CN107436466A - Parallel optical transceiver module and packaging method thereof - Google Patents
Parallel optical transceiver module and packaging method thereof Download PDFInfo
- Publication number
- CN107436466A CN107436466A CN201710876986.2A CN201710876986A CN107436466A CN 107436466 A CN107436466 A CN 107436466A CN 201710876986 A CN201710876986 A CN 201710876986A CN 107436466 A CN107436466 A CN 107436466A
- Authority
- CN
- China
- Prior art keywords
- thermal conductive
- conductive substrate
- parallel light
- transceiving module
- lower house
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000013307 optical fiber Substances 0.000 claims abstract description 12
- 230000000712 assembly Effects 0.000 claims description 40
- 238000000429 assembly Methods 0.000 claims description 40
- 238000012856 packing Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 9
- 238000012546 transfer Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000007792 addition Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009510 drug design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a parallel optical transceiver module and a packaging method thereof, wherein the parallel optical transceiver module comprises an optical fiber band component, an electric connector, a shell, a PCB (printed circuit board) and a chip component, wherein the PCB and the chip component are positioned in the shell; the shell comprises an upper shell and a lower shell, the parallel light transceiving module further comprises two first heat conduction substrates and two second heat conduction substrates, and one sides of the two first heat conduction substrates extend upwards to be in contact with the inner surface of the upper shell to form a heat dissipation channel; the bottom surfaces of the two second heat-conducting substrates are contacted with the inner surface of the lower shell to form a heat-radiating channel; the chip components are fixed on the corresponding heat conducting substrates. The invention realizes 48-path high-density small-volume packaging, improves the heat dissipation effect and prolongs the service life of the chip assembly.
Description
Technical field
The invention belongs to technical field of photo communication, is to be related to a kind of parallel light transceiving module and its encapsulation side specifically
Method.
Background technology
Popularization and deep application with optic communication, there is miniaturization, high density, high speed in photoelectric conversion module market
Rate, powerful demand, the module heat dissipating problem brought therewith, also have impact on properties of product and life-span.How module realizes this
The unification of a little opposites, in the case of more number of channels, accomplishes reduced size, and can solve heat dissipation problem, turns into product
It is successfully crucial.
Heat during high-power optical-electric module work mostlys come from the chip of inside, it is necessary to by encapsulating design by its heat
Amount export, along with number of channels is more, it is larger to frequently can lead to module encapsulation volume, takes motherboard layout space, reduces module
Application density.The such high-power optical-electric module product occurred in the market, port number at most typically only has 24 tunnels, and encapsulates
Volume is relatively large, radiating effect far from ideal, is difficult to realize small-sized package, multichannel quantity, and high efficiency and heat radiation three takes into account.
The content of the invention
The invention provides a kind of parallel light transceiving module, radiating effect is improved.
In order to solve the above technical problems, the present invention is achieved using following technical scheme：
A kind of parallel light transceiving module, including ribbon assemblies, electric connector, shell body, pcb board and core in shell body
Piece component, the optical device of the ribbon assemblies are communicated with chip assembly, and the chip assembly communicates with pcb board, described
Pcb board communicates with electric connector；The shell body includes upper shell and lower house, and the parallel light transceiving module also includes first
Thermal conductive substrate, first thermal conductive substrate are fixed on pcb board, and the chip assembly is fixed on the first thermal conductive substrate top surface；Institute
The side for stating the first thermal conductive substrate upwardly extends to form thermal conductive surface, and the top surface of the thermal conductive surface contacts with upper shell inner surface.
Further, the ribbon assemblies include four optical devices, and the parallel light transceiving module includes four chips
Component, four optical devices correspond progress light path with four chip assemblies and coupled；The first described thermal conductive substrate is laid
There are two, two of which chip assembly is correspondingly fixed on the first thermal conductive substrate top surface；The parallel light transceiving module also includes two
Individual second thermal conductive substrate, second thermal conductive substrate are fixed on pcb board, and two other chip assembly is correspondingly fixed on second and led
Hot substrate surface, the bottom surface of second thermal conductive substrate contact with lower house inner surface.
Further, the lower house has multiple mounting posts, is laid with position corresponding to the upper shell multiple
Stepped hole, the mounting post are melted in corresponding stepped hole.
Further, each described optical device is respectively provided with 12 passages, the joints of optical fibre of the ribbon assemblies
With 48 passages.
Further, the pilot hole being adapted to electric connector, the electrical connection are offered in the bottom surface of the lower house
Device is arranged in pilot hole.
Preferably, at least two positioning holes are laid with the electric connector, the corresponding position on the lower house
Pilot pin is laid with, the position of the pilot pin and quantity are adapted to positioning hole；The electric connector is arranged in pilot hole, institute
State pilot pin and pass through corresponding positioning hole.
Further, the upper shell, lower house, the first thermal conductive substrate, the second thermal conductive substrate are metal material.
Further, the chip assembly by heat-conducting patch glue sticking in corresponding thermal conductive substrate；Described first
Thermal conductive substrate, the second thermal conductive substrate are pasted or are welded on pcb board respectively.
Further, the optical device of the ribbon assemblies is FA optical devices.
Based on the design of above-mentioned parallel light transceiving module, the invention also provides a kind of to above-mentioned parallel light transceiving module
Method for packing, the method for packing comprise the steps：
（1）Two the first thermal conductive substrates, two the second thermal conductive substrates are separately fixed on pcb board；
（2）Four chip assemblies are correspondingly bonded in four thermal conductive substrates using heat-conducting patch glue；
（3）Four optical devices of ribbon assemblies are carried out to light path coupling with corresponding chip assembly respectively to fix；
（4）Pcb board is loaded into lower house；
（5）Upper shell is arranged at the top of lower house, the mounting post of lower house is located at corresponding to upper shell in stepped hole, using sharp
Mounting post is melted in corresponding stepped hole by flush weld so that upper shell and lower house are fixed；
（6）Electric connector is installed in lower house bottom.
Compared with prior art, the advantages and positive effects of the present invention are：The parallel light transceiving module and its envelope of the present invention
Dress method, because chip assembly is fixed on the first thermal conductive substrate top surface, thermal conductive surface and the upper shell inner surface of the first thermal conductive substrate
Directly contact；Therefore the heat transfer that chip assembly distributes passes to the first thermal conductive substrate, and by the thermal conductive surface of the first thermal conductive substrate
Upper shell is passed, heat is distributed in time, improves radiating effect, extends the service life of chip assembly.
After the detailed description of embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more
Add clear.
Brief description of the drawings
Fig. 1 is the positive structure schematic of one embodiment of parallel light transceiving module proposed by the invention；
Fig. 2 is the reverse structure schematic of one embodiment of parallel light transceiving module in Fig. 1；
Fig. 3 is Fig. 1 explosive view；
Fig. 4 is Fig. 1 fragmentary cross-sectional view；
Fig. 5 is Fig. 1 fragmentary cross-sectional view；
Fig. 6 is the structural representation of the ribbon assemblies of parallel light transceiving module in Fig. 1；
Fig. 7 is thermal conductive substrate and the connection diagram of pcb board in Fig. 1；
Fig. 8 is the connection diagram of Fig. 1 chips component and thermal conductive substrate；
Fig. 9 is the connection diagram of pcb board and lower house in Fig. 1；
Figure 10 is the connection diagram of electric connector and lower house in Fig. 1；
Figure 11 is the flow chart of one embodiment of parallel light transceiving module method for packing proposed by the invention.
Reference：
100th, upper shell；110th, stepped hole；
200th, ribbon assemblies；210th, optical device；220th, optical device；230th, optical device；240th, optical device；250th, optical connector；
310th, chip assembly；320th, chip assembly；330th, chip assembly；340th, chip assembly；
410th, the second thermal conductive substrate；420th, the second thermal conductive substrate；430th, the first thermal conductive substrate；440th, the first thermal conductive substrate；
500th, pcb board；
600th, lower house；610th, mounting post；620th, pilot pin；700th, electric connector.
