CN108655017B - Testing device and testing method for semiconductor plastic sealing strip high-voltage insulation testing system - Google Patents

Testing device and testing method for semiconductor plastic sealing strip high-voltage insulation testing system Download PDF

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Publication number
CN108655017B
CN108655017B CN201810336311.3A CN201810336311A CN108655017B CN 108655017 B CN108655017 B CN 108655017B CN 201810336311 A CN201810336311 A CN 201810336311A CN 108655017 B CN108655017 B CN 108655017B
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China
Prior art keywords
traction
semiconductor plastic
test
sealing strip
testing
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CN201810336311.3A
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Chinese (zh)
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CN108655017A (en
Inventor
施文俊
陈慧峰
王忠华
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Jiangyin Ace Electronic Equipments Co ltd
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Jiangyin Ace Electronic Equipments Co ltd
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Priority to CN201810336311.3A priority Critical patent/CN108655017B/en
Publication of CN108655017A publication Critical patent/CN108655017A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02Measures preceding sorting, e.g. arranging articles in a stream orientating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • B07C5/361Processing or control devices therefor, e.g. escort memory
    • B07C5/362Separating or distributor mechanisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H1/00Supports or magazines for piles from which articles are to be separated
    • B65H1/04Supports or magazines for piles from which articles are to be separated adapted to support articles substantially horizontally, e.g. for separation from top of pile
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00Delivering or advancing articles from machines; Advancing articles to or into piles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H3/00Separating articles from piles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H31/00Pile receivers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00Feeding articles separated from piles; Feeding articles to machines
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • G01R31/1263Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
    • G01R31/129Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of components or parts made of semiconducting materials; of LV components or parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/10Handled articles or webs
    • B65H2701/19Specific article or web
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to a testing device of a semiconductor plastic seal strip high-voltage insulation testing system, which is characterized in that the testing device (4) comprises a supporting mechanism (401), a pressing mechanism (402) and an ejection mechanism (403), wherein the supporting mechanism (401) is used for supporting a semiconductor plastic seal strip (8) entering the testing device (4), the pressing mechanism (402) is used for pressing the semiconductor plastic seal strip (8) entering the testing device (4), and the ejection mechanism (403) is in contact with the semiconductor plastic seal strip (8) so as to enable the semiconductor plastic seal strip (8) to be electrified for insulation testing. The high-voltage insulation test system for the assembled semiconductor plastic sealing strip has the advantages of realizing automatic operation, reducing labor intensity of workers, improving production efficiency and reducing production cost of enterprises.

Description

Testing device and testing method for semiconductor plastic sealing strip high-voltage insulation testing system
Technical Field
The invention relates to a testing device and a testing method for a semiconductor plastic sealing strip high-voltage insulation testing system.
Background
The traditional insulation test of semiconductor plastic envelope strip is artifical material loading and puts into test station, and artifical pressfitting tests, and artifical unloading is received the material and is collected the waste material by the manual work, inefficiency, and workman intensity of labour is big, can not realize automated production, has reduced production efficiency, has improved the manufacturing cost of enterprise. Therefore, the semiconductor plastic seal strip high-voltage insulation test system and the test method thereof for realizing automatic operation, reducing the labor intensity of workers, improving the production efficiency and reducing the production cost of enterprises are particularly important.
Disclosure of Invention
The invention aims to overcome the defects and provide the semiconductor plastic seal strip high-voltage insulation test system test device which can be assembled into the semiconductor plastic seal strip high-voltage insulation test system for realizing automatic operation, reducing the labor intensity of workers, improving the production efficiency and reducing the production cost of enterprises.
The purpose of the invention is realized in the following way:
the utility model provides a semiconductor plastic seal strip high-voltage insulation test system testing arrangement, its characterized in that testing arrangement includes supporting mechanism, pushing down mechanism and top mechanism, and supporting mechanism is used for supporting the semiconductor plastic seal strip that gets into in the testing arrangement, and pushing down mechanism is used for compressing tightly the semiconductor plastic seal strip that gets into in the testing arrangement, and top mechanism top and semiconductor plastic seal strip contact to make the semiconductor plastic seal strip electric insulation test.
The supporting mechanism comprises a supporting mechanism bracket which is fixed on the frame and is provided with a longitudinal testing flow passage,
the pushing mechanism comprises a pushing mechanism support, the pushing mechanism support is fixed on the frame, a vertical pushing mechanism sliding rail is arranged on the pushing mechanism support, a pushing mechanism lifting seat is arranged on the pushing mechanism sliding rail, the pushing mechanism lifting seat is connected with the telescopic end of an upward pushing mechanism cylinder, the bottom of the pushing mechanism cylinder is fixed on the frame, the pushing mechanism lifting seat is connected with a test board mounting seat to the right side through a connecting piece, the bottom of the test board mounting seat is connected with a test board, and the test board is electrically connected with a tester,
the upper jacking mechanism comprises an upper jacking mechanism support, the upper jacking mechanism support is fixed on the frame, a vertical upper jacking mechanism sliding rail is arranged on the upper jacking mechanism support, an upper jacking mechanism lifting seat is arranged on the upper jacking mechanism sliding rail, an electrode seat is arranged on the upper jacking mechanism lifting seat, and a test electrode is arranged on the electrode seat; the lifting seat of the jacking mechanism is connected with the telescopic end of an upward cylinder of the jacking mechanism.
