CN208538148U - A kind of encapsulating structure of ultra-thin fingerprint recognition chip - Google Patents
A kind of encapsulating structure of ultra-thin fingerprint recognition chip Download PDFInfo
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- CN208538148U CN208538148U CN201821204848.6U CN201821204848U CN208538148U CN 208538148 U CN208538148 U CN 208538148U CN 201821204848 U CN201821204848 U CN 201821204848U CN 208538148 U CN208538148 U CN 208538148U
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Abstract
The utility model discloses a kind of encapsulating structures of ultra-thin fingerprint recognition chip, belong to fingerprint recognition chip package field.The front of its fingerprint Identification sensor chip (1) is equipped with fingerprint induction identification region (12) and is set to several chip electrodes (14) of side, the positive interconnection metal layer (6) again is distributed in the side of the chip electrode (14) except the positive vertical area of fingerprint induction identification region (12), and it is connect with chip electrode (14), metal connecting piece (5) is set to the side of fingerprint Identification sensor chip (1) and is set to chip electrode (14) side nearby, its top passes through the lower surface of insulating layer (31) through positive interconnection metal layer (6) again, expose encapsulated member (4) in its bottom, the back side again interconnection metal layer (7) one end be arranged soldered ball (71), its other end is connect with the bottom of metal connecting piece (5), the front of fingerprint Identification sensor chip (1) First setting dielectric layer I (35) again on dielectric layer I (35) bonding and wafer thinning composite membrane (9).It is bad that the utility model solves product appearance, improves product yield.
Description
Technical field
The utility model relates to a kind of encapsulating structures of ultra-thin fingerprint recognition chip, belong to fingerprint recognition chip package neck
Domain.
Background technique
Fingerprint is the unique feature of human body, and fingerprint identification technology is the key that current biological identification technology.Nowadays hand
Machine is at indispensable a part in people's daily life, since access times are frequent, input password repeatedly and also people is allowed to feel
It is very inconvenient, there is fingerprint recognition system, user is allowed to feel more convenient and quicker safety.
But the reliability performance of fingerprint recognition chip is not able to satisfy test request, needs to carry out it secondary encapsulation and is referring to
Line identifies product table face paste composite membrane, allows it to meet the inferior current phone development trend that meets of reliability, ultra-thin, screen
It is required that.Fingerprint recognition field generallys use Substrate encapsulation at present, but in the actual production process, finds in fingerprint recognition
Product surface directly pastes composite membrane and has a large amount of bad order, Die Mark as shown in Figure 1 (chip trace) and Dent
(sags and crests).
Summary of the invention
The utility model proposes a kind of ultra-thin fingerprint for improving bad order mainly for the deficiency of existing encapsulation technology
The encapsulating structure of identification chip.
Purpose of the utility model is realized as follows:
A kind of encapsulating structure of ultra-thin fingerprint recognition chip of the utility model comprising fingerprint Identification sensor chip and packet
Feng Ti, the front of the fingerprint Identification sensor chip are equipped with fingerprint induction identification region and several chip electrodes, the core
Plate electrode is set to the side of fingerprint induction identification region,
The encapsulated member encapsulates the fingerprint Identification sensor chip and metal connecting piece, and fingerprint recognition is exposed in upper surface
The front of sensor chip, the insulation of the upper surface overlay pattern in the front and encapsulated member of the fingerprint Identification sensor chip
Layer, and insulating layer openings are opened up at the chip electrode, the upper surface of the insulating layer is selectively arranged front and is routed again
Metal layer, interconnection metal layer is distributed in the core except the positive vertical area of the fingerprint induction identification region again in the front
The side of plate electrode, and connect by insulating layer openings with chip electrode, the front coating of the fingerprint Identification sensor chip
Dielectric layer I, the dielectric layer I covers front, and interconnection metal layer and insulating layer, the metal connecting piece are set to fingerprint recognition again
It the side of sensor chip and is set to by chip electrode, and is corresponded with the number of chip electrode nearby, top passes through
Encapsulated member is exposed in the lower surface of the through positive interconnection metal layer again of insulating layer, bottom,
The lower surface setting back side interconnection metal layer and the back side plastic packaging layer again of the encapsulated member, back side wiring metal again
Soldered ball is arranged in one end of layer, and the bottom connection of the other end and metal connecting piece, the metal connecting piece and the back side are routed gold again
Belong to layer to be structure as a whole, the back side plastic packaging layer covering back side four walls of interconnection metal layer, encapsulated member and dielectric layer I and is only revealed again
The welding surface of soldered ball out, front are flushed with the upper surface of dielectric layer I,
It further include the composite membrane being set on dielectric layer I, the front key of the composite membrane and dielectric layer I, back side plastic packaging layer
Connection is closed, the composite membrane includes dielectric layer II, dumb light base, wearing layer, the mist degree of the dumb light base: 3 ~ 5%, transmitance:
95 ~ 98%, the composite membrane is thinned to 20 microns +/- 2 microns.
