CN208572549U - High current easy heat radiation inner-layer thick copper circuit board - Google Patents
High current easy heat radiation inner-layer thick copper circuit board Download PDFInfo
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- CN208572549U CN208572549U CN201821311408.0U CN201821311408U CN208572549U CN 208572549 U CN208572549 U CN 208572549U CN 201821311408 U CN201821311408 U CN 201821311408U CN 208572549 U CN208572549 U CN 208572549U
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- bottom plate
- thick copper
- radiator
- high current
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Abstract
The utility model discloses a kind of high current easy heat radiation inner-layer thick copper circuit boards, it includes radiator, thick copper foil, location hole, output connecting terminal, installation site hole, bottom plate, radiator is located at the top of thick copper foil, thick copper foil is located at the top of resin base sheet and coupled, location hole is located on a angle of bottom plate, output connecting terminal is located at the right side of bottom plate, and installation site hole is located at the inside of bottom plate, and bottom plate is located at the bottom end of radiator.Wherein: radiator includes cooling fin, layer of silica gel, connecting plate, screw, and wherein cooling fin is located at the top of layer of silica gel, and layer of silica gel is located at the top of connecting bottom board, connects the top that bottom plate is located at screw, and screw is located at the bottom of radiator and coupled.The utility model can effectively dissipate high current by when heat, structure is simple, improves safety.
Description
Technical field
The utility model relates to a kind of circuit boards, more particularly to a kind of high current easy heat radiation inner-layer thick copper circuit board.
Background technique
The heavy copper circuit board circuit board scope of application now on the market is small and thermo-labile, and holding very much when high current passes through is to produce
Raw huge heat burns circuit even directly using plate service life reduction, and structure is complicated, and production is inconvenient.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of high current easy heat radiation inner-layer thick copper circuit board, energy
Enough effective diverging high currents by when heat, structure is simple, improves safety.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of high current easy heat radiation internal layer
Heavy copper circuit board, which is characterized in that it include radiator, thick copper foil, location hole, output connecting terminal, installation site hole,
Bottom plate, radiator are located at the top of thick copper foil, and thick copper foil is located at the top of resin base sheet and coupled, positioning hole location
In on a angle of bottom plate, output connecting terminal is located at the right side of bottom plate, and installation site hole is located at the inside of bottom plate, and bottom plate, which is located at, to be dissipated
The bottom end of thermal, in which: radiator includes cooling fin, layer of silica gel, connecting plate, screw, and wherein cooling fin is located at layer of silica gel
Top, layer of silica gel is located at the top of connecting bottom board, connects the top that bottom plate is located at screw, and screw is located at the bottom of radiator
Portion is simultaneously coupled；Bottom plate includes insulating layer, heat dissipating layer, adhesive layer, resin mixture layer, waterproof layer, and insulating layer is located at heat dissipation
The top of layer, heat dissipating layer are located at the top of adhesive layer, and adhesive layer is located at the top of resin mixture layer, and resin mixture layer is located at
The lower section of etch resistant layer, waterproof layer are located at the bottom of bottom plate.
Preferably, the thickness of the thick copper foil is greater than or equal to 100um.
Preferably, the silica gel thickness of the layer of silica gel is greater than 50um.
Preferably, the cooling fin uses copper sheet.
Preferably, the gel content of the prepreg of the knot layer is 70% to 90%.
The positive effect of the utility model is: the utility model can effectively dissipate heat when high current passes through
Amount, structure is simple, improves safety.
Detailed description of the invention
Fig. 1 is the overall structure figure of the utility model.
Fig. 2 is the construction for heat radiating device figure of the utility model.
Fig. 3 is the floor structure figure of the utility model.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1 to Figure 3, the utility model high current easy heat radiation inner-layer thick copper circuit board includes radiator 1, thick copper
Paillon 2, location hole 3, output connecting terminal 4, installation site hole 5, bottom plate 6, radiator 1 is located at the top of thick copper foil 2, thick
Copper foil 2 is located at the top of resin base sheet 6 and coupled, and location hole 3 is located on 4 angles of bottom plate, exports connecting terminal 4
In the right side of bottom plate, installation site hole 5 is located at the inside of bottom plate, and bottom plate is located at the bottom end of radiator 1, in which: radiator 1
Including cooling fin 7, layer of silica gel 8, connecting plate 9, screw 10, wherein cooling fin 7 is located at the top of layer of silica gel, and layer of silica gel 8, which is located at, to be connected
Connect the top of bottom plate 9, connect the top that bottom plate 9 is located at screw 10, screw 10 be located at the bottom of radiator 1 and with its phase
Even.
Bottom plate 6 includes insulating layer 11, heat dissipating layer 12, adhesive layer 13, resin mixture layer 14, waterproof layer 15, insulating layer 11
Positioned at the top of heat dissipating layer 12, heat dissipating layer 12 is located at the top of adhesive layer 13, and adhesive layer 13 is located at the upper of resin mixture layer 14
Side, resin mixture layer 14 are located at the lower section of etch resistant layer 11, and waterproof layer 15 is located at the bottom of bottom plate 6.Insulating layer can use
Polyvinyl chloride etc..Waterproof layer can be using polyurethane material etc..Resin mixture layer can be using melamine resin etc..Heat dissipation
Layer can be using materials such as copper.Adhesive layer uses sodium carboxymethylcellulose.
The thickness of thick copper foil 2 is greater than or equal to 100um so that it is convenient to connection with component.
Cooling fin 7 uses copper sheet, can more effectively radiate in this way.
The gel content of the prepreg of adhesive layer 13 is 70% to 90%, guarantees a certain amount of glue in this way to bond.
The silica gel thickness of layer of silica gel 8 is greater than 50um, the connection both ends that can more seal in this way.
Utility model works principle is as follows: the radiator of high current easy heat radiation inner-layer thick copper circuit board is in high current stream
Heat can be sufficiently dissipated when logical, improves heat-sinking capability, and cooling fin radiates, and layer of silica gel carries out thermally conductive.Thick copper foil is used to connect
The component for needing to weld is connect, location hole facilitates location and installation position, and output connecting terminal is used to connect the output element needed,
Installation site hole facilitates the installation of electronic component.Bottom plate includes insulating layer, heat dissipating layer, adhesive layer, resin mixture layer, waterproof
Layer, wherein insulating layer, which can play the role of insulation, prevents electric leakage, improves safety.Heat dissipating layer can play the work of diverging heat
With further increasing heat-sinking capability.Adhesive layer provides a certain amount of glue and comes binding resin mixture layer and heat dissipating layer, waterproof layer
The short circuit problem for preventing water from causing is played, safety is improved.The utility model is by insulating layer, heat dissipating layer, adhesive layer, resin
Mixture layer, waterproof layer each layer, which is stacked with each other, to be fabricated.
In conclusion the utility model can effectively dissipate heat when high current passes through, structure is simple, improves peace
Quan Xing.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of high current easy heat radiation inner-layer thick copper circuit board, which is characterized in that it includes radiator, thick copper foil, positioning
Hole, output connecting terminal, installation site hole, bottom plate, radiator are located at the top of thick copper foil, and thick copper foil is located at resin bottom
The top of plate is simultaneously coupled, and location hole is located on a angle of bottom plate, and output connecting terminal is located at the right side of bottom plate, installation site
Hole is located at the inside of bottom plate, and bottom plate is located at the bottom end of radiator, in which: radiator includes cooling fin, layer of silica gel, connection
Plate, screw, wherein cooling fin is located at the top of layer of silica gel, and layer of silica gel is located at the top of connecting bottom board, connects bottom plate and is located at spiral shell
The top of silk, screw are located at the bottom of radiator and coupled；Bottom plate includes that insulating layer, heat dissipating layer, adhesive layer, resin are mixed
Nitride layer, waterproof layer are closed, insulating layer is located at the top of heat dissipating layer, and heat dissipating layer is located at the top of adhesive layer, and adhesive layer is mixed positioned at resin
The top of nitride layer is closed, resin mixture layer is located at the lower section of etch resistant layer, and waterproof layer is located at the bottom of bottom plate.
2. high current easy heat radiation inner-layer thick copper circuit board as described in claim 1, which is characterized in that the thickness of the thickness copper foil
Degree is greater than or equal to 100um.
3. high current easy heat radiation inner-layer thick copper circuit board as described in claim 1, which is characterized in that the silica gel of the layer of silica gel
Thickness is greater than 50um.
4. high current easy heat radiation inner-layer thick copper circuit board as described in claim 1, which is characterized in that the cooling fin uses copper
Piece.
5. high current easy heat radiation inner-layer thick copper circuit board as claimed in claim 4, which is characterized in that the half of the adhesive layer is solid
The gel content for changing piece is 70% to 90%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821311408.0U CN208572549U (en) | 2018-08-15 | 2018-08-15 | High current easy heat radiation inner-layer thick copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821311408.0U CN208572549U (en) | 2018-08-15 | 2018-08-15 | High current easy heat radiation inner-layer thick copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208572549U true CN208572549U (en) | 2019-03-01 |
Family
ID=65450540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821311408.0U Active CN208572549U (en) | 2018-08-15 | 2018-08-15 | High current easy heat radiation inner-layer thick copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208572549U (en) |
-
2018
- 2018-08-15 CN CN201821311408.0U patent/CN208572549U/en active Active
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