.1, a traditional SMT (surface mount technology) mounting mode is adopted, solder paste is printed on a corresponding bonding pad of the circuit board 7.1 by a steel mesh, a welding foot is tightly attached to the side surface of a cup opening and an LED lamp bead 6.1 with the cup opening flush is mounted on the circuit board 7.1, the light emitting part of the LED lamp bead 6.1 faces to a hole 7.2 (shown in figure 11), or the LED lamp bead 6.2 with the welding foot bent and wrapped on the cup opening is mounted on the circuit board 7.1, the light emitting part of the LED lamp bead 6.2 faces to a hole 7.2 (shown in figure 13), or the welding foot is bent at the cup opening back to the cup opening, the LED lamp bead 6.4 with a wing-shaped welding foot is mounted on the circuit board 7.1, the light emitting part of the LED lamp bead 6.4 directly extending out of the welding foot in the middle part of injection molding is mounted on the circuit board 7.1, the LED lamp bead 6.4 is embedded in the hole 7.2 arranged in the circuit board 7.1, and the light emitting surface of the LED lamp bead 6.1 is emitted from the back of the circuit board 7.1, and (4) performing reflow soldering to manufacture the LED circuit board module which emits light from the back of the circuit board.
The invention has been described in detail with reference to the drawings, wherein specific embodiments of an LED circuit board module emitting light from the back surface of a circuit board and a method for manufacturing the same are shown. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (4)
1. A manufacturing method of an LED circuit board module capable of emitting light from the back of a circuit board comprises the steps of punching and electroplating a metal plate, then forming a cup through injection molding, then bending the metal on two sides outside the cup towards the direction of a cup opening to form a welding leg which is parallel to or exceeds the cup opening, or bending towards the direction of the cup opening and then bending towards the cup opening to form a welding leg wrapping the cup opening plastic, or bending towards the direction of the cup opening and then bending towards the opposite direction of the cup opening to form two wing-shaped welding legs, or directly extending the welding leg into a wing shape at the middle part of injection molding, then packaging an LED chip on a welding spot at the bottom of the cup through a support to form an LED lamp bead with the welding leg on the cup opening surface, welding the cup opening of the lamp bead onto the circuit board, and enabling the circuit board to be light-transmitting at the luminous position of the lamp bead, namely manufacturing the LED circuit board module.
2. An LED wiring board module that emits light from the back of a wiring board, comprising:
LED lamp beads;
a circuit board;
the LED chip mounting structure is characterized in that an LED lamp bead is welded on a circuit board, an injection molding resin material of the LED lamp bead forms a cup on one hand, and fixes a positive and negative electrode metal sheet circuit on the other hand, the positive and negative electrodes of the metal sheet circuit at the bottom of the cup are exposed for packaging an LED chip, the positive and negative electrode metal sheet circuit is bent towards the cup mouth outside the cup to form a welding leg close to the cup mouth, the welding leg wraps the cup mouth, or the welding leg is tightly attached to the side surface of the cup mouth and is flush with or exceeds the cup mouth, or the welding leg is bent back to the cup mouth at the cup mouth to form a wing-shaped welding leg, or the welding leg is directly extended into a wing shape at the middle part of injection molding, the welding leg of the manufactured LED chip mounting bracket is tightly attached to the cup mouth or close to the cup mouth, the chip is fixed on a metal on the cup bottom and is connected and conducted with the positive and negative electrodes of the cup bottom, the chip, the light that the lamp pearl sent passes the circuit board and sends towards the circuit board back, and the circuit board is the printing opacity material or is porose to be used for light to pass at the luminous department of lamp pearl.
3. The LED circuit board module capable of emitting light from the back of a circuit board according to claim 1 or 2, wherein the module is used for manufacturing a light-emitting keyboard, an LED lamp strip and an LED display screen.
4. The LED circuit module according to claim 1 or 2, wherein the number of the legs of the LED is 2 or more and 10 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811299551.7A CN111092071A (en) | 2018-10-24 | 2018-10-24 | LED circuit board module capable of emitting light from back of circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811299551.7A CN111092071A (en) | 2018-10-24 | 2018-10-24 | LED circuit board module capable of emitting light from back of circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111092071A true CN111092071A (en) | 2020-05-01 |
Family
ID=70392694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811299551.7A Withdrawn CN111092071A (en) | 2018-10-24 | 2018-10-24 | LED circuit board module capable of emitting light from back of circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111092071A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023103158A1 (en) * | 2021-12-07 | 2023-06-15 | 东莞市欧思科光电科技有限公司 | Led base module, led module, and led light strip |
-
2018
- 2018-10-24 CN CN201811299551.7A patent/CN111092071A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023103158A1 (en) * | 2021-12-07 | 2023-06-15 | 东莞市欧思科光电科技有限公司 | Led base module, led module, and led light strip |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200501 |