CN208806246U - Fan-out-type antenna packages structure - Google Patents
Fan-out-type antenna packages structure Download PDFInfo
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- CN208806246U CN208806246U CN201821755419.8U CN201821755419U CN208806246U CN 208806246 U CN208806246 U CN 208806246U CN 201821755419 U CN201821755419 U CN 201821755419U CN 208806246 U CN208806246 U CN 208806246U
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Abstract
The utility model provides a kind of fan-out-type antenna packages structure, and fan-out-type antenna packages structure includes: re-wiring layer, and re-wiring layer includes opposite the first face and the second face；Stack at least two layers of antenna structure of setting, antenna structure is located on the second face of re-wiring layer, it is electrically connected with the metal wiring layer in re-wiring layer, the side of antenna structure has same plane, and the projection of antenna structure in the horizontal direction covers metal wiring layer；Semiconductor chip and metal coupling on the first face of re-wiring layer, and are electrically connected with metal wiring layer, and the projection covering semiconductor chip and metal coupling of antenna structure in the horizontal direction.To formed stack setting have stacked antenna structure, high effective antenna performance, the fan-out-type antenna packages structure of high conformability；The characteristic that metal wiring layer, semiconductor chip and metal coupling are covered by the projection of antenna structure in the horizontal direction, can be improved product quality.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation, is related to a kind of fan-out-type antenna packages structure.
Background technique
It is more inexpensive, more reliable, faster and more highdensity circuit be integrated antenna package pursue target.In future,
Integrated antenna package will improve the integration density of various electronic components by constantly reducing characteristic size.Currently, common
Packaging method includes: wafer level chip scale encapsulation (Wafer Level Chip Scale Packaging, WLCSP), is fanned out to
Type wafer-level packaging (Fan-Out Wafer Level Package, FOWLP), flip-chip (Flip Chip), stacked package
(Package on Package, POP) etc..Wherein, FOWLP is since its input/output end port (I/O) is more, integrated flexible
Property it is preferable, it has also become one of current more common packaging method.
With the increase of universal and people's demand of high-tech electronic product, especially for the mobile demand of cooperation,
Most high-tech electronic product both increases the function of wireless telecommunications.
In general, existing antenna structure is usually the surface that antenna is directly made in circuit board, this way meeting
Antenna is allowed to occupy additional board area, conformability is poor.For various high-tech electronic products, if antenna is direct
Be made in the surface of circuit board, will need that there is large volume of circuit board so that high-tech electronic product also take up compared with
Big volume, this disagrees the miniaturization of high-tech electronic product, the demand of portable with people, therefore, how to reduce day
The volume of wire encapsulation construction and the integration performance for improving antenna packages structure, will overcome the problems, such as needed for these electronic devices.
In consideration of it, it is necessary to design a kind of novel fan-out-type antenna packages structure, for solving due to antenna packages knot
Structure occupies that volume is big, conformability is poor, caused above-mentioned technical problem.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of fan-out-type antenna packages
Structure, for solving the problems, such as the encapsulation of antenna packages structure in the prior art.
In order to achieve the above objects and other related objects, the utility model provides a kind of fan-out-type antenna packages structure, institute
Stating encapsulating structure includes:
Re-wiring layer, the re-wiring layer include opposite the first face and the second face；
At least two layers of antenna structure of setting is stacked, the antenna structure is located on the second face of the re-wiring layer,
It is electrically connected with the metal wiring layer in the re-wiring layer, the side of the antenna structure has same plane, and the day
The projection of cable architecture in the horizontal direction covers the metal wiring layer；
Semiconductor chip and metal coupling, on the first face of the re-wiring layer, and with the metal wiring layer
Electrical connection, and the projection of the antenna structure in the horizontal direction covers the semiconductor chip and metal coupling.
Optionally, on the second face of the re-wiring layer include stack setting the N layer antenna structure, wherein N >=
3。
Optionally, the range of the thickness of the antenna structure includes 50 μm~1000 μm.
