CN208572692U - A kind of cooling cabinet of power amplifier - Google Patents
A kind of cooling cabinet of power amplifier Download PDFInfo
- Publication number
- CN208572692U CN208572692U CN201821247824.9U CN201821247824U CN208572692U CN 208572692 U CN208572692 U CN 208572692U CN 201821247824 U CN201821247824 U CN 201821247824U CN 208572692 U CN208572692 U CN 208572692U
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- China
- Prior art keywords
- heat
- plate
- cabinet
- cooling
- power amplifier
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Abstract
The utility model discloses a kind of cooling cabinets of power amplifier, it is related to power amplifier cabinet field, including panel, cabinet and backboard, it further include heat-dissipation spacer, the cabinet is rectangular frame structure, is arranged fluted on internal two opposite sides, and the both ends of the heat-dissipation spacer are arranged in the groove, the heat-dissipation spacer includes heat-conducting plate, thermal insulation board and the conduction cooling plate for load power amplifier function component, and the conduction cooling plate, thermal insulation board and heat-conducting plate are set gradually from top to bottom；Several semiconductor chilling plates are provided in the heat-dissipation spacer, the cold end of the semiconductor chilling plate contacts setting with the conduction cooling plate, and the hot end of the semiconductor chilling plate contacts setting with the heat-conducting plate；The bottom surface of the heat-conducting plate is fixedly installed heat dissipation tooth plate, and the lower part of the backboard is provided with cooling fan, and the lower part of the panel is provided with the ventilation opening of lattice-shaped.The cooling cabinet has good heat dissipation performance, while compact-sized, and cabinet volume is smaller.
Description
Technical field
The utility model relates to power amplifier cabinet field, specially a kind of cooling cabinet of power amplifier.
Background technique
Power amplifier refers under the conditions of given distortion rate, can generate maximum power output to drive a certain load)
Amplifier is generally made of cabinet with the functional component for being carried on cabinet inside.Cabinet is also mentioned in addition to bearing function component for it
For the function of protecting and radiate.Because power cost of power amplifier is big, frequency is high, the requirement to heat dissipation is also high.In the prior art, in order to
Enhance the heat dissipation effect of power amplifier, it will usually radiator be set in cabinet, common are air blast cooling heat dissipation, water cooling
Heat dissipation, but these radiator heat dissipation effects are general, and structure is complicated for chassis design, it is bulky, do not meet power amplifier
Compact-sized, small in size requirement.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of cooling cabinet of power amplifier,
Has good heat dissipation performance, and compact-sized, cabinet volume is smaller.
The purpose of this utility model is achieved through the following technical solutions:
A kind of cooling cabinet of power amplifier, including panel, cabinet and backboard, the panel and backboard are fixedly installed on
The both ends of cabinet further include heat-dissipation spacer, and the cabinet is rectangular frame structure, are provided on internal two opposite sides recessed
The both ends of slot, the heat-dissipation spacer are arranged in the groove, and the heat-dissipation spacer includes heat-conducting plate, thermal insulation board and for carrying
The conduction cooling plate of power amplifier functional component, the conduction cooling plate, thermal insulation board and heat-conducting plate are set gradually from top to bottom；
Several semiconductor chilling plates, the cold end of the semiconductor chilling plate and the conduction cooling are provided in the heat-dissipation spacer
Plate contact setting, the hot end of the semiconductor chilling plate contacts setting with the heat-conducting plate；
The bottom surface of the heat-conducting plate is fixedly installed heat dissipation tooth plate, and the lower part of the backboard is provided with cooling fan, described
The lower part of panel is provided with the ventilation opening of lattice-shaped.
Further, the panel and backboard are provided with the rubber mat for sealing between the cabinet；The heat dissipation
The surrounding of partition is surrounded with the rubber mat for sealing.
Further, several drying boxes are provided on the top surface of the conduction cooling plate, are provided with desiccant in the drying box.
Further, the heat-conducting plate and conduction cooling plate select the good metal material of thermal conductivity.
Further, several grating form cooling fins, the top of the cooling fin and institute are provided on the conduction cooling plate top surface
State cabinet contact setting.
Further, the good silicone grease of thermal conductivity is provided between the heat-conducting plate and the heat dissipation tooth plate.
It further, further include mounting plate, the mounting plate is fixedly attached on the panel by screw, the installation
Plate is machined with the through-hole for installation close to corner location, and the lateral surface both ends of the mounting plate are provided with handle.
The beneficial effects of the utility model are: cabinet is divided by the cooling cabinet setting heat-dissipation spacer of the power amplifier
Two cavitys, are radiated by the functional component that semiconductor chilling plate carries top cavity, good heat dissipation effect, and structure is tight
It gathers, reduces cabinet volume.Lower section cavity setting heat dissipation tooth plate, by being set to the blower of backboard to lower section cavity forced heat radiation,
Effectively the hot end of semiconductor chilling plate is cooled down, semiconductor chilling plate is enable persistently to make the functional component of top cavity
It is cold.Setting rubber pad makes top cavity form confined space, avoids the entrance of dust, can effective protection functional component.Above
Drying box is set in cavity, air in the cavity is dried, avoid because under cryogenic conditions Water vapor condensation due to damage function
Component.
