CN208521906U - A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing - Google Patents

A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing Download PDF

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Publication number
CN208521906U
CN208521906U CN201821330663.XU CN201821330663U CN208521906U CN 208521906 U CN208521906 U CN 208521906U CN 201821330663 U CN201821330663 U CN 201821330663U CN 208521906 U CN208521906 U CN 208521906U
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China
Prior art keywords
clamping
clamping jaw
encapsulating
solder joint
upside
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CN201821330663.XU
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Inventor
黄春跃
唐香琼
赵胜军
何伟
王建培
路良坤
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Guilin University of Electronic Technology
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Guilin University of Electronic Technology
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Abstract

The utility model discloses a kind of clamping devices for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, including the displacement of the direction miniature electrical grinding machine XZ and precision positioning mechanism, by sandwich piece XY direction clamping self-locking mechanism and supporting mechanism, on the side of the displacement of the direction miniature electrical grinding machine XZ and the fixed supporting mechanism of precision positioning mechanism, the centre of supporting mechanism is located at by the direction sandwich piece XY clamping self-locking mechanism.The device designs that miniature electrical grinding machine is accurate up and down, left and right positioning and clamping mechanism, not only can on device clamping chip, but also can polish chip welding spot, guarantee the quality polished.

Description

A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing
Technical field
The utility model relates to tooling and fixture technical field, specifically a kind of realization upside-down mounting welding core solder joint encapsulating and polishing Clamping device.
Background technique
With electronic product to miniaturization and functional diversities direction fast development, the Highgrade integration of electronic component and Micromation is hidden in solder joint failure reason below electronic element packaging body for analysis and increases difficulty.With electronic product plate electrode group For part, wherein the upside-down mounting welding cores device such as BGA/CSP of thin space occupies very big ratio, and solder joint is hidden in electronic component Below packaging body, to their solder joint failure analysis and the bad structure for determining to need to carry out butt welding point using the micro- dicing method of metallographic Form carries out deep dissection and thorough micro-analysis, and the basic reason and mechanism of failure are looked for this.Before the micro- slice of metallographic It needs to carry out chip device encapsulating to inlay and polish, in order to save material, time and the work for reducing polishing that encapsulating uses Amount carries out part encapsulating to hiding solder joint.Existing chip clamping device has a single function, and cannot realize that chip is clamped and beaten simultaneously Mill.
There are two the design studies purposes of this fixture: first is that clamping is provided when to the encapsulating of chip welding spot part, second is that wait fill Sealing carries out the solder joint rough grinding of next step after solidifying, in order to improve the grinding efficiency and quality of solder joint, chip is in original dress On folder, increase can the miniature electrical grinding machine mechanism arrangement of clamping be used to polish solder joint, the fine polishing to next step solder joint is continued to complete, It is prepared with obtaining clear microsection figure.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, and provide a kind of realization upside-down mounting welding core solder joint filling Envelope and the clamping device of polishing, the device have multi-functional, easy to operate, it can be achieved that chip clamping and polishing.
Realizing the technical solution of the utility model aim is:
A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, including the direction miniature electrical grinding machine XZ displacement and Precision positioning mechanism, by sandwich piece XY direction clamping self-locking mechanism and supporting mechanism, the direction miniature electrical grinding machine XZ displacement and accurate On the side of the fixed supporting mechanism of positioning mechanism, the centre of supporting mechanism is located at by the direction sandwich piece XY clamping self-locking mechanism.
The described direction the miniature electrical grinding machine XZ displacement and precision positioning mechanism, including two root posts, crossbeam, lifting screw, Drive disk, connecting plate, X are gone up and down to sliding block and Z-direction sliding block, the vertically symmetrical formula of two root posts is distributed, and crossbeam level is fixed at Two root posts and crossbeam are linked together by the top of two root posts, and Z-direction sliding block, two Z-direction slider tops are arranged in each column It is connected by connecting plate, the lower end of lifting screw is connect with connecting plate, and the upper end of lifting screw sequentially passes through in the middle part of crossbeam and rises Drop drive disk, two horizontal X be additionally provided between two root posts to mobile polished rod, X is located at X on mobile polished rod to sliding block, X to The lower end of sliding block is equipped with the flat folder of spring, and the flat folder of spring is equipped with miniature electrical grinding machine.
Described is surrounded square and is located at branch by the direction sandwich piece XY clamping self-locking mechanism, including 4 clamping jaws, 4 clamping jaws The centre of support mechanism, clamping jaw lower end are equipped with clamping jaw drive rod;
The supporting mechanism, including support frame and bottom plate are equipped with clamping jaw drive disk, support frame between support frame and bottom plate Horizontal and vertical central axes be equipped with and the matched clamping jaw installation position of clamping jaw, clamping jaw installation position be equipped with clamping jaw drive rod cunning Dynamic slot, clamping jaw pass through the sliding groove on support frame by clamping jaw drive rod and connect with clamping jaw drive disk.
The support frame is square support frame.
