CN208938562U - Display device - Google Patents

Abstract

The utility model discloses a kind of display devices, belong to LED display field, and the display device includes first device, for providing multiple pixel units；Second device, for providing driving signal for the first device；And 3rd device, to provide being electrically connected between the second device and the first device, it is characterised in that: the 3rd device includes attachment device with multi-layer structure, including top layer, bottom and middle layer；Wherein, the bottom die bond of the 3rd device has the second device；There is the first device in the top layer die bond of the 3rd device.The utility model solves the problems such as display screen producer difficulty of processing is high, maintenance difficulty is high.

Description

Display device

Technical field

The utility model relates to LED display fields, and in particular to a kind of small spacing is shown and the fields such as multimedia display.

Background technique

LED has discrete and integrated two kinds of packing forms.LED (Light Emitting Diode, light emitting diode) is discrete Device belongs to conventional package, is widely used in each relevant field.Integrated chip module belongs to personalized encapsulation at present, mainly For some cases application product and design and produce.Traditional LED way is due to no ready-made suitable core light source group Part and the way taken, not only work consuming is time-consuming, and higher cost.

There is some superiority using the small clearance display screen tradition LED relatively of integrated packaged type.One of which display Screen includes multiple LED die groups, multiple driving wafers and single layer pcb board (Printed Circuit Board, printed circuit Plate), each LED die group includes three LED dies, respectively red LED wafer, green LED wafer and blue led wafer, Its mode for driving wafer and LED die group to be all made of upside-down mounting is welded on the component side of single layer pcb board, and driving wafer is double Line triple channel LED constant current drives non-packed IC (Integrated Circuit integrated circuit), and each driving wafer drives a LED Wafer group, and cascaded with other driving wafers.In addition, this is aobvious there are also a kind of extra small spacing waterproof energy-saving type LED electronic display Display screen includes LED lamp tube, pcb board and IC driving, wherein spacing is put in the rectangular front for being evenly distributed on pcb board of LED lamp tube Driving the SSOP using ultra-miniature structures for 1mm-4.5mm, IC, (Shrink Small Out-Line Package, scaled-down version are small Outline packages) it is encapsulated in the back side of pcb board.

The IC needed in the case of the smaller same area of spacing is more, and pcb board can not be placed because of space problem IC.In documents Small clearance display screen there are also more optimization spaces.

Utility model content

The technical problems to be solved in the utility model is that the more driving lists of placement are integrated on limited pcb board space Member increases the resolution ratio of RGBR virtual representation vegetarian refreshments to realize the LED display of extra small spacing.

In order to solve the above technical problems, the utility model embodiment the technical solution adopted is that:

A kind of display device disclosed in the utility model, it includes first device, for providing multiple pixel units；The Two devices, for providing driving signal for the first device；And 3rd device, to provide the second device with it is described Electrical connection between first device, it is characterised in that: the second device includes driving device；The 3rd device includes having The attachment device of multilayered structure, including top layer, bottom and middle layer；Wherein, the bottom die bond of the 3rd device has the second dress It sets；There is first device in the top layer die bond of the 3rd device.

The utility model has the beneficial effects that:

It is routed using the attachment device with Miltilayer wiring structure, so that the wiring of circuit board is more reasonable, electromagnetism is simultaneous Capacitive is more preferable.Simultaneously the direct die bond of driving unit attachment device bottom, and the direct die bond of LED display unit connection fill The top layer set largely optimizes the layout structure of display device, allows to dispose more in limited typesetting area More driving units realizes smaller spacing and shows, also increases the resolution ratio of RGBR virtual representation vegetarian refreshments.

Detailed description of the invention

By referring to the drawings to the description of the utility model embodiment, above-mentioned and other mesh of the utility model , feature and advantage will be apparent from.

