CN109037113A - A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing - Google Patents
A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing Download PDFInfo
- Publication number
- CN109037113A CN109037113A CN201810940857.XA CN201810940857A CN109037113A CN 109037113 A CN109037113 A CN 109037113A CN 201810940857 A CN201810940857 A CN 201810940857A CN 109037113 A CN109037113 A CN 109037113A
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- Prior art keywords
- clamping
- clamping jaw
- encapsulating
- solder joint
- upside
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- 238000005498 polishing Methods 0.000 title claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 title claims abstract description 20
- 238000006073 displacement reaction Methods 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004452 microanalysis Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Jigs For Machine Tools (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention discloses a kind of clamping devices for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, including the displacement of the direction miniature electrical grinding machine XZ and precision positioning mechanism, by sandwich piece XY direction clamping self-locking mechanism and supporting mechanism, on the side of the displacement of the direction miniature electrical grinding machine XZ and the fixed supporting mechanism of precision positioning mechanism, the centre of supporting mechanism is located at by the direction sandwich piece XY clamping self-locking mechanism.The device designs that miniature electrical grinding machine is accurate up and down, left and right positioning and clamping mechanism, not only can on device clamping chip, but also can polish chip welding spot, guarantee the quality polished.
Description
Technical field
The present invention relates to tooling and fixture technical field, specifically a kind of dress for realizing the encapsulating of upside-down mounting welding core solder joint and polishing
Clamp device.
Background technique
With electronic product to miniaturization and functional diversities direction fast development, the Highgrade integration of electronic component and
Micromation is hidden in solder joint failure reason below electronic element packaging body for analysis and increases difficulty.With electronic product plate electrode group
For part, wherein the upside-down mounting welding cores device such as BGA/CSP of thin space occupies very big ratio, and solder joint is hidden in electronic component
Below packaging body, to their solder joint failure analysis and the bad structure for determining to need to carry out butt welding point using the micro- dicing method of metallographic
Form carries out deep dissection and thorough micro-analysis, and the basic reason and mechanism of failure are looked for this.Before the micro- slice of metallographic
It needs to carry out chip device encapsulating to inlay and polish, in order to save material, time and the work for reducing polishing that encapsulating uses
Amount carries out part encapsulating to hiding solder joint.Existing chip clamping device has a single function, and cannot realize that chip is clamped and beaten simultaneously
Mill.
There are two the design studies purposes of this fixture: first is that clamping is provided when to the encapsulating of chip welding spot part, second is that wait fill
Sealing carries out the solder joint rough grinding of next step after solidifying, in order to improve the grinding efficiency and quality of solder joint, chip is in original dress
On folder, increase can the miniature electrical grinding machine mechanism arrangement of clamping be used to polish solder joint, the fine polishing to next step solder joint is continued to complete,
It is prepared with obtaining clear microsection figure.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide a kind of realization upside-down mounting welding core solder joint encapsulating and
The clamping device of polishing, the device have multi-functional, easy to operate, it can be achieved that chip clamping and polishing.
Realizing the technical solution of the object of the invention is:
A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, including the direction miniature electrical grinding machine XZ displacement and accurate
Positioning mechanism, by sandwich piece XY direction clamping self-locking mechanism and supporting mechanism, the displacement of the direction miniature electrical grinding machine XZ and be accurately positioned
On the side of the fixed supporting mechanism of mechanism, the centre of supporting mechanism is located at by the direction sandwich piece XY clamping self-locking mechanism.
The described direction the miniature electrical grinding machine XZ displacement and precision positioning mechanism, including two root posts, crossbeam, lifting screw,
Drive disk, connecting plate, X are gone up and down to sliding block and Z-direction sliding block, the vertically symmetrical formula of two root posts is distributed, and crossbeam level is fixed at
Two root posts and crossbeam are linked together by the top of two root posts, and Z-direction sliding block, two Z-direction slider tops are arranged in each column
It is connected by connecting plate, the lower end of lifting screw is connect with connecting plate, and the upper end of lifting screw sequentially passes through in the middle part of crossbeam and rises
Drop drive disk, two horizontal X be additionally provided between two root posts to mobile polished rod, X is located at X on mobile polished rod to sliding block, X to
The lower end of sliding block is equipped with the flat folder of spring, and the flat folder of spring is equipped with miniature electrical grinding machine.
Described is surrounded square and is located at branch by the direction sandwich piece XY clamping self-locking mechanism, including 4 clamping jaws, 4 clamping jaws
The centre of support mechanism, clamping jaw lower end are equipped with clamping jaw drive rod；
The supporting mechanism, including support frame and bottom plate are equipped with clamping jaw drive disk, the cross of support frame between support frame and bottom plate
The sliding of clamping jaw drive rod is equipped with the matched clamping jaw installation position of clamping jaw, clamping jaw installation position to being equipped with longitudinal central axis line
Slot, clamping jaw pass through the sliding groove on support frame by clamping jaw drive rod and connect with clamping jaw drive disk.
The support frame is square support frame.
The utility model has the advantages that a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing provided by the invention, the dress
Install that the miniature electrical grinding machine of meter is accurate up and down, left and right positioning and clamping mechanism, not only can on device clamping chip, but also can be right
Chip welding spot polishing, guarantees the quality of polishing, has multi-functional, easy to operate, it can be achieved that chip clamping and polishing, realize part
It polishes again after encapsulating, more high efficiency and economy, there is certain application prospect.
Detailed description of the invention
Fig. 1 is a kind of overall structure for the clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing of the embodiment of the present invention
Schematic diagram；
Fig. 2 is the displacement of the direction miniature electrical grinding machine XZ of the embodiment of the present invention and precision positioning mechanism schematic diagram；
Fig. 3 is the embodiment of the present invention by the structural schematic diagram of the direction sandwich piece XY clamping self-locking mechanism and supporting mechanism；
Fig. 4 is the structural schematic diagram of support frame of the embodiment of the present invention；
Fig. 5 is the structural schematic diagram that clamping jaw of the embodiment of the present invention is connect with clamping jaw drive disk；
In figure, the displacement of 1. directions miniature electrical grinding machine XZ and precision positioning mechanism 2. are by the direction sandwich piece XY clamping self-locking mechanism
3. supporting mechanism 1-1. lifting screw 1-2. goes up and down drive disk 1-3. crossbeam 1-4. column 1-5. connecting plate 1-
6. Z-direction sliding block 1-7.X is to the flat folder 1-9. electrical grinding machine 2-1. clamping jaw 2-2. clamping jaw drive rod of sliding block 1-8. spring
3-1. support frame 3-2. shop bolt 3-3. bottom plate 3-4. clamping jaw drive disk 3-5. clamping jaw installation position 3-6. sliding
Slot.
Specific embodiment
The present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
Embodiment:
As shown in Figure 1, a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, including the direction miniature electrical grinding machine XZ
It is displaced with precision positioning mechanism 1, by the direction sandwich piece XY clamping self-locking mechanism 2 and supporting mechanism 3, miniature electrical grinding machine XZ direction position
It moves and precision positioning mechanism 1 is fixed on the side of supporting mechanism 3, support machine is located at by the direction sandwich piece XY clamping self-locking mechanism 2
The centre of structure 3.
