CN208433384U - Wafer position real-time detection system - Google Patents
Wafer position real-time detection system Download PDFInfo
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- CN208433384U CN208433384U CN201821252596.4U CN201821252596U CN208433384U CN 208433384 U CN208433384 U CN 208433384U CN 201821252596 U CN201821252596 U CN 201821252596U CN 208433384 U CN208433384 U CN 208433384U
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- wafer
- mechanical arm
- detection system
- time detection
- imaging sensor
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- 238000011897 real-time detection Methods 0.000 title claims abstract description 25
- 238000003384 imaging method Methods 0.000 claims abstract description 37
- 230000003287 optical effect Effects 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000007689 inspection Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 85
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
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- 230000000694 effects Effects 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
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- 230000007812 deficiency Effects 0.000 description 1
- 238000013401 experimental design Methods 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of wafer position real-time detection system, comprising: transmits the mechanical arm of wafer；Laser occurs to form the laser emitter of interference hot spot to the back side of the wafer；It receives the interference hot spot to be imaged with the back side to the wafer, and obtained image is compared to the imaging sensor to judge whether the wafer shifts.The utility model, which can be realized, detects the wafer to shift on mechanical arm.By introducing laser emitter and imaging sensor in backside of wafer position, detecting real-time is carried out to wafer position, alarm is issued beyond the wafer of setting value to offset, timely shutdown inspection avoids generating bad products.
Description
Technical field
The utility model relates to field of semiconductor manufacture, more particularly to a kind of wafer position real-time detection system.
Background technique
In semiconductor fabrication process now, semiconductor manufacturing facility generally transmits wafer using mechanical arm.It is existing
Some mechanical arms generally can not real-time detection wafer position, can not judge wafer on mechanical arm with the presence or absence of offset even
The case where falling, there are certain risks.When position of the wafer on mechanical arm shifts, wafer placement location will cause
It is improper, or rub and generate particles effect yield to other component, or even break wafer and cause fragmentation.
Therefore, for the application demand of the wafer position detecting real-time on mechanical arm, it is necessary to propose a kind of new crystalline substance
Circle position real-time detection system, to solve the above problems.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of new wafer position is real
When detecting system, for solving the problems, such as that the prior art can not wafer position on detecting real-time mechanical arm.
To achieve the above object and other related purposes, the utility model provide a kind of wafer position real-time detection system,
It is characterised by comprising:
Transmit the mechanical arm of wafer；
Laser occurs to form the laser emitter of interference hot spot to the back side of the wafer, is located at the mechanical arm
On；
It receives the interference hot spot to be imaged with the back side to the wafer, and obtained image is compared to sentence
The imaging sensor whether wafer that breaks shifts, the imaging sensor are located on the mechanical arm.
As a kind of preferred embodiment of the utility model, the receiving that top has opening is formed in the mechanical arm
Chamber, the laser emitter and the imaging sensor are respectively positioned in the accommodating chamber, and the imaging sensor is positioned at described
The laser that laser emitter occurs is on the reflection path after the backside of wafer forms interference hot spot.
As a kind of preferred embodiment of the utility model, optical transmission window, the light inlet window are additionally provided on the mechanical arm
Mouth covers the opening at the top of the accommodating chamber.
As a kind of preferred embodiment of the utility model, the optical transmission window includes euphotic cover plate.
As a kind of preferred embodiment of the utility model, the upper table of the upper surface of the euphotic cover plate and the mechanical arm
Face is flush.
As a kind of preferred embodiment of the utility model, the imaging sensor includes:
For receiving the receiving module of interference hot spot, the receiving module is towards the back side of the wafer；
For the image-forming module according to interference hot spot imaging, the image-forming module connects the receiving module；
For storing target image, and the comparison module that obtained image is compared, the comparison module connects institute
State image-forming module.
As a kind of preferred embodiment of the utility model, the wafer position real-time detection system further includes offset alarm dress
It sets, the offset warning device is connected with the imaging sensor.
As described above, the utility model provides a kind of wafer position real-time detection system, have the advantages that
The utility model is by introducing a kind of wafer position real-time detection system, it can be achieved that inclined to the generation on mechanical arm
The wafer of shifting is detected.By introducing laser emitter and imaging sensor in backside of wafer position, wafer position is carried out
Detecting real-time issues alarm beyond the wafer of setting value to offset, and timely shutdown inspection avoids generating bad products.