It optionally, further include Underfill layer between the semiconductor chip and the first face of the re-wiring layer.
Optionally, the antenna structure includes metal connecting column, encapsulated layer and antenna metal layer.
Optionally, the encapsulated layer covers the upper surface of the metal connecting column and the aobvious leakage metal connecting column, described
The upper surface that antenna metal layer is located at the encapsulated layer is electrically connected with the metal connecting column.
Optionally, the bottom of the metal connecting column is also connected with cross-sectional area and connects greater than the metal of the metal connecting column
Connect block.
Optionally, the metal connecting column includes golden metal connecting column, silver metal connecting column, copper metal connecting column and aluminium gold
Belong to one of connecting column.
Optionally, the encapsulated layer includes one of epoxy resin layer, polyimide layer and layer of silica gel.
Optionally, the metal coupling includes in copper metal convex block, nickel metal coupling, tin metal convex block and silver metal convex block
One kind.
As described above, the fan-out-type antenna packages-structure of the utility model, can form stacking setting has stacked antenna
Structure, high effective antenna performance, the fan-out-type antenna packages structure of high conformability；Pass through the throwing of antenna structure in the horizontal direction
Shadow covers the characteristic of metal wiring layer, semiconductor chip and metal coupling, and product quality can be improved.
Detailed description of the invention
Fig. 1 is shown as the flow diagram of the fan-out-type antenna packages method in the utility model.
The structural representation that each step of fan-out-type antenna packages method that Fig. 2~Figure 16 is shown as in embodiment one is presented
Figure.
The structural representation that each step of fan-out-type antenna packages method that Figure 17~Figure 23 is shown as in embodiment two is presented
Figure.
Figure 24 is shown as the structural schematic diagram of the fan-out-type antenna packages structure in embodiment three.
Component label instructions
101 support substrates
102 separating layers
103 re-wiring layers
113 dielectric layers
123 metal wiring layers
104 first antenna structures
114 first metal link blocks
124 first metal connecting columns
134 first encapsulated layers
144 first antenna metal layers
105 second antenna structures
115 second metal link blocks
125 second metal connecting columns
135 second encapsulated layers
145 second antenna metal layers
106 third antenna structures
116 third metal link blocks
126 third metal connecting columns
136 third encapsulated layers
146 third antenna metal layers
107 semiconductor chips
108 metal couplings
109 Underfill layers
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Please refer to FIG. 1 to FIG. 24.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model is only shown with related component in the utility model rather than when according to actual implementation in schema then
Component count, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind
Become, and its assembly layout kenel may also be increasingly complex.
Embodiment one
Such as Fig. 1, the present embodiment provides a kind of fan-out-type antenna packages methods, comprising the following steps:
Support substrate is provided, forms separating layer in Yu Suoshu support substrate；
In forming re-wiring layer in the separating layer, the re-wiring layer includes to be in contact with the separating layer
On one side and the second opposite face；
In at least two layers of the antenna structure for forming stacking setting on the second face of the re-wiring layer, the antenna structure
It is electrically connected with the metal wiring layer in the re-wiring layer, the re-wiring layer protrudes from the side of the antenna structure；
The projected area of the antenna structure to connect in the horizontal direction differs, and the projection of the antenna structure in the horizontal direction
Cover the metal wiring layer；
Based on the separating layer, appear the first face of the re-wiring layer；
Semiconductor chip is provided, the semiconductor chip is engaged on the first face of the re-wiring layer；In described
Metal coupling is formed on first face of re-wiring layer；The semiconductor chip and metal coupling are electrically connected with the metal wiring layer
It connects, and the projection of the antenna structure in the horizontal direction covers the semiconductor chip and metal coupling.
