CN106455361A - Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process - Google Patents

Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process Download PDF

Info

Publication number
CN106455361A
CN106455361A CN201610970534.6A CN201610970534A CN106455361A CN 106455361 A CN106455361 A CN 106455361A CN 201610970534 A CN201610970534 A CN 201610970534A CN 106455361 A CN106455361 A CN 106455361A
Authority
CN
China
Prior art keywords
circuit board
jaw
solder joint
joint distribution
stannum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610970534.6A
Other languages
Chinese (zh)
Inventor
陈松盛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen City Electric Control Technology Co Ltd
Original Assignee
Jiangmen City Electric Control Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangmen City Electric Control Technology Co Ltd filed Critical Jiangmen City Electric Control Technology Co Ltd
Priority to CN201610970534.6A priority Critical patent/CN106455361A/en
Publication of CN106455361A publication Critical patent/CN106455361A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/044Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Abstract

The invention discloses circuit board soldering spot distribution recognition type automatic tin immersion equipment. The equipment comprises a circuit board propelling mechanism, a circuit board clamping mechanism, a moving mechanism, a circuit board swing mechanism and a scanning recognition mechanism. The moving mechanism is used for moving a circuit board by lifting and/or rotating to the tin immersion position, the circuit board swing mechanism is used in a tin immersion process, and the scan recognition mechanism is used for scanning recognition of soldering spot distribution on the circuit board. The swing mechanism is controlled through contacts on two sides of the circuit board to enable the circuit board to automatically swing in the tin immersion process; the circuit board is controlled through the scan recognition mechanism to swing in a specific manner that one side, dense in soldering spot distribution, of the circuit board descends later and ascends first. Therefore, complete tin immersion of soldering spots on the side dense in soldering spot distribution can be realized in continuous vertical swing, the soldering spots can be uniformly covered with tin to make solidified tin on the soldering spots plump in appearance, and quality of circuit board products is improved.

Description

A kind of solder joint distribution of circuit board recognizes automatic wicking equipment and technique
Technical field
The present invention relates to the solder joint distribution identification of a kind of tin soldering equipment of circuit board and technique, more particularly to a kind of circuit board Automatic wicking equipment and technique.
Background technology
After part of the circuit board needed for installing, need to process completely through soldering process, wicking equipment is used Overall wicking is carried out in the circuit board to installing each part, as the solder joint on soldering machine is distributed for different circuit boards For different and traditional soldering machine be merely able to be placed on Xi Mianshang by circuit board and carry out scolding tin, this mode Scolding tin poor effect, defect rate is very high, have impact on working (machining) efficiency and effect, therefore, it is necessary to be further improved.
Content of the invention
Present invention seek to address that above-mentioned mentioned technical problem, provides a kind of solder joint distribution identification automatic infiltration of circuit board Stannum equipment and technique.
It is an object of the invention to realized by following technical scheme:A kind of solder joint distribution identification of circuit board is certainly Dynamic wicking equipment, includes the propulsive mechanism of circuit board, the clamping device of circuit board, circuit board by lifting and/or is rotated Mode move to the shift mechanism of wicking position, solder joint distribution on the rotatable mechaninism of circuit board and circuit board during wicking Scanning recognition mechanism;Clamping device includes the first jaw for being arranged on that circuit board advances path both sides, the first folder of both sides Pawl all can be toward and away from circuit board motion;It is provided with first jaw of both sides for the steering that controls rotatable mechaninism Contact;Scanning recognition mechanism determines the steering of rotation motor according to the solder joint distribution situation that scanning is arrived.
Preferably, scanning recognition mechanism includes light source, image-pickup device and image processing system, image processing system Outfan connection rotation motor.
Preferably, contact is provided in the signal circuit on the first jaw, can produce when signal circuit touches stannum face Change the control signal of the steering of rotatable mechaninism.
Preferably, shift mechanism includes the cantilever of the first jaw of connection, is provided with lifting motor on cantilever.
Preferably, the electric rotating machine that shift mechanism includes column and drives cantilever to rotate around column.
Preferably, rotatable mechaninism includes upper mounting plate and lower platform, is provided with jointed shaft between upper mounting plate and lower platform, under Platform can be rotated with respect to upper mounting plate around jointed shaft, and the upper wall surface of upper mounting plate is installed with rotation motor, the output of rotation motor Axle is hinged through upper mounting plate with lower platform;Upper mounting plate connecting cantilever, lower platform connects clamping device.
Preferably, propulsive mechanism includes the conveyer belt of the guide rail for being arranged on circuit board both sides and drive circuit board motion, The groove of accommodating first jaw is provided with guide rail.
Preferably, clamping device also includes the second jaw being arranged on circuit board propulsion path, and the second jaw being capable of court To with dorsad circuit board motion.
Preferably, the first jaw and the second jaw are by air cylinder driven.
Another object of the present invention is realized by following technical scheme:A kind of solder joint distribution identification of circuit board Automatic infiltration process of tin, circuit board is advanced by propulsive mechanism, and circuit board is stopped by scanning recognition mechanism in progradation To identify the closeer side of solder joint distribution in circuit board, after the completion of identification, circuit board continues propulsion;It is advanced to initial clamping position After putting, circuit board completes under the clamping of the first jaw and the second jaw to fix, then by elevating mechanism and rotating mechanism Circuit board is clamped to the top in stannum face;Elevating mechanism is coordinated to make the circuit board under heeling condition gradually by rotatable mechaninism afterwards Decline, the heeling condition be the sparse side of circuit board solder joint distribution under;Circuit board is first touched in the contact of lower side After stannum face, rotatable mechaninism rotation makes the contact of the side closeer in upper solder joint distribution of circuit board also touch stannum face, from And cause circuit board to need the part of wicking to be completely immersed in stannum face;Rotatable mechaninism continues rotation afterwards makes closeer one of solder joint distribution Side rises, and then rotatable mechaninism control board opposite side also rises so that circuit board returns to horizontal level and by elevating mechanism Rotating mechanism is coordinated to make circuit board return to initial clip position;First jaw and the second jaw unclamp, and circuit board is in pusher Continue propulsion under the driving of structure.
Beneficial effect is:Compared with prior art, a kind of automatic wicking of the solder joint distribution identification of circuit board of the present invention sets Standby and technique controls rotatable mechaninism to cause circuit board automatic rotation during wicking by the contact of circuit board both sides, passes through Scanning recognition mechanism carrys out the concrete rotation mode of control board and first rises for declining behind the closeer side of solder joint distribution, the side Solder joint being capable of abundant wicking and stannum can be uniformly covered on solder joint under continuous up and down rotation so that consolidating on solder joint Change stannum full appearance, so as to lift the quality of circuit board product.
Description of the drawings
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail, wherein:
Fig. 1 is the structural representation at the positive visual angle of automatic wicking equipment;
Fig. 2 is the structural representation at the lateral visual angle of automatic wicking equipment;
Fig. 3 is the partial structural diagram for accommodating mechanism in automatic wicking equipment.
Specific embodiment
Automatically the overall structure of wicking equipment has following examples:
Embodiment one
