CN106455361A - Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process - Google Patents
Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process Download PDFInfo
- Publication number
- CN106455361A CN106455361A CN201610970534.6A CN201610970534A CN106455361A CN 106455361 A CN106455361 A CN 106455361A CN 201610970534 A CN201610970534 A CN 201610970534A CN 106455361 A CN106455361 A CN 106455361A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- jaw
- solder joint
- joint distribution
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses circuit board soldering spot distribution recognition type automatic tin immersion equipment. The equipment comprises a circuit board propelling mechanism, a circuit board clamping mechanism, a moving mechanism, a circuit board swing mechanism and a scanning recognition mechanism. The moving mechanism is used for moving a circuit board by lifting and/or rotating to the tin immersion position, the circuit board swing mechanism is used in a tin immersion process, and the scan recognition mechanism is used for scanning recognition of soldering spot distribution on the circuit board. The swing mechanism is controlled through contacts on two sides of the circuit board to enable the circuit board to automatically swing in the tin immersion process; the circuit board is controlled through the scan recognition mechanism to swing in a specific manner that one side, dense in soldering spot distribution, of the circuit board descends later and ascends first. Therefore, complete tin immersion of soldering spots on the side dense in soldering spot distribution can be realized in continuous vertical swing, the soldering spots can be uniformly covered with tin to make solidified tin on the soldering spots plump in appearance, and quality of circuit board products is improved.
Description
Technical field
The present invention relates to the solder joint distribution identification of a kind of tin soldering equipment of circuit board and technique, more particularly to a kind of circuit board
Automatic wicking equipment and technique.
Background technology
After part of the circuit board needed for installing, need to process completely through soldering process, wicking equipment is used
Overall wicking is carried out in the circuit board to installing each part, as the solder joint on soldering machine is distributed for different circuit boards
For different and traditional soldering machine be merely able to be placed on Xi Mianshang by circuit board and carry out scolding tin, this mode
Scolding tin poor effect, defect rate is very high, have impact on working (machining) efficiency and effect, therefore, it is necessary to be further improved.
Content of the invention
Present invention seek to address that above-mentioned mentioned technical problem, provides a kind of solder joint distribution identification automatic infiltration of circuit board
Stannum equipment and technique.
It is an object of the invention to realized by following technical scheme：A kind of solder joint distribution identification of circuit board is certainly
Dynamic wicking equipment, includes the propulsive mechanism of circuit board, the clamping device of circuit board, circuit board by lifting and/or is rotated
Mode move to the shift mechanism of wicking position, solder joint distribution on the rotatable mechaninism of circuit board and circuit board during wicking
Scanning recognition mechanism；Clamping device includes the first jaw for being arranged on that circuit board advances path both sides, the first folder of both sides
Pawl all can be toward and away from circuit board motion；It is provided with first jaw of both sides for the steering that controls rotatable mechaninism
Contact；Scanning recognition mechanism determines the steering of rotation motor according to the solder joint distribution situation that scanning is arrived.
Preferably, scanning recognition mechanism includes light source, image-pickup device and image processing system, image processing system
Outfan connection rotation motor.
Preferably, contact is provided in the signal circuit on the first jaw, can produce when signal circuit touches stannum face
Change the control signal of the steering of rotatable mechaninism.
Preferably, shift mechanism includes the cantilever of the first jaw of connection, is provided with lifting motor on cantilever.
Preferably, the electric rotating machine that shift mechanism includes column and drives cantilever to rotate around column.
Preferably, rotatable mechaninism includes upper mounting plate and lower platform, is provided with jointed shaft between upper mounting plate and lower platform, under
Platform can be rotated with respect to upper mounting plate around jointed shaft, and the upper wall surface of upper mounting plate is installed with rotation motor, the output of rotation motor
Axle is hinged through upper mounting plate with lower platform；Upper mounting plate connecting cantilever, lower platform connects clamping device.
