CN208092769U - A kind of fingerprint recognition structure applied to smart card - Google Patents
A kind of fingerprint recognition structure applied to smart card Download PDFInfo
- Publication number
- CN208092769U CN208092769U CN201820535804.5U CN201820535804U CN208092769U CN 208092769 U CN208092769 U CN 208092769U CN 201820535804 U CN201820535804 U CN 201820535804U CN 208092769 U CN208092769 U CN 208092769U
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- silicon substrate
- control panel
- identification module
- smart card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The utility model discloses a kind of fingerprint recognition structures applied to smart card, including:Control panel, fingerprint identification module, and the card body for inlaying the control panel and fingerprint identification module；The control panel upper surface is provided with several pads；The fingerprint identification module includes the silicon substrate for being provided with via, and the fingerprint sensor chip being separately positioned in the silicon substrate, the MCU chip being electrically connected with the fingerprint sensor chip, the silicon substrate lower surface is equipped with lower photoresist layer, and photoresist layer is equipped with above the silicon substrate；The via madial wall is filled with conductive metal, and the lower surface of the silicon substrate is provided with several tin balls, the RDL line layers being connect with the conductive metal are provided in the upper photoresist layer, and the RDL line layers are connect with the MCU chip.Fingerprint recognition structure provided by the utility model applied to smart card effectively shortens the path that signal transmits between MCU chip and fingerprint sensor chip, lifting system efficiency.
Description
Technical field
The utility model is related to encapsulation technology field more particularly to a kind of fingerprint recognition knots applied to smart card
Structure.
Background technology
Fingerprint recognition structure in the prior art applied to smart card is all first by MCU chip and to refer under normal conditions
After line sensor chip encapsulates respectively, then the two is assembled into fingerprint identification module, in this case just required circuit board face
Product just increases, and just improves production cost accordingly, meanwhile, the distance between MCU chip and fingerprint sensor chip are big, lead
Cause the distance of signal transmission remote, reaction efficiency is relatively low.
Therefore, the existing technology needs to be improved and developed.
Utility model content
In view of above-mentioned deficiencies of the prior art, the purpose of this utility model is to provide a kind of fingerprints applied to smart card
Identify structure, it is intended to solve the MCU chip in fingerprint recognition structure in the prior art and the news between fingerprint sensor chip
The problem of number long transmission distance.
The technical solution of the utility model is as follows：
A kind of fingerprint recognition structure applied to smart card, including:Control panel, the fingerprint recognition being connect with the control panel
Module, and the card body for inlaying the control panel and fingerprint identification module；
The control panel upper surface is provided with several pads for being connect with the fingerprint identification module；
The fingerprint identification module includes the fingerprint for being provided with the silicon substrate of via, and be separately positioned in the silicon substrate
Sensor chip, the MCU chip being electrically connected with the fingerprint sensor chip, the silicon substrate lower surface are equipped with lower photoresist
Layer, the silicon substrate top are equipped with photoresist layer；
The via madial wall is filled with conductive metal, and the lower surface of the silicon substrate is provided with several and conductive gold
Belong to connection and tin ball corresponding with the pad, a RDL being connect with the conductive metal is provided in the upper photoresist layer
Line layer, the RDL line layers are connect with the MCU chip.
Preferably, the fingerprint recognition structure applied to smart card, wherein the outer surface of the card body offers appearance
Receive slot, the control panel is embedded in fingerprint identification module in the holding tank.
Preferably, the fingerprint recognition structure applied to smart card, wherein the control panel is FPC, passes through first
Adhesive linkage is embedded in the receiving trench bottom.
Preferably, the fingerprint recognition structure applied to smart card, wherein the holding tank and the fingerprint recognition
The second adhesive linkage is filled between module.
Preferably, the fingerprint recognition structure applied to smart card, wherein the silicon substrate is set to the control
The top of plate, the silicon substrate upper surface are etched with the first groove for accommodating MCU chip and are passed for accommodating fingerprint respectively
Second groove of sensor chip, the MCU chip, fingerprint sensor chip all by the third adhesive linkage and the first groove,
Second groove connects.
Preferably, the fingerprint recognition structure applied to smart card, wherein the MCU chip and fingerprint sensor
The upper surface of chip, which is all provided with, is electrically connected with contact.
Compared with prior art, the fingerprint recognition structure provided by the utility model applied to smart card, including：Control
Plate, the fingerprint identification module being connect with the control panel, and the card body for inlaying the control panel and fingerprint identification module；
The control panel upper surface is provided with several pads for being connect with the fingerprint identification module；The fingerprint identification module packet
The silicon substrate for being provided with via is included, and the fingerprint sensor chip being separately positioned in the silicon substrate and the fingerprint sensing
The MCU chip of device chip electrical connection, the silicon substrate lower surface are equipped with lower photoresist layer, glazing are equipped with above the silicon substrate
Resistance layer；The via madial wall is filled with conductive metal, and the lower surface of the silicon substrate is provided with several and conductive metal
Connection and tin ball corresponding with the pad are provided with the RDL lines being connect with the conductive metal in the upper photoresist layer
Road floor, the RDL line layers are connect with the MCU chip, and MCU chip and fingerprint sensor chip are packaged into a module,
Required circuit board area when can not only reduce volume and assembling and reduce cost, additionally it is possible to shorten MCU chip and refer to
The path that signal transmits between line sensor chip, lifting system efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the fingerprint recognition structure preferred embodiment applied to smart card in the utility model.
Specific implementation mode
The utility model provides a kind of fingerprint recognition structure applied to smart card, to make the purpose of this utility model, skill
Art scheme and effect are clearer, clear, referring to the drawings and give an actual example to the utility model further description.It should
Understand, specific embodiment described herein is only used to explain the utility model, is not used to limit the utility model.
Fig. 1 is the structural schematic diagram of the fingerprint recognition structure preferred embodiment applied to smart card in the utility model,
As shown in Figure 1, in a kind of fingerprint recognition structure applied to smart card that the utility model preferred embodiment provides, including:Control
Making sheet 100, the fingerprint identification module 200 being connect with the control panel 100, and for inlaying the control panel 100 and fingerprint
The card body 300 of identification module 200；100 upper surface of the control panel is provided with several for connecting with the fingerprint identification module 200
The pad 101 connect；The fingerprint identification module 200 includes being provided with the silicon substrate 201 of via 211, and be separately positioned on described
Fingerprint sensor chip 202 in silicon substrate 201, the MCU chip 203 being electrically connected with 202 chip of the fingerprint sensor, it is described
201 lower surface of silicon substrate is equipped with lower photoresist layer 204, and 201 top of the silicon substrate is equipped with photoresist layer 205；The via
211 madial walls are filled with conductive metal 221, and the lower surface of the silicon substrate 201 is provided with several and conductive metal 221 and connects
It connects and tin ball 206 corresponding with the pad 101, one and the conductive metal 221 is provided in the upper photoresist layer 205
The RDL line layers 207 of connection, the RDL line layers 207 are connect with the MCU chip 203.
Via 211 is also referred to as plated through-hole.In dual platen and multi-layer board, for the printed conductor being connected between each layer, each
Layer needs the intersection for the conducting wire being connected to bore a upper common aperture, i.e. via.Mainly porose outer diameter and the drilling of the parameter of via
Size.
In the further preferred embodiment of the utility model, the outer surface of the card body 300 offers holding tank, the control
Plate 100 is embedded in fingerprint identification module 200 in the holding tank.
In the further preferred embodiment of the utility model, the control panel 100 is FPC, is inlayed by the first adhesive linkage 400
In the receiving trench bottom.
FPC is flexible PCB, be using polyimides or polyester film be made of base material it is a kind of have it is highly reliable
Property, excellent flexible printed circuit.Have the characteristics that Distribution density is high, light-weight, thickness is thin.
In the further preferred embodiment of the utility model, filled between the holding tank and the fingerprint identification module 200
There is the second adhesive linkage 500.
In the further preferred embodiment of the utility model, the silicon substrate 201 is set to the top of the control panel 100,
201 upper surface of the silicon substrate is etched with the first groove for accommodating MCU chip 203 and respectively for accommodating fingerprint sensor
Second groove of chip 202, the MCU chip 203, fingerprint sensor chip 202 all pass through the third adhesive linkage 600 and
One groove, the connection of the second groove.
In the further preferred embodiment of the utility model, the upper table of the MCU chip 203 and fingerprint sensor chip 202
Face is all provided with and is electrically connected with contact.
The specific encapsulation step for the fingerprint recognition structure applied to smart card that the utility model preferred embodiment is provided
It is：MCU chip 203 and fingerprint sensor chip 202 are first fixed on silicon substrate 201 to be eclipsed in the holding tank carved, recycled
Fan-out and TSV (Through silicon via) technologies are electrically connected with contact (die by fingerprint sensor chip 202 is positive
Pad) it is connected with the contact that is electrically connected with of 203 upper surface of MCU chip, then the contact that is electrically connected with of 203 upper surface of MCU chip is connected
It is connected on the tin ball 206 of 203 lower surface of MCU chip；Tin ball 206 is connected to shape after the pad 101 on FPC (flexible circuit board)
It is fixed on smart card at fingerprint identification module, then by module.This structure is by 202 envelope of MCU chip 203 and fingerprint sensor chip
Overall volume can be reduced by being fitted together.
It refers to some component's feet being walked out a bit of line, then make a call to a via and terminate (this mistake to be fanned out to (fan-out)
Hole would generally be connected to plane layer, naturally it is also possible to be signal wire) this process.
TSV (Through silicon via) technology is to utilize short vertical electrical connection across silicon chip passage technology
Or " through-hole " by silicon wafer, to establish the electrical connection from effective side of chip to the back side.TSV provides shortest mutual link
Diameter creates an approach for final 3D is integrated.
In conclusion the fingerprint recognition structure provided by the utility model applied to smart card, including：Control panel, with
The fingerprint identification module of the control panel connection, and the card body for inlaying the control panel and fingerprint identification module；It is described
Control panel upper surface is provided with several pads for being connect with the fingerprint identification module；The fingerprint identification module includes setting
It is equipped with the silicon substrate of via, and the fingerprint sensor chip being separately positioned in the silicon substrate and the fingerprint sensor core
The MCU chip of piece electrical connection, the silicon substrate lower surface are equipped with lower photoresist layer, photoresist are equipped with above the silicon substrate
Layer；The via madial wall is filled with conductive metal, and the lower surface of the silicon substrate is provided with several and conductive metal and connects
It connects and tin ball corresponding with the pad, the RDL circuits being connect with the conductive metal is provided in the upper photoresist layer
Layer, the RDL line layers are connect with the MCU chip, MCU chip and fingerprint sensor chip are packaged into a module, no
Required circuit board area when can only reduce volume and assembling and reduce cost, additionally it is possible to shorten MCU chip and fingerprint
The path that signal transmits between sensor chip, lifting system efficiency.
It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
It says, it can be modified or changed according to the above description, and all these modifications and variations should all belong to the appended power of the utility model
The protection domain that profit requires.
Claims (6)
1. a kind of fingerprint recognition structure applied to smart card, which is characterized in that including:Control panel is connect with the control panel
Fingerprint identification module, and the card body for inlaying the control panel and fingerprint identification module；
The control panel upper surface is provided with several pads for being connect with the fingerprint identification module；
The fingerprint identification module includes the fingerprint sensing for being provided with the silicon substrate of via, and be separately positioned in the silicon substrate
Device chip, the MCU chip being electrically connected with the fingerprint sensor chip, the silicon substrate lower surface are equipped with lower photoresist layer, institute
It states and is equipped with photoresist layer above silicon substrate；
The via madial wall is filled with conductive metal, and the lower surface of the silicon substrate is provided with several and conductive metal and connects
It connects and tin ball corresponding with the pad, the RDL circuits being connect with the conductive metal is provided in the upper photoresist layer
Layer, the RDL line layers are connect with the MCU chip.
2. the fingerprint recognition structure according to claim 1 applied to smart card, which is characterized in that the appearance of the card body
Face offers holding tank, and the control panel is embedded in fingerprint identification module in the holding tank.
3. the fingerprint recognition structure according to claim 2 applied to smart card, which is characterized in that the control panel is
FPC is embedded in the receiving trench bottom by the first adhesive linkage.
4. the fingerprint recognition structure according to claim 2 applied to smart card, which is characterized in that the holding tank and institute
It states and is filled with the second adhesive linkage between fingerprint identification module.
5. the fingerprint recognition structure according to claim 1 applied to smart card, which is characterized in that the silicon substrate setting
In the top of the control panel, the silicon substrate upper surface is etched with the first groove for accommodating MCU chip and is used for respectively
Accommodate fingerprint sensor chip the second groove, the MCU chip, fingerprint sensor chip all by the third adhesive linkage with
First groove, the connection of the second groove.
6. the fingerprint recognition structure according to claim 1 applied to smart card, which is characterized in that the MCU chip and
The upper surface of fingerprint sensor chip, which is all provided with, is electrically connected with contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820535804.5U CN208092769U (en) | 2018-04-16 | 2018-04-16 | A kind of fingerprint recognition structure applied to smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820535804.5U CN208092769U (en) | 2018-04-16 | 2018-04-16 | A kind of fingerprint recognition structure applied to smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208092769U true CN208092769U (en) | 2018-11-13 |
Family
ID=64056194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820535804.5U Expired - Fee Related CN208092769U (en) | 2018-04-16 | 2018-04-16 | A kind of fingerprint recognition structure applied to smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208092769U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110781848A (en) * | 2019-10-30 | 2020-02-11 | Oppo广东移动通信有限公司 | Fingerprint recognition device under screen and electronic equipment |
| CN114154607A (en) * | 2020-09-07 | 2022-03-08 | Lg伊诺特有限公司 | Circuit board and smart card for fingerprint identification |
-
2018
- 2018-04-16 CN CN201820535804.5U patent/CN208092769U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110781848A (en) * | 2019-10-30 | 2020-02-11 | Oppo广东移动通信有限公司 | Fingerprint recognition device under screen and electronic equipment |
| CN110781848B (en) * | 2019-10-30 | 2022-05-20 | Oppo广东移动通信有限公司 | Screen fingerprint identification device and electronic equipment |
| CN114154607A (en) * | 2020-09-07 | 2022-03-08 | Lg伊诺特有限公司 | Circuit board and smart card for fingerprint identification |
| CN114154607B (en) * | 2020-09-07 | 2023-10-27 | Lg伊诺特有限公司 | Circuit board and smart card for fingerprint identification |
| US11900720B2 (en) | 2020-09-07 | 2024-02-13 | Lg Innotek Co., Ltd. | Circuit board and smart card for fingerprint recognition including the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181113 Termination date: 20190416 |