As shown in Figure 1-Figure 3, a kind of automatic wicking equipment of the solder joint distribution identification of circuit board, includes the propulsive mechanism of circuit board 1st, the clamping device 2 of circuit board, circuit board by lift and rotate by way of move to wicking position shift mechanism 3, leaching The rotatable mechaninism 4 of circuit board and scanning recognition mechanism during stannum;Clamping device 2 is included and is arranged on circuit board propulsion path First jaw 21 of both sides, the first jaw 21 of both sides all can be toward and away from circuit board motion;First jaw 21 of both sides On be provided with contact 22 for the steering for controlling rotatable mechaninism 4.Wherein contact 22 is provided in the letter on the first jaw 21 Number circuit, can produce the control signal of the steering for changing rotatable mechaninism 4, specially signal electricity when signal circuit touches stannum face Control the first jaw 21 of corresponding 22 side of contact to decline under the normality of road, form short circuit when signal circuit touches stannum face, letter Number circuit sending signal is initially dropped until to the rotation motor 44 of rotatable mechaninism 4, the first jaw 21 so as to control opposite side Its signal circuit touches stannum face, and now 2 control board of clamping device is integrally entered in stannum face.
Stannum face being contacted by contact 22 controls the method for operation of rotatable mechaninism 4 to enable to circuit board left side during soldering Right rotation, so that the stannum of liquid can flow and homogenization on the solder joint of circuit board so that energy after the stannum solidification of liquid Enough covering solder joints well so that the effect of automatic tin soldering is also better than the effect of manual scolding tin, in hgher efficiency, and whole mistake Journey achieves full automation, significant for the automatic batch soldering of realizing circuit board.
Solder joint on circuit board just can be found out before rotation is started by scanning recognition mechanism closeer side is distributed, Then the rotation that first goes up under being distributed behind closeer side using circuit board solder joint during actual rotation so that the solder joint of the side Being capable of abundant wicking and stannum can be uniformly covered on solder joint under continuous up and down rotation so that the solidification stannum on solder joint Full appearance, so as to lift the quality of circuit board product.
In actual operating process, as the first jaw 21 is touched behind stannum face, stannum solidification can be attached on contact 22, And contact 22 conventional be wiring, the stannum that wiring is easy to be cured is covered so that the contact bottom that is close to stannum face is not clever enough Quick, in production afterwards, contact need drop to so that unattached solidification stannum enter partly into stannum face after can just produce letter Number control rotation motor 44, this causes the precise decreasing of wicking.Thus there is further improvement, make the first jaw 21 become contact 22, the first jaw 21 is big compared with contact 22 with the contact area in stannum face, is difficult to after stannum solidification to be completely covered first and clamps 21 with stannum face Between contact surface, the first jaw 21 is divided into two sections of mutually isolated components, and two cross-talk parts connect the two ends of signal circuit respectively, After two cross-talk parts all touch stannum face, signal circuit path, send the signal of control rotation motor 44.Ensure that precision While simplifying structure.
Shift mechanism 3 in embodiment one has following examples:
Embodiment two
As depicted in figs. 1 and 2, shift mechanism 3 includes the cantilever 31 of the first jaw 21 of connection, is provided with lifting electricity on cantilever 31 Machine 32, lifting motor 32 is used for after clamping device 2 clamps circuit board, and circuit board is raised so as to leave initial clamping position Putting, enabling circuit board to enter stannum face while being additionally operable to decline circuit board after circuit board being moved to above stannum face.Shifting machine The electric rotating machine 34 that structure 3 also includes column 33 and drives cantilever 31 to rotate around column 33, cantilever 31 is spindle rotationally arranged in vertical On post 33, electric rotating machine 34 is used for driving cantilever 31 to rotate around column 33, while driving clamping device 2 and circuit board rotation.Rise Drop motor 32 and electric rotating machine 34 are to produce the streamline of circuit board as continuous-flow type due to propulsive mechanism 1 the reason for setting, need Circuit board on streamline is moved to the station beside streamline to be processed, after then machining, circuit board is moved Move and initial position is returned to, so as to ensure the seriality of circuit board batch machining, it is ensured that production efficiency.Electric rotating machine 34 drives cantilever 31 rotate around column 33, and cantilever 31 and clamping device 2 are fixedly connected with each other, and cantilever 31 drives clamping device 2 to rotate;Also set on cantilever 31 Lifting motor 32 is equipped with, lifting motor 32 connects clamping device 2 by shaft member, and clamping device 2 can be in the drive of lifting motor 32 Lift in shaft member under dynamic, while shaft member is used as the connector for driving the rotation of clamping device 2.
Rotatable mechaninism 4 in embodiment one has following examples
Embodiment three:
As depicted in figs. 1 and 2, rotatable mechaninism 4 includes upper mounting plate 41 and lower platform 42, sets between upper mounting plate 41 and lower platform 42 Jointed shaft 43 is equipped with, lower platform 42 can be rotated with respect to upper mounting plate 41 around jointed shaft 43, and the upper wall surface of upper mounting plate 41 is installed with Rotation motor 44, the output shaft of rotation motor 44 is hinged through upper mounting plate 41 with lower platform 42;41 connecting cantilever 31 of upper mounting plate, Lower platform 42 connects clamping device 2.Rotatable mechaninism 4 is used for co-operating contact 22 to complete the inclination control of circuit board.Jointed shaft 43 The surface of side contact 22 can be arranged on, so when side contact 22 touches stannum face, it is only necessary to control rotatable mechaninism 4 Opposite side contact 22 is made around the downward rotation of jointed shaft 43 to contact stannum face, it is not necessary to control elevating mechanism to move;Jointed shaft 43 surfaces that can also be arranged on 22 centre position of both sides contact, so when side contact 22 touches stannum face, rotation machine Structure 4 needs to coordinate elevating mechanism, during making the downward rotation contact stannum face in the contact 22 of opposite side, first to touch stannum face Contact 22 can keep the position for contacting with stannum face.
