CN208547834U - A kind of embedded type control module - Google Patents

Abstract

The utility model discloses a kind of embedded type control modules, including circuit board, encapsulating structure and control module；The circuit board includes A plate and B plate, is provided with support column between the A plate and B plate；Limit plate is provided on the B plate；The encapsulating structure includes top plate, side plate, baffle, and the inner surface of the side plate is provided with link block, and the sliding slot that can be coupled with A plate is provided on the link block；The top plate and limit plate is detachably connected using detachable structure.The beneficial effects of the utility model are: the utility model is convenient for for control module being packaged using encapsulating structure, consequently facilitating saving, transporting or connect use with other equipment as external structure, internal circuit configuration is avoided to be damaged, and certain sealing function can be played, prevent water, dust etc. from entering inside.

Description

A kind of embedded type control module

Technical field

The utility model relates to control module technical field, specifically a kind of embedded type control module.

Background technique

With the development of science and technology with the progress of social and economic level, the intelligence and automation of all kinds of life/industrial equipments It is horizontal constantly to be promoted, it brings great convenience for social life and work, in intelligent equipment, controller plays must can not Scarce effect, in intelligent equipment and system, controller is publication order " policy-making body ", is responsible for completing coordination and commander The operation of entire computer system；Currently, controller has gradually been applied to the every field of industry life, social life is risen Increasingly important role is arrived, such as automobile mounted control, aircraft flight control, Intelligent housing, manufacture control, data inspection Observing and controlling etc. is required to using to controller.

But for now, the integrated level of controller is low, limited to the acquisition process ability of data, is not easy to insertion intelligence Can system carry out using.And the heat dissipation for circuit board environment for being used for integrated electronic component is poor, excessively high temperature is easy to influence control The use of device.

Utility model content

In order to overcome the deficiencies of the prior art, the utility model provides a kind of embedded type control module.

The technical scheme in the invention for solving the above technical problem is: a kind of embedded type control module, including circuit Plate is arranged encapsulating structure on circuit boards and the control module on circuit boards and being located inside encapsulating structure is arranged；

The circuit board includes A plate and B plate, several connection A plates and B plate are provided between the A plate and B plate Support column；The length of the B plate is greater than the length of A plate, and the width of the B plate is greater than the width of A plate, the control mould Block is integrated on A plate；

Limit plate is provided on the B plate；

The encapsulating structure include top plate, two be arranged on top plate same side and side plate parallel to each other, setting End baffle on top plate and between two side plates, the inner surface of the side plate are provided with link block, the company Connect the sliding slot for being provided with and capable of being coupled on block with A plate；

The top plate and limit plate is detachably connected using detachable structure.

Beneficial effect acquired by this programme is: it is convenient for for control module being packaged using encapsulating structure, consequently facilitating It saves, transport or connect use with other equipment as external structure, avoid internal circuit configuration from being damaged, and can play Certain sealing function prevents water, dust etc. from entering inside.It is detachably connected top plate with limit plate, encapsulation can be removed Structure and so that the circuit board in this programme connect, installed with other circuit boards.It can satisfy two kinds of use states with this, increase Use scope.Heat sinking function can be enhanced using double-deck circuit board.

Further, in order to preferably realize that the utility model, the B plate and support column are made of aluminium alloy.

It is using beneficial effect acquired by above-mentioned further technical solution: enhancing heat transfer and heat sinking function.

Further, in order to preferably realize the utility model, several mounting holes are provided on the B plate.

It is using beneficial effect acquired by above-mentioned further technical solution: convenient for pacifying B plate and other structures Dress.

Further, in order to preferably realize the utility model, the detachable structure is including being arranged on limit plate Lockplate and be arranged on top plate and the lock slots with lockplate interference fit installation.

It is using beneficial effect acquired by above-mentioned further technical solution: is easy to implement and is detachably connected and provides one Fixed coupling mechanism force is to prevent from loosening.

Further, in order to preferably realize that the utility model, the lockplate are made of elastic material.

It is using beneficial effect acquired by above-mentioned further technical solution: convenient for improving locking intensity.

Further, in order to preferably realize the utility model, several arc convex are provided on the lockplate, The arc groove being coupled with arc convex is provided on the top plate.

It is using beneficial effect acquired by above-mentioned further technical solution: convenient for improving locking intensity.