Detailed description of the invention
Fig. 1 is shown as the cross-sectional view of the wafer position real-time detection system provided in the utility model embodiment.
Fig. 2 is shown as the annexation figure of the wafer position real-time detection system provided in the utility model embodiment.
Fig. 3 be shown as wafer in the utility model embodiment on mechanical arm in do not deviate ideal position when vertical view
Figure.
Fig. 4 is shown as top view of the wafer when deviating on mechanical arm in the utility model embodiment.
Fig. 5 is shown as interference figure when wafer in the utility model embodiment is in ideal position.
Fig. 6 is shown as interference figure when wafer in the utility model embodiment is in deviation post.
Fig. 7 is shown as the comparison result of real-time interference figure and standard interference pattern in the utility model embodiment
Component label instructions
101 wafers
102 mechanical arms
103 laser emitters
104 imaging sensors
104a receiving module
104b image-forming module
104c comparison module
105 accommodating chambers
106 optical transmission windows
107 offset warning devices
108 crystal circle center
109 wafer ideal positions
110 ideal crystal circle center positions
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands the further advantage and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Fig. 1 is please referred to Fig. 7.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though it is only shown with related component in the utility model rather than when according to actual implementation in diagram
Component count, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind
Become, and its assembly layout form may also be increasingly complex.
Fig. 1 to Fig. 2 is please referred to, the utility model provides a kind of wafer position real-time detection system, comprising:
Transmit the mechanical arm 102 of wafer 101；
Laser occurs to form the laser emitter 103 of interference hot spot to the back side of the wafer 101, is located at the machinery
On arm 102；
It receives the interference hot spot to be imaged with the back side to the wafer 101, and obtained image is compared
To judge that imaging sensor 104 that whether wafer 101 shifts, the imaging sensor 104 are located at the manipulator
On arm 102.
As shown in Figure 1, the utility model is by introducing back side emitter of the laser emitter 103 to the wafer 101
Laser generates interference fringe by the back side of the wafer 101, and is collected by the imaging sensor 104.Laser has excellent
Coherence, the fine difference of 101 back side different location of wafer, so that it may cause laser reflection light phase occur it is poor
It is different, it interferes with each other, generates interference hot spot.Since the flatness and angularity at the back side of the wafer 101 are generally other in the micron-scale,
And the optical wavelength of the emitted laser of the laser emitter 103 is generally nanoscale, it is sufficient to generate identifiable interference hot spot
Pattern.The laser interference hot spot pattern for storing different time points, by comparing the difference between each interference spot pattern, so that it may
Change in location of the wafer 101 described in detecting real-time on the mechanical arm 102.
As an example, the accommodating chamber 105 that top has opening is formed in the mechanical arm 102, the Laser emission
Device 103 and the imaging sensor 104 are respectively positioned in the accommodating chamber 105, and the imaging sensor 104 is located at the laser
The laser that transmitter 103 occurs is on the reflection path after 101 back side of wafer forms interference hot spot.As shown in Figure 1, described
Laser emitter 103 and the imaging sensor 104 are all set in the accommodating chamber 105, and described in its positional relationship satisfaction
After backside reflection of the laser that laser emitter 103 is occurred by the wafer 101, connect by the imaging sensor 104
It receives.The wafer position real-time detection system is arranged by increasing in the inner space of the mechanical arm 102 in the utility model,
Detecting real-time is carried out in the position of the mechanical arm 102 to the wafer 101, which occupies the device space without additional,
To the transformation means of existing equipment and a kind of practical.
As an example, being additionally provided with optical transmission window 106 on the mechanical arm 102, the optical transmission window 106 covers the appearance
Receive the opening at the top of chamber 105.Since optical interference circuit has high-accuracy property, it is necessary to the optical transmission window 106 be arranged to separate
State accommodating chamber 105 and external microenvironment.
As an example, the optical transmission window 106 includes euphotic cover plate.For the ease of maintenance personnel to the accommodating chamber 105
The interior wafer position real-time detection system is safeguarded, using the euphotic cover plate as the optical transmission window 106.It is described
Euphotic cover plate can raise removal in plant maintenance from the mechanical arm 102, and lid closes again after maintenance.
As an example, the upper surface of the euphotic cover plate and the upper surface of the mechanical arm 102 are flush.In order to prevent
Back side friction with the wafer 101 generates particle, and the upper surface of the euphotic cover plate must be upper with the mechanical arm 102
Surface is in same level, in order to avoid the mechanical friction that euphotic cover plate protrusion or recess may generate.
As an example, the imaging sensor 104 includes:
Interfere the receiving module 104a, the receiving module 104a of hot spot towards the back side of the wafer 101 for receiving；
For the image-forming module 104b according to interference hot spot imaging, the image-forming module 104b connection receiving module
104a；
For storing target image, and the comparison module 104c that obtained image is compared, the comparison module connect
Meet the image-forming module 104b.
Referring to Fig. 2, the imaging sensor 104 includes the receiving module 104a, the image-forming module 104b and institute
State comparison module 104c.Wherein, it is anti-through 101 back side of wafer to receive the laser emitter 103 by the receiving module 104a
The interference hot spot penetrated；The image-forming module 104b connection receiving module 104a, and according to interference hot spot imaging；The comparison
The module 104c connection image-forming module 104b, is compared for storing target image, and by obtained image.
As an example, the wafer position real-time detection system further includes offset warning device 107, the offset alarm dress
107 are set to be connected with the imaging sensor 104.
As an example, Fig. 3 to Fig. 7 is please referred to, it can be accurate based on wafer position real-time detection system described in the present embodiment
Change in location of the wafer 101 described in ground detecting real-time on the mechanical arm 102.Generally all match in semiconductor production equipment
It is equipped with wafer alignment device, by the position correction of the wafer 101 to perfect condition.Therefore, when the mechanical arm 102 is from institute
When stating the wafer alignment device crawl wafer 101, position of the wafer 101 on the mechanical arm 102 be can consider
It is the ideal position there is no offset.As shown in figure 3, be the wafer 101 on the mechanical arm 102 in not sending out
The schematic diagram of ideal position when raw offset.The crystal circle center 108 of the wafer 101 is located on the mechanical arm 102 at this time
Set ideal position.As shown in figure 4, when the wafer 101 is by unexpected disturbances, when appearance position deviates, the wafer
101 deviate wafer ideal position 109, and the crystal circle center 108 of the wafer 101 occurs relative to ideal crystal circle center position 110
Offset, as shown by the arrows in Figure 4.When the mechanical arm 102 grabs the wafer 101, the laser emitter 103
The laser beam of generation is irradiated to the back side of the wafer 101 and generates interference hot spot by reflection, by the imaging sensor 104
The receiving module 104a is received, and is transmitted to the imaging that the image-forming module 104b carries out interference hot spot, obtained interference
Spot pattern is stored by the comparison module 104c.The image-forming module 104b is to the interference hot spot received according to certain
Grid units make pixelation imaging, as shown in Figure 5, Figure 6.The ideal position is in for wafer 101 described in Fig. 3
When, the interference figure that the imaging sensor 104 obtains is as shown in Figure 5.There is deviation for the position of wafer 101 described in Fig. 4
When, the interference figure that the imaging sensor 104 obtains is as shown in Figure 6.Made with the interference figure (such as Fig. 5) of the ideal position
It is obtained by certain time interval (such as every 1 second) real for standard interference pattern in 102 subsequent action of mechanical arm
When interference figure (by taking Fig. 6 as an example), and itself and the standard interference pattern are compared by the comparison module 104c, and
The offset of the real-time interference figure and the standard interference pattern out.As shown in fig. 7, being the comparison module 104c by institute
State the result that real-time interference figure is compared with the standard interference pattern.According to comparison result, the standard interference is compared
Pattern, the real-time interference figure deviate 2 lattice in X-direction, deviate -2 lattice in Y direction, can obtain total drift amount is 2* (2)1/2
Lattice.Setting offsets alarming value in the offset warning device 107, and from the comparison module 104c obtain in real time it is described partially
Shifting amount, when finding that the offset exceeds the offset alarming value, the offset warning device 107 is sounded an alarm and is shut down,
In order to avoid there is fragmentation in the wafer 101.As the wafer offset in Fig. 7 is shown as in the inclined of the pixel compartments of X-axis and Y direction
It moves, real offset corresponding on wafer when obtaining one pixel compartments of offset can be verified by experimental design.For example, a pixel
Real offset corresponding to lattice is 0.5mm, then the corresponding relationship is based on, when the reality of the wafer on certain semiconductor production equipment
Allow offset be 2mm when, it is described offset warning device 107 the offset alarming value be set as 4 pixel compartments.As this reality
The preferred embodiment for applying example can root when the offset warning device 107 detects the offset beyond the offset alarming value
Operation, (being, for example, less than 3mm), the machine when offset is smaller are carried out according to the standard operating procedure under preset different offsets
Tool arm 102 passes the wafer 101 back 101 alignment device of wafer, carries out realigning for the wafer 101, or
The mechanical arm 102 compensates corresponding correction value automatically in subsequent transfer operation；(the example when offset exceeds a certain range
Such as larger than 3mm), at this time offset exceeded equipment can voluntarily modified range, settable shutdown to maintenance personnel to safeguard.Institute
Model can be allowed according to the offset correction ability of different semiconductor production equipments and the offset of manufacturing process by stating standard operating procedure
It encloses and is flexibly set.
In conclusion the utility model provides a kind of wafer position real-time detection system, comprising: transmit the machinery of wafer
Arm；Laser occurs to form the laser emitter of interference hot spot to the back side of the wafer；The interference hot spot is received with right
The back side of the wafer is imaged, and obtained image is compared to the imaging to judge whether the wafer shifts
Sensor.The utility model, which can be realized, detects the wafer to shift on mechanical arm.By in backside of wafer position
It sets and introduces laser emitter and imaging sensor, detecting real-time is carried out to wafer position, the wafer of setting value is exceeded to offset
Alarm is issued, timely shutdown inspection avoids generating bad products.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (7)
1. a kind of wafer position real-time detection system characterized by comprising
Transmit the mechanical arm of wafer；
Laser occurs to form the laser emitter of interference hot spot to the back side of the wafer, is located on the mechanical arm；
It receives the interference hot spot to be imaged with the back side to the wafer, and obtained image is compared to judge
The imaging sensor whether wafer shifts is stated, the imaging sensor is located on the mechanical arm.
2. wafer position real-time detection system according to claim 1, which is characterized in that be formed in the mechanical arm
Top has the accommodating chamber of opening, and the laser emitter and the imaging sensor are respectively positioned in the accommodating chamber, and described
Imaging sensor is located at reflection path of the laser of laser emitter generation after the backside of wafer forms interference hot spot
On.
3. wafer position real-time detection system according to claim 2, which is characterized in that be additionally provided on the mechanical arm
Optical transmission window, the optical transmission window cover the opening at the top of the accommodating chamber.
4. wafer position real-time detection system according to claim 3, which is characterized in that the optical transmission window includes light transmission
Cover board.
5. wafer position real-time detection system according to claim 4, which is characterized in that the upper surface of the euphotic cover plate
It is flush with the upper surface of the mechanical arm.
6. wafer position real-time detection system according to claim 1, which is characterized in that the imaging sensor includes:
For receiving the receiving module of interference hot spot, the receiving module is towards the back side of the wafer；
For the image-forming module according to interference hot spot imaging, the image-forming module connects the receiving module；
For storing target image, and the comparison module that obtained image is compared, the comparison module connection it is described at
As module.
7. wafer position real-time detection system according to claim 1, which is characterized in that the wafer position detecting real-time
System further includes offset warning device, and the offset warning device is connected with the imaging sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821252596.4U CN208433384U (en) | 2018-08-03 | 2018-08-03 | Wafer position real-time detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821252596.4U CN208433384U (en) | 2018-08-03 | 2018-08-03 | Wafer position real-time detection system |
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| Publication Number | Publication Date |
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| CN208433384U true CN208433384U (en) | 2019-01-25 |
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| CN201821252596.4U Expired - Fee Related CN208433384U (en) | 2018-08-03 | 2018-08-03 | Wafer position real-time detection system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113120596A (en) * | 2019-12-31 | 2021-07-16 | 旺矽科技股份有限公司 | Material transfer state detection system and method |
| CN114823455A (en) * | 2022-07-01 | 2022-07-29 | 西安奕斯伟材料科技有限公司 | Device and method for adjusting wafer position |
-
2018
- 2018-08-03 CN CN201821252596.4U patent/CN208433384U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113120596A (en) * | 2019-12-31 | 2021-07-16 | 旺矽科技股份有限公司 | Material transfer state detection system and method |
| CN114823455A (en) * | 2022-07-01 | 2022-07-29 | 西安奕斯伟材料科技有限公司 | Device and method for adjusting wafer position |
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Granted publication date: 20190125 |