The utility model has the advantages that a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing provided by the utility model, The device designs that miniature electrical grinding machine is accurate up and down, left and right positioning and clamping mechanism, not only can on device clamping chip, Er Qieke To polish chip welding spot, guarantee the quality of polishing, has multi-functional, easy to operate, it can be achieved that chip clamping and polishing, are realized It polishes again after the encapsulating of part, more high efficiency and economy, there is certain application prospect.
Detailed description of the invention
Fig. 1 is a kind of entirety for the clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing of the utility model embodiment Structural schematic diagram;
Fig. 2 is the displacement of the utility model embodiment direction miniature electrical grinding machine XZ and precision positioning mechanism schematic diagram;
Fig. 3 is the utility model embodiment by the structural representation of the direction sandwich piece XY clamping self-locking mechanism and supporting mechanism Figure;
Fig. 4 is the structural schematic diagram of the utility model embodiment support frame;
Fig. 5 is the structural schematic diagram that the utility model embodiment clamping jaw is connect with clamping jaw drive disk;
In figure, the displacement of 1. directions miniature electrical grinding machine XZ and precision positioning mechanism 2. are by the direction sandwich piece XY clamping self-locking machine 3. supporting mechanism 1-1. lifting screw 1-2. of structure goes up and down drive disk 1-3. crossbeam 1-4. column 1-5. connecting plate 1-6. Z It is supported to sliding block 1-7.X to the flat folder 1-9. electrical grinding machine 2-1. clamping jaw 2-2. clamping jaw drive rod 3-1. of sliding block 1-8. spring Frame 3-2. shop bolt 3-3. bottom plate 3-4. clamping jaw drive disk 3-5. clamping jaw installation position 3-6. sliding groove.
Specific embodiment
The utility model is further elaborated with reference to the accompanying drawings and examples, but is not the limit to the utility model It is fixed.
Embodiment:
As shown in Figure 1, a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, including miniature electrical grinding machine XZ Direction is displaced with precision positioning mechanism 1, by the direction sandwich piece XY clamping self-locking mechanism 2 and supporting mechanism 3, the miniature electrical grinding machine side XZ To on the side of displacement and the fixed supporting mechanism 3 of precision positioning mechanism 1, branch is located at by the direction sandwich piece XY clamping self-locking mechanism 2 The centre of support mechanism 3.
As shown in Fig. 2, the direction the miniature electrical grinding machine XZ displacement and precision positioning mechanism 1, including two root posts 1-4, Crossbeam 1-3, lifting screw 1-1, lifting drive disk 1-2, connecting plate 1-5, X are to sliding block 1-7 and Z-direction sliding block 1-6, two root posts 1- 4 vertically symmetrical formulas distributions, crossbeam 1-3 level are fixed at the top of two root posts 1-4 for two root posts 1-4 and crossbeam 1-3 It is linked together, Z-direction sliding block 1-6 is set on each column 1-4, Z-direction sliding block 1-6 can be slided on column 1-4, and two Z-directions are sliding It is connected at the top of block 1-6 by connecting plate 1-5, the lower end of lifting screw 1-1 is connect with connecting plate 1-5, the upper end of lifting screw 1-1 It sequentially passes through in the middle part of crossbeam 1-1 and is additionally provided with two horizontal X between lifting drive disk 1-2, two root posts 1-4 to mobile polished rod 1-9, X are located at X on mobile polished rod 1-9 to sliding block 1-7, and X can be slided in X on mobile polished rod 1-9 to sliding block 1-7, and X is to cunning The lower end of block 1-7 is equipped with the flat folder 1-8 of spring, and the flat folder 1-8 of spring is equipped with miniature electrical grinding machine 1-10.
In use, the inner trapezoidal thread of the upper end lifting screw 1-1 and lifting drive disk 1-2 cooperate, the lower end lifting screw 1-1 It being connect with connecting plate 1-5, connecting plate 1-5 is connected with the Z-direction sliding block 1-6 of two sides using screw, under combination, connecting plate 1-5, Z To sliding block 1-6 and X to mobile polished rod 1-9 be one can be with the entirety of raising and lowering;Then Z-direction sliding block 1-6 is respectively and column 1-4 clearance fit is realized and is moved up and down;X forms a whole to sliding block 1-7, spring flat folder 1-8 and miniature electrical grinding machine 1-10, Moved in X on mobile polished rod 1-9, can be formed X to polishing move.When turn goes up and down drive disk 1-2, drive disk is gone up and down 1-2 drives lifting screw 1-1 rotation, and lifting screw 1-1 drives connecting plate 1-5 to move up and down, to promote Z-direction sliding block 1-6 mono- It rises and moves up and down, realize that miniature electrical grinding machine 1-10 realizes miniature electrical grinding machine 1- by the circle number of control rotation in the movement of Z-direction 10 Bit andits controls and accurate positionin, to achieve the purpose that different height chip of polishing.
As shown in figure 3, described by the direction sandwich piece XY clamping self-locking mechanism 2, including 4 clamping jaws 2-1,4 clamping jaw 2-1 The centre that square is located at supporting mechanism 3 is surrounded, the lower end clamping jaw 2-1 is equipped with clamping jaw drive rod 2-2;
The supporting mechanism 3, including support frame 3-1 and bottom plate 3-3, support frame 3-1 are fixed on by shop bolt 3-2 On bottom plate 3-3, clamping jaw drive disk 3-4, as shown in Figure 4, Figure 5, the cross of support frame 3-1 are equipped between support frame 3-1 and bottom plate 3-3 It is driven to being equipped with longitudinal central axis line with the matched clamping jaw installation position 3-5 of clamping jaw 2-1, clamping jaw installation position 3-5 equipped with clamping jaw The sliding groove 3-6 of bar 2-2, clamping jaw 2-1 pass through sliding groove 3-6 and clamping jaw driving on support frame 3-1 by clamping jaw drive rod 2-2 Disk 3-4 connection.Square spiral slot clearance fit on clamping jaw drive rod 2-2 and clamping jaw drive disk 3-4, the dove-tail form of clamping jaw 2-1 Installation position 3-5 on section and support frame 3-1, which is fitted close, realizes stable movement, by being rotated both clockwise and counterclockwise clamping jaw The adjustable four clamping jaw 2-1 of drive disk 3-4 are clamped chip, to realize chip portion in the movement of XY axis direction Divide encapsulating, while preparing for polishing chip.
The support frame 3-1 is square support frame.
The application designs miniature electrical grinding machine accurate upper and lower, left and right positioning and clamping mechanism on the basis of original chip clamping, Not only can on device clamping chip, but also can polish chip welding spot, guarantee the quality of polishing.