Fig. 1 shows the positive view of display device part-structure in the utility model embodiment；

Fig. 2 shows the top level structure schematic diagram of attachment device in the utility model embodiment；

Fig. 3 shows the fabric schematic diagram of attachment device in the utility model embodiment；

Fig. 4 shows single connection structure signal between driving unit and attachment device in the utility model embodiment Figure；

Fig. 5 shows the arranged distribution schematic diagram of part first device in the utility model embodiment；

Fig. 6 a to Fig. 6 b shows the chip pin figure and its functional diagram of encapsulating housing in the utility model embodiment.

Specific embodiment

Hereinafter reference will be made to the drawings is more fully described the utility model.In various figures, identical element is using similar Appended drawing reference indicate.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.In addition, may in figure Certain well known parts are not shown.

Many specific details of the utility model, such as the structure of device, material, size, place are described hereinafter Science and engineering skill and technology, to be more clearly understood that the utility model.But just as the skilled person will understand, The utility model can not be realized according to these specific details.

Particularly, specific explanations will be made to some words occurred in text herein, in order to correct understanding.Die bond (Die Bond, also known as load), that is, pass through colloid (being usually conducting resinl or insulating cement for LED) wafer bonding in bracket Specified region, form heat passage or electric pathway.It is a kind of craft method.But does not limit in the present invention and use colloid Fix a kind of this method.

In the following, the utility model is described in detail referring to attached drawing.

It is as shown in Figure 1 the positive view of display device part-structure in the utility model embodiment.

As shown in Figure 1, the display device includes: first device 6, for providing multiple pixel units；Second device 1, For providing driving signal for the first device 6；And 3rd device 4, to provide the second device 1 and described first Electrical connection between device 6.Wherein, the 3rd device 4 is attachment device with multi-layer structure, including bottom 41, centre Layer 42 and top layer 43；The bottom die bond of the 3rd device has second device 1；Have first in the top layer die bond of the 3rd device Device 6.Bracket 2 is provided on the bottom 41 of the attachment device 4, the bracket 2 is to mix using made of composite material Integral support, and direct die bond has the second device 1 thereon.The multiple bracket 2 passes through fixed device 7 and is bonded in connection dress It sets on 4, and remains with conductive channel in the fixed device 7.The top layer 43 of the attachment device is provided with multiple bases Plate 5, direct die bond has the first device 6 on the substrate 5.

Further, in the utility model embodiment, the first device includes multiple LED display units；Described Two devices include driving device, and the driving device includes multiple driving units, wherein the second device is to provide Driving signal needed for one device；The attachment device includes pcb board, to realize the first device and the second device Electrical connection.

Wherein, the fixed device 7 includes insulating cement, can simplify production to a certain extent using the fixing means Technique, save the cost.

Fig. 2 show the top level structure schematic diagram of attachment device in the utility model embodiment.

As shown in Fig. 2, being provided with multiple substrates 6 on the top layer 43 of the attachment device 4, while on the substrate 6 Direct die bond has first device 5.

In the present embodiment, the substrate 6 being alternatively arranged for tight type on top layer 43, described first on the substrate Each LED display unit is evenly distributed between device, can optimize space layout in this way, can save the cloth of single led display unit Office space helps to improve what display screen was shown so that carrying out more LED display unit settings in identical typesetting area Effect and quality.It is also beneficial to post-production and maintenance and inspection simultaneously.

Fig. 3 show the fabric schematic diagram of attachment device in the utility model embodiment.

As shown in figure 3, being provided with bracket 2 on the bottom 41 of the attachment device 4, there is direct die bond on the bracket 2 The specific position of second device 1, the bracket is equipped with multiple through-holes 3 through bracket 2, to realize the second device 1 Being electrically connected between the attachment device.In the present embodiment simultaneously, the bracket 2 is that entirety is mixed made of composite material Bracket, easy to process and production.

Fig. 4 show single connection structure signal between driving unit and attachment device in the utility model embodiment Figure.

As shown in figure 4, the direct die bond of the second device 1 is spaced in the specific region on bracket 2 on bracket 2 Multiple through-holes 3 are provided with, the through-hole 3 is used as the conductive channel of second device 1 Yu attachment device 4.Bracket 2 passes through fixation Device 7 is fixed in attachment device 4, wherein remaining conductive channel in the fixed device 7.The second device 1 passes through branch Frame 2 and the finished product module that more pins are packaged into using special gluing process.

Wherein, the second device 1 can be using the driving unit of novel ranks unification, small in size, outside line structure Simply, peripheral component is few, while having low voltage difference, and display screen can be improved in high constant current accuracy and superpower plug-in driving capability Use quality and service life.

In the present embodiment, since the die bond technology of use handles driving unit, it can effectively reduce each drive The volume of dynamic IC allows to arrange more drivings IC in limited pcb board face, and integrated level is higher, and driving capability is stronger, The problem of also having better solved small spacing simultaneously, enhances the resolution ratio of display screen.

Fig. 5 show the arranged distribution schematic diagram of part first device in the utility model embodiment, straight on the pedestal 5 Connecing die bond has first device 6, and is packaged using the technique of COB or CSP.Wherein, COB or CSP is chip on board encapsulation Technology is one of bare chip mounting technique: IC bare die is fixed in printed wiring board by COB (chip On board) encapsulation, It is namely to be adhered directly to chip then to be encapsulated with black glue on PCB with the electric link that wire bonding reaches chip and PCB.Institute Stating encapsulating is thermoplastic or thermosetting resin to be applied on product with the methods of brushing, dip-coating, spraying, and make its appearance Face is all wrapped by and a kind of operation as protective coating or insulating layer.It solves LED heat dissipation problem, saves space, simplification Packaging operation has efficient heat management mode.CSP (Chip Scale Package) encapsulation, is the meaning of wafer-level package. CSP encapsulates the memory chip encapsulation technology of latest generation, and technical performance has new promotion again.CSP encapsulation can allow chip The ratio between area and package area are more than 1:1.14, and the ideal situation of fairly close 1:1, absolute dimension also only have 32 squares of millis Rice, the 1/3 of about common BGA, only just correspond to the 1/6 of TSOP memory chip area.Compared with BGA package, same space Memory capacity can be improved three times by lower CSP encapsulation.

Fig. 6 a to Fig. 6 b shows the chip pin figure and its functional diagram of encapsulating housing in the utility model embodiment.

In the utility model embodiment, encapsulating housing is additionally provided with outside the driving unit 1.The encapsulating housing is used to pair It is packaged by the driving circuit that driving unit 1 described in the utility model is constituted.The encapsulating housing has first side, the Dual side-edge, third side and four side, wherein the first side and the third side are relatively parallel, and described second Side and the four side are relatively parallel.

It as shown in Figure 6 a, is the pinouts of encapsulating housing in the utility model embodiment.In the present embodiment, the encapsulation Shell has multiple pins, wherein the multiple pin is evenly distributed on one or more sides of the encapsulating housing. It is described by taking the final package device of 8 pins as an example herein.Such as: first pin to the 4th pin is sequentially located at One side of the encapsulating housing, the 5th pin to the 8th pin are sequentially located at its relative side；Or in the encapsulation There are two pin and sequentials on first to fourth side of shell.

As Fig. 6 b shows each pin function figure of encapsulating housing in the utility model embodiment.Such as wherein, described One pin is power end VDD, is connected to power supply to provide operating voltage for the driving chip or circuit；The second pin For serial data output terminal SD0, to transmitting serial data signal；The third pin is serial clock output end CLK0, is used To transmit serial clock signal；4th pin is scanning serial output terminal SEL0, to connect the scanning of next stage driving Serial input terminal；5th pin is scanning serial input terminal SEL1, to connect the scanning Serial output of upper level driving End；6th pin is serial clock input terminal CLK1, to receive serial clock signal；7th pin is serial number According to input terminal SD1, to receive serial data signal；8th pin is ground terminal GND, to for the driving chip or Driving circuit provides zero-potential point.

It should be noted that positional relationship of the pin on encapsulating housing might not only have two kinds of cited rows Column relationship, other some position Rankine-Hugoniot relations obtained under the premise of those skilled in the art do not make the creative labor, Also it should be within the protection scope of the utility model.