As shown in Fig. 2, the direction the miniature electrical grinding machine XZ displacement and precision positioning mechanism 1, including two root posts 1-4,
Crossbeam 1-3, lifting screw 1-1, lifting drive disk 1-2, connecting plate 1-5, X are to sliding block 1-7 and Z-direction sliding block 1-6, two root posts 1-
4 vertically symmetrical formulas distributions, crossbeam 1-3 level are fixed at the top of two root posts 1-4 for two root posts 1-4 and crossbeam 1-3
It is linked together, Z-direction sliding block 1-6 is set on each column 1-4, Z-direction sliding block 1-6 can be slided on column 1-4, and two Z-directions are sliding
It is connected at the top of block 1-6 by connecting plate 1-5, the lower end of lifting screw 1-1 is connect with connecting plate 1-5, the upper end of lifting screw 1-1
It sequentially passes through in the middle part of crossbeam 1-1 and is additionally provided with two horizontal X between lifting drive disk 1-2, two root posts 1-4 to mobile polished rod
1-9, X are located at X on mobile polished rod 1-9 to sliding block 1-7, and X can be slided in X on mobile polished rod 1-9 to sliding block 1-7, and X is to cunning
The lower end of block 1-7 is equipped with the flat folder 1-8 of spring, and the flat folder 1-8 of spring is equipped with miniature electrical grinding machine 1-10.
In use, the inner trapezoidal thread of the upper end lifting screw 1-1 and lifting drive disk 1-2 cooperate, the lower end lifting screw 1-1
It being connect with connecting plate 1-5, connecting plate 1-5 is connected with the Z-direction sliding block 1-6 of two sides using screw, under combination, connecting plate 1-5, Z
To sliding block 1-6 and X to mobile polished rod 1-9 be one can be with the entirety of raising and lowering；Then Z-direction sliding block 1-6 is respectively and column
1-4 clearance fit is realized and is moved up and down；X forms a whole to sliding block 1-7, spring flat folder 1-8 and miniature electrical grinding machine 1-10,
Moved in X on mobile polished rod 1-9, can be formed X to polishing move.When turn goes up and down drive disk 1-2, drive disk is gone up and down
1-2 drives lifting screw 1-1 rotation, and lifting screw 1-1 drives connecting plate 1-5 to move up and down, to promote Z-direction sliding block 1-6 mono-
It rises and moves up and down, realize that miniature electrical grinding machine 1-10 realizes miniature electrical grinding machine 1- by the circle number of control rotation in the movement of Z-direction
10 Bit andits controls and accurate positionin, to achieve the purpose that different height chip of polishing.
As shown in figure 3, described by the direction sandwich piece XY clamping self-locking mechanism 2, including 4 clamping jaws 2-1,4 clamping jaw 2-1
The centre that square is located at supporting mechanism 3 is surrounded, the lower end clamping jaw 2-1 is equipped with clamping jaw drive rod 2-2；
The supporting mechanism 3, including support frame 3-1 and bottom plate 3-3, support frame 3-1 are fixed on bottom plate by shop bolt 3-2
On 3-3, between support frame 3-1 and bottom plate 3-3 be equipped with clamping jaw drive disk 3-4, as shown in Figure 4, Figure 5, the transverse direction of support frame 3-1 and
Longitudinal central axis line, which is equipped with, is equipped with clamping jaw drive rod 2-2 with the matched clamping jaw installation position 3-5 of clamping jaw 2-1, clamping jaw installation position 3-5
Sliding groove 3-6, clamping jaw 2-1 by clamping jaw drive rod 2-2 pass through support frame 3-1 on sliding groove 3-6 and clamping jaw drive disk 3-4
Connection.Square spiral slot clearance fit on clamping jaw drive rod 2-2 and clamping jaw drive disk 3-4, the dove-tail form section of clamping jaw 2-1 and
Installation position 3-5 on support frame 3-1, which is fitted close, realizes stable movement, by being rotated both clockwise and counterclockwise clamping jaw drive disk
The adjustable four clamping jaw 2-1 of 3-4 are clamped chip in the movement of XY axis direction, to realize the encapsulating of chip part,
Prepare simultaneously for polishing chip.
The support frame 3-1 is square support frame.
The application designs miniature electrical grinding machine accurate upper and lower, left and right positioning and clamping mechanism on the basis of original chip clamping,
Not only can on device clamping chip, but also can polish chip welding spot, guarantee the quality of polishing.