The middle of the test flow channel is provided with a concave step.
The test flow channel is internally embedded with a lower insulating block, and the test plate is internally embedded with an upper insulating block at intervals.
The upper surface of the test flow channel is provided with a positioning hole, and the bottom of the test plate is provided with a downward positioning needle.
The testing method of the testing device comprises the following steps:
in a normal state, placing the semiconductor plastic sealing strip into a runner, pressing down a test plate, and fully wrapping the semiconductor plastic sealing strip after the test plate is pressed down, wherein the semiconductor plastic sealing strip forms a negative electrode;
in a pressing state, the test electrode is controlled to be propped up by a cylinder of a propping mechanism and is contacted with a lead of the semiconductor plastic sealing strip in place, then the machine is used for pressing a signal tester, the tester is used for insulating test, under a certain parameter setting, if the semiconductor plastic sealing strip is intact, the tester is used for giving a machine good signal, and if the semiconductor plastic sealing strip is not completely encapsulated, the tester is used for giving a machine bad signal.
Compared with the prior art, the invention has the beneficial effects that:
the high-voltage insulation test system for the assembled semiconductor plastic sealing strip has the advantages of realizing automatic operation, reducing labor intensity of workers, improving production efficiency and reducing production cost of enterprises.
Drawings
Fig. 1 is a schematic diagram of a semiconductor plastic package strip high voltage insulation test system.
Fig. 2 is an exploded view of fig. 1.
Fig. 3 is a schematic diagram of the cooperation of the frame and the feeding device.
Fig. 4 is a schematic view of the semiconductor plastic sealing strip in the feeding device in a low position.
Fig. 5 is a schematic diagram of two switching states of a cartridge in a loading device.
Fig. 6 is a schematic view of the semiconductor plastic sealing strip in the feeding device in a high position.
Fig. 7 is a schematic diagram of the upper structure of the feeding device.
Fig. 8 is an exploded view of fig. 7.
Fig. 9 is a schematic view of the lower structure of the feeding device.
Fig. 10 is an exploded view of fig. 9.
Fig. 11 is a schematic view of a dispensing device.
Fig. 12 is an exploded view of fig. 11.
FIG. 13 is a schematic diagram of a test apparatus.
FIG. 14 is a schematic view of a supporting mechanism of the testing device.
Fig. 15 is a schematic view of a pressing mechanism of the testing device.
Fig. 16 is an exploded view of fig. 15.
FIG. 17 is a schematic diagram of a jack up mechanism of the test apparatus.
Fig. 18 is an exploded view of fig. 17.
Fig. 19 is a schematic view of a traction device.
Fig. 20 is an exploded view of fig. 19.
Fig. 21 is a schematic view of a traction mechanism of the traction device.
Fig. 22 is a schematic view of the traction device in a traction gripping cylinder extended state.
Fig. 23 is a schematic view of the traction device in a traction gripping cylinder retracted state.
Fig. 24 is a schematic view of a receiving device.
Fig. 25 is an exploded view of fig. 24.
Fig. 26 is a schematic diagram of a unidirectional feed mechanism of the receiving device.
Fig. 27 is an exploded view of fig. 26.
Fig. 28 is a schematic view of a waste collection device.
Fig. 29 is a positional relationship diagram of the scrap collecting device and the collecting device.
