CN213306042U

CN213306042U - Module with high heat resistance

Info

Publication number: CN213306042U
Application number: CN202022113988.6U
Authority: CN
Inventors: 郑洁
Original assignee: Shenzhen Xinwangtaike Network Co ltd
Current assignee: Shenzhen Xinwangtaike Network Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-05-28
Anticipated expiration: 2030-09-24

Abstract

The utility model provides a module that heat resistance is strong belongs to strong heat resistance module technical field, including module shell, accumulator and chip groove, the accumulator is located module shell upper end left side, and accumulator and module shell fixed connection, and the accumulator right side is equipped with the chip groove, and chip groove and module shell through connection, and chip groove right side is equipped with the treater, and treater and module shell fixed connection. This kind of module structure that heat resistance is strong is stable, when this device is when the inside temperature rose under long-time work, heat conduction is timely with the heat dissipation, can not lead to the inside circuit of module or structure to cause the damage, life increases substantially, do benefit to in-service use, and the inside heat conduction structure of this device is not the exclusive work, the connectivity between the heat conduction structure is fine, the heat conductivity inside the module is strong, the radiating rate is fast, avoid the module inside temperature to rise the back suddenly, heat conduction and radiating work are too slow, and influence the normal work of module.

Description

Module with high heat resistance

Technical Field

The utility model relates to a strong heat resistance module technical field specifically is a module that heat resistance is strong.

Background

The power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads. Generally, such modules are referred to as point-of-load (POL) power supply systems or point-of-use power supply systems (PUPS). Due to the advantages of the modular structure, the modular power supply is widely used in the communication fields of switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, and in automotive electronics, aerospace and the like.

However, the heat conduction structure is single in the existing module, the module works for a long time, the internal temperature rises, the heat conduction and the heat dissipation are not timely, the circuit or the structure inside the module is damaged, the service life is greatly shortened, the actual use is not facilitated, the heat conduction structure inside the existing module works independently, the connectivity between the heat conduction structures is not enough, the heat conduction to the inside of the module is not strong, the heat dissipation speed is low, after the temperature in the module rises suddenly, the heat conduction and the heat dissipation work are not good enough, and the normal work of the module is influenced.

Therefore, it is desirable to upgrade and modify existing modules with high heat resistance to overcome the existing problems and deficiencies.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems that the prior module has a single internal heat conduction structure, the module works for a long time, the internal temperature rises, the heat conduction and the heat dissipation are not timely, the circuit or the structure in the module is damaged, the service life is greatly reduced, the practical use is not facilitated, the prior module has the advantages that the internal heat conduction structure works independently, the connectivity between the heat conduction structures is not enough, the heat conduction to the module is not strong, the heat dissipation speed is low, the internal temperature of the module rises rapidly, the heat conduction and the heat dissipation work are not good enough, the normal work of the module is influenced, the module with strong heat resistance is provided, the structure of the device is stable by arranging a heat conduction layer, a heat dissipation plate, a connecting block and a heat transfer plate, through the heat conduction layer and the heat dissipation plate, when the internal temperature of the module rises under the long-time work, the circuit or the structure in the, the service life is greatly prolonged, the device is favorable for practical use, the heat conduction structure inside the device does not work independently, the connectivity between the heat conduction structures is good, the heat conductivity inside the module is strong, the heat dissipation speed is high, and the normal work of the module is prevented from being influenced due to too slow heat conduction and heat dissipation work after the temperature inside the module rises suddenly.