Claims (5)
1. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing, which is characterized in that including miniature electrical grinding machine XZ
Direction is displaced with precision positioning mechanism, by sandwich piece XY direction clamping self-locking mechanism and supporting mechanism, the direction miniature electrical grinding machine XZ
On the side of displacement and the fixed supporting mechanism of precision positioning mechanism, by the direction sandwich piece XY, clamping self-locking mechanism is located at supporting mechanism
Centre.
2. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 1, feature exist
In, the direction the miniature electrical grinding machine XZ displacement and precision positioning mechanism, including two root posts, crossbeam, lifting screw, lifting drive
Moving plate, connecting plate, X are to sliding block and Z-direction sliding block, and the vertically symmetrical formula of two root posts is distributed, and crossbeam level is fixed at two and stands
Two root posts and crossbeam are linked together by the top of column, and Z-direction sliding block is arranged in each column, and two Z-direction slider tops pass through company
Fishplate bar connection, the lower end of lifting screw are connect with connecting plate, and the upper end of lifting screw sequentially passes through in the middle part of crossbeam and lifting driving
Disk is additionally provided with two horizontal X between two root posts to mobile polished rod, and X is located at X on mobile polished rod to sliding block, and X is to sliding block
Lower end is equipped with the flat folder of spring, and the flat folder of spring is equipped with miniature electrical grinding machine.
3. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 1, feature exist
In described to be surrounded square by the direction sandwich piece XY clamping self-locking mechanism, including 4 clamping jaws, 4 clamping jaws and be located at supporting mechanism
Centre, clamping jaw lower end be equipped with clamping jaw drive rod.
4. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 1, feature exist
In, the supporting mechanism, including support frame and bottom plate, clamping jaw drive disk, the cross of support frame are equipped between support frame and bottom plate
The sliding of clamping jaw drive rod is equipped with the matched clamping jaw installation position of clamping jaw, clamping jaw installation position to being equipped with longitudinal central axis line
Slot, clamping jaw pass through the sliding groove on support frame by clamping jaw drive rod and connect with clamping jaw drive disk.
5. a kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing according to claim 4, feature exist
In the support frame is square support frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810940857.XA CN109037113A (en) | 2018-08-17 | 2018-08-17 | A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810940857.XA CN109037113A (en) | 2018-08-17 | 2018-08-17 | A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109037113A true CN109037113A (en) | 2018-12-18 |
Family
ID=64630925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810940857.XA Pending CN109037113A (en) | 2018-08-17 | 2018-08-17 | A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109037113A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449689A (en) * | 2019-08-28 | 2019-11-15 | 桂林电子科技大学 | A kind of BGA solder joint welding fabrication auxiliary device |
| CN112036489A (en) * | 2020-08-31 | 2020-12-04 | 佛山市南海区广工大数控装备协同创新研究院 | PCB element positioning method based on welding spot color distribution |
| CN115008088A (en) * | 2022-08-05 | 2022-09-06 | 深圳市海纳鑫信息科技有限公司 | Miniature high-precision welding and defluxing integrated robot for chip production |
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| DE202006009437U1 (en) * | 2006-06-13 | 2006-08-31 | Hohenstein Vorrichtungsbau Und Spannsysteme Gmbh | Modular clamping jaw unit for workpieces and machine tables has interfitting criss cross and transverse ribbing on clamping faces with fixed and adjustable clamping jaws with tension screws |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449689A (en) * | 2019-08-28 | 2019-11-15 | 桂林电子科技大学 | A kind of BGA solder joint welding fabrication auxiliary device |
| CN112036489A (en) * | 2020-08-31 | 2020-12-04 | 佛山市南海区广工大数控装备协同创新研究院 | PCB element positioning method based on welding spot color distribution |
| CN115008088A (en) * | 2022-08-05 | 2022-09-06 | 深圳市海纳鑫信息科技有限公司 | Miniature high-precision welding and defluxing integrated robot for chip production |
| CN115008088B (en) * | 2022-08-05 | 2022-10-28 | 深圳市海纳鑫信息科技有限公司 | Miniature high-precision welding and defluxing integrated robot for chip production |
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