Metal connecting piece described in the utility model is solid or hollow cylindrical metal object.
Metal connecting piece described in the utility model is again interconnection metal layer.
The material of dielectric layer II described in the utility model is the high dielectric of epoxy resin, silica and titanium dioxide mixing
Colloid, 15 microns ~ 25 microns of thickness.
The material of dumb light base described in the utility model is PET, 20 microns ~ 30 microns of thickness.
The hardness of wearing layer described in the utility model is 2H or 3H.
Fingerprint Identification sensor chip described in the utility model is rectangle.
Beneficial effect
A kind of encapsulating structure of ultra-thin fingerprint recognition chip of the utility model obtain composite membrane and plastic packaging material, dielectric layer it
Between reliable binding force, dumb light base solves that product appearance is bad, improves the yield of product；It is compound after being thinned
Film realizes the ultrathin packaging structure of fingerprint recognition chip, and the combination of outer abrasion resistant layer, and strengthen its encapsulating structure can
By property and wearability.
Detailed description of the invention
Fig. 1 is the encapsulation bad order figure of existing fingerprint recognition chip；
Fig. 2 is a kind of schematic diagram of the embodiment of the encapsulating structure of ultra-thin fingerprint recognition chip of the utility model；
The schematic diagram of the positional relationship of metal connector and chip electrode, sensing element region that Fig. 3 is Fig. 2 faced；
The schematic diagram of metal connector and the back side positional relationship of interconnection metal layer again that Fig. 4 is Fig. 2 looked up；
Fig. 5 is a kind of appearance figure of the encapsulating structure of ultra-thin fingerprint recognition chip of the utility model；
Wherein,
Fingerprint Identification sensor chip 1
Chip body 10
Fingerprint incudes identification region 12
Chip electrode 14
Insulating layer 31
Dielectric layer I 35
Encapsulated member 4
Metal connecting piece 5
Positive interconnection metal layer 6 again
Back side interconnection metal layer 7 again
Soldered ball 71
Back side plastic packaging layer 78
Composite membrane 9
Dielectric layer II 91
Dumb light base 92
Wearing layer 93.
Specific embodiment
In order to elaborate the Spirit Essence of the utility model, help those skilled in the art are practical, are fully understood by this
The complete technical solution of utility model carries out specifically the technical solution of the utility model below in conjunction with embodiment and attached drawing
It is bright.
Embodiment
A kind of encapsulating structure of ultra-thin fingerprint recognition chip of the utility model, fingerprint Identification sensor chip 1 is in rectangular
Shape, diagrammatic cross-section is as shown in Fig. 2, the front of the chip body 10 of fingerprint Identification sensor chip 1 is equipped with fingerprint induction knowledge
Other region 12 and several chip electrodes 14, chip electrode 14 is set to the side of fingerprint induction identification region 12, so that fingerprint
The useful detection area for incuding identification region 12 is big as far as possible, and the 6 of fingerprint induction 12 side of identification region is set in figure
A chip electrode 14 is illustrated, and sensing element is set in fingerprint induction identification region 12, the circuit of circuit and chip electrode 14
It is set to the inside of fingerprint Identification sensor chip 1.