The present embodiment can form the fan with stacked antenna structure, high effective antenna performance, high conformability for stacking setting
The fan-out-type antenna packages structure of type antenna packages structure out；Pass through the projected area of the antenna structure that connects in the horizontal direction
The projection of equal and antenna structure in the horizontal direction does not cover the characteristic of metal wiring layer, semiconductor chip and metal coupling, can
Save the cost, the volume for improving production efficiency, flexibly controlling fan-out-type antenna packages structure, expand fan-out-type antenna packages structure
The scope of application.
Such as Fig. 2~Figure 16, the structural representation that each step of fan-out-type antenna packages method is presented in the present embodiment is illustrated
Figure.
Such as Fig. 2, support substrate 101 is provided first, forms separating layer 102 in Yu Suoshu support substrate 101.
Specifically, the support substrate 101 includes glass substrate, metal substrate, semiconductor substrate, polymer substrate and pottery
One of ceramic liner bottom, the separating layer 102 include one of adhesive tape and polymeric layer.
As the further embodiment of the embodiment, the support substrate 101 is preferably glass substrate, the separating layer
102 be preferably LTHC photothermal transformation layer.Cost is relatively low for the glass substrate, and is easy to be formed on its surface the LTHC photo-thermal turn
Layer is changed, and the difficulty of the separating technology of the subsequent LTHC photothermal transformation layer can be reduced, such as based on laser to the LTHC photo-thermal
Conversion layer is heated, so that being separated from the LTHC photothermal transformation layer.
Such as Fig. 3, form re-wiring layer 103 in Yu Suoshu separating layer 102, the re-wiring layer 103 include with it is described
The first face and the second opposite face that separating layer 102 connects.
Specifically, making the re-wiring layer 103 the following steps are included: using physical gas-phase deposition or chemical gas
Phase depositing operation forms dielectric layer 113 in 102 surface of separating layer, and performs etching to form figure to the dielectric layer 113
The dielectric layer 113 of change；Using physical gas-phase deposition, chemical vapor deposition process, evaporation process, sputtering technology, galvanizer
Skill or chemical plating process form metal wiring layer 123 in patterned 113 surface of dielectric layer, and to the metal wiring layer
123 perform etching to form patterned metal wiring layer 123.Wherein, the material of the dielectric layer 113 includes epoxy resin, silicon
Glue, PI, PBO, BCB, silica, phosphorosilicate glass, the combination of one or more of fluorine-containing glass；The metal wiring layer
123 material includes the combination of one or more of copper, aluminium, nickel, gold, silver, titanium.Institute in the re-wiring layer 103
The number of plies and distribution pattern for stating metal wiring layer 123, are selected, herein with no restriction according to specific needs.
Such as Fig. 4~Figure 15, the N layer day knot for stacking setting is formed on the second face of Yu Suoshu re-wiring layer 103
Structure, in the present embodiment, the N is 3, that is, includes stacking 3 layers of antenna structure of setting, including first antenna structure 104, the
Two antenna structures 105 and third antenna structure 106.It in another embodiment, can also on the second face of the re-wiring layer 103
The antenna structure including the folded setting of other 3 layer heaps of N >, such as 4 layers, 5 layers or 2 layers are contained only, herein with no restriction.
As the further embodiment of the embodiment, the antenna structure includes metal connecting column, encapsulated layer and antenna gold
Belong to layer.
Specifically, illustrating the structural schematic diagram to form each step of the first antenna structure 104 such as Fig. 4~Fig. 7.
The first antenna structure 104 includes the first metal connecting column 124, the first encapsulated layer 134 and first antenna metal layer 144,
Described in the first metal connecting column 124 be electrically connected with the metal wiring layer 123 in the re-wiring layer 103；Described
One encapsulated layer 134 covers the upper surface of the first metal connecting column 124 and aobvious leakage the first metal connecting column 124；It is described
First antenna metal layer 144 is located at the upper surface of first encapsulated layer 134 and is electrically connected with the first metal connecting column 124
It connects；To form the first antenna structure 104.
As the further embodiment of the embodiment, the method for forming the first metal connecting column 124 includes bonding wire work
Skill, such as one of hot pressing bonding wire craft, supersonic welding Wiring technology and thermosonic bonding wire craft.The first metal connection
The material of column 124 includes one of Au, Ag, Cu, Al or combination.