Wherein:
frame 1, frame channel 101, guide bar 102, guide bar fixing base 103, and frame connecting hole 104
The feeding device 2, the feeding device frame 201, the connecting rod 202, the bin track 203, the bin moving seat 204, the bin 205, the bin fixing frame 206, the tightening cylinder seat 206.1, the tightening cylinder 206.2, the baffle rod 206.3, the tightening bolt 206.4, the bin moving limit seat 207, the vertical support 208, the feeding device servo motor 209, the feeding device supporting rod 210, the feeding device supporting seat 211, the feeding device rotating rod connecting seat 212, the feeding device rotating rod 213, the rotating connecting block 214, the lifting rod fixing seat 215, the lifting rod 216, the lifting plate 217, the gear 218 and the feeding device traversing cylinder 219
The device comprises a distributing device 3, a portal 301, a transverse guide rail 302, a distributing device drag chain installation seat 303, a distributing device motor 304, a distributing device drag chain 305, a transverse mechanism 306, a transverse mechanism limit switch 307, a distributing absorbing mechanism 308, a distributing absorbing cylinder 308.1, a distributing absorbing guide sleeve 308.2, a distributing absorbing guide rod 308.3, an upper connecting rod 308.4, a lower connecting plate 308.5 and a suction head 308.6
Test device 4, support mechanism 401, support mechanism support 401.1, test flow channel 401.2, lower insulation block 401.3, lower pressing mechanism 402, lower pressing mechanism support 402.1, lower pressing mechanism slide rail 402.2, lower pressing mechanism lifting seat 402.3, lower pressing mechanism cylinder 402.4, test board mounting seat 402.5, test board 402.6, upper insulation block 402.7, upper jacking mechanism 403, upper jacking mechanism support 403.1, upper jacking mechanism slide rail 403.2, upper jacking mechanism lifting seat 403.3, electrode seat 403.4, test electrode 403.6
Traction device 5, traction track 501, traction slider 502, traction connection 503, traction belt 504, traction motor 505, traction support 506, traction lift cylinder 507, traction connection 508, cross plate 508.1, riser 508.2, traction mechanism 509, traction bar 509.1, hook 509.2, push block 509.3, swing bar 509.4, grip pawl 509.5, traction grip cylinder 510, traction tow chain 511, traction tow chain guide 512
The material collecting device 6, the material collecting flow channel 601, the front material guiding flow channel 602, the material collecting box 603, the corner post 603.1, the front connecting plate 603.2, the rear connecting plate 603.3, the lifting mechanism 604, the lifting mechanism supporting frame 604.1, the lifting mechanism rail 604.2, the lifting mechanism sliding block 604.3, the lifting plate 604.4, the lifting mechanism cylinder 604.5, the unidirectional material distributing mechanism 605, the material distributing mechanism support 605.1, the pin shaft 605.2, the material distributing plate 605.3 and the supporting block 605.4
Waste collection device 7, waste collection frame 701, and guide plate 702
A semiconductor plastic sealing strip 8.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-29, the invention relates to a semiconductor plastic seal strip high-voltage insulation test system, which comprises a frame 1, a feeding device 2, a distributing device 3, a test device 4, a traction device 5, a receiving device 6 and a waste collection device 7; the feeding device 2, the distributing device 3, the testing device 4, the traction device 5, the receiving device 6 and the waste collecting device 7 are arranged on the frame 1;
wherein: a working method of a semiconductor plastic seal strip high-voltage insulation test system comprises the following steps:
the loading attachment 2 is used for depositing the semiconductor plastic seal strip 8 before the test, feed divider 3 is used for removing semiconductor plastic seal strip 8 in the loading attachment 2 to testing arrangement 4, testing arrangement 4 is used for the insulating test of semiconductor plastic seal strip 8, draw gear 5 is used for taking off semiconductor plastic seal strip 8 that insulating test ended from testing arrangement 4 to send into receiving device 6 with semiconductor plastic seal strip 8 that wherein satisfy insulating test requirement, and then receive the material to semiconductor plastic seal strip 8 that satisfies insulating test requirement through receiving device 6, wherein semiconductor plastic seal strip 8 that does not satisfy insulating test requirement is ejecting in order by follow-up semiconductor plastic seal strip 8 and send into waste collection device 7 and collect.
Preferably, the testing device 4, the traction device 5 and the material receiving device 6 are all provided with two groups in parallel.
The machine frame 1 is horizontally arranged, a machine frame channel 101 through which the semiconductor plastic sealing strip 8 in the feeding device 2 ascends is formed in the middle of the front section of the machine frame 1, a plurality of guide rods 102 for guiding the ascending semiconductor plastic sealing strip 8 are arranged at the inner ring of the machine frame channel 101, and the guide rods 102 are fixed on a guide rod fixing seat 103 positioned on the upper surface of the machine frame 1;
the feeding device 2 comprises a feeding device frame 201, the feeding device frame 201 is horizontally arranged below the frame 1, four upward connecting rods 202 which are uniformly arranged are arranged on the feeding device frame 201, the top ends of the four connecting rods 202 are respectively connected with four frame connecting holes 104 on the frame 1, a transverse bin track 203 is arranged on the upper surface of the feeding device frame 201, a bin moving seat 204 is arranged on the bin track 203, a bin fixing frame 206 is arranged on the bin moving seat 204, at least two bins 205 are arranged in the bin fixing frame 206 from left to right, a front side opening of the bin fixing frame 206 is provided with a bin opening tightening mechanism, the bin opening tightening mechanism comprises a tightening cylinder seat 206.1 arranged on the left side and the right side of the bin fixing frame 206, a forward tightening cylinder 206.2 is arranged on the tightening cylinder seat 206.1, a stop rod 206.3 is arranged at the front end of the tightening cylinder 206.2 towards the opening direction of the material box 205, a tightening bolt 206.4 is arranged on the stop rod 206.3, a bin moving limit seat 207 is respectively arranged on the upper surfaces of the left and right feeding device racks 201 of the bin moving seat 204, a vertical feeding device vertical bracket 208 is arranged below the feeding device racks 201, a feeding device servo motor 209 is arranged on the right side of the feeding device vertical bracket 208, a vertical feeding device supporting rod 210 is arranged on the left side of the feeding device vertical bracket 208, a feeding device supporting seat 211 on the left side is connected with the lower end of the feeding device supporting rod 210, a feeding device rotating rod connecting seat 212 is fixed on the feeding device supporting seat 211, an upward feeding device rotating rod 213 is arranged on the feeding device rotating rod connecting seat 212, a rotating connecting block 214 is sleeved on the feeding device rotating rod 213, the rotating connecting block 214 is connected with a lifting rod fixing seat 215, two lifting rods 216 are connected to the lifting rod fixing seat 215, the top ends of the two lifting rods 216 are connected with a lifting plate 217, the power output end of the servo motor 209 is in power connection with a gear 218 at the lower end of the feeding device rotating rod 213, a transverse feeding device traversing cylinder 219 is arranged below the feeding device rack 201, and the piston rod end of the feeding device traversing cylinder 219 is connected with the bottom of the stock bin moving seat 204;
the distributing device 3 comprises a portal 301 crossing the front section of the frame 1, a transverse moving guide rail 302 and a distributing device drag chain installation seat 303 are arranged on a beam of the portal 301, the distributing device drag chain installation seat 303 is positioned above the transverse moving guide rail 302, a distributing device motor 304 is arranged behind the left section of the distributing device drag chain installation seat 303, a distributing device drag chain 305 is arranged at the rear side of the distributing device drag chain installation seat 303, a transverse moving mechanism 306 capable of performing transverse moving action on the transverse moving guide rail 302 is arranged on the transverse moving guide rail 302, the distributing device motor 304 is in power connection with the transverse moving mechanism 306, the free end of the distributing device drag chain 305 is connected with the transverse moving mechanism 306, a transverse moving mechanism limit switch 307 is respectively arranged at the left section and the rear section of the front side of the portal 301, the transverse moving mechanism 306 comprises a transverse moving seat 306.1, the transverse moving seat 306.1 is in sliding connection with the transverse moving guide rail 302, the traversing seat 306.1 is connected with a drag chain 305 of the distributing device, the traversing seat 306.1 is provided with a hanging bracket 306.2 in an up-down hanging manner, the traversing mechanism 306 is provided with a distributing and sucking mechanism 308 in a down-down manner, the distributing and sucking mechanism 308 comprises an upward distributing and sucking air cylinder 308.1, two distributing and sucking guide sleeves 308.2, two distributing and sucking guide rods 308.3, an upper connecting rod 308.4, a lower connecting plate 308.5 and a plurality of sucking heads 308.6, the distributing and sucking air cylinder 308.1 is positioned in the middle part of a supporting plate of the hanging bracket 306.2, two distributing and sucking guide sleeves 308.2 are positioned at the front side and the rear side of the distributing and sucking air cylinder 308.1, the two distributing and sucking guide rods 308.3 are respectively arranged in the two distributing and sucking guide sleeves 308.2 in a penetrating manner, the upper connecting rod 308.4 is connected with the upper ends of the two distributing and sucking guide rods 308.3 and the telescopic ends of the distributing and sucking air cylinder 308.1, the lower connecting plate 308.5 is connected with the lower ends of the two distributing and sucking guide rods 308.3, a plurality of suction heads 308.6 are arranged downwards on the bottom surface of the lower connecting plate 308.5; the suction head 308.6 is connected with an air extractor;
the testing device 4 is positioned on the front section of the frame 1 and is symmetrically arranged in two groups, taking one testing device 4 on the left side as an example, the testing device 4 comprises a supporting mechanism 401, a pressing mechanism 402 and an upper pushing mechanism 403, the supporting mechanism 401 is used for supporting the semiconductor plastic sealing strip 8 entering the testing device 4, the pressing mechanism 402 is used for pressing the semiconductor plastic sealing strip 8 entering the testing device 4, and the upper pushing mechanism 403 is used for pushing the upper pushing mechanism to contact with the semiconductor plastic sealing strip 8, so that the semiconductor plastic sealing strip 8 is electrified for insulation test;
the supporting mechanism 401 comprises a supporting mechanism bracket 401.1, the supporting mechanism bracket 401.1 is fixed on the frame 1, a longitudinal testing runner 401.2 is arranged on the supporting mechanism bracket 401.1, a concave step is arranged in the middle of the testing runner 401.2, the middle of the testing runner 401.2 is hollowed out, a lower insulating block 401.3 is embedded in the testing runner 401.2, a positioning hole is arranged on the upper surface of the testing runner 401.2,
the pressing mechanism 402 includes a pressing mechanism bracket 402.1, the pressing mechanism bracket 402.1 is fixed on the rack 1, the pressing mechanism bracket 402.1 is located at the distal end of the distributing device 3, a vertical pressing mechanism sliding rail 402.2 is disposed on the pressing mechanism bracket 402.1, a pressing mechanism lifting seat 402.3 is disposed on the pressing mechanism sliding rail 402.2, the pressing mechanism lifting seat 402.3 is connected with the telescopic end of an upward pressing mechanism cylinder 402.4, the bottom of the pressing mechanism cylinder 402.4 is fixed on the rack 1, the pressing mechanism lifting seat 402.3 is connected to the right side by a connecting piece with a test board mounting seat 402.5, the bottom of the test board mounting seat 402.5 is connected with a test board 402.6, the test board 402.6 is electrically connected with a tester, an upper insulating block 402.7 is embedded in the test board 402.6 at intervals, a downward positioning needle is disposed at the bottom of the test board 402.6, and the lower insulating block 401.3 and the upper insulating block 402.7 are used for wrapping the portion of the semiconductor sealing tape 8 that should be exposed to air in the testing process;
the jacking mechanism 403 includes a jacking mechanism bracket 403.1, the jacking mechanism bracket 403.1 is fixed on the frame 1, a vertical jacking mechanism sliding rail 403.2 is arranged on the jacking mechanism bracket 403.1, a jacking mechanism lifting seat 403.3 is arranged on the jacking mechanism sliding rail 403.2, an electrode seat 403.4 is arranged on the jacking mechanism lifting seat 403.3, and a test electrode 403.6 is arranged on the electrode seat 403.4; the lifting seat 403.3 of the jacking mechanism is connected with the telescopic end of an upward cylinder 403.5 of the jacking mechanism;
the test method of the test device 4 comprises the following steps:
in a normal state, the semiconductor plastic sealing strip 8 is placed into a runner by a suction head 308.6 of the distributing device 3, after the suction head 308.6 is removed, a test plate is pressed down, positioning on the test plate is used for guiding the semiconductor plastic sealing strip 8 to be subjected to insulation test, after the test plate is pressed down, the semiconductor plastic sealing strip 8 is fully wrapped, and the semiconductor plastic sealing strip 8 forms a negative electrode;
in the pressing state, the test electrode is controlled to be propped by the cylinder 404.5 of the propping mechanism and is contacted with the pin of the semiconductor plastic sealing strip 8, after the test electrode is in place, the machine supplies a signal tester, the tester is pressurized for insulation test, under a certain parameter setting, if the semiconductor plastic sealing strip 8 is intact, the tester supplies a machine good signal, and if the semiconductor plastic sealing strip 8 is not completely encapsulated, the tester supplies a machine bad signal.
The traction device 5 comprises a traction track 501, wherein a traction sliding block 502 is arranged on the traction track 501, the traction sliding block 502 is connected with a longitudinal traction belt 504 through a traction connecting piece 503 at the bottom of the traction sliding block, the traction belt 504 is connected with a traction motor 505, a traction support 506 is arranged on the traction sliding block 502, an upward traction lifting cylinder 507 is arranged on the traction support 506, the telescopic end of the traction lifting cylinder 507 is connected with a traction connecting frame 508, the traction connecting frame 508 comprises a transverse plate 508.1 and a vertical plate 508.2 which is arranged at the front end of the transverse plate 508.1 downwards, the top of the transverse plate 508.1 is connected with a longitudinal traction mechanism 509, the front side of the vertical plate 508.2 is provided with a vertical traction clamping cylinder 510, the traction mechanism 509 comprises a traction rod 509.1 which is longitudinally arranged, the front end of the traction rod 509.1 is provided with an upward hook 509.2, the rear end of the traction rod 509.1 is provided with an upward push block 509.3, the middle of the front section of the traction rod 509.1 is provided with a longitudinal hollow rod 509, the hollow rod 509 is arranged at the middle of the front section of the traction rod 509.1, the hollow rod 509 is provided with a hollow rod 509, the hollow rod 509 is hinged with the hollow rod 509, the hollow rod 509 is arranged at the two hollow rod 4 side 4 is hinged with the hollow rod 509, and the hollow rod 509 is hinged with the hollow rod 4, and the hollow rod 509 4 is hinged with the hollow rod 4. The traction device 5 further comprises a longitudinal traction drag chain 511, the traction drag chain 511 is in matched connection with a longitudinal traction drag chain guide rail 512, and the free end of the traction drag chain 511 is connected with a traction support 506.
