CN110449689A - A kind of BGA solder joint welding fabrication auxiliary device - Google Patents
A kind of BGA solder joint welding fabrication auxiliary device Download PDFInfo
- Publication number
- CN110449689A CN110449689A CN201910820863.6A CN201910820863A CN110449689A CN 110449689 A CN110449689 A CN 110449689A CN 201910820863 A CN201910820863 A CN 201910820863A CN 110449689 A CN110449689 A CN 110449689A
- Authority
- CN
- China
- Prior art keywords
- clamping
- solder joint
- auxiliary device
- printed circuit
- welding fabrication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000006073 displacement reaction Methods 0.000 claims abstract description 11
- 240000007643 Phytolacca americana Species 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of BGA solder joint welding fabrication auxiliary devices, including the clamping positioning mechanism for fixing printed circuit board level and are used to compressing bga chip into hold-down mechanism on a printed circuit, the top of clamping positioning mechanism is arranged in hold-down mechanism.The present invention first passes through the horizontal displacement that control clamps four clamping jaws of rotation drive counterclockwise and clockwise of driving disk, so that it is fixed to be clamped at printed circuit board between four clamping jaws；After printed circuit board is clamped and fixed, ball is planted in face on a printed circuit again, chip is placed on again on the tin ball planted, then knob is adjusted by command displacement and controls rotating cycle, lifting screw movement is driven, so that briquetting generates downwards or upwards accurate displacement and positioning under the action of lifting screw, chip is pressed on printed circuit board with realizing, then tin ball is heated by reflow welding stove, to realize the welding to chip.
Description
Technical field
The present invention relates to BGA welding technology field more particularly to a kind of BGA solder joint welding fabrication auxiliary devices.
Background technique
As bga device is widely used in actual circuit, BGA solder joint is as electrical connection, mechanical support and dissipates
The important function such as heat and be caused attention, in the Solder Joint of BGA, the i.e. structure parameters influence of solder joint solder soldering processes
Stress intensity, and then the service reliability of solder joint is affected, the form of solder joint during actual welding is controlled based on energy principle
To the service reliability important role for improving solder joint.
It is existing to be manually welded to chip on printed circuit board by the way of BGA but in laboratory research
When, it needs first to plant ball on a printed circuit, then chip is placed on tin ball again, compress chip downwards, and in printing electricity
Standard clearance gauge is placed between road plate and chip in the form of controlling the welding fabrication height of BGA solder joint to control solder joint.Operation
It is more complicated, cause chip welding effect bad, is badly in need of a kind of BGA solder joint welding fabrication auxiliary device to improve operating efficiency.
Summary of the invention
In view of this, chip is adopted with improving the object of the present invention is to provide a kind of BGA solder joint welding fabrication auxiliary device
Efficiency when being welded on printed circuit board with the mode of BGA.
The present invention solves above-mentioned technical problem by following technological means:
A kind of BGA solder joint welding fabrication auxiliary device, including for the clamping localization machine that printed circuit board level is fixed
Structure and for bga chip to be compressed hold-down mechanism on the printed circuit board, the hold-down mechanism is arranged in the clamping
The top of positioning mechanism；
The clamping positioning mechanism includes bottom support plate and the clamping positioning component that is arranged in bottom support plate, described
Clamping positioning component includes support base, the clamping driving disk and four circumferentially arrays for being rotatably installed in support base bottom
The clamping jaw being slidably mounted at the top of support base, the clamping drives and offers concentric vortex-like wire casing on disk upper surface, described
The bottom of clamping jaw is provided with the poke rod extended downwardly, and the bottom end of the poke rod is inserted into the vortex-like wire casing, described in rotation
Driving disk is clamped to drive four clamping jaws to slide on support base simultaneously；
The hold-down mechanism includes the top support plate being horizontally set on right above the support base and rotates straight down
The lifting screw being threaded through in the top support plate, the lower horizontal of the lifting screw be provided with for directly with BGA core
The briquetting of piece surface contact.
Further, the clamping jaw is T-block shape, offers below clamping jaw on the support base and matches with the clamping jaw
T shape sliding slot, the slot bottom of the T shape sliding slot is downward through offering the movable span extended along the shape track length direction T, described group
Lever protrudes into the vortex-like wire casing for clamping driving disk after passing through the movable span.
Further, the clamping jaw is provided with side plate on the side at support base center.
Further, the driving disk that clamps is rotatably installed in the bottom support plate by the shaft being arranged concentrically.
Further, the support base is square, and is equipped with vertical columns, the bottom of the vertical columns on four angles vertically
End is fixed in the bottom support plate, and the top support plate is fixed at the top of four vertical columns.
Further, the bottom of the support base is offered for accommodating the circular groove for clamping driving disk, described
The relief hole for facilitating manual toggle to clamp driving disk is offered on the surrounding side wall of circular groove.
Further, the tooth axially extending along clamping driving disk is evenly distributed on the lateral wall for clamping driving disk
Cord.
Further, fixing sleeve is equipped with adjustment of displacement knob on the lifting screw.
Further, the middle part boss edge of the T shape sliding slot is provided with the flange outwardly protruded, and the clamping jaw is in flange pair
Position is answered to be provided with the recess to match with the flange, the flange is located at setting in the recess.
Beneficial effects of the present invention: the present invention first passes through the rotation band counterclockwise and clockwise that control clamps driving disk
The horizontal displacement of dynamic four clamping jaws, so that it is fixed to be clamped at printed circuit board between four clamping jaws, clamping jaw cooperation can be real
Now various sizes of printed circuit board is clamped；After printed circuit board is clamped and fixed, then face on a printed circuit
Ball is planted, then chip is placed on the tin ball planted, knob is then adjusted by command displacement and controls rotating cycle, is driven
Lifting screw movement, so that briquetting generates downwards or upwards accurate displacement and positioning under the action of lifting screw, with reality
Now chip is pressed on printed circuit board, then tin ball is heated by reflow welding stove, to realize the welding to chip.
Assistant apparatus structure of the invention is simple, easy to operate, effectively improves manual welding chip in the lab
Efficiency, and the welding quality after chip welding fabrication can be effectively improved.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of BGA solder joint welding fabrication auxiliary device of the present invention；
Fig. 2 is the fit structure of clamping the driving disk and clamping jaw of a kind of BGA solder joint welding fabrication auxiliary device of the present invention
Schematic diagram；
Fig. 3 is a kind of structural schematic diagram one of the support base of BGA solder joint welding fabrication auxiliary device of the present invention；
Fig. 4 is a kind of structural schematic diagram two of the support base of BGA solder joint welding fabrication auxiliary device of the present invention；
Fig. 5 is the enlarged structure schematic diagram in Fig. 4 at A；
Fig. 6 is a kind of structural schematic diagram of the clamping jaw of BGA solder joint welding fabrication auxiliary device of the present invention；
Fig. 7 is a kind of structural schematic diagram of the clamping driving disk of BGA solder joint welding fabrication auxiliary device of the present invention.
Specific embodiment
Below with reference to the drawings and specific embodiments, the present invention is described in detail:
As shown in Fig. 1-Fig. 7, a kind of BGA solder joint welding fabrication auxiliary device of the invention, including be used for printed circuit
The fixed clamping positioning mechanism of plate level and for bga chip to be compressed hold-down mechanism on a printed circuit, hold-down mechanism
The top of clamping positioning mechanism is set；Clamping positioning mechanism includes bottom support plate 1 and the folder that is arranged in bottom support plate 1
Tight positioning component, clamp positioning component include support base 2, be rotatably installed in 2 bottom of support base clamping driving disk 3 and
Four circumferentially array be slidably mounted on the clamping jaw 4 at the top of support base 2, clamp offered on driving 3 upper surface of disk it is concentric
Vortex-like wire casing 5 clamps driving disk 3 and is rotatably installed in bottom support plate 1 by the shaft being arranged concentrically, the bottom of support base 2
Portion is offered for accommodating the circular groove 14 for clamping driving disk 3, is offered and is used on the surrounding side wall of circular groove 14
Manual toggle is facilitated to clamp the relief hole 15 of driving disk 3.The bottom of clamping jaw 4 is provided with the poke rod 6 extended downwardly, poke rod
6 bottom end is inserted into vortex-like wire casing 5, and rotation clamps driving disk 3 to drive four clamping jaws 4 to slide on support base 2 simultaneously；Pressure
Tight mechanism includes that the top support plate 7 for being horizontally set on 2 surface of support base and rotation straight down are threaded through top support plate 7
On lifting screw 8, the lower horizontal of lifting screw 8 is provided with the briquetting 9 for directly contacting with bga chip surface, goes up and down
Fixing sleeve is equipped with adjustment of displacement knob 17 on screw rod 8.
Specifically, clamping jaw 4 is T-block shape, it is sliding that the T shape matched with clamping jaw 4 is offered on support base 2 below clamping jaw 4
Slot 10, the slot bottom of T shape sliding slot 10 are worn downward through the movable span 11 extended along 10 length direction of T shape sliding slot, poke rod 6 is offered
It is protruded into the vortex-like wire casing 5 for clamping driving disk 3 after crossing movable span 11.When rotation clamps driving disk 3, vortex-like wire casing 5 is rotated
To push poke rod 6 to move, poke rod 6 drives clamping jaw 4 to slide in T shape sliding slot 10, to match clamping jaw 4 and T shape sliding slot 10
It closes even closer, the middle part boss edge of T shape sliding slot 10 is provided with the flange 18 outwardly protruded, clamping jaw 4 is corresponding in flange 18
Position is provided with the recess 19 to match with flange 18, and flange 18 is located at setting in recess 19.
For preferably with the contact of printed circuit board side, to preferably clamp printed circuit board, in clamping jaw 4 close to branch
It supports and is provided with side plate 12 on the side at 2 center of seat.
Specifically, support base 2 is square, vertical columns 13, the bottom end of vertical columns 13 are equipped on four angles vertically
It is fixed in bottom support plate 1, to support base 2 is fixed in bottom support plate 1, as shown in Figure 1, vertical columns 13
Top restraining position ring block is set, top support plate 7 is threaded through the top of four vertical columns 13, and bottom surface is in contact with stop collar,
To provide support to top support plate 7.
To stir clamping driving disk 3 convenient for finger, it is evenly distributed with edge on the lateral wall for clamping driving disk 3 and clamps
The tip surface item 16 for driving disk 3 axially extending.
In use, first passing through the water that control clamps four clamping jaws 4 of rotation drive counterclockwise and clockwise of driving disk 3
Prosposition moves, so that it is fixed to be clamped at printed circuit board between four clamping jaws 4, the cooperation of clamping jaw 4 be can be realized to different sizes
Printed circuit board be clamped；After printed circuit board is clamped and fixed, then ball is planted in face on a printed circuit, then by chip
It is placed on the tin ball planted, knob 17 is then adjusted by command displacement and controls rotating cycle, lifting screw 8 is driven to transport
It is dynamic so that briquetting 9 generates downwards or upwards accurate displacement and positioning under the induced effect of lifting screw 8, with realize by
Chip is pressed on printed circuit board, is then heated by reflow welding stove to tin ball, to realize the welding to chip.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair
It is bright to be described in detail, those skilled in the art should understand that, it can modify to technical solution of the present invention
Or equivalent replacement should all cover without departing from the objective and range of technical solution of the present invention in claim of the invention
In range.Technology not described in detail in the present invention, shape, construction portion are well-known technique.
Claims (9)
1. a kind of BGA solder joint welding fabrication auxiliary device, it is characterised in that: including for the folder that printed circuit board level is fixed
Tight positioning mechanism and for bga chip to be compressed hold-down mechanism on the printed circuit board, the hold-down mechanism setting exists
The top of the clamping positioning mechanism；
The clamping positioning mechanism includes the clamping positioning component of bottom support plate (1) and setting on bottom support plate (1), institute
Stating and clamping positioning component includes support base (2), clamping driving disk (3) and four for being rotatably installed in support base (2) bottom
Circumferentially array is slidably mounted on the clamping jaw (4) at the top of support base (2), and the clamping driving offers on disk (3) upper surface
Concentric vortex-like wire casing (5), the bottom of the clamping jaw (4) are provided with the poke rod (6) extended downwardly, the poke rod (6)
Bottom end is inserted into the vortex-like wire casing (5), rotates clamping driving disk (3) to drive four clamping jaw (4) In simultaneously
Support base slides on (2)；
The hold-down mechanism includes being horizontally set on the top support plate (7) right above the support base (2) and turning straight down
The dynamic lifting screw (8) being threaded through on the top support plate (7), the lower horizontal of the lifting screw (8), which is provided with, to be used for
The briquetting (9) directly contacted with bga chip surface.
2. a kind of BGA solder joint welding fabrication auxiliary device according to claim 1, it is characterised in that: the clamping jaw (4) is
T-block shape offers the T shape sliding slot (10) matched with the clamping jaw (4), institute below clamping jaw (4) on the support base (2)
The slot bottom of T shape sliding slot (10) is stated downward through offering the movable span (11) extended along T shape sliding slot (10) length direction, described group
Lever (6) protrudes into the vortex-like wire casing (5) for clamping driving disk (3) after passing through the movable span (11).
3. a kind of BGA solder joint welding fabrication auxiliary device according to claim 2, it is characterised in that: the clamping jaw (4) is leaned on
Side plate (12) are provided on the side at nearly support base (2) center.
4. a kind of BGA solder joint welding fabrication auxiliary device according to claim 3, it is characterised in that: the clamping driving
Disk (3) passes through the shaft being arranged concentrically and is rotatably installed on the bottom support plate (1).
5. a kind of BGA solder joint welding fabrication auxiliary device according to claim 4, it is characterised in that: the support base (2)
It is square, is equipped with vertically on four angles vertical columns (13), the bottom end of the vertical columns (13) is fixed at described
In bottom support plate (1), the top support plate (7) is fixed at the top of four vertical columns (13).
6. a kind of BGA solder joint welding fabrication auxiliary device according to claim 5, it is characterised in that: the support base (2)
Bottom offer for accommodate it is described clamp driving disk (3) circular groove (14), the surrounding of the circular groove (14)
The relief hole (15) for facilitating manual toggle to clamp driving disk (3) is offered on side wall.
7. a kind of BGA solder joint welding fabrication auxiliary device according to claim 6, it is characterised in that: the clamping driving
The tip surface item (16) axially extending along clamping driving disk (3) is evenly distributed on the lateral wall of disk (3).
8. a kind of BGA solder joint welding fabrication auxiliary device according to claim 7, it is characterised in that: the lifting screw
(8) fixing sleeve is equipped with adjustment of displacement knob (17) on.
9. a kind of BGA solder joint welding fabrication auxiliary device according to claim 6, it is characterised in that: the T shape sliding slot
(10) middle part boss edge is provided with the flange (18) outwardly protruded, and the clamping jaw (4) is arranged in flange (18) corresponding position
There is the recess (19) to match with the flange (18), the flange (18) is located at setting in the recess (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910820863.6A CN110449689A (en) | 2019-08-28 | 2019-08-28 | A kind of BGA solder joint welding fabrication auxiliary device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910820863.6A CN110449689A (en) | 2019-08-28 | 2019-08-28 | A kind of BGA solder joint welding fabrication auxiliary device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110449689A true CN110449689A (en) | 2019-11-15 |
Family
ID=68490385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910820863.6A Pending CN110449689A (en) | 2019-08-28 | 2019-08-28 | A kind of BGA solder joint welding fabrication auxiliary device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110449689A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702845A (en) * | 2020-12-21 | 2021-04-23 | 安徽展新电子有限公司 | Even liquid treatment facility of circuit board printing |
| CN113038733A (en) * | 2021-03-10 | 2021-06-25 | 梁健玲 | Welding equipment for assembling printed circuit board |
| CN114192925A (en) * | 2022-02-15 | 2022-03-18 | 南通中铁华宇电气有限公司 | Automatic tin device that brushes of core solder joint based on visual positioning |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2157203A (en) * | 1983-12-23 | 1985-10-23 | Yang Tai Her | Servo-clamping device |
| CN205763961U (en) * | 2016-07-11 | 2016-12-07 | 湖北新二机床有限公司 | A kind of chuck lathe of stable accuracy |
| CN106455361A (en) * | 2016-10-27 | 2017-02-22 | 江门市众能电控科技有限公司 | Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process |
| CN108213644A (en) * | 2018-01-18 | 2018-06-29 | 西安应用光学研究所 | A kind of auxiliary device of manual welding component |
| CN109037113A (en) * | 2018-08-17 | 2018-12-18 | 桂林电子科技大学 | A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing |
| CN210633079U (en) * | 2019-08-28 | 2020-05-29 | 桂林电子科技大学 | BGA solder joint welding shaping auxiliary device |
-
2019
- 2019-08-28 CN CN201910820863.6A patent/CN110449689A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2157203A (en) * | 1983-12-23 | 1985-10-23 | Yang Tai Her | Servo-clamping device |
| CN205763961U (en) * | 2016-07-11 | 2016-12-07 | 湖北新二机床有限公司 | A kind of chuck lathe of stable accuracy |
| CN106455361A (en) * | 2016-10-27 | 2017-02-22 | 江门市众能电控科技有限公司 | Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process |
| CN108213644A (en) * | 2018-01-18 | 2018-06-29 | 西安应用光学研究所 | A kind of auxiliary device of manual welding component |
| CN109037113A (en) * | 2018-08-17 | 2018-12-18 | 桂林电子科技大学 | A kind of clamping device for realizing the encapsulating of upside-down mounting welding core solder joint and polishing |
| CN210633079U (en) * | 2019-08-28 | 2020-05-29 | 桂林电子科技大学 | BGA solder joint welding shaping auxiliary device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702845A (en) * | 2020-12-21 | 2021-04-23 | 安徽展新电子有限公司 | Even liquid treatment facility of circuit board printing |
| CN113038733A (en) * | 2021-03-10 | 2021-06-25 | 梁健玲 | Welding equipment for assembling printed circuit board |
| CN113038733B (en) * | 2021-03-10 | 2023-04-14 | 梁健玲 | Welding equipment for assembling printed circuit board |
| CN114192925A (en) * | 2022-02-15 | 2022-03-18 | 南通中铁华宇电气有限公司 | Automatic tin device that brushes of core solder joint based on visual positioning |
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