CN208507659U - A kind of multi-chip cloth wire encapsulation construction again - Google Patents
A kind of multi-chip cloth wire encapsulation construction again Download PDFInfo
- Publication number
- CN208507659U CN208507659U CN201821020637.7U CN201821020637U CN208507659U CN 208507659 U CN208507659 U CN 208507659U CN 201821020637 U CN201821020637 U CN 201821020637U CN 208507659 U CN208507659 U CN 208507659U
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- China
- Prior art keywords
- chip
- face
- pin
- wiring layer
- encapsulation
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of multi-chip cloth wire encapsulation constructions again, including encapsulation matrix, chip and wiring layer, the fixing clip is inside card slot, the chip output setting is on the surface of the chip, and pad is provided with by the surface of chip, the end face of the chip is fixedly welded with pin by pad, the end face of the encapsulation matrix, which corresponds to, is welded with coating above chip, the end face of the coating corresponds to card slot and is internally provided with pressing plate, and the end face of pressing plate contacts setting with the surface of chip.Multi-chip cloth wire encapsulation construction again, having operative employee needs simply, it improves to being routed packaging efficiency between chip, improve the use fastness of pin connected to chip output, the advantages of keeping chip normal use solves existing complicated to chip wiring packaging process, the pin easy fracture connected to chip output, the problem of causing chip to lose using effect, influencing chip normal use.
Description
Technical field
The utility model relates to chip encapsulation technology field, specially a kind of multi-chip cloth wire encapsulation construction again.
Background technique
As chip functions become to become increasingly complex, I/O number is more and more, and Fan-in encapsulation has been unable to meet I/O and is fanned out to
Requirement, it is as follows for the Fan-out process flow of the encapsulation Infineon of core plate: chip is temporarily placed at wafer slide glass
On, using wafer level Shooting Technique, by chip buried moulding compound, curing mold plastics, then remove wafer slide glass, later to being embedded with
The moulding compound disk of chip carries out wafer scale technique, finally slice encapsulation, connects pin to chip output after encapsulation.
This complex operation seals chip since the output end on surface and chip of the pin after packaging body welds
Pin frequency of use is higher after dress, easily pin is caused to disconnect after long-time use, influences the normal use of chip.
Utility model content
The purpose of this utility model is to provide a kind of multi-chip cloth wire encapsulation construction again, having operative employee needs simple, mention
Height improves the use fastness of pin connected to chip output to packaging efficiency is routed between chip, keeps chip normal
It the advantages of use, solves existing complicated to chip wiring packaging process, to the pin easy fracture that chip output is connected, leads
The problem of causing chip to lose using effect, influence chip normal use.
To achieve the above object, the utility model provides the following technical solutions: a kind of multi-chip cloth wire encapsulation construction again, packet
Encapsulation matrix, chip and wiring layer are included, the wiring layer is arranged on the end face of encapsulation matrix, and the end face of wiring layer offers
Card slot corresponding with chip, inside card slot, the chip output is arranged on the surface of the chip the fixing clip,
And pad is provided with by the surface of chip, the end face of the chip is fixedly welded with pin, the pin by pad
Extend the side of encapsulation matrix in bending-like, the end face of the encapsulation matrix corresponds to and is welded with coating above chip, institute
The end face for stating coating corresponds to card slot and is internally provided with pressing plate, and the end face of pressing plate contacts setting with the surface of chip.
Preferably, the encapsulation matrix is arranged using the PC material of ceramics mixing, and wiring layer is arranged using metal structure,
The bottom end face of the wiring layer and the end face fixed bonding of encapsulation matrix.The surface of wiring layer and encapsulation matrix is fixed viscous
It connects, wiring layer is dismantled after the wafer damage that wiring layer end face is installed, encapsulation matrix is recycled and is used, reduce to chip cloth
The cost of line encapsulation.
Preferably, the bottom end face of the coating corresponds to pin and offers slot position, and bonding is filled with inside slot position
Agent.When coating is fixedly connected with encapsulation matrix, the slot position of coating bottom end face covers the pin that chip end face is welded solid
It is fixed, so that coating is adhesively fixed by pad of the adhesive to pin and chip output, improves pin and chip output
Welding spot welding fastness.