The traction method of the traction device 5 comprises the following steps:
the traction motor 505 acts to enable the traction belt 504 to drive the traction sliding block 502 to the front end, at the moment, the hook 509.2 is positioned below the rear section of the semiconductor plastic sealing strip 8 tested in the testing device 4, the traction lifting cylinder 507 is ejected, the hook 509.2 is inserted into a gap of the rear section of the semiconductor plastic sealing strip 8, the traction clamping cylinder 510 ejects to drive the swinging rod 509.4 to rotate, then the clamping claw 509.5 clamps the end of the semiconductor plastic sealing strip 8 stably, then the traction motor 505 acts on the traction belt 504 to drive the traction sliding block 502 to the rear end until the semiconductor plastic sealing strip 8 enters the material collecting flow channel 601 of the material collecting device 6, then the traction clamping cylinder 510 is retracted, the traction lifting cylinder 507 is retracted, the traction mechanism 509 descends below the semiconductor plastic sealing strip 8, then the next round of traction operation is carried out, and the semiconductor plastic sealing strip 8 enters the material collecting device 6 and then the subsequent material collecting operation is carried out, at the moment, if the waste material of the semiconductor plastic sealing strip 8 is not lifted in the material collecting flow channel 601 of the material collecting device 6, the traction mechanism 509.3 pushes the waste material of the semiconductor plastic sealing strip 8 to the rear end.
The material receiving device 6 is positioned on the middle section of the frame 1 and is arranged in two groups in a bilateral symmetry way, taking one material receiving device 6 on the left side as an example, the material receiving device 6 is also in a bilateral symmetry structure, the material receiving device 6 comprises a material receiving runner 601 which is longitudinally arranged in the middle, the front end of the material receiving runner 601 is connected with a front material guiding runner 602, the rear end of the material receiving runner 601 is connected with a rear material guiding runner, the front end of the front material guiding runner 602 is close to the rear end of a test runner 401.2 of the test device 4, the rear end of the material receiving runner 601 and the front end of the front material guiding runner 602 are both provided with inclined downward guiding inclined planes, a material receiving box 603 is fixed above the middle part of the material receiving runner 601, a lifting mechanism 604 for lifting a semiconductor plastic sealing strip 8 is arranged below the left side and the right side of the material receiving box 603, the material receiving box 603 comprises four corner posts 603.1 which are positioned at ninety-degree folds, a front connecting plate 603.2 is connected between the front two corner posts 603.1, the upper section between the two rear corner posts 603.1 is connected with a rear connecting plate 603.3, the inner side surfaces of the front connecting plate 603.2 and the rear connecting plate 603.3 are respectively provided with a photoelectric sensor, the lower section of the corner post 603.1 is respectively provided with a notch for the lifting mechanism 604 to act, the lifting mechanism 604 comprises a lifting mechanism supporting frame 604.1 which is respectively positioned below the outer side of the corner post 603.1, a vertical lifting mechanism rail 604.2 is arranged outside the lifting mechanism supporting frame 604.1, a lifting mechanism sliding block 604.3 is arranged on the lifting mechanism rail 604.2, the upper and lower strokes of the lifting mechanism sliding blocks 604.3 are matched with the height of the notch of the lower section of the corner post 603.1, the left side two lifting mechanism sliding blocks 604.3 and the right side two lifting mechanism sliding blocks 604.3 are respectively provided with a longitudinal lifting plate 604.4, the middle part of the lifting plate 604.4 is connected with the telescopic end of an upward lifting mechanism cylinder 604.5, the lower end of a lifting mechanism cylinder 604.5 is fixed on a frame 1, the front end, the middle section and the rear end of the inner side of a lifting plate 604.4 are respectively provided with a front lifting rod, a middle lifting rod and a rear lifting rod which are transversely inwards, the front lifting rod and the rear lifting rod are rectangular rods, the upper surface of the free end of the middle lifting rod is provided with a notch to form a step surface, the step surface is provided with a limit for the left side and the right side of a semiconductor plastic belt 8 due to the height matching of the notch corresponding to a material collecting runner 601, the front section and the rear section of the lifting plate 604.4 are respectively provided with a group of unidirectional material distributing mechanisms 605, the unidirectional material distributing mechanisms 605 comprise material distributing mechanism supports 605.1, the material distributing mechanism supports 605.1 are fixed on the upper surface of the lifting plate 604.4, the material distributing mechanism supports 605.1 are hinged with transversely inwards material distributing plates 605.3 through pin shafts 605.2, the upper surface of the material distributing plates 605.3 form a folded edge of the inner section, the folded edge is formed at the step surface for limiting the left side and the right side of the semiconductor plastic belt 8, the material distributing mechanism 605.3 is arranged in a state of supporting the material distributing blocks 605.1.3 at the moment, and the material distributing mechanism supports 605.3 are arranged in a state of being in the horizontal state for supporting the material distributing plates 653; that is, the top surface of the supporting block 605.4 is consistent with the height of the pin shaft 605.2;
the receiving method of the receiving device 6 comprises the following steps:
the tested semiconductor plastic sealing strip 8 enters a receiving flow channel 601 through a front guide flow channel 602, if the semiconductor plastic sealing strip 8 is a qualified product, a lifting mechanism cylinder 604.5 acts, a lifting mechanism cylinder 604.5 acts to enable a lifting plate 604.4 to lift, a front lifting rod, a middle lifting rod and a rear lifting rod on the lifting plate 604.4 respectively lift the front section, the middle section and the rear section of the semiconductor plastic sealing strip 8 in the receiving flow channel 601, so that the semiconductor plastic sealing strip 8 is integrally lifted, when the semiconductor plastic sealing strip 8 is lifted, the left edge and the right edge of the semiconductor plastic sealing strip 8 touch a material distributing plate 605.3 of a unidirectional material distributing mechanism 605, the material distributing plate 605.3 rotates upwards around a pin shaft 605.2 until the vertical state, the lifting plate 604.4 continues to lift until the semiconductor plastic sealing strip 8 is higher than the height of the material distributing plate 605.3, at the moment, the lifting plate 604.4 descends to the original position, the material distributing plate 605.3 also rotates downwards around a pin shaft 605.2 due to the action of gravity until the horizontal state, the semiconductor plastic sealing strip 8 is lifted until the semiconductor plastic sealing strip 8 is placed at the bottom of the upper part of the semiconductor plastic sealing strip 8, the semiconductor plastic sealing strip 8 is received until the semiconductor plastic sealing strip is required to be received at the height of the receiving box 603, and the semiconductor plastic sealing strip 8 is recovered until the semiconductor plastic sealing strip is required to be recovered at the height of a certain level; if the semiconductor plastic sealing strip 8 is not a qualified product, the lifting mechanism cylinder 604.5 does not act, and when the next semiconductor plastic sealing strip 8 is a qualified product, the lifting mechanism cylinder 604.5 acts, in the process, the unqualified semiconductor plastic sealing strip 8 is ejected backwards by the next semiconductor plastic sealing strip 8 entering the material collecting flow passage 601, and finally the unqualified semiconductor plastic sealing strip 8 is collected by the waste collecting device 7.
The waste collection device 7 is located on the frame 1 behind the material receiving device 6, the waste collection device 7 comprises a waste collection frame 701, the waste collection frame 701 is arranged on the frame 1, two groups of waste guide plates 702 are arranged in the waste collection frame 701, the two groups of waste guide plates 702 are respectively located behind a rear material guide runner of the material receiving device 6, and the waste guide plates 702 are provided with an inclined plane pointing to the right lower side, so that the semiconductor plastic sealing strip 8 waste entering the waste guide plates 702 falls into the waste collection frame 701.
The foregoing is merely a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All technical schemes formed by equivalent transformation or equivalent substitution fall within the protection scope of the invention.

Claims (6)

1. The testing device of the semiconductor plastic seal strip high-voltage insulation testing system is characterized in that the testing device (4) comprises a supporting mechanism (401), a pressing mechanism (402) and an ejection mechanism (403), the supporting mechanism (401) is used for supporting the semiconductor plastic seal strip (8) entering the testing device (4), the pressing mechanism (402) is used for pressing the semiconductor plastic seal strip (8) entering the testing device (4), and the ejection mechanism (403) is in ejection contact with the semiconductor plastic seal strip (8), so that the semiconductor plastic seal strip (8) is electrified for insulation testing;
the supporting mechanism (401) comprises a supporting mechanism bracket (401.1), the supporting mechanism bracket (401.1) is fixed on the frame (1), a longitudinal test flow channel (401.2) is arranged on the supporting mechanism bracket (401.1),
the pressing mechanism (402) comprises a pressing mechanism bracket (402.1), the pressing mechanism bracket (402.1) is fixed on the frame (1), a vertical pressing mechanism sliding rail (402.2) is arranged on the pressing mechanism bracket (402.1), a pressing mechanism lifting seat (402.3) is arranged on the pressing mechanism sliding rail (402.2), the pressing mechanism lifting seat (402.3) is connected with the telescopic end of an upward pressing mechanism cylinder (402.4), the bottom of the pressing mechanism cylinder (402.4) is fixed on the frame (1), the right side of the pressing mechanism lifting seat (402.3) is connected with a test board mounting seat (402.5) through a connecting piece, the bottom of the test board mounting seat (402.5) is connected with a test board (402.6), the electrical signal of the test board (402.6) is connected with the tester,
the upper jacking mechanism (403) comprises an upper jacking mechanism bracket (403.1), the upper jacking mechanism bracket (403.1) is fixed on the frame (1), a vertical upper jacking mechanism sliding rail (403.2) is arranged on the upper jacking mechanism bracket (403.1), an upper jacking mechanism lifting seat (403.3) is arranged on the upper jacking mechanism sliding rail (403.2), an electrode seat (403.4) is arranged on the upper jacking mechanism lifting seat (403.3), and a test electrode (403.6) is arranged on the electrode seat (403.4); the lifting seat (403.3) of the jacking mechanism is connected with the telescopic end of an upward jacking mechanism cylinder (403.5);
the traction device is positioned below the testing device,
the traction device is used for taking down the semiconductor plastic package strip that insulation test ended from testing arrangement, traction device includes traction track, is provided with a traction sliding block on the traction track, and traction sliding block passes through a traction connecting piece of its bottom and connects a fore-and-aft traction belt, and traction belt connects a traction motor, be provided with a traction support on the traction sliding block, be provided with an ascending traction lift cylinder on the traction support, traction lift cylinder's flexible end is connected a traction link, and traction link includes a diaphragm and a riser that is located diaphragm front end and sets up downwards, and wherein the top of diaphragm is connected with fore-and-aft traction mechanism, and the front side of riser is provided with vertical ascending traction clamping cylinder, traction mechanism includes the traction lever of vertical arrangement, the front end of traction lever is provided with ascending hook, the rear end of traction lever is provided with ascending ejector pad, be provided with a swinging rod in this swinging rod in the middle part and the hollow place of traction lever, the middle part of swinging rod and the upper end of the articulated clamping jaw of the main part of the swinging rod, the swinging rod is provided with the front end of the articulated clamping jaw.
