CN207249194U - A kind of parallel light transceiving module - Google Patents
A kind of parallel light transceiving module Download PDFInfo
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- CN207249194U CN207249194U CN201721234583.XU CN201721234583U CN207249194U CN 207249194 U CN207249194 U CN 207249194U CN 201721234583 U CN201721234583 U CN 201721234583U CN 207249194 U CN207249194 U CN 207249194U
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- thermal conductive
- conductive substrate
- parallel light
- transceiving module
- chip assembly
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Abstract
The utility model discloses a kind of parallel light transceiving module, parallel light transceiving module includes ribbon assemblies, electric connector, shell body, pcb board and chip assembly in shell body, the optical device of ribbon assemblies communicates with chip assembly, chip assembly communicates with pcb board, and pcb board communicates with electric connector；Shell body includes upper shell and lower housing shell, and parallel light transceiving module further includes two the first thermal conductive substrates, two the second thermal conductive substrates, and the side of two the first thermal conductive substrates is upwardly extended to be contacted with upper shell inner surface, forms heat dissipation channel；Two the second thermal conductive substrate bottom surfaces are contacted with lower housing shell inner surface, form heat dissipation channel；Chip assembly is fixed in corresponding thermal conductive substrate.The utility model realizes 48 tunnel high density small size encapsulation, improves heat dissipation effect, extends the service life of chip assembly.
Description
Technical field
The utility model belongs to technical field of photo communication, is to be related to a kind of parallel light transceiving module specifically.
Background technology
Popularization and deep application with optic communication, there is miniaturization, high density, high speed in photoelectric conversion module market
Rate, powerful demand, the module heat dissipating problem brought therewith, also have impact on properties of product and service life.How module realizes this
The unification of a little opposites, in the case of more number of channels, accomplishes reduced size, and can solve heat dissipation problem, becomes product
It is successfully crucial.
Heat during high-power optical-electric module work mostlys come from the chip of inside, it is necessary to by encapsulating design by its heat
Amount export, along with number of channels is more, it is larger to frequently can lead to module encapsulation volume, takes motherboard layout space, reduces module
Application density.The such high-power optical-electric module product occurred currently on the market, port number at most generally only has 24 tunnels, and encapsulates
Volume is relatively large, heat dissipation effect far from ideal, is difficult to realize small-sized package, multichannel quantity, and high efficiency and heat radiation three takes into account.
The content of the invention
The utility model provides a kind of parallel light transceiving module, improves heat dissipation effect.
In order to solve the above technical problems, the utility model is achieved using following technical scheme：
A kind of parallel light transceiving module, including ribbon assemblies, electric connector, shell body, the pcb board in shell body
And chip assembly, the optical device of the ribbon assemblies communicate with chip assembly, the chip assembly communicates with pcb board,
The pcb board communicates with electric connector；The shell body includes upper shell and lower housing shell, and the parallel light transceiving module further includes
First thermal conductive substrate, first thermal conductive substrate are fixed on pcb board, and the chip assembly is fixed on the first thermal conductive substrate top
Face；The side of first thermal conductive substrate upwardly extends to form thermal conductive surface, and top surface and the upper shell inner surface of the thermal conductive surface connect
Touch.
Further, the ribbon assemblies include four optical devices, and the parallel light transceiving module includes four chips
Component, four optical devices correspond progress light path with four chip assemblies and couple；First thermal conductive substrate is laid
There are two, two of which chip assembly corresponds to and is fixed on the first thermal conductive substrate top surface；The parallel light transceiving module further includes two
A second thermal conductive substrate, second thermal conductive substrate are fixed on pcb board, two other chip assembly correspondence is fixed on second and leads
Hot substrate surface, the bottom surface of second thermal conductive substrate are contacted with lower housing shell inner surface.
Further, the lower housing shell has multiple mounting posts, is laid with the corresponding position of the upper shell multiple
Stepped hole, the mounting post are melted in corresponding stepped hole.
Further, each optical device is respectively provided with 12 passages, the optical fiber connector of the ribbon assemblies
With 48 passages.
Further, the pilot hole being adapted to electric connector, the electrical connection are offered in the bottom surface of the lower housing shell
Device is installed in pilot hole.