In order to achieve the above object, the present invention provides a module with high heat resistance, comprising a module housing, a storage and a chip slot, wherein the storage is located at the left side of the upper end of the module housing, the storage is fixedly connected with the module housing, the right side of the storage is provided with the chip slot, the chip slot is connected with the module housing, the right side of the chip slot is provided with a processor, the processor is fixedly connected with the module housing, one side of the processor is provided with a chip ejector, the chip ejector is connected with the module housing, the front end of the transverse cutting surface of the module housing is provided with an installation interface, the installation interface is connected with the module housing, the left side of the module housing is provided with a ventilating plate, the ventilating plate is connected with the module housing, the middle of the inner side of the module housing is provided with a heat conducting layer, the heat conducting layer is fixedly connected with the module housing, the left and right ends of, and the heat dissipation plate is connected with the heat conduction layer in an embedded mode, the left end and the right end of the upper side of the heat conduction layer are respectively provided with a heat conduction block, the heat conduction blocks are fixedly connected with the heat conduction layer, the middle of the upper side of the heat conduction layer is provided with a connecting block, the connecting blocks are fixedly connected with the heat conduction blocks, the upper side of each heat conduction block is provided with a heat conduction column, the heat conduction columns are fixedly connected with the heat conduction blocks, the left side of the heat conduction layer is provided with a heat conduction plug, the heat conduction plug is fixedly connected with the heat conduction layer, the upper side of.

Preferably, the number of the heat dissipation plates is 2, and the ventilation plates are arranged in parallel with the heat dissipation plates.

Preferably, the number of the heat conduction blocks is 2, and the heat conduction blocks are symmetrically distributed by taking the connection block as a center.

Preferably, the heat conduction plug is rectangular, and the equal equidistance of heat conduction plug distributes in heat-conducting layer one side.

Preferably, the heat dissipation sockets and the heat conduction plug are arranged in an embedded mode, and the heat dissipation sockets are connected through heat transfer plates.

Preferably, the heat conduction columns are circular and are perpendicular to the upper ends of the heat conduction blocks.

Has the advantages that:

(1) this kind of module that heat resistance is strong passes through the improvement of structure, make this device when in-service use, when this device is when the inside temperature rises under long-time work, heat conduction is timely with the heat dissipation, can not lead to inside circuit of module or structure to cause the damage, life increases substantially, do benefit to in-service use, and the inside heat conduction structure of this device is not the exclusive work, the connectivity between the heat conduction structure is fine, the heat conductivity to the module inside is strong, the radiating rate is fast, avoid the module inside temperature to rise the back suddenly, heat conduction and radiating work are too slow, and influence the normal work of module.

(2) The module with strong heat resistance has the advantages that: because this device is equipped with heat-conducting layer and heating panel, through heat-conducting layer and heating panel for the module is under long-time work, when inside temperature rose, can in time heat conduction and heat dissipation to the temperature of module inside, thereby make the inside high temperature of module, avoid the module can not lead to the damage of its circuit or structure because inside high temperature, and then make the life of module improve, do benefit to in-service use.

(3) Secondly, the method comprises the following steps: the heat conducting structure inside the device does not work independently, the heat conducting layer and the heat radiating plate are good in connectivity through the connecting block, the heat conducting plug, the heat radiating socket and the heat transfer plate, the heat conducting layer and the heat radiating plate are high in heat conductivity to the inside of the module, the heat radiating speed is high, and the phenomenon that after the temperature inside the module rises suddenly, the heat conducting and radiating work is too slow, and the normal work of the module is affected is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic diagram of the internal structure of the module of the present invention.

Fig. 3 is a schematic view of the heat conducting layer structure of the present invention.

Fig. 4 is a schematic view of the heat dissipation plate structure of the present invention.

In FIGS. 1-4: 1. a module housing; 2. a reservoir; 3. a chip slot; 4. a chip flicker; 5. a processor; 6. installing an interface; 7. a ventilation board; 8. a heat conductive layer; 801. a heat conducting block; 802. a heat-conducting column; 803. connecting blocks; 804. a heat conducting plug; 9. a heat dissipation plate; 901. a heat dissipation socket; 902. a heat transfer plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.

Example (b):

with reference to the figures 1-4 of the drawings,

the module with high heat resistance provided by the embodiment comprises a module shell 1, a storage 2 and a chip groove 3, wherein the storage 2 is positioned on the left side of the upper end of the module shell 1, the storage 2 is fixedly connected with the module shell 1, the chip groove 3 is arranged on the right side of the storage 2, the chip groove 3 is communicated with the module shell 1, a processor 5 is arranged on the right side of the chip groove 3, the processor 5 is fixedly connected with the module shell 1, a chip flicking device 4 is arranged on one side of the processor 5, the chip flicking device 4 is communicated with the module shell 1, a mounting interface 6 is arranged at the front end of the transverse section of the module shell 1, the mounting interface 6 is communicated with the module shell 1, a ventilating plate 7 is arranged on the left side of the module shell 1, the ventilating plate 7 is communicated with the module shell 1, a heat conducting layer 8 is arranged in the middle of the inner side of the module shell 1, and, both ends all are equipped with heating panel 9 about heat-conducting layer 8, and heating panel 9 inlays with heat-conducting layer 8 and is connected, both ends all are equipped with heat conduction piece 801 about 8 upsides of heat-conducting layer, and

heat conduction piece

801 and 8 fixed connection of heat-conducting layer, all be equipped with connecting block 803 in the middle of the 8 upsides of heat-conducting layer, and connecting block 803 and heat conduction piece 801 fixed connection, heat conduction piece 801 upside all is equipped with heat conduction post 802, and heat conduction post 802 and heat conduction piece 801 fixed connection, 8 left sides of heat-conducting layer all are equipped with heat conduction plug 804, and

heat conduction plug

804 and 8 fixed connection of heat-conducting layer, 9 upsides of heating panel all are equipped with heat dissipation socket 901 and heat transfer.

Furthermore, 2 heat dissipation plates 9 are arranged, and the ventilation plates 7 are arranged in parallel with the heat dissipation plates 9;

in this embodiment, through this kind of design for the temperature transmission in the heat-conducting layer 8 comes out simultaneously on both sides about the heating panel 9, and the temperature elimination in the heat-conducting layer 8 is faster, and the ventilating board 7 all with heating panel 9 parallel arrangement, thereby make the temperature transmission in the heat-conducting layer 8 to heating panel 9 after, the temperature of heating panel 9 can be better dissipates to external UNICOM.

Further, the heat conducting columns 802 are circular, and the heat conducting columns 802 are all perpendicular to the upper ends of the heat conducting blocks 801;

in this embodiment, the heat-conducting pillar 802 is perpendicular to the upper end of the heat-conducting block 801, so that the high temperature generated by the storage 2 and the processor 5 during long-time operation is transmitted to the heat-conducting block 801 through the conduction of the heat-conducting pillar 802.

Furthermore, 2 heat conduction blocks 801 are arranged, and the heat conduction blocks 801 are symmetrically distributed by taking the connection block 803 as a center;

in this embodiment, through this kind of design for heat conduction block 801 can carry out the UNICOM through connecting block 803 when conducting the temperature, thereby makes 2 heat conduction blocks 801's temperature even equal, can not appear one of them heat conduction block 801 excessive situation on the high side, reduces heat conduction block 801's life.

Further, the heat conducting plugs 804 are rectangular, and the heat conducting plugs 804 are equally spaced on one side of the heat conducting layer 8;

in this embodiment, the heat conducting plugs 804 are equally spaced on one side of the heat conducting layer 8, so that when the temperature of the heat conducting block 801 is conducted to the heat conducting plugs 804, the heat conducting plugs 804 can evenly absorb and transmit the temperature conducted by the heat conducting block 801.

Further, the heat dissipation sockets 901 and the heat conducting plug 804 are arranged in an embedded manner, and the heat dissipation sockets 901 are connected by heat transfer plates 902;

in this embodiment, through such a design, after the heat conducting plug 804 absorbs the temperature transmitted by the heat conducting block 801 uniformly, the heat conducting plug 804 can directly transmit the absorbed temperature to the heat dissipation sockets 901, and the heat dissipation sockets 901 are connected by the heat transfer plate 902, so that the temperatures between all the heat dissipation sockets 901 can be uniformly dispersed by the heat transfer plate 902, and the heat dissipation speed is increased.

The working principle is as follows:

when the module with strong heat resistance provided by the embodiment is used, the tightness of connection among all parts of the module is firstly checked, the module is well installed through the installation interface 6, after the module normally works, the storage 3, the processor 5 and the like can generate heat under long-time work, so that the temperature inside the module rises, the heat conduction layer 8 and the heat dissipation plate 9 can play a role in timely conducting and dissipating heat to the temperature inside the module, the heat conduction column 802 in the heat conduction layer 8 can conduct the temperature of the storage 3 and the processor 5 and then transmit the temperature to the heat conduction block 801, the temperature in the heat conduction block 801 can be conducted to the heat conduction plug 804, the heat conduction plug 804 can uniformly absorb and transmit the temperature conducted by the heat conduction block 801, the temperature inside the module cannot be too high, and the phenomenon that the circuit or the structure of the module is damaged due to the too high internal temperature is avoided, then through heat dissipation socket 901 and heat conduction plug 804 for inlaying the setting, thereby make heat conduction plug 804 can directly spread absorbed temperature to heat dissipation socket 901, and all connect with heat transfer plate 902 between the heat dissipation socket 901, and then make the temperature between all heat dissipation sockets 901 can pass through heat transfer plate 902 homodisperse, heat transfer plate 902 passes through ventilating board 7 and is connected with the external world, dissipate the temperature from ventilating board 7 fast again, therefore the inside heat conductivity of visible module is strong, the radiating rate is fast, avoid the inside temperature of module to rise the back suddenly, heat conduction and radiating work are too slow, and influence the normal work of module, do benefit to in-service use.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A module with high heat resistance comprises a module shell (1), a storage (2) and a chip groove (3), and is characterized in that the storage (2) is positioned on the left side of the upper end of the module shell (1), the storage (2) is fixedly connected with the module shell (1), the chip groove (3) is arranged on the right side of the storage (2), the chip groove (3) is communicated with the module shell (1), a processor (5) is arranged on the right side of the chip groove (3), the processor (5) is fixedly connected with the module shell (1), a chip flicking device (4) is arranged on one side of the processor (5), the chip flicking device (4) is communicated with the module shell (1), a mounting interface (6) is arranged at the front end of the transverse section of the module shell (1), the mounting interface (6) is communicated with the module shell (1), and a ventilating plate (7) is arranged on the left side of the module shell (1), the ventilation plate (7) is communicated with the module shell (1), the middle of the inner side of the module shell (1) is provided with a heat conduction layer (8), the heat conduction layer (8) is fixedly connected with the module shell (1), the left end and the right end of the heat conduction layer (8) are respectively provided with a heat dissipation plate (9), the heat dissipation plates (9) are connected with the heat conduction layer (8) in an embedding way, the left end and the right end of the upper side of the heat conduction layer (8) are respectively provided with a heat conduction block (801), the heat conduction block (801) is fixedly connected with the heat conduction layer (8), the middle of the upper side of the heat conduction layer (8) is respectively provided with a connecting block (803), the connecting block (803) is fixedly connected with the heat conduction block (801), the upper side of the heat conduction block (801) is respectively provided with a heat conduction column (802), the heat conduction column (802) is fixedly connected with the heat conduction block (801), the upper side of the heat dissipation plate (9) is provided with a heat dissipation socket (901) and a heat transfer plate (902), and the heat dissipation socket (901) and the heat transfer plate (902) are fixedly connected with the heat dissipation plate (9).

2. The module with high heat resistance according to claim 1, wherein the number of the heat dissipation plates (9) is 2, and the ventilation plates (7) are arranged in parallel with the heat dissipation plates (9).

3. The module with high heat resistance according to claim 1, wherein the number of the heat conduction blocks (801) is 2, and the heat conduction blocks (801) are symmetrically distributed around the connection block (803).

4. The module with high heat resistance according to claim 1, wherein the heat conducting plugs (804) are rectangular, and the heat conducting plugs (804) are distributed at equal intervals on one side of the heat conducting layer (8).

5. The module with high heat resistance according to claim 1, wherein the heat dissipation sockets (901) and the heat conducting plugs (804) are arranged in a mosaic manner, and the heat dissipation sockets (901) are connected with each other by heat transfer plates (902).

6. The module with high heat resistance as claimed in claim 1, wherein the heat conducting columns (802) are circular, and the heat conducting columns (802) are all perpendicular to the upper end of the heat conducting block (801).