2. The test device for the semiconductor plastic sealing strip high-voltage insulation test system according to claim 1, wherein the middle of the test flow channel (401.2) is provided with a concave step.
3. The test device for the high-voltage insulation test system of the semiconductor plastic sealing strip according to claim 1, wherein the lower insulation blocks (401.3) are embedded in the test flow channel (401.2), and the upper insulation blocks (402.7) are embedded in the test plate (402.6) at intervals.
4. The testing device of the semiconductor plastic sealing strip high-voltage insulation testing system according to claim 1, wherein a positioning hole is formed in the upper surface of the testing runner (401.2), and a downward positioning needle is arranged at the bottom of the testing plate (402.6).
5. The test device of the semiconductor plastic sealing strip high-voltage insulation test system according to claim 1, characterized in that the test method of the test device (4) comprises the following steps:
in a normal state, the semiconductor plastic sealing strip (8) is placed in a test flow channel, a test plate is pressed down, the semiconductor plastic sealing strip (8) is fully wrapped after the test plate is pressed down, and the semiconductor plastic sealing strip (8) forms a negative electrode;
in a pressing state, a test electrode is controlled to be propped by a cylinder (403.5) of a propping mechanism and is contacted with pins of the semiconductor plastic sealing strip (8), after the pins are in place, the machine is used for providing a signal tester, the tester is pressurized for insulation test, under a certain parameter setting, if the semiconductor plastic sealing strip (8) is intact, the tester is used for providing a machine good signal, and if the semiconductor plastic sealing strip (8) is not completely encapsulated, the tester is used for providing a machine defective signal.
6. A semiconductor plastic sealing strip high-voltage insulation test system assembled by the semiconductor plastic sealing strip high-voltage insulation test system test device according to claim 1.
CN201810336311.3A 2018-04-16 2018-04-16 Testing device and testing method for semiconductor plastic sealing strip high-voltage insulation testing system Active CN108655017B (en)

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* Cited by examiner, † Cited by third party
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WO1992013762A1 (en) * 1991-01-31 1992-08-20 Krauss-Maffei Aktiengesellschaft Aircraft towing vehicle
CN201873029U (en) * 2010-11-23 2011-06-22 上海骏图电子科技有限公司 Subsequent packaging test device for plastic package surface-mounted diode
CN203858338U (en) * 2014-05-28 2014-10-01 深圳市麦肯机电有限公司 Fully automatic FPC electrical testing machine
KR20150110934A (en) * 2014-03-21 2015-10-05 (주)테크윙 Handler for semiconductor device test, tray supporting apparatus and connecting apparatus thereof
CN105904751A (en) * 2016-05-11 2016-08-31 浙江三维橡胶制品股份有限公司 Cloth traction mechanism of V belt cloth wrapping machine
CN205910296U (en) * 2016-07-29 2017-01-25 江阴亨德拉科技有限公司 Semiconductor device high voltage insulation detection device
CN208527357U (en) * 2018-04-16 2019-02-22 江阴新基电子设备有限公司 Semiconductor plastic package band high-voltage isulation test system and test device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992013762A1 (en) * 1991-01-31 1992-08-20 Krauss-Maffei Aktiengesellschaft Aircraft towing vehicle
CN201873029U (en) * 2010-11-23 2011-06-22 上海骏图电子科技有限公司 Subsequent packaging test device for plastic package surface-mounted diode
KR20150110934A (en) * 2014-03-21 2015-10-05 (주)테크윙 Handler for semiconductor device test, tray supporting apparatus and connecting apparatus thereof
CN203858338U (en) * 2014-05-28 2014-10-01 深圳市麦肯机电有限公司 Fully automatic FPC electrical testing machine
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