CN208547959U - A kind of encapsulating structure of ultra-thin fingerprint recognition chip - Google Patents

Abstract

The utility model discloses a kind of encapsulating structures of ultra-thin fingerprint recognition chip, belong to fingerprint recognition chip package field.Its positive interconnection metal layer (6) again is distributed in the side of the chip electrode (14) except the positive vertical area of fingerprint induction identification region (12), and it is connect with chip electrode (14), metal connecting piece (5) is set to the side of fingerprint Identification sensor chip (1) and is set to chip electrode (14) side nearby, its top passes through the lower surface of insulating layer (31) through positive interconnection metal layer (6) again, expose encapsulated member (4) in its bottom, the back side again interconnection metal layer (7) one end be arranged soldered ball, its other end is connect with the bottom of metal connecting piece (5), the front of fingerprint Identification sensor chip (1) first setting dielectric layer (35) composite protection film (91) that bonding connection is thinned on dielectric layer (35) again.It is bad that the utility model solves product appearance, improves product yield.

Description

A kind of encapsulating structure of ultra-thin fingerprint recognition chip

Technical field

The utility model relates to a kind of encapsulating structures of ultra-thin fingerprint recognition chip, belong to fingerprint recognition chip package neck Domain.

Background technique

Fingerprint is the unique feature of human body, and fingerprint identification technology is the key that current biological identification technology.Nowadays hand Machine is at indispensable a part in people's daily life, since access times are frequent, input password repeatedly and also people is allowed to feel It is very inconvenient, there is fingerprint recognition system, user is allowed to feel more convenient and quicker safety.

But the reliability performance of fingerprint recognition chip is not able to satisfy test request, needs to carry out secondary encapsulation to it, so that It can satisfy reliability, ultra-thin, the inferior requirement for meeting current phone development trend of screen.Fingerprint recognition field is generally adopted at present It is encapsulated with Substrate, but in the actual production process, discovery has a large amount of bad order in fingerprint recognition product surface, such as Die Mark (chip trace) shown in FIG. 1 and Dent(sags and crests).

Summary of the invention

The utility model proposes a kind of ultra-thin fingerprint for improving bad order mainly for the deficiency of existing encapsulation technology The encapsulating structure of identification chip.

Purpose of the utility model is realized as follows:

The utility model provides a kind of encapsulating structure of ultra-thin fingerprint recognition chip comprising fingerprint Identification sensor core Piece and encapsulated member, the front of the fingerprint Identification sensor chip are equipped with fingerprint induction identification region and several chip electrodes,

The chip electrode is set to the side of fingerprint induction identification region, and the encapsulated member is encapsulated the fingerprint recognition and passed The front of fingerprint Identification sensor chip, the fingerprint Identification sensor are exposed in sensor chip and metal connecting piece, upper surface The insulating layer of the upper surface overlay pattern in the front and encapsulated member of chip, and open up insulating layer at the chip electrode and open Mouthful, front interconnection metal layer again is selectively arranged in the upper surface of the insulating layer, and interconnection metal layer is distributed in again in the front The side of chip electrode except the positive vertical area of the fingerprint induction identification region, and pass through insulating layer openings and core Plate electrode connection, the front dielectric layer of the fingerprint Identification sensor chip, dielectric layer covering front are routed gold again Belong to layer and insulating layer, the metal connecting piece are set to the side of fingerprint Identification sensor chip and are set to chip electrode nearby Side, and corresponded with the number of chip electrode, top passes through the lower surface of the through positive interconnection metal layer again of insulating layer, Encapsulated member is exposed in bottom,

The lower surface setting back side interconnection metal layer and the back side plastic packaging layer again of the encapsulated member, back side wiring metal again Soldered ball, the bottom connection of the other end and metal connecting piece is arranged in one end of layer, and the back side plastic packaging layer covering back side is routed again Metal layer, four walls of encapsulated member and dielectric layer and the welding surface for only exposing soldered ball, front are flushed with the upper surface of dielectric layer,

It further include the composite protection film being set on dielectric layer, the composite protection film includes base and semi-solid preparation resin Layer, the semi-solid preparation resin layer are bonded with the front of dielectric layer, back side plastic packaging layer, and the composite protection film is thinned to 20 microns +/- 2 microns, the outside of the base is arranged one layer of abrasion resistant polyurethane and forms outer abrasion resistant layer.

Metal connecting piece described in the utility model is in solid or hollow column.

Metal connecting piece described in the utility model is again interconnection metal layer, and interconnection metal layer is integrated knot again with the back side Structure.

The material of base described in the utility model is polyimides or polyethylene naphthalate.

Contain atomizing particle, mist degree 3 ~ 5%, transmitance 95 ~ 98% in base's material described in the utility model.

The inside of base described in the utility model is arranged one layer of abrasion resistant polyurethane and forms internal layer wearing layer, hardness be 2H or 3H。

Semi-solid preparation resin layer described in the utility model is PSA or silicone adhesive.

Fingerprint Identification sensor chip described in the utility model is rectangle.

Beneficial effect

A kind of packaging method of ultra-thin fingerprint recognition chip of the utility model obtains composite protection film and dielectric layer, plastic packaging Reliable binding force between material, solves that product appearance is bad, improves the yield of product；Composite protection film after being thinned, The ultrathin packaging structure of fingerprint recognition chip, and the combination of wearing layer are realized, the reliability of its encapsulating structure and resistance to is strengthened Mill property.

Detailed description of the invention

Fig. 1 is the encapsulation bad order figure of existing fingerprint recognition chip；

Fig. 2 is a kind of schematic diagram of the embodiment of the encapsulating structure of ultra-thin fingerprint recognition chip of the utility model；

The schematic diagram of the positional relationship of metal connector and chip electrode, sensing element region that Fig. 3 is Fig. 2 faced；

The schematic diagram of metal connector and the back side positional relationship of interconnection metal layer again that Fig. 4 is Fig. 2 looked up；

Fig. 5 is a kind of appearance figure of the encapsulating structure of ultra-thin fingerprint recognition chip of the utility model；

Wherein,

Fingerprint Identification sensor chip 1

Chip body 10

Fingerprint incudes identification region 12

Chip electrode 14

Insulating layer 31

Dielectric layer 35

Encapsulated member 4

Metal connecting piece 5

Positive interconnection metal layer 6 again

Back side interconnection metal layer 7 again

Soldered ball 71

Wiring metal line 72 again

Back side plastic packaging layer 78

Composite protection film 91

Base 911

Semi-solid preparation resin layer 912

Outer abrasion resistant layer 913

Internal layer wearing layer 914.

Specific embodiment

In order to elaborate the Spirit Essence of the utility model, help those skilled in the art are practical, are fully understood by this The complete technical solution of utility model carries out specifically the technical solution of the utility model below in conjunction with embodiment and attached drawing It is bright.

Embodiment

A kind of encapsulating structure of ultra-thin fingerprint recognition chip of the utility model, fingerprint Identification sensor chip 1 is in rectangular Shape, diagrammatic cross-section is as shown in Fig. 2, the front of the chip body 10 of fingerprint Identification sensor chip 1 is equipped with fingerprint induction knowledge Other region 12 and several chip electrodes 14, chip electrode 14 is set to the side of fingerprint induction identification region 12, so that fingerprint The useful detection area for incuding identification region 12 is big as far as possible, and the 6 of fingerprint induction 12 side of identification region is set in figure A chip electrode 14 is illustrated, and sensing element is set in fingerprint induction identification region 12, the circuit of circuit and chip electrode 14 It is set to the inside of fingerprint Identification sensor chip 1.

Encapsulating material encapsulates fingerprint Identification sensor chip 1 and metal connecting piece 5, and the material of encapsulating material is at present with epoxy Resin, phenolic resin, organic siliconresin and unsaturated polyester resin are the most commonly used.After the completion of encapsulating material encapsulating, solidification, in solid The encapsulated member 4 of shape, the effects of waterproof, moisture-proof, shockproof, dust-proof, heat dissipation can be played, insulated.It is encapsulated simultaneously generally for reduction The thermal expansion coefficient problem of material, the thermomechanical reliability of lift structure itself, also adds silica, nitrogen in encapsulating material The filler materials such as SiClx.

Expose the front of fingerprint Identification sensor chip 1 in the upper surface of encapsulated member 4.Fingerprint Identification sensor chip 1 is just The insulating layer 31 of the upper surface overlay pattern of face and encapsulated member 4, and insulating layer openings 311 are opened up at chip electrode 14.Absolutely The material of edge layer 31 is silica, silicon nitride etc..Front interconnection metal layer 6 again are selectively arranged in the upper surface of insulating layer 31, Interconnection metal layer 6 is distributed in the chip electrode 14 except the positive vertical area of fingerprint induction identification region 12 again in front Side, and connect by insulating layer openings 311 with chip electrode 14, interconnection metal layer 6 is generally good using electric conductivity again in front The materials such as copper Cu well, iron Fe, nickel.Its specific number of plies can be set as one or more layers according to product requirement, common, front Interconnection metal layer 6 is high-density wiring layer again, i.e., line width/line-spacing is in 5um or less.The fingerprint Identification sensor chip 1 is just Face dielectric layer 35, the dielectric layer 35 cover front interconnection metal layer 6 and insulating layer 31 again.

Metal connecting piece 5 is set to the side of fingerprint Identification sensor chip 1, is set to fingerprint with metal connecting piece 5 and knows The ipsilateral of chip electrode 14 of individual sensor chip 1 is preferred.Metal connecting piece 5 be in solid or hollow column, material be copper Cu, Nickel, vanadium V, titanium Ti, palladium Pd, gold Au, silver Ag etc..Alternatively, metal connecting piece 5 is again interconnection metal layer, and it is routed again with the back side Metal layer 7 is structure as a whole.The top of metal connecting piece 5 passes through the lower surface of the through positive interconnection metal layer 6 again of insulating layer 31, Interconnection metal layer 6 realizes connection again with front.The number of metal connecting piece 5 is closed with the number of chip electrode 14 without absolutely corresponding System, designs according to actual needs.It is the connection relationship for clearly demonstrating metal connecting piece 5 Yu chip electrode 14 in Fig. 3, with metal The number of connector 5 and the number of chip electrode 14 correspond and illustrate.Expose encapsulated member 4 in the bottom of metal connecting piece 5.

Back side interconnection metal layer 7 again are arranged in the lower surface of encapsulated member 4.Interconnection metal layer 7 generally uses electric conductivity again at the back side The metals production such as the good copper Cu of energy, iron Fe, nickel.Its specific number of plies can be set as one or more layers according to product requirement, lead to Normal, interconnection metal layer 7 is high-density wiring layer again at the back side, i.e., line width/line-spacing is in 5um hereinafter, to improve the reliability of electricity. Soldered ball 71 is arranged in one end of back side interconnection metal layer 7 again, and the other end connect with the bottom of metal connecting piece 5.Being equivalent to will refer to The back side that the positive chip electrode of line identification sensor chip 1 leads to fingerprint Identification sensor chip 1 is connected with substrate.Cause This, compared with the prior art of fingerprint Identification sensor encapsulating structure, the program of the utility model equally reduces fingerprint knowledge The vertical blank area of a room that individual sensor needs, in order to which fingerprint Identification sensor is designed in the position closer to user's finger, effectively Ground improves the sensitivity of fingerprint Identification sensor contact.

The front dielectric layer 35 of above-mentioned fingerprint Identification sensor chip 1, the dielectric constant of dielectric layer 35 are 4.5 ~ 6, To reduce dead resistance, capacitor and the inductance of circuit structure, while guaranteeing that route has good insulation performance.

The back side plastic packaging layer 78 cover the back side again interconnection metal layer 7, encapsulated member 4 and dielectric layer 35 four walls and only expose Soldered ball 71, front are flushed with the upper surface of dielectric layer 35.After the back side is polished, soldered ball 71 exposes its welding surface, in case using When connect with pcb board or substrate.The material of back side plastic packaging layer 78 generally includes silica, silicon nitride or resinae dielectric material. Corresponding different substrate, the position of soldered ball 71 can with flexible setting, shape can also flexible design, generally, soldered ball 71 is in battle array Column-shaped arrangement, and be the bigger the better, on the one hand convenient for connection, one of another aspect and the heat dissipation channel of encapsulating structure.According to not Same soldered ball 71 is laid out, as shown in figure 4, soldered ball 71 is illustrated with the array arrangement of 3*2, then interconnection metal layer 7 is with most convenient and fast cloth Line scheme realizes the electrical connection of soldered ball 71 and metal connecting piece 5, to save production cost.

Composite protection film 91 includes base 911 and semi-solid preparation resin layer 912.The material of base 911 is Polyimde(polyamides Imines), PEN(polyethylene naphthalate) etc., have extraordinary impact resistance and tear resistance.In 911 material of base Containing atomizing particle, mist degree 3 ~ 5%, transmitance 95 ~ 98%, diffusing reflection of the light in dumb light substrate is uniform, can cover entire super The flaws such as sags and crests existing for the encapsulating structure of thin fingerprint recognition chip, die mark.To reinforce wear resistence, base 911 it is outer Side is arranged one layer of very thin abrasion resistant polyurethane and forms outer abrasion resistant layer 913, and hardness can prevent film surface from being drawn in 2H or 3H Wound.When necessary, the inside of base 911 also can be set one layer of very thin abrasion resistant polyurethane and form internal layer wearing layer 914, hardness Also in 2H or 3H, film surface can be further prevented to be scratched.The thickness of outer abrasion resistant layer 913 and internal layer wearing layer 914 is generally 5 Microns, as shown in Figure 2.Base 911 and semi-solid preparation resin layer 912 and outer abrasion resistant layer 913, internal layer wearing layer 914 are jointly Form new composite protection film 91.Semi-solid preparation resin layer 912 is to have sticking PSA, silicone adhesive(silicone adhesive) Deng 5 microns ~ 18 microns of thickness, softening under heating pressurization, there is viscosity, solidification can be reacted after cooling.Complex protection 912 side of semi-solid preparation resin layer of film 91 is bonded with the positive dielectric layer 35 of fingerprint Identification sensor chip 1.It can obtain compound Reliable binding force between protective film 91 and plastic packaging material improves the encapsulation yield of product.

The thickness of composite protection film 91 is thinned to 20 microns +/- 2 microns, on the one hand obtains ultra-thin package thickness, another Aspect can remove the flaw on 91 surface of composite protection film, meanwhile, improve the sensitivity quick response speed of fingerprint chip.

The package thickness 300um of ultra-thin fingerprint recognition encapsulating structure is hereinafter, the encapsulating structure is complied with completely under above-mentioned screen This development trend.

A kind of packaging method of the encapsulating structure of above-mentioned ultra-thin fingerprint recognition chip can obtain protective film 9 and product Reliable binding force between plastic packaging layer, solves that product appearance is bad, improves the encapsulation yield of product.As shown in figure 5, super Its appearance is observed on the surface of the encapsulating structure of thin fingerprint recognition chip, does not have Dent(sags and crests), also without Die Mark(chip The marking).

Above-described specific embodiment, to the purpose of this utility model, technical scheme and beneficial effects carried out into It is described in detail to one step, it should be understood that being not used to the foregoing is merely specific embodiment of the present utility model Limit the protection scope of the utility model.Within the spirit and principle of the utility model, any modification for being made equally is replaced It changes, improve, should be included within the scope of protection of this utility model.

Claims (8)

1. a kind of encapsulating structure of ultra-thin fingerprint recognition chip comprising fingerprint Identification sensor chip (1) and encapsulated member (4), The front of the fingerprint Identification sensor chip (1) is equipped with fingerprint induction identification region (12) and several chip electrodes (14),

It is characterized by: the chip electrode (14) is set to the side of fingerprint induction identification region (12), the encapsulated member (4) The fingerprint Identification sensor chip (1) and metal connecting piece (5) are encapsulated, fingerprint Identification sensor chip is exposed in upper surface (1) front, the insulation of the upper surface overlay pattern in the front and encapsulated member (4) of the fingerprint Identification sensor chip (1) Layer (31), and insulating layer openings (311) are opened up at the chip electrode (14), the upper surface selectivity of the insulating layer (31) Interconnection metal layer (6), the positive interconnection metal layer (6) again are distributed in the fingerprint induction identification region again in ground setting front (12) side of the chip electrode (14) except positive vertical area, and pass through insulating layer openings (311) and chip electrode (14) it connects, the front dielectric layer (35) of the fingerprint Identification sensor chip (1), dielectric layer (35) covering front Interconnection metal layer (6) and insulating layer (31) again, the metal connecting piece (5) are set to the one of fingerprint Identification sensor chip (1) Side and to be set to chip electrode (14) nearby other, and corresponded with the number of chip electrode (14), top passes through insulating layer (31) encapsulated member (4) are exposed in the lower surface of through positive interconnection metal layer (6) again, bottom,

The lower surface setting back side interconnection metal layer (7) and the back side plastic packaging layer (78) again of the encapsulated member (4), back side cloth again Soldered ball (71) are arranged in one end of line metal layer (7), and the other end is connect with the bottom of metal connecting piece (5), the back side plastic packaging Interconnection metal layer (7), four walls of encapsulated member (4) and dielectric layer (35) and the only weldering of exposing soldered ball (71) again of layer (78) the covering back side Junction, front are flushed with the upper surface of dielectric layer (35),

It further include the composite protection film (91) being set on dielectric layer (35), the composite protection film (91) includes base (911) With semi-solid preparation resin layer (912), the front key of the semi-solid preparation resin layer (912) and dielectric layer (35), back side plastic packaging layer (78) It closes, the composite protection film (91) is thinned to 20 microns +/- 2 microns, and one layer of wear-resisting poly- ammonia is arranged in the outside of the base (911) Ester forms outer abrasion resistant layer (913).

2. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the metal connecting piece It (5) is in solid or hollow column.

3. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the metal connecting piece It (5) is interconnection metal layer again, and interconnection metal layer (7) is structure as a whole again with the back side.

4. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the base (911) Material be polyimides or polyethylene naphthalate.

5. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 4, it is characterised in that: the base (911) Mist degree 3 ~ 5%, transmitance 95 ~ 98%.

6. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the base (911) Inside one layer of abrasion resistant polyurethane be set form internal layer wearing layer (914), hardness is 2H or 3H.

7. the encapsulating structure of ultra-thin fingerprint recognition chip according to claim 1, it is characterised in that: the semi-solid preparation resin Layer (912) is PSA or silicone adhesive.

8. the encapsulating structure of ultra-thin fingerprint recognition chip according to any one of claim 1 to 7, it is characterised in that: institute Fingerprint Identification sensor chip (1) is stated to be rectangle.