Preferably, the encapsulation matrix is provided centrally with positioning column, and the top of positioning column is arranged across wiring layer, institute
The center for stating coating corresponds to positioning column and offers location hole, and the top of the positioning column is arranged across location hole.In coating
When end face fixation with encapsulation matrix is located at the fixation of the position inside card slot to chip, positioning column passes through the positioning at coating center
Hole, the periphery of coating are fixedly connected by welding with the periphery of wiring layer, and by the top of positioning column and location hole junction
It is fixedly welded, the fastness connected between encapsulation matrix and coating is improved by positioning column, passes through coating internal end surface
The chip that pressing plate clamps card slot inside is fixed.
Preferably, the end fixing sleeve of the pin is equipped with attachment base, and the bottom of corresponding pin is opened inside the attachment base
Equipped with through slot, and connection pin is fitted with inside through slot, the end of the connection pin is contacted with pin end bottom end face
Setting.Attachment base is fixedly mounted in the end of pin by way of viscose glue or welding, and peg ends are corresponded to inside attachment base
The fixed inserting connection pin in end face, injection is to adhesive glue fixed between connection pin and pin inside through slot, when in use,
It is inserted by the way that connection pin and equipment are fixed, when causing to connect pin damage with equipment disassembly to connection pin, passes through connection
One group of connection pin that seat more renews avoids replacement pin from damaging chip.
Compared with prior art, the beneficial effects of the utility model are as follows:
1, the utility model opens up card slot by wiring layer in the end face of encapsulation matrix, and corresponding in the end face of encapsulation matrix
Coating is fixedly installed in the top of wiring layer, and wiring layer is fixed on the end face of encapsulation matrix by the placement of viscose glue, will be needed
For the chip card of encapsulation inside the card slot of wiring layer end face, pin welds solid point with chip top end surface by way of spot welding
Fixed welding, the pressing plate of coating end face correspond to above the chip inside card slot to the fixed pressure holding of chip inside card slot, coating
The slot position of bottom end face fixes the pin covering that chip end face is welded, the periphery that the periphery of coating passes through welding and wiring layer
It is fixedly connected, after being fixedly welded to coating and wiring layer, coating, which corresponds to, injects adhesive inside the slot position that pin opens up, and leads to
It crosses adhesive to be adhesively fixed to the pad of pin and chip output, raising pin is fixedly welded secured with chip output
Property, it avoids the phenomenon that chip is with easily pin and chip junction is damaged when being dismantled using equipment.
2, connection pin is fixedly mounted by attachment base in the end of pin in the utility model, and the end of pin passes through viscose glue
Or attachment base is fixedly mounted in the mode of welding, and the fixed inserting connection pin in peg ends end face is corresponded to inside attachment base,
Injection is to adhesive glue fixed between connection pin and pin inside through slot, when in use, is fixed by connection pin with equipment
Inserting, when causing to connect pin damage with equipment disassembly to connection pin, the one group of connection pin more renewed by attachment base,
Replacement pin is avoided to damage chip.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is that the utility model dismantles mounting structure schematic diagram.
Fig. 3 is the utility model Fig. 1 overlooking structure diagram.
In figure: 1 encapsulation matrix；11 coatings；12 pressing plates；13 slot positions；131 adhesives；14 positioning columns；141 location holes；2
Core plate；21 pads；22 pins；23 attachment bases；231 through slots；232 connection pins；3 wiring layers；31 card slots.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-3, a kind of multi-chip cloth wire encapsulation construction, including encapsulation matrix 1, chip 2 and wiring layer 3 again, institute
It states wiring layer 3 to be arranged on the end face of encapsulation matrix 1, and the end face of wiring layer 3 offers card slot 31 corresponding with chip 2, institute
Encapsulation matrix 1 is stated using the PC material setting of ceramics mixing, and wiring layer 3 is arranged using metal structure, the bottom of the wiring layer 3