Further, in order to preferably realize the utility model, supporting block is provided in the end baffle.

It is using beneficial effect acquired by above-mentioned further technical solution: encapsulating structure is supported, A plate is avoided Or support column bears pressure.

Further, in order to preferably realize the utility model, the control module includes FPGA module, passes through respectively The first CPU and the 2nd CPU that CPCI connector is connect with FPGA module；The FPGA module is connected with interface module, described The first CPU be connected with debugging interface；2nd CPU is connected with serial interface module, memory module and network-control mould Block, the network control module are connected with RJ45 interface；The interface module is connected with CPCI connector；Described first CPU is connected with reset circuit and LED light；2nd CPU is connect by latch with network control module.

Be using beneficial effect acquired by above-mentioned further technical solution: so that this programme has, integrated level is high, connects Mouth is resourceful, wide adaptation range, is convenient to insertion intelligence system progress data processing.And allows access network based on ethernet, increase The function that this programme can be realized.Reserved debugging interface can be communicated with host computer, thus debugged using host computer, with Improve the performance of this programme.

The interface module include AD acquisition unit, DA output unit, I/O port communication unit, LVDS communication unit, One of RS422 communication unit is a variety of.

Further, in order to preferably realize the utility model, the AD acquisition unit includes 12 road AD acquisition channels； The DA output unit includes 8 road DA output channels；The I/O port communication unit includes 32 railway digital I/O ports；Described LVDS communication unit includes 4 railway digital LVDS serial ports；The RS422 communication unit includes 20 railway digital RSS422 serial ports.

It is using beneficial effect acquired by above-mentioned further technical solution: so that entire embedded controller module Interface resource is abundant, can satisfy the requirement of most of smart machines, improves the scope of application of this programme.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of circuit board；

Fig. 2 is the top view of Fig. 1；

Fig. 3 is the structural schematic diagram of encapsulating structure；

Fig. 4 is the scheme of installation of encapsulating structure and A plate；

Fig. 5 is the scheme of installation of encapsulating structure and limit plate；

Fig. 6 is enlarged drawing at the A of Fig. 5；

Fig. 7 is the structural schematic diagram of control module.

Wherein: 1-A plate, 2-B plate, 3- support column, 4- mounting hole, 5- limit plate, 51- lockplate, 52- arc convex, 6- Encapsulating structure, 61- side plate, 62- end baffle, 63- link block, 64- lock slots, 65- supporting block, 66- top plate.

Specific embodiment

Below with reference to examples and drawings, the utility model is described in further detail, but the reality of the utility model It is without being limited thereto to apply mode.

Embodiment 1:

In the present embodiment, a kind of embedded type control module, including circuit board, 6 and of encapsulating structure of setting on circuit boards The control module on circuit boards and being located inside encapsulating structure 6 is set.The circuit board includes A plate 1 and B plate 3, described The support column 2 of several connection A plates 1 and B plate 3 is provided between A plate 1 and B plate 3.As shown in Figure 1 and Figure 2, the B plate 3 Length is greater than the length of A plate 1, and the width of the B plate 3 is greater than the width of A plate 1, and the control module integrates 1 on A plate. Limit plate 5 is provided on the B plate 3.It is arranged as shown in figure 3, the encapsulating structure 6 includes 66, two, top plate in top plate On 66 same sides and side plate 61 parallel to each other, the end baffle that is arranged on top plate 66 and is located between two side plates 61 62, the inner surface of the side plate 61 is provided with link block 63, is provided with to cooperate with A plate 1 on the link block 63 and pacify The sliding slot of dress.

As shown in Figure 4, Figure 5, control module is integrated on A plate 1, utilizes the side of sliding slot and A plate 1 on encapsulating structure 6 Face is coupled, and can be realized the installation of encapsulating structure 6 Yu circuit board, thus by control module protection inside encapsulating structure 6. It can be arranged on the encapsulating structure 6 with the mutually matched opening of interface module to realize control module and other equipment Connection.The interface module refers to that control module is for connecting the interface of other equipment in this programme.

When this programme has encapsulating structure 6, can directly it be connect from outside with other equipment.When needing to integrate this programme When inside other equipment, by removing encapsulating structure 6, circuit board and other circuit connections can be made.It can satisfy two with this The different use state of kind.

Using the connection of sliding slot and A plate 1, will can be carried out in the thermal energy conduction on A plate 1 to encapsulating structure 6 when in use Heat dissipation.Using the gap between A plate 1 and B plate 3, also space can be provided for the heat dissipation of A plate 1, so that the A plate 1 in use state The directions different from two can radiate, and so as to improve the radiating efficiency of A plate 1, avoid control module by high temperature shadow It rings and fails, is impaired.It can accelerate the speed of heat transfer using support column 2 to quickly take away heat.In order to improve heat dissipation Efficiency, the encapsulating structure 6, B plate 3 and support column 2 are made of aluminium alloy, to enhance the efficiency of heat transfer and heat dissipation.

It is greater than 0 at a distance from the side plate 61 or end baffle 62 and B plate 3 of the encapsulating structure 6, side plate can be avoided with this 61 or end baffle 62 and B plate 3 be in contact and the heat-dissipating space between A plate 1 and B plate 3 caused to be blocked, to avoid radiating Efficiency is affected.

It is detachably connected top plate 66 using detachable structure with limit plate 5.According to specific needs, choose whether to seal Assembling structure 6 fills on circuit boards to meet different use environments.

Embodiment 2:

As shown in Figure 1, on the basis of the above embodiments, in the present embodiment, being provided with several peaces on the B plate 3 Fill hole 4.It is passed through using mounting hole 4 convenient for screw, to B plate 3 is fixed to realize integrally-built installation.The present embodiment In, other contents not described are same as the previously described embodiments, therefore do not repeat.

Embodiment 3:

As shown in figure 5, on the basis of the above embodiments, in the present embodiment, the detachable structure includes that setting exists Lockplate 51 on limit plate 5 and the lock slots 64 on top plate 66 and with the interference fit installation of lockplate 51 are set.Utilize lock The interference fit of fixed board 51 and lock slots 64 realize the installation of encapsulating structure 6 have it is easy to loading and unloading, do not need to increase supernumerary structure The advantages of, it is advantageously implemented simple, quick handling.In the present embodiment, other contents not described are same as the previously described embodiments, Therefore it does not repeat.

Embodiment 4:

On the basis of the above embodiments, in the present embodiment, the lockplate 51 is made of elastic material.With this benefit The bonding strength for increasing lockplate 51 Yu lock slots 64 with the elasticity of lockplate 51 is avoided in the case where not providing external force Lockplate 51 is loosened with lock slots 64.The elastic material uses one of rubber, plastics, elastic metallic, elastic alloy To meet requirement.In the present embodiment, the elastic material is the common knowledge of those skilled in the art, specific material Expect the improvement not as this programme, the specific material of elastic material is not defined herein.

As shown in fig. 6, being provided with several arc convex 52 on the lockplate 51, it is provided on the top plate 66 The arc groove being coupled with arc convex 52.It can be realized the work of fastening using the cooperation of arc convex 52 and arc groove With increasing the bonding strength of lockplate 51 Yu lock slots 64 with this, prevent lockplate 51 from loosening with lock slots 64 and cause to seal Assembling structure 6 is detached from circuit board.In the present embodiment, other contents not described are same as the previously described embodiments, therefore do not repeat.

Embodiment 5:

On the basis of the above embodiments, in the present embodiment, the detachable structure is connected using threaded connection or buckle The bonding strength for increasing lockplate 51 and lock slots 64 is fetched, the threaded connection or is snapped connection as those skilled in the art Conventional techniques, specific structure is not as the improvement of this programme, and those skilled in the art are according to specifically needing to select Being threadedly coupled or snapped connection with any one can be realized said effect, herein not to the tool for being threadedly coupled or snapping connection Body structure is repeated.In the present embodiment, other contents not described are same as the previously described embodiments, therefore do not repeat.

Embodiment 5:

As shown in figure 3, on the basis of the above embodiments, in the present embodiment, in the present embodiment, the end baffle 62 On be provided with supporting block 65.The maximum distance of the supporting block 65 and end baffle 62 is equal to end baffle 62 and B plate 3 most Big distance.It, can be using supporting block 65 and lockplate 51 to encapsulating structure with this after encapsulating structure 6 is coupled with A plate 1 6 play a supporting role, and when encapsulating structure 6 being avoided to bear pressure, pressure passes to A plate 1 and support column 2, avoid A plate 1 or support Column 2 is damaged under the effect of the pressure and influences to use.In the present embodiment, other contents not described are same as the previously described embodiments, Therefore it does not repeat.