Preferably, at least two location holes are laid with the electric connector, the corresponding position on the lower housing shell
Pilot pin is laid with, the position of the pilot pin and quantity are adapted to location hole；The electric connector is installed in pilot hole, institute
State pilot pin and pass through corresponding location hole.
Further, the upper shell, lower housing shell, the first thermal conductive substrate, the second thermal conductive substrate are metal material.
Further, the chip assembly by heat-conducting patch glue sticking in corresponding thermal conductive substrate；Described first
Thermal conductive substrate, the second thermal conductive substrate are pasted or are welded on pcb board respectively.
Further, the optical device of the ribbon assemblies is FA optical devices.
Compared with prior art, the advantages of the utility model and good effect is：The parallel light transmitting-receiving mould of the utility model
Block, since chip assembly is fixed on the first thermal conductive substrate top surface, the thermal conductive surface and upper shell inner surface of the first thermal conductive substrate are direct
Contact；Therefore the heat transfer that chip assembly distributes is passed to the first thermal conductive substrate by the thermal conductive surface of the first thermal conductive substrate
Upper shell, heat is distributed in time, improves heat dissipation effect, extends the service life of chip assembly.
After the detailed description of the utility model embodiment is read in conjunction with the figure, other features and advantage of the utility model
It will become clearer.
Brief description of the drawings
Fig. 1 is the positive structure schematic of the one embodiment for the parallel light transceiving module that the utility model is proposed；
Fig. 2 is the reverse structure schematic of one embodiment of parallel light transceiving module in Fig. 1；
Fig. 3 is the explosive view of Fig. 1；
Fig. 4 is the fragmentary cross-sectional view of Fig. 1；
Fig. 5 is the fragmentary cross-sectional view of Fig. 1；
Fig. 6 is the structure diagram of the ribbon assemblies of parallel light transceiving module in Fig. 1；
Fig. 7 is thermal conductive substrate and the connection diagram of pcb board in Fig. 1；
Fig. 8 is the connection diagram of Fig. 1 chips component and thermal conductive substrate；
Fig. 9 is the connection diagram of pcb board and lower housing shell in Fig. 1；
Figure 10 is the connection diagram of electric connector and lower housing shell in Fig. 1.
Reference numeral：
100th, upper shell；110th, stepped hole；
200th, ribbon assemblies；210th, optical device；220th, optical device；230th, optical device；240th, optical device；250th, light connects
Device；
310th, chip assembly；320th, chip assembly；330th, chip assembly；340th, chip assembly；
410th, the second thermal conductive substrate；420th, the second thermal conductive substrate；430th, the first thermal conductive substrate；440th, the first thermal conductive substrate；
500th, pcb board；
600th, lower housing shell；610th, mounting post；620th, pilot pin；700th, electric connector.
Embodiment
Specific embodiment of the present utility model is described in more detail below in conjunction with the accompanying drawings.
The parallel light transceiving module of the present embodiment mainly includes ribbon assemblies 200, electric connector 700, shell body, is located at
Pcb board 500 and chip assembly in shell body, the optical device 210 of ribbon assemblies 200 communicate with chip assembly, chip
Component communicates with pcb board 500, and pcb board 500 communicates with electric connector 700, and electric connector 700 is the external electrical interface of module；Outside
Housing includes upper shell 100 and lower housing shell 600；Parallel light transceiving module further includes the first thermal conductive substrate, and the first thermal conductive substrate is consolidated
It is scheduled on pcb board 500, chip assembly is fixed on the first thermal conductive substrate top surface；The side of first thermal conductive substrate upwardly extends to be formed
Thermal conductive surface, the top surface of thermal conductive surface is contacted with 100 inner surface of upper shell, referring to shown in Fig. 1 to Figure 10.
The parallel light transceiving module of the present embodiment, since chip assembly is fixed on the first thermal conductive substrate top surface, the first heat conduction
The thermal conductive surface of substrate is directly contacted with upper shell inner surface, and the first thermal conductive substrate, upper shell form the heat dissipation channel of chip；Therefore
The heat transfer that chip assembly distributes gives the first thermal conductive substrate, and passes to upper shell 100 by the thermal conductive surface of the first thermal conductive substrate,
Heat is distributed in time, improves heat dissipation effect, extends the service life of chip assembly.
In the present embodiment, ribbon assemblies 200 include 250, four fibre ribbon, optical connector optical devices：Optical device
210th, optical device 220, optical device 230, optical device 240；One end connection optical connector 250 of fibre ribbon, the other end of fibre ribbon
Connect four optical devices；Optical-path interface of the optical connector 250 as parallel light transceiving module.It is adapted, parallel light transmitting-receiving mould
Block includes four chip assemblies：Chip assembly 310, chip assembly 320, chip assembly 330, chip assembly 340；Four optical devices
Progress light path is corresponded with four chip assemblies to couple.Chip assembly act as opto-electronic conversion, receives what optical device was sent
Optical signal is simultaneously converted to electric signal, is then sent to pcb board；Moreover, chip assembly also receives the electric signal of pcb board transmission and turns
Optical signal is changed to, is then sent to optical device.
In order to radiate to four chip assemblies, it is adapted, the first thermal conductive substrate is laid with two：First thermal conductive substrate
430th, the first thermal conductive substrate 440；Two chip assemblies therein correspond to and are fixed on the first thermal conductive substrate top surface, i.e. chip assembly
330 are fixed on 430 top surface of the first thermal conductive substrate, and chip assembly 340 is fixed on 440 top surface of the first thermal conductive substrate.
Parallel light transceiving module further includes two the second thermal conductive substrates：Second thermal conductive substrate 410, the second thermal conductive substrate 420；
Two the second thermal conductive substrates are separately fixed on pcb board, and the bottom surface of each second thermal conductive substrate stretches out, and PCB is stretched out in bottom surface
Plate is contacted with lower housing shell inner surface, and the second thermal conductive substrate, lower housing shell form the heat dissipation channel of chip；In addition two chip assemblies
Correspondence is fixed on the second thermal conductive substrate top surface, i.e. chip assembly 310 is fixed on the second thermal conductive substrate top surface 410；Chip assembly 320
It is fixed on the second thermal conductive substrate top surface 420；Therefore, the heat transfer that chip assembly 310 and 320 distributes gives corresponding second heat conduction
Substrate, lower housing shell 600 is passed to via the second thermal conductive substrate, and heat is distributed in time.
Therefore, parallel light transceiving module includes two the first thermal conductive substrates, two the second thermal conductive substrates, the first thermal conductive substrate
Side upwardly extend and contacted with upper shell inner surface, form heat dissipation channel；Pcb board and lower casing are stretched out in second thermal conductive substrate bottom surface
Internal surface contact, forms heat dissipation channel;Chip assembly is fixed on corresponding thermal conductive substrate top surface, passes through respective heat dissipation channel
Heat dissipation.The design of heat dissipation channel, heat is grouped and is conducted, each independent conducting path, heat is distributed more balanced, heat transfer
It is more efficient.
That is, chip assembly 330,340 is mounted on corresponding first thermal conductive substrate top surface, and two the first thermal conductive substrates are prolonged upwards
Put in and gone corner design and form thermal conductive surface, thermal conductive surface is bonded with upper shell inner surface, and chip heat is conducted to upper shell dissipates
Hair;Chip assembly 310,320 is mounted on corresponding second thermal conductive substrate top surface, and two second thermal conductive substrate bottom surface one end are stretched out
Pcb board is mounted with lower housing shell inner surface, and chip heat is conducted to lower housing shell and is distributed.
Specifically, the heat transfer that chip assembly 310 distributes gives the second thermal conductive substrate 410, via the second thermal conductive substrate
410 radiating surface passes to lower housing shell 600；The heat transfer that chip assembly 320 distributes gives the second thermal conductive substrate 420, via
The radiating surface of two thermal conductive substrates 420 passes to lower housing shell 600；The heat transfer that chip assembly 330 distributes gives the first thermal conductive substrate
430, pass to upper shell 100 via the radiating surface of the first thermal conductive substrate 430；The heat transfer that chip assembly 340 distributes is to the
One thermal conductive substrate 440, upper shell 100 is passed to via the radiating surface of the first thermal conductive substrate 430.