Encapsulating material encapsulates fingerprint Identification sensor chip 1 and metal connecting piece 5, and the material of encapsulating material is at present with epoxy
Resin, phenolic resin, organic siliconresin and unsaturated polyester resin are the most commonly used.After the completion of encapsulating material encapsulating, solidification, in solid
The encapsulated member 4 of shape, the effects of waterproof, moisture-proof, shockproof, dust-proof, heat dissipation can be played, insulated.It is encapsulated simultaneously generally for reduction
The thermal expansion coefficient problem of material, the thermomechanical reliability of lift structure itself, also adds silica, nitrogen in encapsulating material
The filler materials such as SiClx.
Expose the front of fingerprint Identification sensor chip 1 in the upper surface of encapsulated member 4.Fingerprint Identification sensor chip 1 is just
The insulating layer 31 of the upper surface overlay pattern of face and encapsulated member 4, and insulating layer openings 311 are opened up at chip electrode 14.Absolutely
The material of edge layer 31 is silica, silicon nitride etc..Front interconnection metal layer 6 again are selectively arranged in the upper surface of insulating layer 31,
Interconnection metal layer 6 is distributed in the chip electrode 14 except the positive vertical area of fingerprint induction identification region 12 again in front
Side, and connect by insulating layer openings 311 with chip electrode 14, interconnection metal layer 6 is generally good using electric conductivity again in front
The materials such as copper Cu well, iron Fe, nickel.Its specific number of plies can be set as one or more layers according to product requirement, common, front
Interconnection metal layer 6 is high-density wiring layer again, i.e., line width/line-spacing is in 5um or less.The fingerprint Identification sensor chip 1 is just
Face dielectric layer I 35, the covering of dielectric layer I 35 positive interconnection metal layer 6 and the insulating layer 31 again.
Metal connecting piece 5 is set to the side of fingerprint Identification sensor chip 1, is set to fingerprint with metal connecting piece 5 and knows
The ipsilateral of chip electrode 14 of individual sensor chip 1 is preferred.Metal connecting piece 5 be in solid or hollow column, material be copper Cu,
Nickel, vanadium V, titanium Ti, palladium Pd, gold Au, silver Ag etc..Alternatively, metal connecting piece 5 is again interconnection metal layer, and it is routed again with the back side
Metal layer 7 is structure as a whole.The top of metal connecting piece 5 passes through the lower surface of the through positive interconnection metal layer 6 again of insulating layer 31,
Interconnection metal layer 6 realizes connection again with front.The number of metal connecting piece 5 is closed with the number of chip electrode 14 without absolutely corresponding
System, designs according to actual needs.It is the connection relationship for clearly demonstrating metal connecting piece 5 Yu chip electrode 14 in Fig. 3, with metal
The number of connector 5 and the number of chip electrode 14 correspond and illustrate.Expose encapsulated member 4 in the bottom of metal connecting piece 5.
Back side interconnection metal layer 7 again are arranged in the lower surface of encapsulated member 4.Interconnection metal layer 7 generally uses electric conductivity again at the back side
The metals production such as the good copper Cu of energy, iron Fe, nickel.Its specific number of plies can be set as one or more layers according to product requirement, lead to
Normal, interconnection metal layer 7 is high-density wiring layer again at the back side, i.e., line width/line-spacing is in 5um hereinafter, to improve the reliability of electricity.
Soldered ball 71 is arranged in one end of back side interconnection metal layer 7 again, and the other end connect with the bottom of metal connecting piece 5.Being equivalent to will refer to
The back side that the positive chip electrode of line identification sensor chip 1 leads to fingerprint Identification sensor chip 1 is connected with substrate.Cause
This, compared with the prior art of fingerprint Identification sensor encapsulating structure, the program of the utility model equally reduces fingerprint knowledge
The vertical blank area of a room that individual sensor needs, in order to which fingerprint Identification sensor is designed in the position closer to user's finger, effectively
Ground improves the sensitivity of fingerprint Identification sensor contact.
The front dielectric layer I 35 of above-mentioned fingerprint Identification sensor chip 1, the material of dielectric layer I 35 be epoxy resin,
The high dielectric colloid of silica and titanium dioxide mixing, dielectric constant (dielectric constant) DK value are required 3
~ 8, there is viscosity, solidification can be reacted after cooling, 1 front of fingerprint Identification sensor chip can be filled, be effectively protected finger
The face induction sensor of line chip, to reduce dead resistance, capacitor and the inductance of circuit structure, while it is good to guarantee that route has
Insulation performance.
Composite membrane 9 is arranged in the surface of dielectric layer I 35.Pass through, the composite membrane 9 and dielectric layer I 35, back side plastic packaging layer 78
Front bonding connection, composite membrane 9 include dielectric layer II 91, dumb light base 92, wearing layer 93.The material of dielectric layer II 91 is also ring
The high dielectric colloid of oxygen resin, silica and titanium dioxide mixing can soften under heating pressurization, have viscosity, cooling
After can react solidification, 5 microns ~ 15 microns of thickness, dielectric constant (dielectric constant) DK value requires 3 ~
8, it can dissolve each other with dielectric layer I 35, fit closely composite membrane 9, be effectively protected the induction sensor of fingerprint chip together
Face to reduce dead resistance, capacitor and the inductance of circuit structure, while guaranteeing that route has good insulation performance.Dumb light base
The material of layer 92 is PET, and thickness is the supporting layer of composite membrane at 10 microns ~ 15 microns.Contain atomization in its PET material
Grain, mist degree: 3 ~ 5%, transmitance: 95 ~ 98%, diffusing reflection of the light in dumb light substrate is uniform, can cover entire ultra-thin fingerprint
The flaws such as sags and crests existing for the encapsulating structure of identification chip, die mark.Wearing layer 93 is formed by one layer of abrasion resistant polyurethane, and one
As, thickness can prevent composite membrane 9 to be scratched in 5 microns, hardness in 2H or 3H.
The total thickness control of composite membrane 9 is at 20 microns +/- 2 microns, to obtain ultra-thin package thickness, meanwhile, raising refers to
The sensitivity quick response speed of line chip.
The back side plastic packaging layer 78 cover the back side again interconnection metal layer 7, encapsulated member 4 and dielectric layer I 35 four walls and only reveal
Soldered ball 71 out, front are flushed with the upper surface of dielectric layer I 35.After the back side is polished, soldered ball 71 exposes its welding surface, in case making
Used time connect with pcb board or substrate.The material of back side plastic packaging layer 78 generally includes silica, silicon nitride or resinae dielectric material
Material.Corresponding different substrate, the position of soldered ball 71 can with flexible setting, shape can also flexible design, generally, soldered ball 71 is in
Array-like arrangement, and be the bigger the better, on the one hand convenient for connection, one of another aspect and the heat dissipation channel of encapsulating structure.According to
Different soldered balls 71 is laid out, as shown in figure 4, soldered ball 71 is illustrated with the array arrangement of 3*2, then interconnection metal layer 7 is with most easily
Cabling scenario realizes the electrical connection of soldered ball 71 and metal connecting piece 5, to save production cost.
The package thickness 300um of ultra-thin fingerprint recognition encapsulating structure is hereinafter, the encapsulating structure is complied with completely under above-mentioned screen
This development trend.
A kind of encapsulating structure of above-mentioned ultra-thin fingerprint recognition chip, can obtain between composite membrane 9 and the plastic packaging layer of product
Reliable binding force, solves that product appearance is bad, improves the encapsulation yield of product.As shown in figure 5, in ultra-thin fingerprint recognition
Its appearance is observed on the surface of the encapsulating structure of chip, does not have Dent(sags and crests), also without the Die Mark(chip marking).
Above-described specific embodiment, to the purpose of this utility model, technical scheme and beneficial effects carried out into
It is described in detail to one step, it should be understood that being not used to the foregoing is merely specific embodiment of the present utility model
Limit the protection scope of the utility model.Within the spirit and principle of the utility model, any modification for being made equally is replaced
It changes, improve, should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of encapsulating structure of ultra-thin fingerprint recognition chip comprising fingerprint Identification sensor chip (1) and encapsulated member (4),
The front of the fingerprint Identification sensor chip (1) is equipped with fingerprint induction identification region (12) and several chip electrodes (14),
The chip electrode (14) is set to the side of fingerprint induction identification region (12),
It is characterized by: the encapsulated member (4) encapsulates the fingerprint Identification sensor chip (1) and metal connecting piece (5), thereon
Expose the front of fingerprint Identification sensor chip (1), the front of the fingerprint Identification sensor chip (1) and encapsulated member in surface
(4) insulating layer (31) of upper surface overlay pattern, and insulating layer openings (311) are opened up at the chip electrode (14),
Front interconnection metal layer (6) again, positive interconnection metal layer (6) again are selectively arranged in the upper surface of the insulating layer (31)
It is distributed in the side of the chip electrode (14) except the positive vertical area of fingerprint induction identification region (12), and is passed through
Insulating layer openings (311) are connect with chip electrode (14), the front dielectric layer I of the fingerprint Identification sensor chip (1)
(35), interconnection metal layer (6) and insulating layer (31), the metal connecting piece (5) are arranged again in dielectric layer I (35) covering front
In fingerprint Identification sensor chip (1) side and to be set to chip electrode (14) other nearby, and with chip electrode (14)
It counts and corresponds, top passes through the lower surface of insulating layer (31) through positive interconnection metal layer (6) again, and encapsulating is exposed in bottom
Body (4),
The lower surface setting back side interconnection metal layer (7) and the back side plastic packaging layer (78) again of the encapsulated member (4), back side cloth again
Soldered ball (71) are arranged in one end of line metal layer (7), and the other end is connect with the bottom of metal connecting piece (5), the metal connection
Interconnection metal layer (7) is structure as a whole part (5) again with the back side, and the back side plastic packaging layer (78) covers back side interconnection metal layer again
(7), four walls of encapsulated member (4) and dielectric layer I (35) and the only welding surface of exposing soldered ball (71), front and dielectric layer I (35)
Upper surface flush,
It further include the composite membrane (9) being set on dielectric layer I (35), the composite membrane (9) and dielectric layer I (35), back side plastic packaging
The front bonding connection of layer (78), the composite membrane (9) includes dielectric layer II (91), dumb light base (92), wearing layer (93), institute
State the mist degree of dumb light base (92): 3 ~ 5%, transmitance: 95 ~ 98%, the composite membrane (9) is thinned to 20 microns +/- 2 microns.
2. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the metal connecting piece
It (5) is solid or hollow cylindrical metal object.
3. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the metal connecting piece
It (5) is interconnection metal layer again.
4. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the dielectric layer II
(91) with a thickness of 15 microns ~ 25 microns.
5. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the dumb light base
(92) material is PET, 20 microns ~ 30 microns of thickness.
6. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the wearing layer (93)
Hardness be 2H or 3H.
7. the encapsulating structure of ultra-thin fingerprint recognition chip according to any one of claim 1 to 6, it is characterised in that: institute
Fingerprint Identification sensor chip (1) is stated to be rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204848.6U CN208538148U (en) | 2018-07-27 | 2018-07-27 | A kind of encapsulating structure of ultra-thin fingerprint recognition chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204848.6U CN208538148U (en) | 2018-07-27 | 2018-07-27 | A kind of encapsulating structure of ultra-thin fingerprint recognition chip |
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| Publication Number | Publication Date |
|---|---|
| CN208538148U true CN208538148U (en) | 2019-02-22 |
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| CN201821204848.6U Active CN208538148U (en) | 2018-07-27 | 2018-07-27 | A kind of encapsulating structure of ultra-thin fingerprint recognition chip |
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