Preferably, propulsive mechanism includes the conveyer belt of the guide rail for being arranged on circuit board both sides and drive circuit board motion,
The groove of accommodating first jaw is provided with guide rail.
Preferably, clamping device also includes the second jaw being arranged on circuit board propulsion path, and the second jaw being capable of court
To with dorsad circuit board motion.
Preferably, the first jaw and the second jaw are by air cylinder driven.
Another object of the present invention is realized by following technical scheme：A kind of solder joint distribution identification of circuit board
Automatic infiltration process of tin, circuit board is advanced by propulsive mechanism, and circuit board is stopped by scanning recognition mechanism in progradation
To identify the closeer side of solder joint distribution in circuit board, after the completion of identification, circuit board continues propulsion；It is advanced to initial clamping position
After putting, circuit board completes under the clamping of the first jaw and the second jaw to fix, then by elevating mechanism and rotating mechanism
Circuit board is clamped to the top in stannum face；Elevating mechanism is coordinated to make the circuit board under heeling condition gradually by rotatable mechaninism afterwards
Decline, the heeling condition be the sparse side of circuit board solder joint distribution under；Circuit board is first touched in the contact of lower side
After stannum face, rotatable mechaninism rotation makes the contact of the side closeer in upper solder joint distribution of circuit board also touch stannum face, from
And cause circuit board to need the part of wicking to be completely immersed in stannum face；Rotatable mechaninism continues rotation afterwards makes closeer one of solder joint distribution
Side rises, and then rotatable mechaninism control board opposite side also rises so that circuit board returns to horizontal level and by elevating mechanism
Rotating mechanism is coordinated to make circuit board return to initial clip position；First jaw and the second jaw unclamp, and circuit board is in pusher
Continue propulsion under the driving of structure.
Beneficial effect is：Compared with prior art, a kind of automatic wicking of the solder joint distribution identification of circuit board of the present invention sets
Standby and technique controls rotatable mechaninism to cause circuit board automatic rotation during wicking by the contact of circuit board both sides, passes through
Scanning recognition mechanism carrys out the concrete rotation mode of control board and first rises for declining behind the closeer side of solder joint distribution, the side
Solder joint being capable of abundant wicking and stannum can be uniformly covered on solder joint under continuous up and down rotation so that consolidating on solder joint
Change stannum full appearance, so as to lift the quality of circuit board product.
Description of the drawings
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail, wherein：
Fig. 1 is the structural representation at the positive visual angle of automatic wicking equipment；
Fig. 2 is the structural representation at the lateral visual angle of automatic wicking equipment；
Fig. 3 is the partial structural diagram for accommodating mechanism in automatic wicking equipment.
Specific embodiment
Automatically the overall structure of wicking equipment has following examples：
Embodiment one
As shown in Figure 1-Figure 3, a kind of automatic wicking equipment of the solder joint distribution identification of circuit board, includes the propulsive mechanism of circuit board
1st, the clamping device 2 of circuit board, circuit board by lift and rotate by way of move to wicking position shift mechanism 3, leaching
The rotatable mechaninism 4 of circuit board and scanning recognition mechanism during stannum；Clamping device 2 is included and is arranged on circuit board propulsion path
First jaw 21 of both sides, the first jaw 21 of both sides all can be toward and away from circuit board motion；First jaw 21 of both sides
On be provided with contact 22 for the steering for controlling rotatable mechaninism 4.Wherein contact 22 is provided in the letter on the first jaw 21
Number circuit, can produce the control signal of the steering for changing rotatable mechaninism 4, specially signal electricity when signal circuit touches stannum face
Control the first jaw 21 of corresponding 22 side of contact to decline under the normality of road, form short circuit when signal circuit touches stannum face, letter
Number circuit sending signal is initially dropped until to the rotation motor 44 of rotatable mechaninism 4, the first jaw 21 so as to control opposite side
Its signal circuit touches stannum face, and now 2 control board of clamping device is integrally entered in stannum face.
Stannum face being contacted by contact 22 controls the method for operation of rotatable mechaninism 4 to enable to circuit board left side during soldering
Right rotation, so that the stannum of liquid can flow and homogenization on the solder joint of circuit board so that energy after the stannum solidification of liquid
Enough covering solder joints well so that the effect of automatic tin soldering is also better than the effect of manual scolding tin, in hgher efficiency, and whole mistake
Journey achieves full automation, significant for the automatic batch soldering of realizing circuit board.
Solder joint on circuit board just can be found out before rotation is started by scanning recognition mechanism closeer side is distributed,
Then the rotation that first goes up under being distributed behind closeer side using circuit board solder joint during actual rotation so that the solder joint of the side
Being capable of abundant wicking and stannum can be uniformly covered on solder joint under continuous up and down rotation so that the solidification stannum on solder joint
Full appearance, so as to lift the quality of circuit board product.
In actual operating process, as the first jaw 21 is touched behind stannum face, stannum solidification can be attached on contact 22,
And contact 22 conventional be wiring, the stannum that wiring is easy to be cured is covered so that the contact bottom that is close to stannum face is not clever enough
Quick, in production afterwards, contact need drop to so that unattached solidification stannum enter partly into stannum face after can just produce letter
Number control rotation motor 44, this causes the precise decreasing of wicking.Thus there is further improvement, make the first jaw 21 become contact
22, the first jaw 21 is big compared with contact 22 with the contact area in stannum face, is difficult to after stannum solidification to be completely covered first and clamps 21 with stannum face
Between contact surface, the first jaw 21 is divided into two sections of mutually isolated components, and two cross-talk parts connect the two ends of signal circuit respectively,
After two cross-talk parts all touch stannum face, signal circuit path, send the signal of control rotation motor 44.Ensure that precision
While simplifying structure.
Shift mechanism 3 in embodiment one has following examples：
Embodiment two
As depicted in figs. 1 and 2, shift mechanism 3 includes the cantilever 31 of the first jaw 21 of connection, is provided with lifting electricity on cantilever 31
Machine 32, lifting motor 32 is used for after clamping device 2 clamps circuit board, and circuit board is raised so as to leave initial clamping position
Putting, enabling circuit board to enter stannum face while being additionally operable to decline circuit board after circuit board being moved to above stannum face.Shifting machine
The electric rotating machine 34 that structure 3 also includes column 33 and drives cantilever 31 to rotate around column 33, cantilever 31 is spindle rotationally arranged in vertical
On post 33, electric rotating machine 34 is used for driving cantilever 31 to rotate around column 33, while driving clamping device 2 and circuit board rotation.Rise
Drop motor 32 and electric rotating machine 34 are to produce the streamline of circuit board as continuous-flow type due to propulsive mechanism 1 the reason for setting, need
Circuit board on streamline is moved to the station beside streamline to be processed, after then machining, circuit board is moved
Move and initial position is returned to, so as to ensure the seriality of circuit board batch machining, it is ensured that production efficiency.Electric rotating machine 34 drives cantilever
31 rotate around column 33, and cantilever 31 and clamping device 2 are fixedly connected with each other, and cantilever 31 drives clamping device 2 to rotate；Also set on cantilever 31
Lifting motor 32 is equipped with, lifting motor 32 connects clamping device 2 by shaft member, and clamping device 2 can be in the drive of lifting motor 32
Lift in shaft member under dynamic, while shaft member is used as the connector for driving the rotation of clamping device 2.
Rotatable mechaninism 4 in embodiment one has following examples
Embodiment three：
As depicted in figs. 1 and 2, rotatable mechaninism 4 includes upper mounting plate 41 and lower platform 42, sets between upper mounting plate 41 and lower platform 42
Jointed shaft 43 is equipped with, lower platform 42 can be rotated with respect to upper mounting plate 41 around jointed shaft 43, and the upper wall surface of upper mounting plate 41 is installed with
Rotation motor 44, the output shaft of rotation motor 44 is hinged through upper mounting plate 41 with lower platform 42；41 connecting cantilever 31 of upper mounting plate,
Lower platform 42 connects clamping device 2.Rotatable mechaninism 4 is used for co-operating contact 22 to complete the inclination control of circuit board.Jointed shaft 43
The surface of side contact 22 can be arranged on, so when side contact 22 touches stannum face, it is only necessary to control rotatable mechaninism 4
Opposite side contact 22 is made around the downward rotation of jointed shaft 43 to contact stannum face, it is not necessary to control elevating mechanism to move；Jointed shaft
43 surfaces that can also be arranged on 22 centre position of both sides contact, so when side contact 22 touches stannum face, rotation machine
Structure 4 needs to coordinate elevating mechanism, during making the downward rotation contact stannum face in the contact 22 of opposite side, first to touch stannum face
Contact 22 can keep the position for contacting with stannum face.
Upper mounting plate 41 connect embodiment two in cantilever 31, cantilever 31 rotate or lift can drive upper mounting plate 41 and lower put down
Platform 42 is moved together, and lower platform 42 connects clamping device 2, and during rotation, upper mounting plate 41 is in horizontal load, and lower platform 42 is inclined simultaneously
The first jaw 21 is driven to incline.
Propulsive mechanism 1 in embodiment one has following examples：
Example IV
As depicted in figs. 1 and 2, propulsive mechanism 1 include the guide rail 11 for being arranged on circuit board both sides and drive circuit board motion
Conveyer belt, is provided with the groove 12 of accommodating first jaw 21 on guide rail 11, circuit board when initial clip position is introduced into,
In one jaw, 21 equal displacement groove 12, such first jaw 21 will not be without stopping to circuit on the motion path of circuit board
Plate, when circuit board advances to initial clip position, the first jaw 21 of circuit board both sides is drawn in towards circuit board, the first jaw
21 bottom is inclined towards circuit board, is easy to fixing circuit board.Propulsive mechanism 1 is also included for adjusting between two side rails 11
Spacing positioner, positioner can be the screw component of Motor drive or driven by shaking.The guide rail of different spacing
11 are used for coordinating various sizes of circuit board.
Clamping device 2 in embodiment one has following examples：
Embodiment five
As shown in figure 3, clamping device 2 also includes the second jaw 23 being arranged on circuit board propulsion path, 23 energy of the second jaw
Enough toward and away from circuit board motion.First jaw 21 and the second jaw 23 are by air cylinder driven.First jaw 21 being capable of basis
The adjustment of 11 spacing of guide rail carries out position adjustment simultaneously, so that the first jaw 21 of circuit board both sides can coordinate different chis
Very little circuit board.Second jaw 23 is arranged on the rear that circuit board advances path, and the second jaw 23 is completed simultaneously in circuit board wicking
After returning to initial clip position, dorsad the lifting of circuit board, so that circuit board can continue to move along propulsion path, often
The second jaw 23 under state is that circuit board is blocked at the rear for carrying out in circuit board, this be in order to prevent circuit board from advancing to initially
Continue to move to after clip position.
There are following examples in scanning recognition mechanism in embodiment one：
Embodiment six
Scanning recognition mechanism includes the light source being arranged on operating path of the circuit board under propulsive mechanism effect and image is taken the photograph
Device is taken, also includes the image processing system that input connects image-pickup device；Light source and image-pickup device are preferably
The lower section of circuit board, the bottom surface of light source and the equal directive circuit board of image-pickup device is arranged on, because bottom surface is wicking face, and
The one side of observation solder joint distribution；Position sensor is preferable to provide in the position of light source and image-pickup device, for making to push away
Enter when mechanism is advanced to observation bond pad locations circuit board and stop propulsion；Light source and image-pickup device are preferably installed in one
On support, on the support, lifting assembly can be provided with, be conveniently adjusted the distance between image-pickup device and circuit board；Image
Capturing apparatus include CCD chip or CMOS chip, and image-pickup device also includes camera lens；Image processing system is preferably wrapped
Image digitazation module, Digital Image Processing module and intelligent decision decision-making module are included；The outfan of image processing system is even
Connect rotation motor 44.The steering of the identification control rotation motor 44 being distributed by solder joint.Can protect in view of human assistance identification
Card accuracy of identification, image-pickup device is connected with display, and operator controls turning for rotation motor 44 by observing display
To, corresponding button can be turned to controlling by different, button includes at least two, for control board first under one
End, the process of operational mode reference embodiment one afterwards.
Embodiment one to six combines and has, and rotation motor 44, lifting motor 32, electric rotating machine 34 are respectively connected with controller,
Rotation motor 44, lifting motor 32, electric rotating machine 34 are the executable portion controlled by controller, position sensor and contact 22
For the sensing part of controller, controller is run according to following technological process for control board：Circuit board passes through pusher
Structure 1 enters into the scanning area of scanning recognition mechanism and punishes position sensor, drives image-pickup device to catch on circuit board
The picture of solder joint distribution, controls the steering of follow-up rotation electromechanics machine 44 by the signal that image processing system is exported；Complete pusher
Enter mechanism 1 and continue advancing circuit plate to initial clip position and trigger position sensor, drive the first jaw 21 to coordinate second to press from both sides
Pawl 23 clamps circuit board；Then the top that lifting motor 32 and electric rotating machine 34 are clamped to circuit board in stannum face is passed sequentially through；It
Make circuit board in heeling condition by rotation motor 44 afterwards, the decline of 32 control board of lifting motor causes solder joint on circuit board
The contact of the side that distribution is relatively dredged first contacts stannum face, and then 44 control board rotation of rotation motor causes solder joint on circuit board to divide
The contact of the closeer side of cloth also contacts stannum face, so that the solder joint of circuit board is totally immersed into stannum face, afterwards by rotation electricity
Machine 44 first lifts the closeer side of circuit board solder joint and lifts the thinner side of solder joint again, after returning to horizontal level and by lifting
Motor 32 and electric rotating machine 34 make circuit board return to initial clip position；First jaw 21 and the second jaw 23 unclamp, circuit
Plate continues propulsion under the driving of propulsive mechanism 1.
Circuit board needed the part of wicking to be sprayed-on fluxing agent before initial clip position is entered, and circuit board is being risen
Drop motor 32 and electric rotating machine 34 are oven-dried preheated during moving to above stannum face from initial clip position.
Above example is only not limited in order to technical scheme to be described, all without departing from the present invention
Any modification of spirit and scope or equivalent, which all should be covered in the range of technical solution of the present invention.
Claims (10)
1. a kind of solder joint distribution of circuit board recognizes automatic wicking equipment, it is characterised in that include the propulsive mechanism of circuit board
（1）, circuit board clamping device（2）, circuit board moved to the shifting machine of wicking position by way of lifting and/or rotating
Structure（3）, during wicking circuit board rotatable mechaninism（4）And the scanning recognition mechanism that on circuit board, solder joint is distributed；Clamping machine
Structure（2）Include the first jaw for being arranged on that circuit board advances path both sides（21）, the first jaw of both sides（21）All being capable of court
To with dorsad circuit board motion；First jaw of both sides（21）On be provided with for controlling rotatable mechaninism（4）Steering touch
Point（22）；Scanning recognition mechanism determines rotation motor according to the solder joint distribution situation that scanning is arrived（4）Steering.
2. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described
Scanning recognition mechanism includes light source, image-pickup device and image processing system, the outfan connection pendulum of image processing system
Rotating motor（4）.
3. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described
Contact（22）It is provided in the first jaw（21）On signal circuit, change rotation can be produced when signal circuit touches stannum face
Mechanism（4）Steering control signal.
4. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described
Shift mechanism（3）Include the first jaw of connection（21）Cantilever（31）, cantilever（31）On be provided with lifting motor（32）.
5. a kind of solder joint distribution of circuit board according to claim 4 recognizes automatic wicking equipment, it is characterised in that described
Shift mechanism（3）Include column（33）With driving cantilever（31）Around column（33）The electric rotating machine of rotation（34）.
6. a kind of solder joint distribution of circuit board according to claim 4 recognizes automatic wicking equipment, it is characterised in that described
Rotatable mechaninism（4）Include upper mounting plate（41）And lower platform（42）, upper mounting plate（41）And lower platform（42）Between be provided with hinged
Axle（43）, lower platform（42）Can be around jointed shaft（43）With respect to upper mounting plate（41）Rotate, upper mounting plate（41）Upper wall surface fixed
There is rotation motor（44）, rotation motor（44）Output shaft pass through upper mounting plate（41）With lower platform（42）It is hinged；Upper mounting plate
（41）Connecting cantilever（31）, lower platform（42）Connection clamping device（2）.
7. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described
Propulsive mechanism（1）Include the guide rail for being arranged on circuit board both sides（11）With the conveyer belt of drive circuit board motion, guide rail（11）
On be provided with accommodating first jaw（21）Groove（12）.
8. a kind of solder joint distribution of circuit board according to claim 1 recognizes automatic wicking equipment, it is characterised in that described
Clamping device（2）Also include the second jaw being arranged on circuit board propulsion path（23）, the second jaw（23）Can direction and
Dorsad circuit board motion.
9. a kind of solder joint distribution of circuit board according to claim 8 recognizes automatic wicking equipment, it is characterised in that described
First jaw（21）With the second jaw（23）By air cylinder driven.
10. a kind of solder joint distribution of circuit board recognizes automatic infiltration process of tin, it is characterised in that circuit board passes through propulsive mechanism（1）
Advanced, circuit board stops in progradation and identifies that by scanning recognition mechanism in circuit board, solder joint is distributed closeer one
Side, after the completion of identification, circuit board continues propulsion；After being advanced to initial clip position, circuit board is in the first jaw（21）With second
Jaw（23）Clamping under complete fix, then by elevating mechanism and rotating mechanism, circuit board is clamped to the top in stannum face；
Pass through rotatable mechaninism afterwards（4）Elevating mechanism is coordinated to be gradually reduced the circuit board under heeling condition, the heeling condition is circuit
The sparse side of plate solder joint distribution under；Circuit board is in the contact of lower side（22）After first touching stannum face, rotatable mechaninism
（4）Rotation makes the contact of the side closeer in upper solder joint distribution of circuit board（22）Also stannum face is touched, so that circuit
Plate needs the part of wicking to be completely immersed in stannum face；Rotatable mechaninism afterwards（4）Continuing rotation rises the closeer side of solder joint distribution,
Then rotatable mechaninism（4）Control board opposite side also rises so that circuit board is returned to horizontal level and coordinated by elevating mechanism
Rotating mechanism makes circuit board return to initial clip position；First jaw（21）With the second jaw（23）Unclamp, circuit board is being pushed away
Enter mechanism（1）Driving under continue propulsion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970534.6A CN106455361B (en) | 2016-10-27 | 2016-10-27 | Automatic tin dipping equipment and process for solder joint distribution identification of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970534.6A CN106455361B (en) | 2016-10-27 | 2016-10-27 | Automatic tin dipping equipment and process for solder joint distribution identification of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106455361A true CN106455361A (en) | 2017-02-22 |
| CN106455361B CN106455361B (en) | 2023-06-27 |
Family
ID=58180945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610970534.6A Active CN106455361B (en) | 2016-10-27 | 2016-10-27 | Automatic tin dipping equipment and process for solder joint distribution identification of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455361B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449689A (en) * | 2019-08-28 | 2019-11-15 | 桂林电子科技大学 | A kind of BGA solder joint welding fabrication auxiliary device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202447783U (en) * | 2012-03-05 | 2012-09-26 | 镇江苏润电子科技有限公司 | Scaling powder dipping device of semi-automatic tin immersion machine |
| CN204080080U (en) * | 2014-08-29 | 2015-01-07 | 东莞建冠塑胶电子有限公司 | A kind of novel wicking structure |
| CN204381597U (en) * | 2015-01-22 | 2015-06-10 | 杭州衡康电子有限公司 | Semi-automatic solder machine |
-
2016
- 2016-10-27 CN CN201610970534.6A patent/CN106455361B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202447783U (en) * | 2012-03-05 | 2012-09-26 | 镇江苏润电子科技有限公司 | Scaling powder dipping device of semi-automatic tin immersion machine |
| CN204080080U (en) * | 2014-08-29 | 2015-01-07 | 东莞建冠塑胶电子有限公司 | A kind of novel wicking structure |
| CN204381597U (en) * | 2015-01-22 | 2015-06-10 | 杭州衡康电子有限公司 | Semi-automatic solder machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449689A (en) * | 2019-08-28 | 2019-11-15 | 桂林电子科技大学 | A kind of BGA solder joint welding fabrication auxiliary device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106455361B (en) | 2023-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104990934A (en) | Circuit board double-face detection equipment | |
| CN107159835B (en) | A kind of automatic nut riveting device | |
| CN204807471U (en) | Two -sided check out test set of circuit board | |
| CN109332840B (en) | Intelligent welding system and method | |
| CN108701620B (en) | Electronic component processing unit | |
| CN104985299A (en) | Double-station automatic argon arc welding device based on CCD | |
| KR102207774B1 (en) | Device and method for detecting position, and method of manufacturing substrate | |
| CN108188527B (en) | Tin soldering method for mobile power supply | |
| CN201893321U (en) | BGA (ball grid array) chip repair device | |
| CN216819897U (en) | Cell-phone center outward appearance detection mechanism | |
| JPS63193595A (en) | Method and apparatus for soldering printed board assembly | |
| JP2863731B2 (en) | Electronic component mounting apparatus and method | |
| CN106455361A (en) | Circuit board soldering spot distribution recognition type automatic tin immersion equipment and process | |
| KR101473470B1 (en) | bonding apparatus for flexible pcb | |
| CN206181589U (en) | Solder joint of circuit board distributes and discerns automatic tin immersion equipment | |
| CN105323981B (en) | A kind of automatic insertion equipment of pcb board | |
| CN109590627B (en) | Welding device and welding method for water pan | |
| CN208051088U (en) | A kind of tin soldering machine | |
| CN106385773A (en) | Automatic tin dipping equipment and automatic tin dipping process of circuit board | |
| CN206643492U (en) | FPC bonding machines with multiple welding processing units | |
| CN211553801U (en) | Welding spot quality detection device | |
| US20200037478A1 (en) | Three-dimensional mounting device and three-dimensional mounting method | |
| CN206181588U (en) | Automatic tin immersion equipment of circuit board | |
| CN212113939U (en) | Formation and capacity grading integrated machine | |
| CN114654037A (en) | Tin-spraying ball welding equipment and tin-spraying ball welding production line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An automatic tin dipping equipment and process for recognizing the distribution of solder joints on circuit boards Effective date of registration: 20230818 Granted publication date: 20230627 Pledgee: Jiangmen Rural Commercial Bank Co.,Ltd. Jianghai central sub branch Pledgor: JIANGMEN ZHONGNENG ELECTRIC CONTROL TECHNOLOGY CO.,LTD. Registration number: Y2023980052817 |