Further, the number of pins of the encapsulating housing be less than or equal to 8, while each adjacent leads spacing be 2.54 ± 0.25mm, for ease of maintenaince.

Further, the making material of the encapsulating housing includes black glue, but is not limited only to black glue.

In the utility model embodiment, the attachment device is multilayered structure, and cloth is mainly carried out in wherein interbed 42 Line, in this way since save a part wiring space go to dispose more driving devices, further realize display device Small spacing, the wiring of internal planes can also be optimized at the same time, keep the wiring of circuit board more reasonable, Electro Magnetic Compatibility is more It is good.

The utility model be by small spacing show based on the high integration display device researched and developed, solve display screen production system Make quotient's difficulty of processing height, the high problem of maintenance difficulty.Using display device described in the utility model, may be implemented between smaller point Away from making invocation point spacing be less than the degree equal to 0.625mm.Manufacturing cost and difficulty can also be reduced simultaneously, is promoted Production efficiency.

It should be noted that herein, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that There is also other identical elements in process, method, article or equipment including the element.

Finally, it should be noted that obviously, above-described embodiment is merely examples for clearly illustrating the present invention, And it does not limit the embodiments.For those of ordinary skill in the art, may be used also on the basis of the above description To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.And thus Changes and variations that derived from still in the protection scope of the utility model among.

Claims (15)

1. a kind of display device, comprising:

First device, for providing multiple pixel units；

Second device, for providing driving signal for the first device；And

3rd device, to provide being electrically connected between the second device and the first device,

It is characterized by:

The 3rd device includes attachment device with multi-layer structure, including top layer, bottom and middle layer；

Wherein, the bottom die bond of the 3rd device has the second device；

There is the first device in the top layer die bond of the 3rd device.

2. display device according to claim 1, it is characterised in that: the first device includes multiple LED display units.

3. display device according to claim 1, it is characterised in that: the second device includes multiple driving units.

4. display device according to claim 1, it is characterised in that: the attachment device includes pcb board.

5. display device according to claim 1, it is characterised in that: the middle layer of the attachment device includes wiring layer.

6. display device according to claim 5, it is characterised in that: the wiring layer includes at least one with layer cloth The wiring plate of cable architecture.

7. display device according to claim 1, it is characterised in that: the second device is filled by bracket die bond in connection It sets, the first device is by substrate die bond in attachment device.

8. display device according to claim 7, it is characterised in that: between the bracket and attachment device and the base Fixed device is provided between plate and attachment device, the bracket and substrate are fixed in attachment device.

9. display device according to claim 8, it is characterised in that: the fixed device includes that insulating cement or cutting ferrule agree with Device.

10. display device according to claim 7, it is characterised in that: the bracket is equipped with through bracket and interval cloth The multiple through-holes set, to realize being electrically connected for the second device and the attachment device.

11. display device according to claim 1, it is characterised in that: the display device further includes encapsulating housing, its position In the second device outer surface, to be packaged to the second device.

12. display device according to claim 11, which is characterized in that the encapsulating housing includes: first side, second Side, third side and four side, and multiple pins on one or more of sides.

13. display device according to claim 12, which is characterized in that the multiple pin includes:

First pin, first pin is power end, to provide operating voltage；

Second pin, the second pin is serial data output terminal, to transmitting serial data signal；

Third pin, the third pin is serial clock output end, to transmit serial clock signal；

4th pin, the 4th pin is scanning serial output terminal, to connect the scanning serial input terminal of next stage driving；

5th pin, the 5th pin is scanning serial input terminal, to connect the scanning serial output terminal of upper level driving；

6th pin, the 6th pin is serial clock input terminal, to receive serial clock signal；

7th pin, the 7th pin is serial data input, to receive serial data signal；

8th pin, the 8th pin is ground terminal, to provide zero-potential point.

14. display device according to claim 12, it is characterised in that: the number of pins of the encapsulating housing is less than or equal to 8, And adjacent leads spacing is 2.54 conventional ± 0.25mm.

15. display device according to claim 11, it is characterised in that: the making material of the encapsulating housing includes black Glue.