Detailed description of the invention
Fig. 1 is a kind of cooling cabinet schematic perspective view of power amplifier of the utility model；
Fig. 2 is a kind of cooling cabinet explosive view of power amplifier of the utility model；
Fig. 3 is box inner structure schematic diagram.
Specific embodiment
The technical solution of the utility model, but the protection scope of the utility model are described in further detail with reference to the accompanying drawing
It is not limited to as described below.
As shown in Figure 1 to Figure 3, a kind of cooling cabinet of power amplifier, including panel 1, cabinet 2 and backboard 3, panel 1
The both ends of cabinet 2 are fixedly installed on backboard 3.The cooling cabinet further includes heat-dissipation spacer 4, and cabinet 2 is rectangular frame structure, in
It is arranged fluted on two opposite sides of portion, the both ends of heat-dissipation spacer 4 are arranged in the groove.
Heat-dissipation spacer 4 includes heat-conducting plate 43, thermal insulation board 42 and conduction cooling plate 41, conduction cooling plate 41, thermal insulation board 42 and heat-conducting plate 43
It sets gradually from top to bottom.The various functional components of mounting power amplifier are carried on conduction cooling plate 41.
Several semiconductor chilling plates 5 are provided in heat-dissipation spacer 4, the cold end of semiconductor chilling plate 5 is contacted with conduction cooling plate 41
Setting, the hot end of semiconductor chilling plate 5 contacts setting with heat-conducting plate 43.Freezed using the pyroelectric effect of semiconductor chilling plate 5 and is dissipated
Heat is specifically passed through direct current to semiconductor chilling plate 5, under pyroelectric effect, two contacts of energization, and a temperature drop
Low is cold end, and it is hot end that a temperature, which increases,.Under lasting energization, above-mentioned heat transfer occurs in semiconductor chilling plate 5 always
Process, until its cold and hot end temperature difference reaches its function setting value.The refrigeration principle of semiconductor chilling plate 5 is existing more mature
Technology is not repeated herein.The cold end of semiconductor chilling plate 5 contacts setting with conduction cooling plate 41, persistently freezes to conduction cooling plate 41, after
And it effectively radiates to the functional component carried on conduction cooling plate 41.Preferably, conduction cooling plate 41 selects the good metal material of thermal conductivity
Matter makes the transmitting of the heat of conduction cooling plate 41 faster, more preferable to the heat dissipation effect of the functional component of carrying thereon.Preferably, conduction cooling plate 41 pushes up
Several grating form cooling fins are provided on face, the top of cooling fin contacts setting with cabinet 2, and conduction cooling plate 41 is dissipated by the grating form
Backing is connected to the top surface of cabinet 2, and the cavity of bearing function component in cabinet 2 is made to form three-dimensional heat conduction via, the cavity
Heat dissipation is faster.
The bottom surface of heat-conducting plate 43 is fixedly installed heat dissipation tooth plate 6, and the lower part of backboard 3 is provided with cooling fan 8, panel 1
Lower part is provided with the ventilation opening of lattice-shaped.The hot end of semiconductor chilling plate 5 contacts setting with heat-conducting plate 43, transfers heat to and leads
Hot plate then cools down heat dissipation tooth plate 6 by the ventilation of blower Final 8 system to heat-conducting plate 43, so that the heat of semiconductor chilling plate 5
Support continuous refrigeration.Preferably, heat-conducting plate 43 selects the good metal material of thermal conductivity, adds heat transmitting on heat-conducting plate 43 faster,
Fast cooling of the blower 8 to 5 hot end of semiconductor chilling plate, improves its refrigeration performance.Preferably, heat-conducting plate 43 and heat dissipation tooth plate 6 it
Between be provided with the good silicone grease of thermal conductivity so that the heat on heat-conducting plate 43 be faster transmitted to heat dissipation tooth plate 6 on, faster radiate.
Further, panel 1 and backboard 3 are provided with the rubber mat for sealing between cabinet 2；The four of heat-dissipation spacer 4
It is surrounded with the rubber mat for sealing week.By the setting of seal gasket, keep the cavity of installation function component in cabinet 2 close
Envelope avoids dust from entering the cavity.
Further, it is provided with several drying boxes on the top surface of conduction cooling plate 41, is provided with desiccant in drying box.Because of air
In contain vapor, in the course of work of semiconductor chilling plate 5, in cabinet 2 in the cavity of bearing function component, water vapour meet
It is cold to condense into droplet, functional component can be damaged.Drying box is set in this cavity, can in cavity sealing after adsorbent chamber
Water vapour in internal air, the case where avoiding above-mentioned damage functional component generation.