Embodiment 6:

On the basis of the above embodiments, in the present embodiment, on the support column 2 and support column 2 respectively with A plate 1, The junction of B plate 3 is coated with heat conductive rubber, increases the bonding strength of support column 2 and A plate 1, B plate 3 using heat conductive rubber, simultaneously The thermally conductive function that support column 2 can be enhanced is conducive to 1 rapid cooling of A plate in use process, and the use of component is protected to pacify Entirely, and the junction of support column 2 and A plate 1 or B plate 3 is avoided to be disconnected because temperature is excessively high.It is described in the present embodiment Heat conductive rubber is the known current material of those skilled in the art, and this programme is not related to the improvement to heat conductive rubber material, herein The specific material of heat conductive rubber is not defined and is repeated.In the present embodiment, other contents not described and above-described embodiment It is identical, therefore do not repeat.

Embodiment 7:

As shown in fig. 7, on the basis of the above embodiments, in the present embodiment, the control module is integrated on A plate 1, The control module includes FPGA module, the first CPU and the 2nd CPU that connect respectively with FPGA module.The FPGA mould Block is connected with interface module, and the first CPU is connected with debugging interface.2nd CPU be connected with serial interface module, Memory module and network control module, the network control module are connected with RJ45 interface.First CPU and second CPU is all made of Powerpc8315 processor.The serial interface module uses RS232 interface chip MAX232, serial line interface For connecting the function that external sensor makes this programme have monitoring or monitoring data, RS232 standard for serial communication connects module Mouth is easy to use, and wiring is few and transmission range is up to 15m, it is sufficient to meet the technical requirements of sensor monitoring system.Described Memory module uses eeprom memory, saves the configuration informations such as IP address, MAC Address using memory module, makes convenient for basis Parameter flexibly is modified to meet specific requirement with the difference of environment.

By FPGA module, the first CPU, the 2nd CPU, interface module, debugging interface, serial interface module, memory module, net On a circuit board, the first CPU and the 2nd CPU can work independently for network control module, RJ45 interface and sensor integration It can cooperate to enhance data-handling capacity and arithmetic speed.Network control module connects ether by RJ45 interface Net transmits data using Ethernet protocol, is with good expansibility.

This programme also has that integrated level is high, interface resource is abundant, wide adaptation range, is convenient to insertion intelligence system and is counted The advantages that according to processing.Reserved debugging interface can be communicated with host computer, to be debugged using host computer, to improve we The performance of case.

The interface module include AD acquisition unit, DA output unit, I/O port communication unit, LVDS communication unit and RS422 communication unit.The AD acquisition unit includes 12 road AD acquisition channels；The DA output unit includes 8 road DA defeated Channel out；The I/O port communication unit includes 32 railway digital I/O ports；The LVDS communication unit is gone here and there including 4 railway digital LVDS Mouthful；The RS422 communication unit includes 20 railway digital RSS422 serial ports.Make connecing for entire embedded controller module with this Mouth is resourceful, can satisfy the requirement of most of smart machines, improves the scope of application of this programme.

The interface module is connected with CPCI connector.Enhance the detachability, suitability, versatility of this programme with this And it is embedded use ability.

First CPU is connected with reset circuit and LED light.This programme work shape is indicated using LED light State.Using reset circuit this programme is restored to initial state.

First CPU and the 2nd CPU passes through CPCI connector and connect with FPGA module.Make FPGA module and two The transmission for carrying out data-/ command between CPU module by CPCI connector, can make between FPGA module and two CPU modules Detachably, when wherein some module damage, the module is only needed to change, normal use can be continued, to reduce use cost.

2nd CPU is connect by latch with network control module.Latch be 8 latch 74LS373 and 16 latch 74LCX16373.Latch is the sensitive storage unit circuit of a kind of pair of impulse level, they can be specific Input pulse level acts on lower change state.It latches, exactly signal is kept in maintain certain level state.Latch it is most main Acting on is caching, secondly completes the asynchronous problem of the controller and peripheral hardware at a slow speed of high speed, is thirdly to solve driving Problem is finally to solve the problems, such as that one I/O mouthfuls can export and can also input.Latch is to utilize the defeated of level control data Enter.