The end face fixed bonding of end surface and encapsulation matrix 1.By the surface fixed bonding of wiring layer 3 and encapsulation matrix 1, in wiring layer 3
The chip 2 that end face is installed dismantles wiring layer 3 after damaging, and recycles and uses to encapsulation matrix 1, reduces to be routed chip 2 encapsulating
Cost.Inside card slot 31,2 output end of chip is arranged on the surface of chip 22 fixing card of chip, and leads to
The surface for crossing chip 2 is provided with pad 21, and the end face of the chip 2 is fixedly welded with pin 22 by pad 21, described
Pin 22 extends the side of encapsulation matrix 1 in bending-like, and the top that the end face of the encapsulation matrix 1 corresponds to chip 2 is welded with
Coating 11, the end face of the coating 11 correspond to card slot 31 and are internally provided with pressing plate 12, and the end face of pressing plate 12 and chip 2
Surface contact setting.The bottom end face of the coating 11 corresponds to pin 22 and offers slot position 13, and fills inside slot position 13
There is adhesive 131.When coating 11 is fixedly connected with encapsulation matrix 1, the slot position 13 of 11 bottom end face of coating is to 2 end face of chip
The pin 22 of welding, which covers, to be fixed, and keeps coating 1 viscous by pad 21 of the adhesive 131 to pin 22 and 2 output end of chip
Fixation is connect, the fastness of the welding of pad 21 of pin 22 and 2 output end of chip is improved.The center of the encapsulation matrix 1 is arranged
There is positioning column 14, and the top of positioning column 14 is arranged across wiring layer 3, the center of the coating 11 corresponds to positioning column 14 and opens up
There is location hole 141, the top of the positioning column 14 is arranged across location hole 141.It is solid in the end face of coating 11 and encapsulation matrix 1
When being located at the fixation of the position inside card slot 31 to chip 2 calmly, positioning column 14 passes through the location hole 141 at 11 center of coating, covering
The periphery of layer 11 is fixedly connected by welding with the periphery of wiring layer 3, and by the top of positioning column 14 and 141 junction of location hole
It is fixedly welded, the fastness connected between encapsulation matrix 1 and coating 11 is improved by positioning column 14, inside coating 11
The pressing plate 12 of end face is fixed to the chip 2 clamped inside card slot 31.The end fixing sleeve of the pin 22 is equipped with attachment base 23, institute
It states and corresponds to the bottom of pin 22 inside attachment base 23 and offer through slot 231, and be fitted with connection pin 232 inside through slot 231,
The end of the connection pin 232 contacts setting with 22 end bottom end face of pin.The end of pin 22 passes through viscose glue or welding
Mode attachment base 23 is fixedly mounted, and correspond to inside attachment base 23 the fixed inserting connection pin 232 of 22 bottom end face of pin,
Injection is to adhesive glue fixed between connection pin 232 and pin 22 inside through slot 231, when in use, by connecting pin
232 with equipment is fixed inserts, when causing to connect the damage of pin 232 with equipment disassembly to connection pin 232, pass through attachment base 23
The one group of connection pin 232 more renewed avoids replacement pin 23 from damaging chip 2.
In use, wiring layer 3 is fixed on the end face of encapsulation matrix 1 by the placement of viscose glue, the chip 2 that needs are encapsulated
It is installed on inside the card slot 31 of 3 end face of wiring layer, pin 22 is fixed with 2 top end surface pad 21 of chip by way of spot welding
Welding, the pressing plate 12 of 11 end face of coating correspond to 2 top of chip inside card slot 31 and fix pressure holding in card slot 31 to chip 2
The slot position 13 in portion, 11 bottom end face of coating fixes the covering of pin 22 that 2 end face of chip is welded, and the periphery of coating 11 passes through
Welding is fixedly connected with the periphery of wiring layer 3, after being fixedly welded to coating 11 and wiring layer 3, the corresponding pin 22 of coating 11
Adhesive 131 is injected inside the slot position 13 opened up, it is viscous by pad 21 of the adhesive 131 to pin 22 and 2 output end of chip
Fixation is connect, the fastness that pin 22 and 2 output end of chip are fixedly welded is improved；When in use, pass through connection pin 232 and equipment
Fixed inserting is more renewed when causing to connect the damage of pin 232 with equipment disassembly to connection pin 232 by attachment base 23
One group of connection pin 232 avoids replacement pin 23 from damaging chip 2.