Claims (5)

1. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, which is characterized in that including miniature electrical grinding machine XZ Direction is displaced with precision positioning mechanism, by sandwich piece XY direction clamping self-locking mechanism and supporting mechanism, the direction miniature electrical grinding machine XZ On the side of displacement and the fixed supporting mechanism of precision positioning mechanism, by the direction sandwich piece XY, clamping self-locking mechanism is located at supporting mechanism Centre.
2. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 1, feature exist In, the direction the miniature electrical grinding machine XZ displacement and precision positioning mechanism, including two root posts, crossbeam, lifting screw, lifting drive Moving plate, connecting plate, X are to sliding block and Z-direction sliding block, and the vertically symmetrical formula of two root posts is distributed, and crossbeam level is fixed at two and stands Two root posts and crossbeam are linked together by the top of column, and Z-direction sliding block is arranged in each column, and two Z-direction slider tops pass through company Fishplate bar connection, the lower end of lifting screw are connect with connecting plate, and the upper end of lifting screw sequentially passes through in the middle part of crossbeam and lifting driving Disk is additionally provided with two horizontal X between two root posts to mobile polished rod, and X is located at X on mobile polished rod to sliding block, and X is to sliding block Lower end is equipped with the flat folder of spring, and the flat folder of spring is equipped with miniature electrical grinding machine.
3. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 1, feature exist In described to be surrounded square by the direction sandwich piece XY clamping self-locking mechanism, including 4 clamping jaws, 4 clamping jaws and be located at supporting mechanism Centre, clamping jaw lower end be equipped with clamping jaw drive rod.
4. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 1, feature exist In, the supporting mechanism, including support frame and bottom plate, clamping jaw drive disk, the cross of support frame are equipped between support frame and bottom plate The sliding of clamping jaw drive rod is equipped with the matched clamping jaw installation position of clamping jaw, clamping jaw installation position to being equipped with longitudinal central axis line Slot, clamping jaw pass through the sliding groove on support frame by clamping jaw drive rod and connect with clamping jaw drive disk.
5. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 4, feature exist In the support frame is square support frame.
CN201821330663.XU 2018-08-17 2018-08-17 A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing Active CN208521906U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821330663.XU CN208521906U (en) 2018-08-17 2018-08-17 A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821330663.XU CN208521906U (en) 2018-08-17 2018-08-17 A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037113A (en) * 2018-08-17 2018-12-18 桂林电子科技大学 A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing
CN111993306A (en) * 2020-08-14 2020-11-27 赵云 Polytypic anchor clamps are used in chip processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037113A (en) * 2018-08-17 2018-12-18 桂林电子科技大学 A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing
CN111993306A (en) * 2020-08-14 2020-11-27 赵云 Polytypic anchor clamps are used in chip processing

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