As the further embodiment of the embodiment, the method for forming first encapsulated layer 134 includes compression forming, passes
One of molded, fluid-tight molding, vacuum lamination and spin coating are passed, the material of first encapsulated layer 134 includes polyamides Asia
One of amine, silica gel and epoxy resin.
Specifically, in the present embodiment, the horizontal cross-section pattern of the support substrate 101 use more common diameter for
The circle of 300mm can also select the specific size and pattern of the support substrate 101, herein with no restriction as needed.Then
It is support with the re-wiring layer 103, forms the first antenna structure on the second face of the re-wiring layer 103
104.The re-wiring layer 103 protrudes from the side of the first antenna structure 104, that is, protrudes from first encapsulated layer
134 side, the horizontal cross-section pattern of first encapsulated layer 134 can be used diameter be less than 300mm circle, as 297mm,
294mm and 291mm etc., preferably diameter are 294mm, in order to provide the horizontal area of the first sufficiently large encapsulated layer 134
While, the reserved space that can prepare subsequent second antenna structure 105 for stacking setting.Forming first encapsulated layer
After 134, the method that grinding or polishing can be used acts on the upper surface of first encapsulated layer 134, with provide it is smooth described in
First encapsulated layer 134 improves product quality.The projection of first encapsulated layer 134 in the horizontal direction covers the hardware cloth
Line layer 123 avoids in subsequent technique in order to protect the metal wiring layer 123 to the damage of the metal wiring layer 123
Wound, it is ensured that product quality.
As the further embodiment of the embodiment, the method for forming the first antenna metal layer 144 includes physics gas
One of phase depositing operation, chemical vapor deposition process, evaporation process, sputtering technology, electroplating technology or chemical plating process.
Specifically, forming the first antenna metal layer 144 in the upper surface of first encapsulated layer 134, then use
Etching technics forms the required patterned first antenna metal layer 144, and the edge of the first antenna metal layer 144 is preferred
There is the distance of 1mm~5mm for the side apart from first encapsulated layer 134, to protect the first antenna metal layer 144,
Avoid damage in the subsequent process.
Such as Fig. 8~Figure 11, the structural schematic diagram of each step of second antenna structure 105 is illustrated.Described second day
Cable architecture 105 includes the second metal connecting column 125, the second encapsulated layer 135 and the second antenna metal layer 145, wherein described second
Metal connecting column 125 is electrically connected with the first antenna metal layer 144 in the first antenna structure 104；Second envelope
Dress layer 135 covers the upper surface of the second metal connecting column 125 and aobvious leakage the second metal connecting column 125；Described second
Antenna metal layer 145 is located at the upper surface of second encapsulated layer 135 and is electrically connected with the second metal connecting column 125；From
And form second antenna structure 105.Specific method and material are with the first antenna structure 104, and details are not described herein again.
As the further embodiment of the embodiment, second antenna structure 105 can coat the first antenna structure
104, so that the effective volume of the antenna structure can remain unchanged while forming the antenna structure for stacking setting.
Second antenna structure 105 and the Cross Section Morphology of first antenna structure 104 include circle, and second antenna structure 105
Diameter to be greater than the range of diameter of the first antenna structure 104 include 3mm~30mm.
Specifically, when forming second encapsulated layer 135, can first encapsulated layer 134 side with it is described heavy
The reserved space of new route layer 103, prepares second encapsulated layer 135.The horizontal cross-section shape of second encapsulated layer 135
Looks can be used the circle that diameter is less than 300mm, such as 297mm, 294mm and 291mm, in the present embodiment, due to first envelope
The diameter for filling layer 134 is preferably 294mm, and therefore, the diameter of second encapsulated layer 135 is preferably 297mm, thus forming heap
While the folded antenna structure, so that second antenna structure 105 can be with the second face phase of the re-wiring layer 103
Contact keeps the effective volume in second antenna structure 105 to remain unchanged compared with the first antenna structure 104.
As the further embodiment of the embodiment, the top of second antenna structure 105 may also include described first
Antenna structure 104 is combined in the loop structure formed by the first antenna structure 104 with second antenna structure 105
One kind, to further increase the integrated level and integration performance of the fan-out-type antenna packages structure.
Such as Figure 12~Figure 15, the structural schematic diagram for preparing each step of the third antenna structure 106 is illustrated.Described
Triantennary structure 106 includes third metal connecting column 126, third encapsulated layer 136 and third antenna metal layer 146, wherein described
Third metal connecting column 126 is electrically connected with the second antenna metal layer 145 in second antenna structure 105；Described
Three encapsulated layers 136 cover the upper surface of the third metal connecting column 126 and the aobvious leakage third metal connecting column 126；It is described
Third antenna metal layer 146 is located at the upper surface of the third encapsulated layer 136 and is electrically connected with the third metal connecting column 126
It connects；To form the third antenna structure 106.Specific method and material are no longer superfluous herein with the first antenna structure 104
It states.The third antenna structure 106 is preferably the first antenna structure 104, in order to save the cost, improves the convenient of operation
Property, the encapsulated layer as described in can be prepared with the first antenna structure 104 using same mold.In another embodiment, described
The top of two antenna structures 105, which may also include to be combined by the first antenna structure 104 with second antenna structure 105, to be formed
One of loop structure, to further increase the conformability of the antenna structure, and ensure the effective of the antenna structure
Constancy of volume.
Then such as Figure 16, the support substrate 101 is separated based on the separating layer 102, to appear the re-wiring layer
103 the first face.Semiconductor chip 107 is then provided, the semiconductor chip 107 is engaged in the re-wiring layer 103
The first face on；In formation metal coupling 108 on the first face of the re-wiring layer 103；The semiconductor chip 107 and gold
Belong to convex block 108 to be electrically connected with the metal wiring layer 123, and the projection covering described half of the antenna structure in the horizontal direction
Conductor chip 107 and metal coupling 108, to ensure subsequent product quality.
Specifically, can be heated based on laser to the LTHC photothermal transformation layer, to separate the re-wiring layer 103
And the LTHC photothermal transformation layer.In conjunction with the sequence of the semiconductor chip 107 and the metal coupling 108, do not made herein
Limitation is divided preferably formerly in conjunction with the metal coupling 108 to reduce the pollution to the semiconductor chip 107, to improve product
Quality.The metal coupling 108 includes one of copper metal convex block, nickel metal coupling, tin metal convex block and silver metal convex block,
Type, quantity and the distribution of the semiconductor chip 107, do not limit excessively herein.
It further include in the semiconductor chip 107 and the re-wiring layer as the further embodiment of the embodiment
The step of Underfill layer 109 are filled between 103 the first face, to improve the semiconductor chip 107 and the rewiring
The bond strength of layer 103 simultaneously protects the re-wiring layer 103 and the semiconductor chip 107.
As the further embodiment of the embodiment, the range of the thickness of the antenna structure includes 50 μm~1000 μm,
Such as 100 μm, 500 μm, are selected, herein with no restriction according to specific needs.
As the further embodiment of the embodiment, the metal connecting column may also include cross-sectional area greater than the metal
The metal link block of connecting column, described the such as between the first metal connecting column 124 and the metal wiring layer 123
One metal link block 114, the second gold medal between the second metal connecting column 125 and the first antenna metal layer 144
Belong to link block 115 and the third metal between the third metal connecting column 126 and the second antenna metal layer 145 connects
Block 116 is connect, to increase contact area, improves electrical stability.
Such as Figure 24, after preparing the fan-out-type antenna packages structure, the step of may also include cutting, wherein Ke Yiren
The anticipate side of an antenna structure is cut, so that disposably obtaining side has the conplane antenna structure,
And due to antenna structure projection in the horizontal direction cover the metal wiring layer 123, the semiconductor chip 107 and
The metal coupling 108, thus can have minimum level projected area the antenna structure side as edge, carry out
Cutting, will not damage the metal wiring layer 123, the semiconductor chip 107 and the metal coupling 108, so as to save
About cost, raising production efficiency, flexibly control the volume of fan-out-type antenna packages structure, expand fan-out-type antenna packages structure
The scope of application.
Embodiment two
Further to make skilled in the art realises that the advantages of the utility model and effect, such as Figure 17~Figure 23, signal
The structural schematic diagram that another each step of fan-out-type antenna packages method in the utility model is presented.The present embodiment and reality
The main distinction for applying example one is to form the antenna structure of different structure.Wherein, the antenna structure is certainly described again
The second of wiring layer 103, which reduces in staged upwardly, stacks setting, in order to flexibly control fan-out-type antenna packages structure
Volume expands the scope of application of fan-out-type antenna packages structure.
Specifically, specific material, forming method and the pattern of the antenna structure see embodiment one, it is no longer superfluous herein
It states.Such as Figure 17, when preparing second encapsulated layer 135 in second antenna structure 105, can according to processing procedure needs, with
The upper surface of first encapsulated layer 134 forms horizontal section area and is less than the described of first encapsulated layer 134 as support
Second encapsulated layer 135, and so on, it is formed and is formed upwardly from the second of the re-wiring layer 103 in staged reduction heap
The antenna structure of folded setting, details are not described herein again.
As Figure 24 may also include cutting after the preparation antenna structure for reducing stacking setting in staged
Step, wherein the side of the antenna structure with minimum level projected area at top can be located at as edge, carried out
Cutting, so that disposably obtaining side has the conplane antenna structure, and since the antenna structure is in level side
Upward projection covers the metal wiring layer 123, the semiconductor chip 107 and the metal coupling 108, therefore will not damage
Hurt the metal wiring layer 123, the semiconductor chip 107 and the metal coupling 108, thus cost-saved, raising life
Efficiency is produced, the volume of fan-out-type antenna packages structure is flexibly controlled, expands the scope of application of fan-out-type antenna packages structure.
Embodiment three
Such as Figure 24, the present embodiment illustrates the structural schematic diagram of the fan-out-type antenna packages structure in the utility model, institute
Stating encapsulating structure includes:
Re-wiring layer 103, the re-wiring layer 103 include opposite the first face and the second face；
At least two layers of antenna structure of setting is stacked, the antenna structure is located at the second face of the re-wiring layer 103
On, it being electrically connected with the metal wiring layer 123 in the re-wiring layer 103, the side of the antenna structure has same plane,
And the projection of the antenna structure in the horizontal direction covers the metal wiring layer 123；
Semiconductor chip 107 and metal coupling 108, on the first face of the re-wiring layer 103, and with the gold
Belong to wiring layer 123 to be electrically connected, and the projection of the antenna structure in the horizontal direction covers the semiconductor chip 107 and metal
Convex block 108.
The present embodiment can form the fan with stacked antenna structure, high effective antenna performance, high conformability for stacking setting
Type antenna packages structure out；Metal wiring layer, semiconductor chip and gold are covered by the projection of antenna structure in the horizontal direction
The characteristic for belonging to convex block, can be improved product quality.
Specifically, as embodiment one and two may also include the step of cutting after preparing the fan-out-type antenna packages structure
Suddenly, wherein can be cut with the side of any one antenna structure, to disposably obtain side with conplane
The antenna structure, and since the projection of the antenna structure in the horizontal direction covers the metal wiring layer 123, described half
Conductor chip 107 and the metal coupling 108, therefore can have the side of the antenna structure of minimum level projected area
It as edge, is cut, the metal wiring layer 123, the semiconductor chip 107 and the metal coupling will not be damaged
108, so that cost-saved, raising production efficiency, flexibly controls the volume of fan-out-type antenna packages structure, expands fan-out-type day
The scope of application of wire encapsulation construction.
It may include stacking setting as the further embodiment of the embodiment, on the second face of the re-wiring layer 103
The N layer antenna structure, wherein N >=3 are mentioned with forming the fan-out-type antenna packages structure with antenna structure described in multilayer
The efficiency of high antenna reduces encapsulating structure volume, so that encapsulating structure integrated level with higher, improves the integration of encapsulating structure
Performance.Such as 4 layers, 5 layers or 2 layers are contained only, herein with no restriction.In the present embodiment, the antenna structure includes stack setting 3
The layer antenna structure, including first antenna structure 104, the second antenna structure 105 and third antenna structure 106.
As the further embodiment of the embodiment, the range of the thickness of the antenna structure includes 50 μm~1000 μm,
Such as 100 μm, 500 μm, are selected, herein with no restriction according to specific needs.
As the further embodiment of the embodiment, the semiconductor chip 107 and the first of the re-wiring layer 103
It may also include Underfill layer 109 between face, to improve the combination of the semiconductor chip 107 and the re-wiring layer 103
Intensity simultaneously protects the re-wiring layer 103 and semiconductor chip 107.
As the further embodiment of the embodiment, the antenna structure includes metal connecting column, encapsulated layer and antenna gold
Belong to layer, the encapsulated layer covers the upper surface of the metal connecting column and the aobvious leakage metal connecting column, the antenna metal layer
Upper surface positioned at the encapsulated layer is electrically connected with the metal connecting column.
Specifically, the first antenna structure 104 includes the first metal connecting column 124, the first encapsulated layer 134 and first day
Line metal layer 144, wherein the metal wiring layer 123 in the first metal connecting column 124 and the re-wiring layer 103
Electrical connection；First encapsulated layer 134 covers the first metal connecting column 124 and aobvious leakage the first metal connecting column 124
Upper surface；The first antenna metal layer 144 is located at the upper surface of first encapsulated layer 134 and connects with first metal
Connect the electrical connection of column 124；To form the first antenna structure 104.Second antenna structure 105 is connected including the second metal
Column 125, the second encapsulated layer 135 and the second antenna metal layer 145, wherein the second metal connecting column 125 and described first day
The first antenna metal layer 144 electrical connection in cable architecture 104；Second encapsulated layer 135 covers second metal and connects
Connect the upper surface of column 125 and aobvious leakage the second metal connecting column 125；The second antenna metal layer 145 is located at described second
It the upper surface of encapsulated layer 135 and is electrically connected with the second metal connecting column 125；To form second antenna structure 105.
The third antenna structure 106 includes third metal connecting column 126, third encapsulated layer 136 and third antenna metal layer 146,
Described in third metal connecting column 126 be electrically connected with the second antenna metal layer 145 in second antenna structure 105；
The third encapsulated layer 136 covers the upper table of the third metal connecting column 126 and the aobvious leakage third metal connecting column 126
Face；The third antenna metal layer 146 be located at the upper surface of the third encapsulated layer 136 and with the third metal connecting column
126 electrical connections；To form the third antenna structure 106.
As the further embodiment of the embodiment, the bottom of the metal connecting column is also connected with cross-sectional area greater than institute
State the metal link block of metal connecting column.
Specifically, such as first gold medal between the first metal connecting column 124 and the metal wiring layer 123
Belong to link block 114, the second metal between the second metal connecting column 125 and the first antenna metal layer 144 connects
Connect block 115 and the third metal link block between the third metal connecting column 126 and the second antenna metal layer 145
116, to increase contact area, improve electrical stability.
As the further embodiment of the embodiment, the metal connecting column includes golden metal connecting column, silver metal connection
One of column, copper metal connecting column and aluminum metal connecting column；The encapsulated layer includes epoxy resin layer, polyimide layer and silicon
One of glue-line；The metal coupling 108 includes copper metal convex block, nickel metal coupling, tin metal convex block and silver metal convex block
One of；Specific type is selected according to specific needs, herein with no restriction.
In conclusion the fan-out-type antenna packages structure of the utility model, can form stacking setting has stacked antenna
Structure, high effective antenna performance, the fan-out-type antenna packages structure of high conformability；Pass through the throwing of antenna structure in the horizontal direction
Shadow covers the characteristic of metal wiring layer, semiconductor chip and metal coupling, and product quality can be improved.So the utility model has
Effect overcomes various shortcoming in the prior art and has high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (10)
1. a kind of fan-out-type antenna packages structure, which is characterized in that the encapsulating structure includes:
Re-wiring layer, the re-wiring layer include opposite the first face and the second face；
At least two layers of antenna structure of setting is stacked, the antenna structure is located on the second face of the re-wiring layer, with institute
The metal wiring layer electrical connection in re-wiring layer is stated, the side of the antenna structure has same plane, and the day knot
The projection of structure in the horizontal direction covers the metal wiring layer；
Semiconductor chip and metal coupling are electrically connected on the first face of the re-wiring layer, and with the metal wiring layer
It connects, and the projection of the antenna structure in the horizontal direction covers the semiconductor chip and metal coupling.
2. fan-out-type antenna packages structure according to claim 1, it is characterised in that: the second face of the re-wiring layer
Upper includes the N layer antenna structure for stacking setting, wherein N >=3.
3. fan-out-type antenna packages structure according to claim 1, it is characterised in that: the model of the thickness of the antenna structure
It encloses including 50 μm~1000 μm.
4. fan-out-type antenna packages structure according to claim 1, it is characterised in that: the semiconductor chip with it is described heavy
It further include Underfill layer between first face of new route layer.
5. fan-out-type antenna packages structure according to claim 1, it is characterised in that: the antenna structure includes that metal connects
Connect column, encapsulated layer and antenna metal layer.
6. fan-out-type antenna packages structure according to claim 5, it is characterised in that: the encapsulated layer covers the metal
The upper surface of connecting column and the aobvious leakage metal connecting column, the antenna metal layer be located at the upper surface of the encapsulated layer with it is described
The electrical connection of metal connecting column.
7. fan-out-type antenna packages structure according to claim 5, it is characterised in that: the bottom of the metal connecting column is also
It is connected with the metal link block that cross-sectional area is greater than the metal connecting column.
8. fan-out-type antenna packages structure according to claim 5, it is characterised in that: the metal connecting column includes gold gold
Belong to one of connecting column, silver metal connecting column, copper metal connecting column and aluminum metal connecting column.
9. fan-out-type antenna packages structure according to claim 5, it is characterised in that: the encapsulated layer includes epoxy resin
One of layer, polyimide layer and layer of silica gel.
10. fan-out-type antenna packages structure according to claim 1, it is characterised in that: the metal coupling includes copper gold
Belong to one of convex block, nickel metal coupling, tin metal convex block and silver metal convex block.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244046A (en) * | 2018-10-26 | 2019-01-18 | 中芯长电半导体（江阴）有限公司 | Fan-out-type antenna packages structure and packaging method |
| CN114204249A (en) * | 2022-02-18 | 2022-03-18 | 威海艾迪科电子科技股份有限公司 | Fan-out package with antenna and preparation method thereof |
| CN114551251A (en) * | 2022-02-23 | 2022-05-27 | 威海艾迪科电子科技股份有限公司 | Multi-chip package with antenna structure and preparation method thereof |
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2018
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244046A (en) * | 2018-10-26 | 2019-01-18 | 中芯长电半导体（江阴）有限公司 | Fan-out-type antenna packages structure and packaging method |
| CN114204249A (en) * | 2022-02-18 | 2022-03-18 | 威海艾迪科电子科技股份有限公司 | Fan-out package with antenna and preparation method thereof |
| CN114551251A (en) * | 2022-02-23 | 2022-05-27 | 威海艾迪科电子科技股份有限公司 | Multi-chip package with antenna structure and preparation method thereof |
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