I.e. the heat of two of which chip assembly is conducted to upper shell 100 by the first thermal conductive substrate respectively, two other
The heat of chip assembly is conducted to lower housing shell 600 by the second thermal conductive substrate respectively, i.e., the heat tool that four chip assemblies distribute
There is different heat conduction paths, the heat distributed is transmitted on shell body respectively, improves thermal conduction rate, expands heat dissipation area,
So that heat distribution is more balanced, heat dissipation is more efficient, improves the radiating efficiency of whole parallel light transceiving module.
In order to further improve heat dissipation effect, upper shell 100,600, two the first thermal conductive substrates of lower housing shell, two second
Thermal conductive substrate is metal material, good heat conduction effect, and radiating efficiency is high.
Chip assembly by heat-conducting patch glue sticking in corresponding thermal conductive substrate, not only stable connection, but also improve heat transfer
Efficiency, ensures heat dissipation effect.
First thermal conductive substrate, the second thermal conductive substrate are pasted or are welded on pcb board respectively, easy to operate, stable connection.
In the present embodiment, each optical device of ribbon assemblies is respectively provided with 12 passages, and the optical fiber of ribbon assemblies connects
Connecing utensil has 48 passages, and the fibre ribbon of ribbon assemblies includes 48 optical fiber, and 48 optical fiber are equally divided into four groups, four groups of optical fiber
Connection corresponding with four optical devices.The parallel light transceiving module of the present embodiment can realize 48 passage two-way simultaneous transmitting-receiving light letter
Number, there is higher bandwidth and capacity.
12 fiber lengths of every group of optical fiber are equal；In four groups of optical fiber, wherein the length of two groups of optical fiber is more than other two groups
The length of optical fiber, or the length of four groups of optical fiber are different, so as to avoid arrangement of four optical devices in shell body mutual
Limitation, position that can be with reasonable arrangement optical device in shell body avoids taking excessive shell body inner space, so as to drop
The volume of low shell body volume and whole optical transceiver module.
In order to reduce the volume of shell body, the optical device of ribbon assemblies is FA optical devices.FA optical devices are flat,
Size is small, and the shell body space of occupancy is small, so as to reduce the volume of shell body, reduces the volume of whole parallel light transceiving module,
Realize that module minimizes.The optical connector 250 of ribbon assemblies is MT optical connectors.
In order to enable upper shell 100 and the firm connection of lower housing shell 600, lower housing shell 600 has multiple mounting posts 610, upper
100 corresponding position of housing is laid with multiple stepped holes 110, and after upper shell is assembled with lower housing shell, mounting post 610 is positioned at corresponding
In stepped hole 110, mounting post 610 is melted in corresponding stepped hole 110, realizes that upper shell 100 and stablizing for lower housing shell 600 connect
Connect.Upper shell 100 is fixed with 600 reliable welding of lower housing shell, is almost not take up encapsulated space, more shell spaces is left for interior
Portion's function is realized so that module minimizes；Solve in the prior art optical module shell body by screw fixation to encapsulated space
Take the problem of larger.
In the present embodiment, in order to further improve the connective stability of upper shell 100 and lower housing shell 600, mounting post 610
Four are laid with, four mounting posts 610 are uniformly distributed to be adapted on the upper surface of lower housing shell 600, and stepped hole 110 is laid
There are four, four mounting posts 610 are corresponded with four stepped holes 110；After upper shell is assembled with lower housing shell, mounting post 610
In in corresponding stepped hole 110；Using the method for laser melting, mounting post 610 is melted, is filled in stepped hole 110, is realized
Upper shell and lower housing shell are stably connected with.
The parallel light transceiving module of the present embodiment, in less space, by thermal conductive substrate, makes multiple chip assemblies
Heat is delivered to the upper-lower casing of module respectively, effectively solves heat dissipation problem.
The parallel light transceiving module of the present embodiment, overall structure is simple, encapsulation volume is small, number of channels is more（48 tunnels）, have
Effect solves the problems, such as module heat dissipating；High density is realized under less encapsulation volume（48 tunnels）The encapsulation of module and efficiently
Heat dissipation, that is, realize small-sized package, multichannel quantity, high efficiency and heat radiation.