In the present embodiment, the circuit board includes A plate 1 and B plate 3, is provided between the A plate 1 and B plate 3 several A support column 2.The A plate 1 for integrating, fix for realizing installation by the B plate 3, such as is encapsulated and tied using B plate more than 3 Structure installation.The cavity formed between A plate 1 and B plate 3, which can make 1 two sides of A plate, can radiate to enhance the heat radiation energy of A plate 1 Power, the support column 2 can also play thermally conductive function, the thermal energy on part A plate 1 is oriented to B plate 3, to help A plate 1 Heat dissipation, avoiding A plate 1, temperature is excessively high and component is caused to burn out during use, protects this programme and wherein component Using safe.In order to uniformly conduct thermal energy, the support column 2 is uniformly distributed by array.Or in order to reinforce member The heat dissipation of device position keeps support column 2 corresponding with the distributing position of component on A plate 1, in the place for having component point Cloth is more or more dense.

It is above-described, it is only the preferred embodiment of the utility model, any form not is made to the utility model On limitation, according to the technical essence of the utility model, within the spirit and principles of the present invention, to above embodiments institute Any simple modifications, equivalent substitutions and improvements etc. made, within the protection scope for still falling within technical solutions of the utility model.

Claims (10)

1. a kind of embedded type control module, it is characterised in that: including circuit board, setting encapsulating structure (6) on circuit boards and It is arranged on circuit boards and is located at encapsulating structure (6) internal control module；

The circuit board includes A plate (1) and B plate (3), is provided with several support columns between the A plate (1) and B plate (3) (2)；The length of the B plate (3) is greater than the length of A plate (1), and the width of the B plate (3) is greater than the width of A plate (1), institute The control module stated integrates on A plate (1)；

Limit plate (5) are provided on the B plate (3)；

The encapsulating structure (6) include top plate (66), two be arranged on top plate (66) same side and side parallel to each other Plate (61), the end baffle (62) for being arranged on top plate (66) and being located between two side plates (61), the side plate (61) Inner surface is provided with link block (63), and the sliding slot that can be coupled with A plate (1) is provided on the link block (63)；

The top plate (66) is detachably connected with limit plate (5) using detachable structure.

2. a kind of embedded type control module according to claim 1, it is characterised in that: the B plate (3) and support column (2) it is made of aluminium alloy.

3. a kind of embedded type control module according to claim 2, it is characterised in that: the B plate (3) if on be provided with Dry mounting hole (4).

4. a kind of embedded type control module according to claim 1, it is characterised in that: the detachable structure includes setting It sets in the lockplate (51) on limit plate (5) and the locking for being arranged on top plate (66) and being installed with lockplate (51) interference fit Slot (64).

5. a kind of embedded type control module according to claim 4, it is characterised in that: the lockplate (51) uses bullet Property material is made.

6. a kind of embedded type control module according to claim 4 or 5, it is characterised in that: on the lockplate (51) Several arc convex (52) are provided with, it is recessed that the arc being coupled with arc convex (52) is provided on the top plate (66) Slot.

7. a kind of according to claim 1, embedded type control module described in any one of 2,3,4,5, it is characterised in that: described Supporting block (65) are provided in end baffle (62).

8. a kind of according to claim 1, embedded type control module described in any one of 2,3,4,5, it is characterised in that: described Control module includes FPGA module, passes through the first CPU and the 2nd CPU that CPCI connector is connect with FPGA module respectively；It is described FPGA module be connected with interface module, the first CPU is connected with debugging interface；2nd CPU is connected with serially Interface module, memory module and network control module, the network control module are connected with RJ45 interface；The interface group Part is connected with CPCI connector；First CPU is connected with reset circuit and LED light；2nd CPU passes through lock Storage is connect with network control module.

9. a kind of embedded type control module according to claim 8, it is characterised in that: the interface module includes that AD is adopted Collect one of unit, DA output unit, I/O port communication unit, LVDS communication unit, RS422 communication unit or a variety of.

10. a kind of embedded type control module according to claim 9, it is characterised in that: the AD acquisition unit includes 12 road AD acquisition channels；The DA output unit includes 8 road DA output channels；The I/O port communication unit includes 32 numbers Word I/O port；The LVDS communication unit includes 4 railway digital LVDS serial ports；The RS422 communication unit includes 20 railway digitals RSS422 serial ports.