Upper mounting plate 41 connect embodiment two in cantilever 31, cantilever 31 rotate or lift can drive upper mounting plate 41 and lower put down Platform 42 is moved together, and lower platform 42 connects clamping device 2, and during rotation, upper mounting plate 41 is in horizontal load, and lower platform 42 is inclined simultaneously The first jaw 21 is driven to incline.
Propulsive mechanism 1 in embodiment one has following examples:
Example IV
As depicted in figs. 1 and 2, propulsive mechanism 1 include the guide rail 11 for being arranged on circuit board both sides and drive circuit board motion Conveyer belt, is provided with the groove 12 of accommodating first jaw 21 on guide rail 11, circuit board when initial clip position is introduced into, In one jaw, 21 equal displacement groove 12, such first jaw 21 will not be without stopping to circuit on the motion path of circuit board Plate, when circuit board advances to initial clip position, the first jaw 21 of circuit board both sides is drawn in towards circuit board, the first jaw 21 bottom is inclined towards circuit board, is easy to fixing circuit board.Propulsive mechanism 1 is also included for adjusting between two side rails 11 Spacing positioner, positioner can be the screw component of Motor drive or driven by shaking.The guide rail of different spacing 11 are used for coordinating various sizes of circuit board.
Clamping device 2 in embodiment one has following examples:
Embodiment five
As shown in figure 3, clamping device 2 also includes the second jaw 23 being arranged on circuit board propulsion path, 23 energy of the second jaw Enough toward and away from circuit board motion.First jaw 21 and the second jaw 23 are by air cylinder driven.First jaw 21 being capable of basis The adjustment of 11 spacing of guide rail carries out position adjustment simultaneously, so that the first jaw 21 of circuit board both sides can coordinate different chis Very little circuit board.Second jaw 23 is arranged on the rear that circuit board advances path, and the second jaw 23 is completed simultaneously in circuit board wicking After returning to initial clip position, dorsad the lifting of circuit board, so that circuit board can continue to move along propulsion path, often The second jaw 23 under state is that circuit board is blocked at the rear for carrying out in circuit board, this be in order to prevent circuit board from advancing to initially Continue to move to after clip position.
There are following examples in scanning recognition mechanism in embodiment one:
Embodiment six
Scanning recognition mechanism includes the light source being arranged on operating path of the circuit board under propulsive mechanism effect and image is taken the photograph Device is taken, also includes the image processing system that input connects image-pickup device;Light source and image-pickup device are preferably The lower section of circuit board, the bottom surface of light source and the equal directive circuit board of image-pickup device is arranged on, because bottom surface is wicking face, and The one side of observation solder joint distribution;Position sensor is preferable to provide in the position of light source and image-pickup device, for making to push away Enter when mechanism is advanced to observation bond pad locations circuit board and stop propulsion;Light source and image-pickup device are preferably installed in one On support, on the support, lifting assembly can be provided with, be conveniently adjusted the distance between image-pickup device and circuit board;Image Capturing apparatus include CCD chip or CMOS chip, and image-pickup device also includes camera lens;Image processing system is preferably wrapped Image digitazation module, Digital Image Processing module and intelligent decision decision-making module are included;The outfan of image processing system is even Connect rotation motor 44.The steering of the identification control rotation motor 44 being distributed by solder joint.Can protect in view of human assistance identification Card accuracy of identification, image-pickup device is connected with display, and operator controls turning for rotation motor 44 by observing display To, corresponding button can be turned to controlling by different, button includes at least two, for control board first under one End, the process of operational mode reference embodiment one afterwards.
Embodiment one to six combines and has, and rotation motor 44, lifting motor 32, electric rotating machine 34 are respectively connected with controller, Rotation motor 44, lifting motor 32, electric rotating machine 34 are the executable portion controlled by controller, position sensor and contact 22 For the sensing part of controller, controller is run according to following technological process for control board:Circuit board passes through pusher Structure 1 enters into the scanning area of scanning recognition mechanism and punishes position sensor, drives image-pickup device to catch on circuit board The picture of solder joint distribution, controls the steering of follow-up rotation electromechanics machine 44 by the signal that image processing system is exported;Complete pusher Enter mechanism 1 and continue advancing circuit plate to initial clip position and trigger position sensor, drive the first jaw 21 to coordinate second to press from both sides Pawl 23 clamps circuit board;Then the top that lifting motor 32 and electric rotating machine 34 are clamped to circuit board in stannum face is passed sequentially through;It Make circuit board in heeling condition by rotation motor 44 afterwards, the decline of 32 control board of lifting motor causes solder joint on circuit board The contact of the side that distribution is relatively dredged first contacts stannum face, and then 44 control board rotation of rotation motor causes solder joint on circuit board to divide The contact of the closeer side of cloth also contacts stannum face, so that the solder joint of circuit board is totally immersed into stannum face, afterwards by rotation electricity Machine 44 first lifts the closeer side of circuit board solder joint and lifts the thinner side of solder joint again, after returning to horizontal level and by lifting Motor 32 and electric rotating machine 34 make circuit board return to initial clip position;First jaw 21 and the second jaw 23 unclamp, circuit Plate continues propulsion under the driving of propulsive mechanism 1.
Circuit board needed the part of wicking to be sprayed-on fluxing agent before initial clip position is entered, and circuit board is being risen Drop motor 32 and electric rotating machine 34 are oven-dried preheated during moving to above stannum face from initial clip position.
Above example is only not limited in order to technical scheme to be described, all without departing from the present invention Any modification of spirit and scope or equivalent, which all should be covered in the range of technical solution of the present invention.

Claims (10)

1. a kind of solder joint distribution of circuit board recognizes automatic wicking equipment, it is characterised in that include the propulsive mechanism of circuit board (1), circuit board clamping device(2), circuit board moved to the shifting machine of wicking position by way of lifting and/or rotating Structure(3), during wicking circuit board rotatable mechaninism(4)And the scanning recognition mechanism that on circuit board, solder joint is distributed;Clamping machine Structure(2)Include the first jaw for being arranged on that circuit board advances path both sides(21), the first jaw of both sides(21)All being capable of court To with dorsad circuit board motion;First jaw of both sides(21)On be provided with for controlling rotatable mechaninism(4)Steering touch Point(22);Scanning recognition mechanism determines rotation motor according to the solder joint distribution situation that scanning is arrived(4)Steering.
2. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described Scanning recognition mechanism includes light source, image-pickup device and image processing system, the outfan connection pendulum of image processing system Rotating motor(4).
3. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described Contact(22)It is provided in the first jaw(21)On signal circuit, change rotation can be produced when signal circuit touches stannum face Mechanism(4)Steering control signal.
4. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described Shift mechanism(3)Include the first jaw of connection(21)Cantilever(31), cantilever(31)On be provided with lifting motor(32).
5. a kind of solder joint distribution of circuit board according to claim 4 recognizes automatic wicking equipment, it is characterised in that described Shift mechanism(3)Include column(33)With driving cantilever(31)Around column(33)The electric rotating machine of rotation(34).
6. a kind of solder joint distribution of circuit board according to claim 4 recognizes automatic wicking equipment, it is characterised in that described Rotatable mechaninism(4)Include upper mounting plate(41)And lower platform(42), upper mounting plate(41)And lower platform(42)Between be provided with hinged Axle(43), lower platform(42)Can be around jointed shaft(43)With respect to upper mounting plate(41)Rotate, upper mounting plate(41)Upper wall surface fixed There is rotation motor(44), rotation motor(44)Output shaft pass through upper mounting plate(41)With lower platform(42)It is hinged;Upper mounting plate (41)Connecting cantilever(31), lower platform(42)Connection clamping device(2).
7. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described Propulsive mechanism(1)Include the guide rail for being arranged on circuit board both sides(11)With the conveyer belt of drive circuit board motion, guide rail(11) On be provided with accommodating first jaw(21)Groove(12).
8. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described Clamping device(2)Also include the second jaw being arranged on circuit board propulsion path(23), the second jaw(23)Can direction and Dorsad circuit board motion.
9. a kind of solder joint distribution of circuit board according to claim 8 recognizes automatic wicking equipment, it is characterised in that described First jaw(21)With the second jaw(23)By air cylinder driven.
10. a kind of solder joint distribution of circuit board recognizes automatic infiltration process of tin, it is characterised in that circuit board passes through propulsive mechanism(1) Advanced, circuit board stops in progradation and identifies that by scanning recognition mechanism in circuit board, solder joint is distributed closeer one Side, after the completion of identification, circuit board continues propulsion;After being advanced to initial clip position, circuit board is in the first jaw(21)With second Jaw(23)Clamping under complete fix, then by elevating mechanism and rotating mechanism, circuit board is clamped to the top in stannum face; Pass through rotatable mechaninism afterwards(4)Elevating mechanism is coordinated to be gradually reduced the circuit board under heeling condition, the heeling condition is circuit The sparse side of plate solder joint distribution under;Circuit board is in the contact of lower side(22)After first touching stannum face, rotatable mechaninism (4)Rotation makes the contact of the side closeer in upper solder joint distribution of circuit board(22)Also stannum face is touched, so that circuit Plate needs the part of wicking to be completely immersed in stannum face;Rotatable mechaninism afterwards(4)Continuing rotation rises the closeer side of solder joint distribution, Then rotatable mechaninism(4)Control board opposite side also rises so that circuit board is returned to horizontal level and coordinated by elevating mechanism Rotating mechanism makes circuit board return to initial clip position;First jaw(21)With the second jaw(23)Unclamp, circuit board is being pushed away Enter mechanism(1)Driving under continue propulsion.
CN201610970534.6A 2016-10-27 2016-10-27 Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process Pending CN106455361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610970534.6A CN106455361A (en) 2016-10-27 2016-10-27 Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610970534.6A CN106455361A (en) 2016-10-27 2016-10-27 Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process

Publications (1)

Publication Number Publication Date
CN106455361A true CN106455361A (en) 2017-02-22

Family

ID=58180945

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610970534.6A Pending CN106455361A (en) 2016-10-27 2016-10-27 Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process

Country Status (1)

Country Link
CN (1) CN106455361A (en)

Similar Documents

Publication Publication Date Title
CN204807471U (en) Two -sided check out test set of circuit board
CN104990934A (en) Circuit board double-face detection equipment
JP5721072B2 (en) Component mounting apparatus, information processing apparatus, position detection method, and board manufacturing method
CN107159835B (en) A kind of automatic nut riveting device
CN108701620B (en) Electronic component processing unit
CN106455361A (en) Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process
CN206181589U (en) Solder joint of circuit board distributes and discerns automatic tin immersion equipment
CN108188527B (en) Tin soldering method for mobile power supply
KR102207774B1 (en) Device and method for detecting position, and method of manufacturing substrate
CN106583273A (en) Full-automatic CCD detection and exclusion equipment
KR101850808B1 (en) Electronic parts mounting device and method for producing electronic parts
CN1290397C (en) Parts installation device
CN206181588U (en) Automatic tin immersion equipment of circuit board
CN209773765U (en) water collector welding set
CN109590627B (en) Welding device and welding method for water pan
CN208051088U (en) A kind of tin soldering machine
CN106385773A (en) Automatic tin dipping equipment and automatic tin dipping process of circuit board
JP6009695B2 (en) Component mounting apparatus and component mounting method
KR100598459B1 (en) Chip bonding apparatus
KR101473470B1 (en) bonding apparatus for flexible pcb
CN202749662U (en) Automatic welding machine
JP3800671B2 (en) Object transfer device
CN212100866U (en) Novel plate feeding machine
CN209758485U (en) Unloader on panel of self-adaptation
JP2993311B2 (en) Welding equipment

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination