CN208504790U - A kind of semiconductor refrigeration radiating device - Google Patents
A kind of semiconductor refrigeration radiating device Download PDFInfo
- Publication number
- CN208504790U CN208504790U CN201820824572.5U CN201820824572U CN208504790U CN 208504790 U CN208504790 U CN 208504790U CN 201820824572 U CN201820824572 U CN 201820824572U CN 208504790 U CN208504790 U CN 208504790U
- Authority
- CN
- China
- Prior art keywords
- sliding block
- guide sheet
- copper billet
- radiating device
- cool guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of semiconductor refrigeration radiating device, its structure designs advantages of simple, heat sinking function can be made to greatly improve while controlling the temperature of refrigerated area well, and it can facilitate and carry out demolition and replacement to cool guide sheet, it includes semiconductor refrigerating block, the upper end of semiconductor refrigerating block is sequentially fixedly installed with radiating copper sheet, cooling fin, cooling fan, the lower end of semiconductor refrigerating block is fixedly installed with conduction cooling copper billet, the lower end of conduction cooling copper billet is provided with cool guide sheet, it is slidably connected between conduction cooling copper billet and cool guide sheet by the T shape sliding slot of sliding block and sliding block bottom end, the bottom end of conduction cooling copper billet is fixedly installed with sliding block, temperature detector, warming controller, temperature detector, warming controller is located at the two sides of sliding block, the inside of cooling fin is evenly arranged with several heat release holes.
Description
Technical field
The utility model relates to refrigeration radiating engineering device technique field, specially a kind of semiconductor refrigeration radiating device.
Background technique
The advantages that semiconductor cooler is because of work fast, long service life, free from environmental pollution and easily controllable and by people
Be widely used, cooling parameters are not influenced by direction in space and gravity, can be normally under the conditions of big mechanical overload
Work, by adjusting the size of operating current, conveniently adjusted cooling rate, by switching electric current direction, can make refrigerator from
Refrigerating state is changed into heating working condition.
But currently on the market the refrigeration radiating function of common semiconductor cooler must control in a certain range, when
When refrigerated area temperature over range in the refrigerator course of work, lasting refrigeration will lead to the too low problem of the regional temperature
Appearance, therefore, it is necessary to keep the temperature of refrigerated area be not in large change.And refrigerator heat dissipation function in the prior art
Can be poor, if cannot radiate in time when heatsink temperature is excessively high, easily lead to generation fire.It is easy when cool guide sheet uses for a long time
Aging and replacement not easy to disassemble occurs, the heat absorption capacity that freezes after the cool guide sheet aging that can not be replaced is deteriorated, and work is easy to cause to imitate
The problem of rate reduces occurs.
Utility model content
It is not easy effectively to keep for refrigerated area temperature existing in the prior art, heat sinking function is poor, cool guide sheet is asked
When topic the problems such as not easy to disassemble and replacement, the utility model provides a kind of semiconductor refrigeration radiating device, structure design letter
It is single reasonable, heat sinking function can be made to greatly improve while controlling the temperature of refrigerated area well, and can facilitate to conduction cooling
Piece carry out demolition and replacement.
A kind of semiconductor refrigeration radiating device comprising semiconductor refrigerating block, the upper end of the semiconductor refrigerating block is sequentially
It is fixedly installed with radiating copper sheet, cooling fin, cooling fan, the lower end of the semiconductor refrigerating block is fixedly installed with conduction cooling copper billet,
The lower end of the conduction cooling copper billet is provided with cool guide sheet, which is characterized in that passes through cunning between the conduction cooling copper billet and the cool guide sheet
Block and the T shape sliding slot of sliding block bottom end are slidably connected, and the bottom end of the conduction cooling copper billet is fixedly installed with the sliding block, temperature detection
Device, warming controller, the temperature detector, warming controller are located at the two sides of the sliding block；The cooling fin it is interior
Portion is evenly arranged with several heat release holes.
It is further characterized by the two sides of the radiating copper sheet and the cooling fin are provided with Z-type mounting rack, the Z
Being welded between the bottom transverse slat and the cooling fan of type mounting rack has fixed plate；
The outer wall of the cool guide sheet is provided with HDEP film, and the HDEP film is fixedly connected on the conduction cooling by seccotine
Piece, the HDEP film with a thickness of 0.1-0.3mm；
The model W101 of the warming controller；
The input terminal of the output end of the temperature detector and the warming controller is electrically connected, the warming control
The output end of device processed is electrically connected with the input terminal of the semiconductor refrigerating block, cooling fan respectively；
The heat release hole is at least 2.
Using the above structure of the utility model, the setting of temperature detector and warming controller can keep freezing well
The temperature in region is not in large change, solves the problems, such as that refrigerated area temperature cannot effectively be kept, so as to avoid holding
The appearance of the too low problem of the regional temperature caused by continuous refrigeration；The setting in cooling fin internal heat dissipating hole increases dissipating for cooling fin
Heat space greatly strengthens the heat-sinking capability of cooling fin, solves the problems, such as that cooling fin heat-sinking capability is poor, avoids cooling fin temperature
The problem of spending height and causing fire；The setting of sliding block and sliding block bottom end sliding slot facilitates the dismounting and change of cool guide sheet, solves
Cool guide sheet is inconvenient to the problem of replacing, and effectively prevents the problem of refrigeration heat absorption capacity is deteriorated after the cool guide sheet aging that can not be replaced
Occur.
Further, the outer wall of cool guide sheet is provided with HDEP film, and HDEP film can prevent cool guide sheet aging, greatly increase
The service life of cool guide sheet solves the problems, such as that cool guide sheet is unable to long-term stable work in moist, the more serious region of soda acid, from
And avoid the reduction of cool guide sheet refrigeration heat absorption efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of the sliding block of the utility model；
Fig. 3 is the structural schematic diagram in the cooling fin internal heat dissipating hole of the utility model；
Fig. 4 is that the cool guide sheet outer wall of the utility model installs the structural schematic diagram of HDEP film.
Specific embodiment
A kind of semiconductor refrigeration radiating device comprising semiconductor refrigerating block 1, the upper end of semiconductor refrigerating block 1 are sequentially solid
Dingan County is equipped with radiating copper sheet 2, cooling fin 3, cooling fan 4, and the inside of cooling fin 3 is evenly arranged with several heat release holes 31, dissipates
Hot hole 31 is at least 2, and the two sides of radiating copper sheet 2 and cooling fin 3 are provided with Z-type mounting rack 5, the bottom transverse slat of Z-type mounting rack 5
Fixed plate is installed between cooling fan 4；
The lower end of semiconductor refrigerating block 1 is fixedly installed with conduction cooling copper billet 6, and the lower end of conduction cooling copper billet 6 is provided with cool guide sheet 7,
The outer wall of cool guide sheet 7 is provided with HDEP film 71, and HDEP film 71 is fixedly connected on cool guide sheet 7, the thickness of HDEP film 71 by seccotine
Degree is 0.1-0.3mm, is slidably connected between conduction cooling copper billet 6 and cool guide sheet 7 by the T shape sliding slot 9 of 8 bottom end of sliding block 8 and sliding block,
The bottom end of conduction cooling copper billet 6 is fixedly installed with sliding block 8, temperature detector 10, warming controller 11, the model of warming controller 11
W101, temperature detector 10, warming controller 11 are located at the two sides of sliding block 8, the output end and warming of temperature detector 10
The input terminal of controller 11 is electrically connected, the output end of warming controller 11 respectively with semiconductor refrigerating block 1, cooling fan 4
Input terminal is electrically connected.
That the specific working principle is as follows is described for it: being provided with temperature detector 10 in the refrigeration end of radiator and warming controls
Device 11 detects the temperature in certain area coverage, when temperature is higher to be needed to cool down, temperature detector by temperature detector 10
10 communicate information in warming controller 11, start the work refrigeration of semiconductor refrigerating block 1 by warming controller 11, meanwhile, temperature
Sense controller 11 controls cooling fan 4 and starts, and realizes heat dissipation by radiating copper sheet 2 and cooling fin 3, avoids 3 temperature of cooling fin
It is excessively high and the problem of cause fire；When the temperature in the detection certain area coverage of temperature detector 10 is too low, temperature detector
10 communicate information in warming controller 11, control semiconductor refrigerating block 1 by warming controller 11 and stop refrigeration work, thus
The appearance for avoiding the too low problem of the regional temperature caused by lasting refrigeration, realizes intelligent operation, to keep freezing
The temperature in region is not in large change.
Claims (6)
1. a kind of semiconductor refrigeration radiating device comprising semiconductor refrigerating block, the upper end of the semiconductor refrigerating block are sequentially solid
Dingan County is equipped with radiating copper sheet, cooling fin, cooling fan, and the lower end of the semiconductor refrigerating block is fixedly installed with conduction cooling copper billet, institute
The lower end for stating conduction cooling copper billet is provided with cool guide sheet, which is characterized in that passes through sliding block between the conduction cooling copper billet and the cool guide sheet
Be slidably connected with the T shape sliding slot of sliding block bottom end, the bottom end of the conduction cooling copper billet be fixedly installed with the sliding block, temperature detector,
Warming controller, the temperature detector, warming controller are located at the two sides of the sliding block；The inside of the cooling fin is equal
It is even to be provided with several heat release holes.
2. a kind of semiconductor refrigeration radiating device according to claim 1, which is characterized in that the radiating copper sheet and described
The two sides of cooling fin are provided with Z-type mounting rack, are equipped between the bottom transverse slat and the cooling fan of the Z-type mounting rack solid
Fixed board.
3. a kind of semiconductor refrigeration radiating device according to claim 1, which is characterized in that the outer wall of the cool guide sheet is set
Be equipped with HDEP film, the HDEP film is fixedly connected on the cool guide sheet by seccotine, the HDEP film with a thickness of 0.1-
0.3mm。
4. a kind of semiconductor refrigeration radiating device according to claim 1, which is characterized in that the type of the warming controller
Number be W101.
5. a kind of semiconductor refrigeration radiating device according to claim 1, which is characterized in that the temperature detector it is defeated
The input terminal of outlet and the warming controller is electrically connected, the output end of the warming controller respectively with the semiconductor system
Cold piece, the input terminal of cooling fan is electrically connected.
6. a kind of semiconductor refrigeration radiating device according to claim 1, which is characterized in that the heat release hole is at least 2
It is a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820824572.5U CN208504790U (en) | 2018-05-30 | 2018-05-30 | A kind of semiconductor refrigeration radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820824572.5U CN208504790U (en) | 2018-05-30 | 2018-05-30 | A kind of semiconductor refrigeration radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208504790U true CN208504790U (en) | 2019-02-15 |
Family
ID=65287091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820824572.5U Expired - Fee Related CN208504790U (en) | 2018-05-30 | 2018-05-30 | A kind of semiconductor refrigeration radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208504790U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645072A (en) * | 2018-05-30 | 2018-10-12 | 无锡艾迪尔家居有限公司 | A kind of semiconductor refrigeration radiating device |
-
2018
- 2018-05-30 CN CN201820824572.5U patent/CN208504790U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645072A (en) * | 2018-05-30 | 2018-10-12 | 无锡艾迪尔家居有限公司 | A kind of semiconductor refrigeration radiating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190215 Termination date: 20190530 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |