CN208527357U - Semiconductor plastic package band high-voltage isulation test system and test device - Google Patents
Semiconductor plastic package band high-voltage isulation test system and test device Download PDFInfo
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- CN208527357U CN208527357U CN201820541462.8U CN201820541462U CN208527357U CN 208527357 U CN208527357 U CN 208527357U CN 201820541462 U CN201820541462 U CN 201820541462U CN 208527357 U CN208527357 U CN 208527357U
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Abstract
The utility model relates to a kind of semiconductor plastic package band high-voltage isulation test system and test device, it is characterized in that test device (4) includes supporting mechanism (401), press mechanism (402) and Shang Ding mechanism (403), supporting mechanism (401) is used to support into the semiconductor plastic package band (8) in test device (4), press mechanism (402) is compressed for that will enter the semiconductor plastic package band (8) in test device (4), top is contacted with semiconductor plastic package band (8) in Shang Ding mechanism (403), so that semiconductor plastic package band (8), which is powered, carries out Insulation test.The semiconductor plastic package band high-voltage isulation test macro of the utility model assembling has the advantages of realizing automated job, reducing labor intensity of workers, improve production efficiency, reduce enterprise's production cost.
Description
Technical field
The utility model relates to a kind of semiconductor plastic package band high-voltage isulation test system and test device and its test methods.
Background technique
The Insulation test of traditional semiconductor plastic package band is that artificial loading is put into test station, and artificial pressing is surveyed
Examination, artificial blanking carry out rewinding and are manually collected waste material, and inefficiency, labor intensity of workers is big, can not achieve certainly
Dynamic metaplasia produces, and reduces production efficiency, improves enterprise's production cost.Therefore seek a kind of realization automated job, reduce work
People's labor intensity, improve production efficiency, reduce enterprise's production cost semiconductor plastic package band high-voltage isulation test macro and its
Test method is particularly important.
Summary of the invention
Purpose of the utility model is to overcome the above-mentioned shortcomings and provide a kind of semiconductor plastic package band high-voltage isulation tests to be
Guided Missiles Service Test Set can be assembled into realization automated job, reduce labor intensity of workers, improve production efficiency, reduce enterprise
The semiconductor plastic package band high-voltage isulation test macro of production cost.
Purpose of the utility model is realized as follows:
A kind of semiconductor plastic package band high-voltage isulation test system and test device, it is characterised in that test device includes support
Mechanism, press mechanism and Shang Ding mechanism, supporting mechanism are used to support into the semiconductor plastic package band in test device, push
Mechanism is compressed for that will enter the semiconductor plastic package band in test device, is pushed up in Shang Ding mechanism and is connect with semiconductor plastic package band
Touching, so that semiconductor plastic package band, which is powered, carries out Insulation test.
The supporting mechanism includes supporting mechanism bracket, and supporting mechanism bracket is fixed in rack, on supporting mechanism bracket
It is provided with longitudinal test runner,
The press mechanism includes press mechanism bracket, and press mechanism bracket is fixed in rack, on press mechanism bracket
Be provided with vertical press mechanism sliding rail, be provided with press mechanism lifting seat on press mechanism sliding rail, press mechanism lifting seat with
The telescopic end connection of one upward press mechanism cylinder, the bottom of press mechanism cylinder are fixed in rack, press mechanism liter
Drop seat passes through connector to the right and is connected with test board mounting base, and the bottom of test board mounting base is connected with test board, test board
Electric signal connecting test instrument,
The Shang Ding mechanism includes upper top mechanism rack, and upper top mechanism rack is fixed in rack, upper top mechanism rack
On be provided with vertical Shang Ding mechanism sliding rail, Shang Ding mechanism lifting seat, Shang Ding mechanism lifting seat are provided on Shang Ding mechanism sliding rail
On be provided with electrode tip holder, test electrode is provided on electrode tip holder；Shang Ding mechanism lifting seat and a upward Shang Ding mechanism cylinder
Telescopic end connection.
The centre for testing runner has the step of recess.
It tests and is equipped with lower collets in runner, interval is equipped with upper collets in test board.
The upper surface of test runner is provided with location hole, and test board bottom is provided with downward pilot pin.
The test method of the test device:
Normal condition, semiconductor plastic package band are put into runner, and test board pushes, to semiconductor plastic package after test board pushing
Band carries out whole packages, and semiconductor plastic package band forms cathode；
Stitching state, test electrode are contacted, in place by pushing up in the control of Shang Ding mechanism cylinder with semiconductor plastic package band pin
Afterwards, board carries out Insulation test to signal tester, tester pressurization, under certain parameter setting, if semiconductor plastic package band
Intact, tester gives board non-defective unit signal, if semiconductor plastic package band is not encapsulated completely, tester gives board defective products signal.
Compared with prior art, the utility model has the beneficial effects that
The semiconductor plastic package band high-voltage isulation test macro of the utility model assembling, which has, realizes automated job, reduces
The advantages of labor intensity of workers improves production efficiency, reduces enterprise's production cost.
Detailed description of the invention
Fig. 1 is the schematic diagram of semiconductor plastic package band high-voltage isulation test macro.
Fig. 2 is Fig. 1 explosive view.
Fig. 3 is that rack and feeding device cooperate schematic diagram.
Fig. 4 is in schematic diagram when low level for the semiconductor plastic package band in feeding device.
Fig. 5 is the schematic diagram of two kinds of switching states of the magazine in feeding device.
Fig. 6 is the schematic diagram when semiconductor plastic package band in feeding device is in high-order.
Fig. 7 is the superstructure schematic diagram of feeding device.
Fig. 8 is the explosive view of Fig. 7.
Fig. 9 is the substructure schematic diagram of feeding device.
Figure 10 is the explosive view of Fig. 9.
Figure 11 is the schematic diagram of feeding-distribution device.
Figure 12 is the explosive view of Figure 11.
Figure 13 is the schematic diagram of test device.
Figure 14 is the supporting mechanism schematic diagram of test device.
Figure 15 is the press mechanism schematic diagram of test device.
Figure 16 is the explosive view of Figure 15.
Figure 17 is the upper top structural scheme of mechanism of test device.
Figure 18 is the explosive view of Figure 17.
Figure 19 is the schematic diagram of traction device.
Figure 20 is the explosive view of Figure 19.
Figure 21 is the schematic diagram of the traction mechanism of traction device.
Figure 22 is schematic diagram of the traction device in the case where drawing gripper cylinder stretching state.
Figure 23 is schematic diagram of the traction device under traction clamping cylinders retract state.
Figure 24 is the schematic diagram of material collecting device.
Figure 25 is the explosive view of Figure 24.
Figure 26 is the unidirectional feeding distribution mechanism schematic diagram of material collecting device.
Figure 27 is the explosive view of Figure 26.
Figure 28 is the schematic diagram of waste material collection device.
Figure 29 is the location diagram of waste material collection device and material collecting device.
Wherein:
Rack 1, rack channel 101, guide rod 102, guide rod fixing seat 103, rack connecting hole 104
Feeding device 2, feeding device rack 201, connecting rod 202, feed bin track 203, feed bin Mobile base 204, magazine
205, magazine fixed frame 206, tightening cylinder block 206.1, tightening cylinder 206.2, lever 206.3, tightening bolt 206.4, feed bin
Mobile limit base 207, vertical supports 208, feeding device servo motor 209, feeding device support rod 210, feeding device support
Seat 211, feeding device rotating bar attachment base 212, feeding device rotating bar 213, rotation connection block 214, elevating lever fixed seats
215, elevating lever 216, raising plate 217, gear 218, feeding device transverse cylinder 219
Feeding-distribution device 3, door frame 301, traversing guide rail 302, feeding-distribution device drag chain mounting base 303, feeding-distribution device motor 304,
Feeding-distribution device drag chain 305, transverse-moving mechanism 306, transverse-moving mechanism limit switch 307, sub-material draw frame machine 308, sub-material draw cylinder
308.1, sub-material draws guide sleeve 308.2, sub-material draws guide rod 308.3, upper connecting rod 308.4, lower connecting plate 308.5, inhales
First 308.6
Test device 4, supporting mechanism 401, supporting mechanism bracket 401.1, test runner 401.2, lower collets 401.3,
Press mechanism 402, press mechanism bracket 402.1, press mechanism sliding rail 402.2, press mechanism lifting seat 402.3, press mechanism
Cylinder 402.4, test board mounting base 402.5, test board 402.6, upper collets 402.7, Shang Ding mechanism 403, Shang Ding mechanism branch
Frame 403.1, Shang Ding mechanism sliding rail 403.2, Shang Ding mechanism lifting seat 403.3, electrode tip holder 403.4, test electrode 403.6
Traction device 5, traction track 501, traction sliding shoe 502, traction connector 503, traction belts 504, traction electricity
Machine 505, traction support 506, traction lifting cylinder 507, traction connection frame 508, transverse slat 508.1, riser 508.2, traction mechanism
509, draw bar 509.1, hook 509.2, pushing block 509.3, oscillating rod 509.4, gripper jaw 509.5, traction gripper cylinder 510,
Draw drag chain 511, traction drag chain guide rail 512
Material collecting device 6, rewinding runner 601, leading stream road 602, rewinding box 603, corner post 603.1, preceding connecting plate
603.2, rear connecting plate 603.3, hoisting mechanism 604, hoisting mechanism support frame 604.1, hoisting mechanism track 604.2, elevator
Structure sliding block 604.3, lifting plate 604.4, hoisting mechanism cylinder 604.5, unidirectional feeding distribution mechanism 605, feeding distribution mechanism support 605.1,
Pin shaft 605.2, cutting plate 605.3, supporting block 605.4
Waste material collection device 7, garbage collection frame 701, guide plate 702
Semiconductor plastic package band 8.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only invention a part of the embodiment, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, is fallen within the protection scope of the utility model.
Referring to Fig. 1-Figure 29, the utility model relates to a kind of semiconductor plastic package band high-voltage isulation test macro, it is wrapped
Including rack 1, feeding device 2, feeding-distribution device 3, test device 4, traction device 5, material collecting device 6 and waste material collection device 7；On
Material device 2, feeding-distribution device 3, test device 4, traction device 5, material collecting device 6 and waste material collection device 7 are set to rack 1
On；
Wherein: a kind of working method of semiconductor plastic package band high-voltage isulation test macro:
Feeding device 2 is used to store the semiconductor plastic package band 8 before test, and feeding-distribution device 3 is used for will be in feeding device 2
Semiconductor plastic package band 8 is moved in test device 4, and test device 4 is used for the Insulation test of semiconductor plastic package band 8, traction
Device 5 will wherein meet insulation for removing the semiconductor plastic package band 8 that Insulation test terminates from test device 4
The semiconductor plastic package band 8 of test request is sent into material collecting device 6, and then meets Insulation test requirement by 6 pairs of material collecting device
Semiconductor plastic package band 8 carry out rewinding, wherein the semiconductor plastic package band 8 for being unsatisfactory for Insulation test requirement is partly led by subsequent
Body plastic packaging band 8 is sequentially ejected to be sent into waste material collection device 7 and is collected.
Preferably, test device 4, traction device 5 and material collecting device 6 have been arranged in parallel two groups.
The rack 1 is horizontally disposed, offers among the leading portion of the rack 1 for the semiconductor plastic package in feeding device 2
The rack channel 101 that band 8 rises through, the inner ring of rack channel 101 are provided with the semiconductor plastic package band 8 for that will rise
More guide rods 102 being oriented to, guide rod 102 are fixed in the guide rod fixing seat 103 of 1 upper surface of rack；
The feeding device 2 includes feeding device rack 201, and feeding device rack 201 is horizontally disposed below rack 1,
The upward connecting rod 202 of four be evenly arranged, the top difference of four connecting rods 202 are provided in feeding device rack 201
Four rack connecting holes 104 in rack 1 are connected, 201 upper surface of feeding device rack is provided with lateral feed bin track 203,
It is provided with feed bin Mobile base 204 on feed bin track 203, magazine fixed frame 206 is provided on feed bin Mobile base 204, magazine is fixed
From left to right at least provided with two magazines 205 in frame 206, the front openings of the magazine fixed frame 206 are set in opening
It is equipped with magazine opening tightening system, the magazine opening tightening system includes being set to the left right lateral receipts of magazine fixed frame 206
Tight cylinder block 206.1, tightens and is provided with forward tightening cylinder 206.2 on cylinder block 206.1, tightens the front end of cylinder 206.2
The opening direction of magazine 205 is provided with a lever 206.3, a tightening bolt backward is provided on lever 206.3
206.4,201 upper surface of feeding device rack of the left and right of feed bin Mobile base 204 is each provided with the mobile limit of a feed bin
Position seat 207, is provided with a vertical feeding device vertical supports 208 below feeding device rack 201, feeding device is vertical
The right side of bracket 208 is provided with a feeding device servo motor 209, and the left side of feeding device vertical supports 208 is provided with one
The vertical feeding device support rod 210 of root, the lower end of feeding device support rod 210 are connected with feeding device support base to the left
211, feeding device support base 211 is fixed with feeding device rotating bar attachment base 212, on feeding device rotating bar attachment base 212
It is provided with upward feeding device rotating bar 213, rotation connection block 214, rotation connection are set in feeding device rotating bar 213
Block 214 connects an elevating lever fixed seats 215, is connected with two elevating levers 216, two elevating levers in elevating lever fixed seats 215
216 top is connected with raising plate 217, power output end and 213 lower end of feeding device rotating bar of the servo motor 209
Gear 218 is connected by power, and the lower section of the feeding device rack 201 is additionally provided with lateral feeding device transverse cylinder 219,
The tailpiece of the piston rod of feeding device transverse cylinder 219 is connect with the bottom of feed bin Mobile base 204；
The feeding-distribution device 3 include 1 leading portion of rack across door frame 301, be provided with cross on the crossbeam of the door frame 301
Guide rail 302 and feeding-distribution device drag chain mounting base 303 are moved, feeding-distribution device drag chain mounting base 303 is located at traversing 302 top of guide rail, point
Left section of rear of material device drag chain mounting base 303 is provided with feeding-distribution device motor 304, after feeding-distribution device drag chain mounting base 303
Side is provided with feeding-distribution device drag chain 305, and traversing movement can be carried out on traversing guide rail 302 by being provided on traversing guide rail 302
Transverse-moving mechanism 306, feeding-distribution device motor 304 are connected by power transverse-moving mechanism 306, and the free end of feeding-distribution device drag chain 305 connects horizontal
Left section of telephone-moving structure 306, the front side of the door frame 301 is respectively arranged with a transverse-moving mechanism limit switch 307 with back segment, described
Transverse-moving mechanism 306 includes a traversing seat 306.1, and the traversing seat 306.1 is slidably connected on traversing guide rail 302, traversing seat
306.1 connect with feeding-distribution device drag chain 305, and traversing about 306.1 seat, which is hung, is equipped with a hanger 306.2, described traversing
Mechanism 306 is vertically provided with a sub-material draw frame machine 308, and the sub-material draw frame machine 308 includes that a upward sub-material is inhaled
Take 308.1, two sub-materials of cylinder draw 308.2, two sub-materials of guide sleeve draw guide rods 308.3, upper connecting rod 308.4, under
Connecting plate 308.5 and multiple suction nozzles 308.6, sub-material are drawn cylinder 308.1 and are located in the middle part of the support plate of hanger 306.2, and two
Sub-material draws guide sleeve 308.2 and is located at sub-material absorption 308.1 front and rear sides of cylinder, and two sub-materials are drawn guide rods 308.3 and distinguished
It is arranged in two sub-materials to draw in guide sleeve 308.2, upper connecting rod 308.4 connects two sub-materials and draws the upper of guide rod 308.3
End and sub-material draw the telescopic end of cylinder 308.1, and lower connecting plate 308.5 connects two sub-materials and draws under guide rod 308.3
End, multiple suction nozzles 308.6 are down-set in 308.5 bottom surface of lower connecting plate；Suction nozzle 308.6 connects air extractor；
The test device 4, which is located on the leading portion of rack 1 and is symmetrically arranged, two groups, with a test in left side
For device 4, which includes supporting mechanism 401, press mechanism 402 and Shang Ding mechanism 403, supporting mechanism 401
It is used to support the semiconductor plastic package band 8 entered in test device 4, press mechanism 402 is used for will be into half in test device 4
Conductor plastic packaging band 8 compresses, and pushes up in Shang Ding mechanism 403 and contacts with semiconductor plastic package band 8, so that semiconductor plastic package band
8, which are powered, carries out Insulation test；
The supporting mechanism 401 includes supporting mechanism bracket 401.1, and supporting mechanism bracket 401.1 is fixed in rack 1,
Longitudinal test runner 401.2 is provided on supporting mechanism bracket 401.1, the centre of test runner 401.2 has the platform of recess
Rank, the middle part hollow out of the test runner 401.2, test runner 401.2 is interior to be equipped with lower collets 401.3, tests runner
401.2 upper surface is provided with location hole,
The press mechanism 402 includes press mechanism bracket 402.1, and press mechanism bracket 402.1 is fixed in rack 1,
Press mechanism bracket 402.1 is located at the distal end of feeding-distribution device 3, is provided with vertical press mechanism on press mechanism bracket 402.1
Sliding rail 402.2, is provided with press mechanism lifting seat 402.3 on press mechanism sliding rail 402.2, press mechanism lifting seat 402.3 with
The telescopic end connection of one upward press mechanism cylinder 402.4, rack 1 is fixed in the bottom of press mechanism cylinder 402.4
On, press mechanism lifting seat 402.3 is connected with test board mounting base 402.5, test board mounting base by connector to the right
402.5 bottom is connected with test board 402.6,402.6 electric signal connecting test instrument of test board, and interval is embedding in test board 402.6
Be equipped with collets 402.7,402.6 bottom of test board is provided with downward pilot pin, above-mentioned lower collets 401.3 and it is upper absolutely
Edge block 402.7 is for wrapping up the part that the semiconductor plastic package band 8 in test process should be exposed in air；
The Shang Ding mechanism 403 includes upper top mechanism rack 403.1, and upper top mechanism rack 403.1 is fixed in rack 1,
It is provided with vertical Shang Ding mechanism sliding rail 403.2 on upper top mechanism rack 403.1, is provided on Shang Ding mechanism sliding rail 403.2
Shang Ding mechanism lifting seat 403.3 is provided with electrode tip holder 403.4 on Shang Ding mechanism lifting seat 403.3, is arranged on electrode tip holder 403.4
There is test electrode 403.6；Shang Ding mechanism lifting seat 403.3 is connect with the telescopic end of a upward Shang Ding mechanism cylinder 403.5；
The test method of the test device 4:
Normal condition, semiconductor plastic package band 8 are put into runner by the suction nozzle 308.6 of feeding-distribution device 3, and suction nozzle 308.6 moves
After walking, test board is pushed, and the semiconductor plastic package band 8 that the pilot pin on test board treats Insulation test carries out correcting, test board
Whole packages are carried out to semiconductor plastic package band 8 after pushing, semiconductor plastic package band 8 forms cathode；
Stitching state, test electrode are connect by pushing up in the control of Shang Ding mechanism cylinder 404.5 with 8 pin of semiconductor plastic package band
Touching, in place after, for board to signal tester, tester pressurization carries out Insulation test, under certain parameter setting, if semiconductor is moulded
Strip of paper used for sealing band 8 is intact, and tester gives board non-defective unit signal, if semiconductor plastic package band 8 is not encapsulated completely, tester is bad to board
Product signal.
The traction device 5 includes traction track 501, is provided with a traction sliding shoe 502 on traction track 501, leads
Draw the traction belts 504 that sliding shoe 502 connects a longitudinal direction by a traction connector 503 of its bottom, traction belts 504
A traction electric machine 505 is connected, a traction support 506 is provided on the traction sliding shoe 502, draws and is set on support 506
It is equipped with a upward traction lifting cylinder 507, the telescopic end of traction lifting cylinder 507 connects a traction connection frame 508, leads
Drawing connection frame 508 includes that one piece of transverse slat 508.1 and one piece are located at the down-set riser 508.2 in 508.1 front end of transverse slat, wherein horizontal
The top of plate 508.1 is connected with longitudinal traction mechanism 509, and the front side of riser 508.2 is provided with the clamping of traction vertically upward
Cylinder 510, the traction mechanism 509 include longitudinally arranged draw bar 509.1, and the front end of the draw bar 509.1 is provided with
Upward hook 509.2, the rear end of the draw bar 509.1 are provided with upward pushing block 509.3, the draw bar 509.1
It is provided with longitudinal hollow part among leading portion, an oscillating rod 509.4 is provided in the hollow part, the oscillating rod 509.4
Middle part and the main body of the draw bar 509.1 of hollow part two sides are hinged, and the upper end of oscillating rod 509.4 is provided with a forward folder
Pawl 509.5 is held, the lower end of oscillating rod 509.4 and the telescopic end of traction gripper cylinder 510 are hinged.The traction device 5 further includes
Longitudinal traction drag chain 511, traction drag chain 511 and longitudinal traction drag chain guide rail 512 are cooperatively connected, traction drag chain 511 from
Traction support 506 is connected by end.
The traction method of the traction device 5:
Traction electric machine 505 acts, so that traction belts 504 will draw sliding shoe 502 and drive to front end, hook at this time
509.2 are located at the lower section for 8 back segment of semiconductor plastic package band tested in test device 4, and traction lifting cylinder 507 ejects,
So that hook 509.2 is inserted into the gap of 8 back segment of semiconductor plastic package band, the traction ejection of gripper cylinder 510 drives oscillating rod
509.4 rotations, then 8 end of semiconductor plastic package band is clamped and is stablized by gripper jaw 509.5, then the movement of traction electric machine 505 traction
Belt 504 will draw sliding shoe 502 and drive to rear end, until the semiconductor plastic package band 8 enters the rewinding runner of material collecting device 6
It in 601, then draws gripper cylinder 510 and retracts, traction lifting cylinder 507 retracts, and traction mechanism 509 drops to semiconductor modeling
8 lower section of strip of paper used for sealing band, then carries out the towage of next circulation again, and laggard in the entrance material collecting device 6 of semiconductor plastic package band 8
The subsequent rewinding operation of row, at this time if there is the semiconductor plastic package band 8 not promoted in the rewinding runner 601 of material collecting device 6
Waste material, then the pushing block 509.3 of traction mechanism 509 is by the waste material of the semiconductor plastic package band 8 to pusher.
The material collecting device 6, which is located on the middle section of rack 1 and is symmetrically arranged, two groups, with a rewinding in left side
For device 6, which is also symmetrical structure, and material collecting device 6 includes intermediate longitudinally arranged rewinding stream
Road 601, the front end of rewinding runner 601 connect leading stream road 602, and guide runner after the rear end connection of rewinding runner 601 is leading
The front end in stream road 602 and the rear end of the test runner 401.2 of test device 4 are close, the rear end of rewinding runner 601 and preceding guide
The front end of runner 602 is provided with guiding surface obliquely, and 601 middle part of rewinding runner is fixedly arranged above rewinding box
603, the lower section of 603 left and right sides of rewinding box is provided with the hoisting mechanism 604 for 8 lifting power of semiconductor plastic package band, described
Rewinding box 603 includes the corner post 603.1 of four 90 degree of flangings positioned at quadrangle, upper section between two corner posts 603.1 in front
It is connected with preceding connecting plate 603.2, upper section is connected with rear connecting plate 603.3, preceding connecting plate between two corner posts 603.1 at rear
603.2 and the medial surface of rear connecting plate 603.3 be provided with photoelectric sensor, the lower section of the corner post 603.1 to the left and
Right side is respectively arranged with the notch acted for hoisting mechanism 604, and the hoisting mechanism 604 includes being located at outside corner post 603.1
The hoisting mechanism support frame 604.1 of side-lower is provided with vertical hoisting mechanism track on the outside of hoisting mechanism support frame 604.1
604.2, hoisting mechanism sliding block 604.3, the stroke up and down of hoisting mechanism sliding block 604.3 are provided on hoisting mechanism track 604.2
With the matched of the notch of 603.1 lower section of corner post, two hoisting mechanism sliding blocks 604.3 in left side and two promotions on right side
The lifting plate 604.4 of a longitudinal direction is respectively arranged on mechanism sliding block 604.3, the middle part of the lifting plate 604.4 connects one
The telescopic end of upward hoisting mechanism cylinder 604.5, the lower end of hoisting mechanism cylinder 604.5 is fixed in rack 1, described to mention
Inside front ends, middle section and the rear end of lift slab 604.4 are respectively arranged with preceding lift lever, middle lift lever and rear promotion laterally inwardly
Bar, the preceding lift lever and rear lift lever are rectangular shaft, and the free end upper surface of the middle lift lever is provided with a notch shape
At step surface, matched of the setting of step surface due to the notch with 601 corresponding section of rewinding runner, the lifting plate
604.4 leading portion and back segment is respectively arranged with one group of unidirectional feeding distribution mechanism 605, and the unidirectional feeding distribution mechanism 605 includes depiler
Structure support 605.1, the feeding distribution mechanism support 605.1 are fixed on the upper surface of lifting plate 604.4, feeding distribution mechanism support 605.1
Upper to be hinged with cutting plate 605.3 laterally inwardly by pin shaft 605.2, it is outer that the upper surface of cutting plate 605.3 forms inner segment sinking
The flanging risen is held, which to form the limit that a step is used for 8 left and right sides of semiconductor plastic package band at flanging,
A supporting block 605.4, supporting block are provided on the feeding distribution mechanism support 605.1 of the underface of 605.3 inner segment of cutting plate
605.4 for free state under 605.3 gravity of cutting plate when the inner segment of cutting plate 605.3 is shelved so that at this time
Cutting plate 605.3 is in horizontality；That is the height of apical side height with pin shaft 605.2 of supporting block 605.4 is consistent；
The rewinding method of the material collecting device 6:
The semiconductor plastic package band 8 tested enters rewinding runner 601 by leading stream road 602, if the semiconductor
Plastic packaging band 8 is that then hoisting mechanism cylinder 604.5 acts qualified products, and hoisting mechanism cylinder 604.5 acts so that lifting plate
604.4 rise, and preceding lift lever, middle lift lever and the rear lift lever on lifting plate 604.4 are lifted respectively in rewinding runner 601
Semiconductor plastic package band 8 leading portion, middle section and back segment promoted so that semiconductor plastic package band 8 is whole, semiconductor plastic package band
When 8 promotion, the cutting plate 605.3 of unidirectional feeding distribution mechanism 605, cutting plate 605.3 are touched in 8 left and right edges of semiconductor plastic package band
It is rotated up around pin shaft 605.2 until vertical state, lifting plate 604.4 continue to rise, semiconductor plastic package band 8 continues to lift up directly
It is higher than the height of cutting plate 605.3 to semiconductor plastic package band 8, lifting plate 604.4 drops to original position, cutting plate 605.3 at this time
Since gravity is also rotated down around pin shaft 605.2 until horizontality, the semiconductor plastic package band 8 promoted up before
Bottom is held on cutting plate 605.3, repeat above-mentioned process until semiconductor plastic package band 8 rewinding is extremely in rewinding box 603
Certain altitude, the photoelectric sensor induction alarm in rewinding box 603, then need the semiconductor plastic package item of rewinding to certain altitude
Band 8 takes out；Hoisting mechanism cylinder 604.5 is failure to actuate if the semiconductor plastic package band 8 is not qualified products, is waited next
Hoisting mechanism cylinder 604.5 acts when semiconductor plastic package band 8 is qualified products, in the process underproof semiconductor plastic package
Band 8 is ejected backward by next semiconductor plastic package band 8 into rewinding runner 601, final underproof semiconductor modeling
Strip of paper used for sealing band 8 is collected by waste material collection device 7.
The waste material collection device 7 is located in the rack 1 at 6 rear of material collecting device, and the waste material collection device 7 includes waste material
Collection frame 701, garbage collection frame 701 are set in rack 1, and two groups of waste material guide plates 702 are provided in garbage collection frame 701,
Two groups of waste material guide plates 702 are located at the rear of the rear guide runner of material collecting device 6, and waste material guide plate 702 has a finger
Inclined-plane to the right, so that 8 waste material of semiconductor plastic package band into waste material guide plate 702 is fallen into garbage collection frame 701.
The above is only the specific application examples of the utility model, do not constitute any limit to the protection scope of the utility model
System.Any technical scheme formed by adopting equivalent transformation or equivalent replacement, all fall within the utility model rights protection scope it
It is interior.
Claims (6)
1. a kind of semiconductor plastic package band high-voltage isulation test system and test device, it is characterised in that test device (4) includes branch
Support mechanism (401), press mechanism (402) and Shang Ding mechanism (403), supporting mechanism (401) are used to support into test device
(4) the semiconductor plastic package band (8) in, press mechanism (402) will be for that will enter the semiconductor plastic package band in test device (4)
(8) it compresses, pushes up in Shang Ding mechanism (403) and contacted with semiconductor plastic package band (8), so that semiconductor plastic package band (8) is logical
Electricity carries out Insulation test.
2. a kind of semiconductor plastic package band high-voltage isulation test system and test device according to claim 1, feature exist
It include supporting mechanism bracket (401.1) in the supporting mechanism (401), supporting mechanism bracket (401.1) is fixed on rack (1)
On, longitudinal test runner (401.2) is provided on supporting mechanism bracket (401.1),
The press mechanism (402) includes press mechanism bracket (402.1), and press mechanism bracket (402.1) is fixed on rack (1)
On, vertical press mechanism sliding rail (402.2) is provided on press mechanism bracket (402.1), on press mechanism sliding rail (402.2)
It is provided with press mechanism lifting seat (402.3), press mechanism lifting seat (402.3) and a upward press mechanism cylinder
(402.4) telescopic end connection, the bottom of press mechanism cylinder (402.4) are fixed on rack (1), press mechanism lifting seat
(402.3) it is connected with test board mounting base (402.5) by connector to the right, the bottom of test board mounting base (402.5) connects
It is connected to test board (402.6), test board (402.6) electric signal connecting test instrument,
The Shang Ding mechanism (403) includes upper top mechanism rack (403.1), and upper top mechanism rack (403.1) is fixed on rack (1)
On, vertical Shang Ding mechanism sliding rail (403.2), Shang Ding mechanism sliding rail (403.2) are provided on upper top mechanism rack (403.1)
On be provided with Shang Ding mechanism lifting seat (403.3), electrode tip holder (403.4), electrode are provided on Shang Ding mechanism lifting seat (403.3)
Test electrode (403.6) is provided on seat (403.4)；Shang Ding mechanism lifting seat (403.3) and a upward Shang Ding mechanism gas
The telescopic end of cylinder (403.5) connects.
3. a kind of semiconductor plastic package band high-voltage isulation test system and test device according to claim 2, feature exist
There is the step of recess in the centre of test runner (401.2).
4. a kind of semiconductor plastic package band high-voltage isulation test system and test device according to claim 2, feature exist
In being equipped with lower collets (401.3) in test runner (401.2), interval is equipped with upper collets in test board (402.6)
(402.7)。
5. a kind of semiconductor plastic package band high-voltage isulation test system and test device according to claim 2, feature exist
The upper surface of test runner (401.2) is provided with location hole, test board (402.6) bottom is provided with downward pilot pin.
6. a kind of partly leading using semiconductor plastic package band high-voltage isulation test system and test device described in claim 1 assembling
Body plastic packaging band high-voltage isulation test macro.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108655017A (en) * | 2018-04-16 | 2018-10-16 | 江阴新基电子设备有限公司 | Semiconductor plastic package band high-voltage isulation test system and test device and its test method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108655017A (en) * | 2018-04-16 | 2018-10-16 | 江阴新基电子设备有限公司 | Semiconductor plastic package band high-voltage isulation test system and test device and its test method |
| CN108655017B (en) * | 2018-04-16 | 2024-02-06 | 江阴新基电子设备有限公司 | Testing device and testing method for semiconductor plastic sealing strip high-voltage insulation testing system |
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