Further, the cooling cabinet further includes mounting plate 7, and mounting plate 7 is fixedly attached on panel 1 by screw, peace
Loading board 7 is machined with through-hole close to corner location, facilitates the installation of the cooling cabinet.The lateral surface both ends of mounting plate 7 are provided with
Handle 9 facilitates the extraction and carrying of the cooling cabinet.
The above is only the preferred embodiment of the utility model, it should be understood that the utility model is not limited to herein
Disclosed form, should not be regarded as an exclusion of other examples, and can be used for other combinations, modifications, and environments, and
Can be in contemplated scope described herein, modifications can be made through the above teachings or related fields of technology or knowledge.And this field
The modifications and changes that personnel are carried out do not depart from the spirit and scope of the utility model, then all should be in right appended by the utility model
It is required that protection scope in.
Claims (7)
1. a kind of cooling cabinet of power amplifier, including panel (1), cabinet (2) and backboard (3), the panel (1) and backboard
(3) both ends of cabinet (2) are fixedly installed on, which is characterized in that further include heat-dissipation spacer (4), the cabinet (2) is rectangle frame knot
Structure, is arranged on internal two opposite sides fluted, and the both ends of the heat-dissipation spacer (4) are arranged in the groove, institute
Stating heat-dissipation spacer (4) includes heat-conducting plate (43), thermal insulation board (42) and the conduction cooling plate for load power amplifier function component
(41), the conduction cooling plate (41), thermal insulation board (42) and heat-conducting plate (43) are set gradually from top to bottom；
It is provided with several semiconductor chilling plates (5) in the heat-dissipation spacer (4), the cold end of the semiconductor chilling plate (5) and institute
Conduction cooling plate (41) contact setting is stated, the hot end of the semiconductor chilling plate (5) contacts setting with the heat-conducting plate (43)；
The bottom surface of the heat-conducting plate (43) is fixedly installed heat dissipation tooth plate (6), and the lower part of the backboard (3) is provided with cooling fan
(8), the lower part of the panel (1) is provided with the ventilation opening of lattice-shaped.
2. a kind of cooling cabinet of power amplifier according to claim 1, which is characterized in that the panel (1) and back
Plate (3) is provided with the rubber mat for sealing between the cabinet (2)；The surrounding of the heat-dissipation spacer (4) is surrounded with
Rubber mat for sealing.
3. a kind of cooling cabinet of power amplifier according to claim 2, which is characterized in that the conduction cooling plate (41)
It is provided with several drying boxes on top surface, is provided with desiccant in the drying box.
4. a kind of cooling cabinet of power amplifier according to claim 2, which is characterized in that the heat-conducting plate (43) and
Conduction cooling plate (41) selects the good metal material of thermal conductivity.
5. a kind of cooling cabinet of power amplifier according to claim 2, which is characterized in that conduction cooling plate (41) top
Several grating form cooling fins are provided on face, the top of the cooling fin contacts setting with the cabinet (2).
6. a kind of cooling cabinet of power amplifier according to claim 2, which is characterized in that the heat-conducting plate (43) with
The good silicone grease of thermal conductivity is provided between the heat dissipation tooth plate (6).
7. a kind of cooling cabinet of power amplifier according to claim 2, which is characterized in that it further include mounting plate (7),
The mounting plate (7) is fixedly attached on the panel (1) by screw, and the mounting plate (7) is machined with close to corner location
For the through-hole of installation, the lateral surface both ends of the mounting plate (7) are provided with handle (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821247824.9U CN208572692U (en) | 2018-08-03 | 2018-08-03 | A kind of cooling cabinet of power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821247824.9U CN208572692U (en) | 2018-08-03 | 2018-08-03 | A kind of cooling cabinet of power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208572692U true CN208572692U (en) | 2019-03-01 |
Family
ID=65449595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821247824.9U Active CN208572692U (en) | 2018-08-03 | 2018-08-03 | A kind of cooling cabinet of power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208572692U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110360242A (en) * | 2019-08-27 | 2019-10-22 | 河海大学常州校区 | A kind of heat radiation protection device for electric wheelchair clutch |
| CN117119776A (en) * | 2023-10-23 | 2023-11-24 | 广州市韵强电子有限公司 | Power amplifier shell |
-
2018
- 2018-08-03 CN CN201821247824.9U patent/CN208572692U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110360242A (en) * | 2019-08-27 | 2019-10-22 | 河海大学常州校区 | A kind of heat radiation protection device for electric wheelchair clutch |
| CN117119776A (en) * | 2023-10-23 | 2023-11-24 | 广州市韵强电子有限公司 | Power amplifier shell |
| CN117119776B (en) * | 2023-10-23 | 2024-01-12 | 广州市韵强电子有限公司 | Power amplifier shell |
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