In summary: multi-chip cloth wire encapsulation construction again opens up card slot by wiring layer 3 in the end face of encapsulation matrix 1
31, and coating 11, the placement that wiring layer 3 passes through viscose glue is fixedly installed in the top that the end face of encapsulation matrix 1 corresponds to wiring layer 3
It is fixed on the end face of encapsulation matrix 1, the chip 2 encapsulated will be needed to be installed on inside the card slot 31 of 3 end face of wiring layer, pin 22
It is fixedly welded by way of spot welding with 2 top end surface pad 21 of chip, the corresponding card slot 31 of the pressing plate 12 of 11 end face of coating
Internal 2 top of chip is to the fixed pressure holding of chip 2 inside card slot 31, and the slot position 13 of 11 bottom end face of coating is to 2 end of chip
The pin 22 of face welding, which covers, to be fixed, and the periphery of coating 11 is fixedly connected by welding with the periphery of wiring layer 3, to coating
After 11 are fixedly welded with wiring layer 3, adhesive 131 is injected inside the slot position 13 that the corresponding pin 22 of coating 11 opens up, by viscous
Mixture 131 is adhesively fixed to pin 22 and the pad of 2 output end of chip, solves existing multiple to chip wiring packaging process
It is miscellaneous, to the pin easy fracture that chip output is connected, causes chip to lose using effect, influence asking for chip normal use
Topic.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of multi-chip cloth wire encapsulation construction, including encapsulation matrix (1), chip (2) and wiring layer (3) again, it is characterised in that:
The wiring layer (3) is arranged on the end face of encapsulation matrix (1), and the end face of wiring layer (3) offer it is corresponding with chip (2)
Card slot (31), chip (2) fixing card is internal mounted in card slot (31), table of chip (2) the output end setting in chip (2)
It on face, and is provided with pad (21) by the surface of chip (2), the end face of the chip (2) is fixed by pad (21)
It is welded with pin (22), the pin (22) extends the side of encapsulation matrix (1) in bending-like, the encapsulation matrix (1)
End face corresponds to be welded with coating (11) above chip (2), and the end face of the coating (11) corresponds to be set inside card slot (31)
It is equipped with pressing plate (12), and the end face of pressing plate (12) contacts setting with the surface of chip (2).
2. a kind of multi-chip according to claim 1 cloth wire encapsulation construction again, it is characterised in that: the encapsulation matrix (1)
Using the PC material setting of ceramics mixing, and wiring layer (3) is arranged using metal structure, the bottom end face of the wiring layer (3)
With the end face fixed bonding of encapsulation matrix (1).
3. a kind of multi-chip according to claim 1 cloth wire encapsulation construction again, it is characterised in that: the coating (11)
Bottom end face corresponds to pin (22) and offers slot position (13), and is filled with adhesive (131) inside slot position (13).
4. a kind of multi-chip according to claim 1 cloth wire encapsulation construction again, it is characterised in that: the encapsulation matrix (1)
Be provided centrally with positioning column (14), and the top of positioning column (14) is arranged across wiring layer (3), in the coating (11)
The heart corresponds to positioning column (14) and offers location hole (141), and the top of the positioning column (14) is arranged across location hole (141).
5. a kind of multi-chip according to claim 1 cloth wire encapsulation construction again, it is characterised in that: the end of the pin (22)
Hold fixing sleeve that attachment base (23) are housed, the bottom of corresponding pin (22) offers through slot (231) inside the attachment base (23), and
Connection pin (232), the end and pin (22) end bottom of connection pin (232) are fitted with inside through slot (231)
End face contact setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821020637.7U CN208507659U (en) | 2018-06-29 | 2018-06-29 | A kind of multi-chip cloth wire encapsulation construction again |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821020637.7U CN208507659U (en) | 2018-06-29 | 2018-06-29 | A kind of multi-chip cloth wire encapsulation construction again |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507659U true CN208507659U (en) | 2019-02-15 |
Family
ID=65281947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821020637.7U Expired - Fee Related CN208507659U (en) | 2018-06-29 | 2018-06-29 | A kind of multi-chip cloth wire encapsulation construction again |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208507659U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111640677A (en) * | 2020-03-02 | 2020-09-08 | 浙江集迈科微电子有限公司 | Method for placing chips in groove |
-
2018
- 2018-06-29 CN CN201821020637.7U patent/CN208507659U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111640677A (en) * | 2020-03-02 | 2020-09-08 | 浙江集迈科微电子有限公司 | Method for placing chips in groove |
| CN111640677B (en) * | 2020-03-02 | 2022-04-26 | 浙江集迈科微电子有限公司 | Method for placing chips in groove |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201019 Address after: 215300 Second Floor, Room No. 4, 388 Shuanghua Road, Huaqiao Town, Suzhou City, Jiangsu Province Patentee after: KUNSHAN XINXINAN ELECTRONIC TECHNOLOGY Co.,Ltd. Patentee after: Core semiconductor technology (Suzhou) Co., Ltd Address before: 215300 Second Floor, Room No. 4, 388 Shuanghua Road, Huaqiao Town, Suzhou City, Jiangsu Province Patentee before: KUNSHAN XINXINAN ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190215 Termination date: 20210629 |