Embodiment
The embodiment of the present invention is described in more detail below in conjunction with the accompanying drawings.
The parallel light transceiving module of the present embodiment mainly includes ribbon assemblies 200, electric connector 700, shell body, is located at
Pcb board 500 and chip assembly in shell body, the optical device 210 of ribbon assemblies 200 are communicated with chip assembly, chip
Component communicates with pcb board 500, and pcb board 500 communicates with electric connector 700, and electric connector 700 is the external electrical interface of module；Outside
Housing includes upper shell 100 and lower house 600；Parallel light transceiving module also includes the first thermal conductive substrate, and the first thermal conductive substrate is consolidated
It is scheduled on pcb board 500, chip assembly is fixed on the first thermal conductive substrate top surface；The side of first thermal conductive substrate upwardly extends to be formed
Thermal conductive surface, the top surface of thermal conductive surface contacts with the inner surface of upper shell 100, referring to shown in Fig. 1 to Figure 10.
The parallel light transceiving module of the present embodiment, because chip assembly is fixed on the first thermal conductive substrate top surface, the first heat conduction
The thermal conductive surface of substrate directly contacts with upper shell inner surface, and the first thermal conductive substrate, upper shell form the heat dissipation channel of chip；Therefore
The heat transfer that chip assembly distributes gives the first thermal conductive substrate, and passes to upper shell 100 by the thermal conductive surface of the first thermal conductive substrate,
Heat is distributed in time, improves radiating effect, extends the service life of chip assembly.
In the present embodiment, ribbon assemblies 200 include 250, four fibre ribbon, optical connector optical devices：Optical device
210th, optical device 220, optical device 230, optical device 240；One end connection optical connector 250 of fibre ribbon, the other end of fibre ribbon
Connect four optical devices；Optical-path interface of the optical connector 250 as parallel light transceiving module.It is adapted, parallel light transmitting-receiving mould
Block includes four chip assemblies：Chip assembly 310, chip assembly 320, chip assembly 330, chip assembly 340；Four optical devices
Progress light path is corresponded with four chip assemblies to couple.Chip assembly act as opto-electronic conversion, receives what optical device was sent
Optical signal is simultaneously converted to electric signal, is then sent to pcb board；Moreover, chip assembly also receives the electric signal of pcb board transmission and turned
Optical signal is changed to, is then sent to optical device.
In order to be radiated to four chip assemblies, it is adapted, the first thermal conductive substrate is laid with two：First thermal conductive substrate
430th, the first thermal conductive substrate 440；Two chip assemblies therein are correspondingly fixed on the first thermal conductive substrate top surface, i.e. chip assembly
330 are fixed on the top surface of the first thermal conductive substrate 430, and chip assembly 340 is fixed on the top surface of the first thermal conductive substrate 440.
Parallel light transceiving module also includes two the second thermal conductive substrates：Second thermal conductive substrate 410, the second thermal conductive substrate 420；
Two the second thermal conductive substrates are separately fixed on pcb board, and the bottom surface of each second thermal conductive substrate stretches out, and PCB is stretched out in bottom surface
Plate contacts with lower house inner surface, and the second thermal conductive substrate, lower house form the heat dissipation channel of chip；Two other chip assemblies
Corresponding to be fixed on the second thermal conductive substrate top surface, i.e. chip assembly 310 is fixed on the second thermal conductive substrate top surface 410；Chip assembly 320
It is fixed on the second thermal conductive substrate top surface 420；Therefore, the heat transfer that chip assembly 310 and 320 distributes gives corresponding second heat conduction
Substrate, lower house 600 is passed to via the second thermal conductive substrate, and heat is distributed in time.
Therefore, parallel light transceiving module includes two the first thermal conductive substrates, two the second thermal conductive substrates, the first thermal conductive substrate
Side upwardly extend and contacted with upper shell inner surface, form heat dissipation channel；Pcb board and lower casing are stretched out in second thermal conductive substrate bottom surface
Internal surface contact, forms heat dissipation channel;Chip assembly is fixed on corresponding thermal conductive substrate top surface, passes through respective heat dissipation channel
Radiating.The design of heat dissipation channel, heat is grouped and conducted, each independent conducting path, heat is distributed more balanced, heat transfer
It is more efficient.
That is, chip assembly 330,340 is mounted on corresponding first thermal conductive substrate top surface, and two the first thermal conductive substrates are prolonged upwards
Put in and gone corner design and form thermal conductive surface, thermal conductive surface is bonded with upper shell inner surface, and chip heat is conducted into upper shell dissipates
Hair;Chip assembly 310,320 is mounted on corresponding second thermal conductive substrate top surface, and two second thermal conductive substrate bottom surface one end are stretched out
Pcb board is mounted with lower house inner surface, and chip heat is conducted to lower house and distributed.
Specifically, the heat transfer that chip assembly 310 distributes gives the second thermal conductive substrate 410, via the second thermal conductive substrate
410 radiating surface passes to lower house 600；The heat transfer that chip assembly 320 distributes gives the second thermal conductive substrate 420, via
The radiating surface of two thermal conductive substrates 420 passes to lower house 600；The heat transfer that chip assembly 330 distributes gives the first thermal conductive substrate
430, pass to upper shell 100 via the radiating surface of the first thermal conductive substrate 430；The heat transfer that chip assembly 340 distributes is to the
One thermal conductive substrate 440, upper shell 100 is passed to via the radiating surface of the first thermal conductive substrate 430.
I.e. the heat of two of which chip assembly is conducted to upper shell 100 by the first thermal conductive substrate respectively, two other
The heat of chip assembly is conducted to lower house 600 by the second thermal conductive substrate respectively, i.e., the heat tool that four chip assemblies distribute
There is different heat conduction paths, the heat distributed is transmitted on shell body respectively, improves thermal conduction rate, expands area of dissipation,
So that heat distribution is more balanced, radiating is more efficient, improves the radiating efficiency of whole parallel light transceiving module.
In order to further improve radiating effect, upper shell 100,600, two the first thermal conductive substrates of lower house, two second
Thermal conductive substrate is metal material, good heat conduction effect, and radiating efficiency is high.
Chip assembly is by heat-conducting patch glue sticking in corresponding thermal conductive substrate, and both stable connection, improved heat transfer again
Efficiency, ensure radiating effect.
First thermal conductive substrate, the second thermal conductive substrate are pasted or are welded on pcb board respectively, simple to operate, stable connection.
In the present embodiment, each optical device of ribbon assemblies is respectively provided with 12 passages, and the optical fiber of ribbon assemblies connects
Connecing utensil has 48 passages, and the fibre ribbon of ribbon assemblies includes 48 optical fiber, and 48 optical fiber are equally divided into four groups, four groups of optical fiber
Connection corresponding with four optical devices.The parallel light transceiving module of the present embodiment can realize 48 passage two-way simultaneous transmitting-receiving light letter
Number, there is higher bandwidth and capacity.
12 fiber lengths of every group of optical fiber are equal；In four groups of optical fiber, wherein the length of two groups of optical fiber is more than other two groups
The length of optical fiber, or the length of four groups of optical fiber are different, so as to avoid arrangement of four optical devices in shell body mutual
Limitation, position that can be with reasonable arrangement optical device in shell body avoids taking excessive shell body inner space, so as to drop
The volume of low shell body volume and whole optical transceiver module.
In order to reduce the volume of shell body, the optical device of ribbon assemblies is FA optical devices.FA optical devices are flat,
Size is small, and the shell body space of occupancy is small, so as to reduce the volume of shell body, reduces the volume of whole parallel light transceiving module,
Realize that module minimizes.The optical connector 250 of ribbon assemblies is MT optical connectors.
In order that obtaining upper shell 100 and the firm connection of lower house 600, lower house 600 has multiple mounting posts 610, upper
Position corresponding to housing 100 is laid with multiple stepped holes 110, and after upper shell assembles with lower house, mounting post 610 is positioned at corresponding
In stepped hole 110, mounting post 610 is melted in corresponding stepped hole 110, realizes that upper shell 100 and the stabilization of lower house 600 connect
Connect.Upper shell 100 is fixed with 600 reliable welding of lower house, is almost not take up encapsulated space, more shell spaces is left for interior
Portion's function is realized so that module minimizes；Solve in the prior art optical module shell body by screw fixation to encapsulated space
Take the problem of larger.
In the present embodiment, in order to further improve the connective stability of upper shell 100 and lower house 600, mounting post 610
Four are laid with, four mounting posts 610 are uniformly laid on the upper surface of lower house 600, are adapted, and stepped hole 110 is laid
There are four, four mounting posts 610 correspond with four stepped holes 110；After upper shell assembles with lower house, mounting post 610
In in corresponding stepped hole 110；Using the method for lf, mounting post 610 is melted, is filled in stepped hole 110, is realized
Upper shell and lower house are stably connected with.
The parallel light transceiving module of the present embodiment, in less space, by thermal conductive substrate, make multiple chip assemblies
Heat is delivered to the upper-lower casing of module respectively, effectively solves heat dissipation problem.
The parallel light transceiving module of the present embodiment, overall structure is simple, encapsulation volume is small, number of channels is more（48 tunnels）, have
Effect solves the problems, such as module heat dissipating；High density is realized under less encapsulation volume（48 tunnels）The encapsulation of module and efficiently
Radiating, that is, realize small-sized package, multichannel quantity, high efficiency and heat radiation.
Electric connector 700 is installed for the ease of accommodating, offers in the bottom surface of lower house 600 and is adapted to electric connector 700
Pilot hole, electric connector 700 is arranged in pilot hole, and electrically connected with pcb board, and the bottom surface of whole lower house 600 is concordant, keeps away
Exempt to increase module volume.
At least two positioning holes are laid with electric connector 700, corresponding position has pilot pin on lower house 600
620, the position of pilot pin 620 and quantity are adapted to positioning hole；When electric connector 700 is arranged in pilot hole, pilot pin 620 is worn
Cross corresponding positioning hole.The design of positioning hole and pilot pin ensures that electric connector is accurately arranged in pilot hole, ensures electrical connection
Good between device and pcb board electrically connects.
Based on the design of above-mentioned parallel light transceiving module, the present embodiment also proposed a kind of parallel light transceiving module encapsulation side
Method, the method for packing specifically includes following step, shown in Figure 11.
Step S1：By two the first thermal conductive substrates, two the second thermal conductive substrates respectively by pasting or being weldingly fixed on PCB
It is shown in Figure 7 on plate.
Step S2：Four chip assemblies are correspondingly bonded in four thermal conductive substrates using heat-conducting patch glue.
Chip assembly 310,320,330,340 is bonded in thermal conductive substrate 410,420,430,440 respectively, referring to Fig. 8
It is shown.
Step S3：Four optical devices of ribbon assemblies are carried out to light path coupling with corresponding chip assembly respectively to fix.
The FA optical devices 410,420,430,440 of ribbon assemblies 200 respectively with corresponding chip assembly 310,320,
330th, 340 carry out light paths coupling and fix, realize that light path connects, the MT optical connectors of ribbon assemblies 200 as module externally
Optical interface, it is shown in Figure 8.
Step S4：Pcb board is loaded into lower house.
It is shown in Figure 9 in the overall loading lower house that S1-S3 is assembled.
Step S5：Upper shell is arranged at the top of lower house, the mounting post of lower house is located at stepped hole corresponding to upper shell
It is interior, mounting post is melted in corresponding stepped hole using Laser Welding so that upper shell and lower house are fixed.
Step S6：Electric connector is installed in lower house bottom, it is shown in Figure 10.
Electric connector is arranged in the pilot hole that lower house bottom surface opens up, and the pilot pin on lower house positions through corresponding
Hole, it is ensured that electric connector and pcb board electrical connection are good.
The parallel light transceiving module and its method for packing of the present embodiment, by designing thermal conductive substrate（First thermal conductive substrate,
Two thermal conductive substrates）, chip assembly is realized to the heat conduction path of shell body, is realized and is designed heat transfer in less space
Path, heat is conducted to shell body from chip assembly, realizes high efficiency and heat radiation；By designing four chip assemblies and four
Corresponding thermal conductive substrate, each chip assembly has independent heat conduction path, rationally distributed, realizes small-sized encapsulated and heat
Measure equiblibrium mass distribution and conduction；Using the FA optical devices of miniaturization, less encapsulated space is taken, in favor of realizing that overall package is small
Type；Upper shell and lower house are reliably fixed by laser welding, are almost not take up encapsulated space, it is ensured that module small size is sealed
The realization of dress.
The parallel light transceiving module and its method for packing that the present embodiment proposes, make optical module small size, multichannel, high-power
And the several opposites of high efficiency and heat radiation are effectively integrated, pass through chip assembly, the rational design of thermal conductive substrate and layout, material
Reasonable selection, the unique design of heat dissipation channel, welding technique reasonable application, effectively solve highly dense under small package volume
Spend the heat dissipation problem of packaged high-power photoelectric conversion module.The realization of the encapsulation, layout when its application can be greatly improved are close
Degree, makes communication equipment improve communication bandwidth while volume is reduced, and has very big meaning for the horizontal lifting of optic communication.
It should be noted that it is limitation of the present invention that described above, which is not, the present invention is also not limited to the example above,
The variations, modifications, additions or substitutions that those skilled in the art are made in the essential scope of the present invention, also should
Belong to protection scope of the present invention.
Claims (10)
1. a kind of parallel light transceiving module, including ribbon assemblies, electric connector, shell body, the pcb board in shell body and
Chip assembly, the optical device of the ribbon assemblies are communicated with chip assembly, and the chip assembly communicates with pcb board, institute
Pcb board is stated to communicate with electric connector；It is characterized in that：The shell body includes upper shell and lower house,
The parallel light transceiving module also includes the first thermal conductive substrate, and first thermal conductive substrate is fixed on pcb board, the core
Piece component is fixed on the first thermal conductive substrate top surface；The side of first thermal conductive substrate upwardly extends to form thermal conductive surface, described to lead
The top surface in hot face contacts with upper shell inner surface.
2. parallel light transceiving module according to claim 1, it is characterised in that：The ribbon assemblies include four light devices
Part, the parallel light transceiving module include four chip assemblies, four optical devices and four chip assemblies correspond into
Row light path couples；
The first described thermal conductive substrate is laid with two, and two of which chip assembly is correspondingly fixed on the first thermal conductive substrate top surface；
The parallel light transceiving module also includes two the second thermal conductive substrates, and second thermal conductive substrate is fixed on pcb board, separately
Outer two chip assemblies are correspondingly fixed on the second thermal conductive substrate top surface, bottom surface and the lower house inner surface of second thermal conductive substrate
Contact.
3. parallel light transceiving module according to claim 2, it is characterised in that：The lower house has multiple mounting posts,
Multiple stepped holes are laid with position corresponding to the upper shell, the mounting post is melted in corresponding stepped hole.
4. parallel light transceiving module according to claim 2, it is characterised in that：Each described optical device is respectively provided with 12
Passage, the joints of optical fibre of the ribbon assemblies have 48 passages.
5. parallel light transceiving module according to claim 1, it is characterised in that：Offered in the bottom surface of the lower house with
The pilot hole of electric connector adaptation, the electric connector are arranged in pilot hole.
6. parallel light transceiving module according to claim 5, it is characterised in that：It is laid with least on the electric connector
Two positioning holes, corresponding position is laid with pilot pin, the position of the pilot pin and quantity and positioning on the lower house
Hole is adapted to；The electric connector is arranged in pilot hole, and the pilot pin passes through corresponding positioning hole.
7. parallel light transceiving module according to claim 2, it is characterised in that：The upper shell, lower house, the first heat conduction
Substrate, the second thermal conductive substrate are metal material.
8. parallel light transceiving module according to claim 2, it is characterised in that：The chip assembly passes through heat-conducting patch glue
Corresponding to being bonded in thermal conductive substrate；First thermal conductive substrate, the second thermal conductive substrate are pasted or are welded on pcb board respectively.
9. parallel light transceiving module according to any one of claim 1 to 8, it is characterised in that：The ribbon assemblies
Optical device be FA optical devices.
A kind of 10. parallel light transceiving module method for packing, it is characterised in that：The parallel light transceiving module is such as claim 3
Described parallel light transceiving module, the method for packing comprise the steps：
（1）Two the first thermal conductive substrates, two the second thermal conductive substrates are separately fixed on pcb board；
（2）Four chip assemblies are correspondingly bonded in four thermal conductive substrates using heat-conducting patch glue；
（3）Four optical devices of ribbon assemblies are carried out to light path coupling with corresponding chip assembly respectively to fix；
（4）Pcb board is loaded into lower house；
（5）Upper shell is arranged at the top of lower house, the mounting post of lower house is located at corresponding to upper shell in stepped hole, using sharp
Mounting post is melted in corresponding stepped hole by flush weld so that upper shell and lower house are fixed；
（6）Electric connector is installed in lower house bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710876986.2A CN107436466A (en) | 2017-09-25 | 2017-09-25 | Parallel optical transceiver module and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710876986.2A CN107436466A (en) | 2017-09-25 | 2017-09-25 | Parallel optical transceiver module and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107436466A true CN107436466A (en) | 2017-12-05 |
Family
ID=60462378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710876986.2A Pending CN107436466A (en) | 2017-09-25 | 2017-09-25 | Parallel optical transceiver module and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107436466A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109128560A (en) * | 2018-10-26 | 2019-01-04 | 黄山市光锐通信股份有限公司 | The assembly system of 25G optical module |
| CN109856738A (en) * | 2019-03-19 | 2019-06-07 | 中航海信光电技术有限公司 | A kind of light module package structure and optical module |
| CN110388576A (en) * | 2018-04-23 | 2019-10-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN110398806A (en) * | 2018-06-29 | 2019-11-01 | 中航光电科技股份有限公司 | Optical module |
| WO2020125784A1 (en) * | 2018-12-20 | 2020-06-25 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114257315A (en) * | 2021-12-16 | 2022-03-29 | 成都瑞通视讯科技股份有限公司 | Optical communication module, device and system |
| CN114815089A (en) * | 2022-04-18 | 2022-07-29 | 东莞立讯技术有限公司 | Optical module |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1154745A (en) * | 1994-06-14 | 1997-07-16 | 艾利森电话股份有限公司 | Optical miniature capsul |
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| CN104007521A (en) * | 2014-06-13 | 2014-08-27 | 华进半导体封装先导技术研发中心有限公司 | Structure and manufacturing method of optical transceiver module |
| CN204666874U (en) * | 2015-06-11 | 2015-09-23 | 中航海信光电技术有限公司 | Parallel light transceiving module |
| CN104965267A (en) * | 2015-07-13 | 2015-10-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN205027941U (en) * | 2015-10-21 | 2016-02-10 | 中航海信光电技术有限公司 | Optical module |
| CN205232234U (en) * | 2015-12-24 | 2016-05-11 | 中航海信光电技术有限公司 | Optical module |
| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
-
2017
- 2017-09-25 CN CN201710876986.2A patent/CN107436466A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1154745A (en) * | 1994-06-14 | 1997-07-16 | 艾利森电话股份有限公司 | Optical miniature capsul |
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| CN104007521A (en) * | 2014-06-13 | 2014-08-27 | 华进半导体封装先导技术研发中心有限公司 | Structure and manufacturing method of optical transceiver module |
| CN204666874U (en) * | 2015-06-11 | 2015-09-23 | 中航海信光电技术有限公司 | Parallel light transceiving module |
| CN104965267A (en) * | 2015-07-13 | 2015-10-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN205027941U (en) * | 2015-10-21 | 2016-02-10 | 中航海信光电技术有限公司 | Optical module |
| CN205232234U (en) * | 2015-12-24 | 2016-05-11 | 中航海信光电技术有限公司 | Optical module |
| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110388576A (en) * | 2018-04-23 | 2019-10-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN110398806A (en) * | 2018-06-29 | 2019-11-01 | 中航光电科技股份有限公司 | Optical module |
| CN109128560A (en) * | 2018-10-26 | 2019-01-04 | 黄山市光锐通信股份有限公司 | The assembly system of 25G optical module |
| WO2020125784A1 (en) * | 2018-12-20 | 2020-06-25 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11631960B2 (en) | 2018-12-20 | 2023-04-18 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| CN109856738A (en) * | 2019-03-19 | 2019-06-07 | 中航海信光电技术有限公司 | A kind of light module package structure and optical module |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113093349B (en) * | 2020-01-08 | 2022-08-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114257315A (en) * | 2021-12-16 | 2022-03-29 | 成都瑞通视讯科技股份有限公司 | Optical communication module, device and system |
| CN114257315B (en) * | 2021-12-16 | 2024-04-23 | 成都瑞通视讯科技股份有限公司 | Optical communication module, device and system |
| CN114815089A (en) * | 2022-04-18 | 2022-07-29 | 东莞立讯技术有限公司 | Optical module |
| CN114815089B (en) * | 2022-04-18 | 2023-10-24 | 东莞立讯技术有限公司 | Optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107436466A (en) | Parallel optical transceiver module and packaging method thereof | |
| US10658312B2 (en) | Embedded millimeter-wave phased array module | |
| CN100456472C (en) | Power converter package with enhanced thermal management | |
| US7196403B2 (en) | Semiconductor package with heat spreader | |
| JP2561793B2 (en) | Direct chip attach module | |
| CN106443913A (en) | Optical module packaging structure and optical module | |
| WO2021068657A1 (en) | Encapsulation structure and electronic apparatus | |
| CN101960591A (en) | Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device | |
| CN207249194U (en) | A kind of parallel light transceiving module | |
| CN102163590A (en) | Three-dimensional multi-chip encapsulation module based on buried substrate and method | |
| US7180166B2 (en) | Stacked multi-chip package | |
| CN103094256A (en) | Packaging system | |
| KR20190042975A (en) | Semiconductor device package | |
| CN104217659A (en) | Novel LED (light emitting diode) display screen | |
| CN101814443B (en) | Chip design method for multi-chip module of high-performance processor with optical interface | |
| WO2021139200A1 (en) | Optical module | |
| CN101425510A (en) | Sensor module package structure and method of the same | |
| US7249896B2 (en) | Array optical sub-assembly | |
| CN114637079B (en) | Optical module | |
| CN101183673A (en) | Stacked multi-chip semiconductor package structure and package method | |
| CN212209463U (en) | Packaging structure and electronic device | |
| CN218767433U (en) | Optical module | |
| TW472372B (en) | Memory module with direct chip attach and the manufacturing process thereof | |
| CN101136394A (en) | Multiple chip semi-conductor packaging structure and encapsulation method | |
| CN113745202A (en) | Packaging module, manufacturing method thereof and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 266100 Songling Road, Laoshan District, Qingdao, Shandong Province, No. 399 Applicant after: Qingdao Xinghang Photoelectric Technology Co.,Ltd. Address before: 266104 in the investment service center of Beizhai sub district office, beizhaike community, Laoshan District, Qingdao City, Shandong Province Applicant before: HISENSE & JONHON OPTICAL-ELECTRICAL TECHNOLOGIES Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171205 |
|
| RJ01 | Rejection of invention patent application after publication |