Electric connector 700 is installed for the ease of accommodating, offers in the bottom surface of lower housing shell 600 and is adapted to electric connector 700
Pilot hole, electric connector 700 is installed in pilot hole, and is electrically connected with pcb board, and the bottom surface of whole lower housing shell 600 is concordant, keeps away
Exempt to increase module volume.
At least two location holes are laid with electric connector 700, corresponding position has pilot pin on lower housing shell 600
620, the position of pilot pin 620 and quantity are adapted to location hole；When electric connector 700 is installed in pilot hole, pilot pin 620 is worn
Cross corresponding location hole.The design of location hole and pilot pin ensures that electric connector is accurately installed in pilot hole, ensures to be electrically connected
Being well electrically connected between device and pcb board.
The specific encapsulation step of the parallel light transceiving module of the present embodiment is as follows：
Step S1：By two the first thermal conductive substrates, two the second thermal conductive substrates respectively by pasting or being weldingly fixed on PCB
It is shown in Figure 7 on plate.
Step S2：Four chip assemblies are corresponded to using heat-conducting patch glue and are bonded in four thermal conductive substrates.
Chip assembly 310,320,330,340 is bonded in thermal conductive substrate 410,420,430,440 respectively, referring to Fig. 8
It is shown.
Step S3：Four optical devices of ribbon assemblies are carried out to light path coupling with corresponding chip assembly respectively to fix.
The FA optical devices 410,420,430,440 of ribbon assemblies 200 respectively with corresponding chip assembly 310,320,
330th, 340 carry out light paths coupling and fix, realize that light path connects, the MT optical connectors of ribbon assemblies 200 as module externally
Optical interface, it is shown in Figure 8.
Step S4：Pcb board is loaded into lower housing shell.
It is shown in Figure 9 in the overall loading lower housing shell that S1-S3 is assembled.
Step S5：Upper shell is installed at the top of lower housing shell, the mounting post of lower housing shell is located at the corresponding stepped hole of upper shell
It is interior, mounting post is melted in corresponding stepped hole using Laser Welding so that upper shell and lower housing shell are fixed.
Step S6：Electric connector is installed in lower housing shell bottom, it is shown in Figure 10.
Electric connector is installed in the pilot hole that lower housing shell bottom surface opens up, and the pilot pin on lower housing shell passes through corresponding positioning
Hole, it is ensured that electric connector and pcb board are electrically connected well.
The parallel light transceiving module of the present embodiment, by designing thermal conductive substrate（First thermal conductive substrate, the second thermal conductive substrate）,
Chip assembly is realized to the heat conduction path of shell body, realizes and designs heat conduction path in less space, by heat
Conducted from chip assembly to shell body, realize high efficiency and heat radiation；By designing four chip assemblies and four corresponding heat conduction
Substrate, each chip assembly has independent heat conduction path, rationally distributed, realizes small-sized encapsulated and heat balance distribution
And conduction；Using the FA optical devices of miniaturization, less encapsulated space is taken, in favor of realizing that overall package minimizes；Upper casing
Body and lower housing shell are reliably fixed by laser welding, are almost not take up encapsulated space, it is ensured that the realization of module small-sized package.
The parallel light transceiving module that the present embodiment proposes, makes optical module small size, multichannel, high-power and high efficiency and heat radiation several
A opposite is effectively integrated, by chip assembly, the rational design of thermal conductive substrate and layout, the reasonable selection of material,
The reasonable application of the unique design, welding technique of heat dissipation channel, effectively solves the big work(of high-density packages under small package volume
The heat dissipation problem of rate photoelectric conversion module.The realization of the encapsulation, can be greatly improved layout density during its application, set communication
It is standby to improve communication bandwidth while volume is reduced, there is very big meaning for the lifting of optic communication level.
It should be noted that the above description is not intended to limit the present invention, the utility model is also not limited to
The example above, change that those skilled in the art are made in the essential scope of the utility model, retrofit, add
Add or replace, should also belong to the protection scope of the utility model.
Claims (9)
1. a kind of parallel light transceiving module, including ribbon assemblies, electric connector, shell body, the pcb board in shell body and
Chip assembly, the optical device of the ribbon assemblies communicate with chip assembly, and the chip assembly communicates with pcb board, institute
Pcb board is stated to communicate with electric connector；It is characterized in that：The shell body includes upper shell and lower housing shell,
The parallel light transceiving module further includes the first thermal conductive substrate, and first thermal conductive substrate is fixed on pcb board, the core
Piece component is fixed on the first thermal conductive substrate top surface；The side of first thermal conductive substrate upwardly extends to form thermal conductive surface, described to lead
The top surface in hot face is contacted with upper shell inner surface.
2. parallel light transceiving module according to claim 1, it is characterised in that：The ribbon assemblies include four light devices
Part, the parallel light transceiving module include four chip assemblies, four optical devices and four chip assemblies correspond into
Row light path couples；
First thermal conductive substrate is laid with two, and two of which chip assembly corresponds to and is fixed on the first thermal conductive substrate top surface；
The parallel light transceiving module further includes two the second thermal conductive substrates, and second thermal conductive substrate is fixed on pcb board, separately
Outer two chip assemblies, which correspond to, is fixed on the second thermal conductive substrate top surface, bottom surface and the lower housing shell inner surface of second thermal conductive substrate
Contact.
3. parallel light transceiving module according to claim 2, it is characterised in that：The lower housing shell has multiple mounting posts,
Multiple stepped holes are laid with the corresponding position of the upper shell, the mounting post is melted in corresponding stepped hole.
4. parallel light transceiving module according to claim 2, it is characterised in that：Each optical device is respectively provided with 12
Passage, the optical fiber connector of the ribbon assemblies have 48 passages.
5. parallel light transceiving module according to claim 1, it is characterised in that：Offered in the bottom surface of the lower housing shell with
The pilot hole of electric connector adaptation, the electric connector are installed in pilot hole.
6. parallel light transceiving module according to claim 5, it is characterised in that：It is laid with least on the electric connector
Two location holes, corresponding position is laid with pilot pin, the position of the pilot pin and quantity and positioning on the lower housing shell
Hole is adapted to；The electric connector is installed in pilot hole, and the pilot pin passes through corresponding location hole.
7. parallel light transceiving module according to claim 2, it is characterised in that：The upper shell, lower housing shell, the first heat conduction
Substrate, the second thermal conductive substrate are metal material.
8. parallel light transceiving module according to claim 2, it is characterised in that：The chip assembly passes through heat-conducting patch glue
It is bonded in corresponding thermal conductive substrate；First thermal conductive substrate, the second thermal conductive substrate are pasted or are welded on pcb board respectively.
9. parallel light transceiving module according to any one of claim 1 to 8, it is characterised in that：The ribbon assemblies
Optical device be FA optical devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721234583.XU CN207249194U (en) | 2017-09-25 | 2017-09-25 | A kind of parallel light transceiving module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721234583.XU CN207249194U (en) | 2017-09-25 | 2017-09-25 | A kind of parallel light transceiving module |
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| Publication Number | Publication Date |
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| CN207249194U true CN207249194U (en) | 2018-04-17 |
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ID=61886980
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031550A (en) * | 2018-09-18 | 2018-12-18 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021139200A1 (en) * | 2020-01-08 | 2021-07-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2017
- 2017-09-25 CN CN201721234583.XU patent/CN207249194U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031550A (en) * | 2018-09-18 | 2018-12-18 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021139200A1 (en) * | 2020-01-08 | 2021-07-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US20220221667A1 (en) * | 2020-01-08 | 2022-07-14 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical Module |
| CN113093349B (en) * | 2020-01-08 | 2022-08-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Address after: 266100 Songling Road, Laoshan District, Qingdao, Shandong Province, No. 399 Patentee after: Qingdao Xinghang Photoelectric Technology Co.,Ltd. Address before: 266104 in the investment service center of Beizhai sub district office, beizhaike community, Laoshan District, Qingdao City, Shandong Province Patentee before: HISENSE & JONHON OPTICAL-ELECTRICAL TECHNOLOGIES Co.,Ltd. |