CN208609257U - A kind of wiring board - Google Patents
A kind of wiring board Download PDFInfo
- Publication number
- CN208609257U CN208609257U CN201821244461.3U CN201821244461U CN208609257U CN 208609257 U CN208609257 U CN 208609257U CN 201821244461 U CN201821244461 U CN 201821244461U CN 208609257 U CN208609257 U CN 208609257U
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- CN
- China
- Prior art keywords
- layer
- line
- substrate
- epoxy resin
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of wiring board, belongs to electronic apparatus technical field.This wiring board includes substrate, the insulating layer and line layer for being set in turn in substrate surface, component welding position is provided on line layer, substrate longitudinally offers the blind slot through insulating layer along component welding position, blind slot bottom is provided with titanium alloy, graphite thermal layer is provided on line layer, graphite thermal layer is conduction graphite film, conduction graphite film is flattened on route layer surface, substrate includes layers of kraft paper, heat curing type glue-line and epoxy resin layer from lower to upper, and layers of kraft paper is fixedly connected with epoxy resin layer by heat curing type glue-line.The utility model has the advantages that structure is simple, good heat dissipation effect.
Description
Technical field
The utility model belongs to electronic apparatus technical field, and in particular to a kind of wiring board.
Background technique
Wiring board is important electronic component, is the supporter of electronic component, is mentioning for electronic component electrical connection
Donor.Traditional wiring board be usually all include a substrate, component is set on substrate, and traditional substrate is typically all epoxy
Resin material either ceramic substrate, high production cost.
Summary of the invention
The purpose of this utility model is the presence of the above problem in view of the prior art, proposes that a kind of structure is simple, heat dissipation
The good wiring board of effect.
The purpose of this utility model can be realized by the following technical scheme: a kind of wiring board, which is characterized in that including base
Plate, the insulating layer and line layer for being set in turn in substrate surface are provided with component welding position on line layer, and substrate is along component
Welding position longitudinally offers the blind slot through insulating layer, and blind slot bottom is provided with titanium alloy, is provided with graphite radiating on line layer
Layer, graphite thermal layer is conduction graphite film, and conduction graphite film is flattened on route layer surface, and substrate includes brown paper from lower to upper
Layer, heat curing type glue-line and epoxy resin layer, layers of kraft paper are fixedly connected with epoxy resin layer by heat curing type glue-line.
Compared with prior art, the utility model by being arranged blind slot in the circuit board, while titanium is equipped in blind slot
Alloy makes component directly pass through substrate and radiates, to greatly improve the integral heat sink effect of wiring board, extension wire plate
Service life, while substrate includes layers of kraft paper, heat curing type glue-line and epoxy resin layer, after being arranged in this way, heat curing type glue
Epoxy resin layer and layers of kraft paper are bonded together by layer, are a kind of material entirely with previous piece of wiring board, after having added layers of kraft paper,
It is equivalent to the material that epoxy resin layer only needs former a half or thirds, reduces the dosage of epoxy resin layer, brown paper
The cost of layer has haved the function that save cost well below epoxy resin or ceramic substrate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
In figure, 1, layers of kraft paper；2, heat curing type glue-line；3, epoxy resin layer；4, insulating layer；5, component welding position；6,
Line layer；7, graphite thermal layer；8, blind slot；9, titanium alloy.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
As shown in Figure 1, this wiring board includes substrate, the insulating layer 4 and line layer 6 for being set in turn in substrate surface, route
Component welding position 5 is provided on layer 6, substrate is along the longitudinal blind slot 8 offered through insulating layer 4 of component welding position 5, blind slot
8 bottoms are provided with titanium alloy 9, and graphite thermal layer 7 is provided on line layer 6, and graphite thermal layer 7 is conduction graphite film, thermally conductive stone
Ink film is flattened on 6 surface of line layer, and substrate includes layers of kraft paper 1, heat curing type glue-line 2 and epoxy resin layer 3, ox-hide from lower to upper
Paper layer 1 is fixedly connected with epoxy resin layer 3 by heat curing type glue-line 2.
By using above-mentioned technical proposal, blind slot 8 is set in the circuit board, and the blind slot 8 is through insulating layer 4 and is closed in
In substrate, blind slot 8 is made to form accommodating space in substrate, can be placed for component, when welding component, component is placed in
In blind slot 8, so that component is passed through insulating layer 4 and be directly in contact with substrate, when component works, the heat generated need not be by exhausted
Edge layer 4 and be directly conducted to substrate and radiate；It is mutually fitted in addition, being provided in 8 bottom of blind slot with 8 bottom shape of blind slot, size
The titanium alloy 9 matched, titanium alloy 9 has the characteristics that intensity is high, corrosion resistance is good, heat resistance, good conductivity, when titanium alloy 9 and placement
When the component in blind slot 8 contacts, the heat that component generates when working passes to substrate by titanium alloy 9, utilizes
The high thermal conductivity of titanium alloy 9 further decreases thermal resistance, reinforces thermal coefficient, improves the heat dissipation effect of the wiring board, extends
The service life of wiring board, the smooth conduction graphite film on line layer 6, conduction graphite film constitute graphite thermal layer 7, heat conductive graphite
Film is a kind of novel heat conduction and heat radiation material, has unique crystal grain orientation, in both directions uniform heat conduction, it is laminar structured can
It is well adapted for any surface, using the plasticity of graphite, conduction graphite film is done into imageable sheet and is smoothly attached to 6 table of line layer
On face, heat dissipation effect is very good.
Substrate includes layers of kraft paper 1, heat curing type glue-line 2 and epoxy resin layer 3, and after being arranged in this way, heat curing type glue-line 2 will
Epoxy resin layer 3 is bonded together with layers of kraft paper 1, is a kind of material entirely with previous piece of wiring board, after having added layers of kraft paper 1,
Epoxy resin layer 3 materials for needing a half or thirds in the past are equivalent to, the dosage of epoxy resin layer 3, ox-hide are reduced
The cost of paper layer 1 has haved the function that save cost well below epoxy resin or ceramic substrate.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (1)
1. a kind of wiring board, which is characterized in that including substrate, be set in turn in the insulating layer and line layer of substrate surface, route
It is provided with component welding position on layer, substrate longitudinally offers the blind slot through insulating layer, blind slot bottom along component welding position
It is provided with titanium alloy, graphite thermal layer is provided on line layer, graphite thermal layer is conduction graphite film, and conduction graphite film is flattened on
Route layer surface, substrate include layers of kraft paper, heat curing type glue-line and epoxy resin layer, layers of kraft paper and epoxy resin from lower to upper
Layer is fixedly connected by heat curing type glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821244461.3U CN208609257U (en) | 2018-08-03 | 2018-08-03 | A kind of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821244461.3U CN208609257U (en) | 2018-08-03 | 2018-08-03 | A kind of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208609257U true CN208609257U (en) | 2019-03-15 |
Family
ID=65670663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821244461.3U Expired - Fee Related CN208609257U (en) | 2018-08-03 | 2018-08-03 | A kind of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208609257U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
-
2018
- 2018-08-03 CN CN201821244461.3U patent/CN208609257U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190315 Termination date: 20200803 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |