CN114823455A - Device and method for adjusting wafer position - Google Patents
Device and method for adjusting wafer position Download PDFInfo
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- CN114823455A CN114823455A CN202210767535.6A CN202210767535A CN114823455A CN 114823455 A CN114823455 A CN 114823455A CN 202210767535 A CN202210767535 A CN 202210767535A CN 114823455 A CN114823455 A CN 114823455A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The embodiment of the invention discloses a device and a method for adjusting the position of a wafer, wherein the device comprises: the device comprises a light source, a first light source and a second light source, wherein the light source is used for irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, the first light spot and the second light spot are linear, and two end points of each light spot are located at the periphery of the wafer; the sensor is used for sensing the actual central position of the wafer according to the first light spot and the second light spot; a processor for obtaining a deviation between the actual center position and a target center position of the wafer; a controller for controlling the wafer to move according to the deviation so that the actual center position coincides with the target center position.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a device and a method for adjusting the position of a wafer.
Background
Multi-arm wafer transfer apparatus for transferring wafers stored in wafer cassettes are known in the art. The wafer cassette generally has a plurality of slots arranged in a stacked manner in the wafer cassette, each slot being adapted to receive a single wafer, and the multi-arm wafer transfer apparatus has a plurality of gripping arms that can grip respective ones of the plurality of slots corresponding to the plurality of gripping arms simultaneously or at once, and the plurality of gripping arms can move together with the robot arm of the apparatus to transfer the gripped wafers to a target location. In a wafer production process, in order to perform grinding/etching/polishing/detecting operations on wafers, it is generally necessary to frequently take out/put wafers into a cassette by a robot arm, and to frequently detect the positions of the wafers.
A common wafer position detection method is to make a robot pass through a specific detection device while carrying a wafer, and a specific sensor in the detection device records the time when the wafer enters the sensor and the time when the wafer leaves the sensor, so as to determine the position of the wafer by using time and speed.
However, the accuracy of the conventional detection method is greatly affected by the response time of the sensor, the communication delay, the acceleration and deceleration speed of the robot, and the like, so that the detection accuracy is low, and the process of the robot carrying the wafer through the specific detection device affects the production progress and further affects the productivity.
Disclosure of Invention
To solve the above technical problems, embodiments of the present invention are directed to an apparatus and a method for sensing a wafer position and adjusting the wafer to a target position in a non-contact manner.
The technical scheme of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides an apparatus for adjusting a wafer position, where the apparatus includes:
the device comprises a light source, a first light source and a second light source, wherein the light source is used for irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, the first light spot and the second light spot are linear, and two end points of each light spot are located at the periphery of the wafer;
the sensor is used for sensing the actual central position of the wafer according to the first light spot and the second light spot;
a processor for obtaining a deviation between the actual center position and a target center position of the wafer;
a controller for controlling the wafer to move according to the deviation so that the actual center position coincides with the target center position.
In a second aspect, an embodiment of the present invention provides a method for adjusting a wafer position, where the method includes:
irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are linear and two end points of each light spot are located at the periphery of the wafer;
sensing the actual central position of the wafer according to the first light spot and the second light spot;
obtaining a deviation between the actual center position and a target center position of the wafer;
and controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
The embodiment of the invention provides a device and a method for adjusting the position of a wafer; the device comprises a light source, a sensor, a processor and a controller, wherein the sensor senses the actual central position of the wafer according to a light spot formed by a light beam projected on the surface of the wafer by the light source, the controller controls the wafer to move according to the deviation between the actual central position and the target central position obtained by the processor, so that the actual central position of the wafer is superposed with the target central position, therefore, the actual central position of the wafer can be determined in a non-contact mode, the sensor, the processor and the controller form closed-loop control, and the controller executes the operation of adjusting the position of the wafer according to the sensing and calculating results, so that the position of the wafer is adjusted in a simple and high-precision mode.
Drawings
FIG. 1 shows a schematic view of an apparatus for adjusting the position of a wafer according to an embodiment of the invention;
FIG. 2 is a schematic diagram illustrating an apparatus for adjusting the position of a wafer according to an embodiment of the present invention sensing the actual center position of the wafer;
FIG. 3 is a schematic diagram illustrating an apparatus for adjusting the position of a wafer according to another embodiment of the present invention sensing the actual center position of the wafer;
FIG. 4 is a schematic diagram illustrating an apparatus for adjusting the position of a wafer sensing the actual center position of the wafer according to another embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating an apparatus for adjusting the position of a wafer according to another embodiment of the present invention sensing the actual center position of the wafer;
fig. 6 shows a schematic diagram of a method for adjusting the position of a wafer according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, an embodiment of the present invention provides an apparatus 1 for adjusting a wafer position, where the apparatus 1 includes: a light source 10, configured to irradiate a light beam to a wafer W to form a first spot B1 and a second spot B2 on a surface of the wafer W, where the first spot B1 and the second spot B2 are both linear and both end points of each are located at a peripheral edge WP of the wafer W; a sensor 11 for sensing an actual center position PA of the wafer W according to the first spot B1 and the second spot B2; a processor 12, said processor 12 being configured to obtain a deviation DA between said actual center position PA and a target center position PP of said wafer W; a controller 13, wherein the controller 13 is configured to control the wafer W to move according to the deviation DA so that the actual center position PA coincides with the target center position PP.
The embodiment of the invention provides a device for adjusting the position of a wafer; the apparatus 1 includes a light source 10, a sensor 11, a processor 12, and a controller 13, wherein the sensor 11 senses an actual center position PA of the wafer W based on two light spots formed by a light beam projected on a surface of the wafer W by the light source 10, the controller 13 controls the wafer W to move based on a deviation DA between the actual center position PA and a target center position PP obtained by the processor 12 so that the actual center position PA of the wafer W coincides with the target center position PP, whereby the actual center position PA of the wafer W can be determined in a non-contact manner, and the sensor 11, the processor 12, and the controller 13 form a closed-loop control, and the controller 13 performs an operation of adjusting the position of the wafer W based on the sensing and calculation results, thereby achieving adjustment of the position of the wafer W in a simple and highly accurate manner.
The manner in which the sensor 11 senses the actual center position of the wafer will be described below in various embodiments.
According to a preferred embodiment of the present invention, referring to fig. 2, the sensor 11 obtains at least three positions among a first position P1 of a first end point D1 of the first spot B1, a second position P2 of a second end point D2 of the first spot B1, a third position P3 of a first end point D3 of the second spot B2, and a fourth position P4 of a second end point D4 of the second spot B2, and uses a position of an intersection of perpendicular bisectors of two line segments connecting the at least three positions as the actual center position PA of the wafer W. In the embodiment shown in fig. 2, a first position P1 connecting the first end point D1 of the first light spot B1 and a second position P2 connecting the second end point D2 of the first light spot B1 form a first line segment N1, and a first position P1 connecting the first end point D1 of the first light spot B1 and a fourth position P4 connecting the second end point D4 of the second light spot B2 form a second line segment N2, a perpendicular bisector of the first line segment N1 is O1, a perpendicular bisector of the second line segment N2 is O2, one end of the perpendicular bisector O1 is perpendicularly intersected with the first line segment N1 at a point M1, one end of the perpendicular bisector O2 is perpendicularly intersected with the second line segment N2 at a point M2, and the other end of the perpendicular bisector O1 is intersected with the other end of the perpendicular O2, which is the actual center position PA of the wafer W.
In order to make the sensed actual center position of the wafer more accurate, it is preferable that two positions connected by each line segment are not adjacent, and, in particular, as shown in fig. 3, a first position P1 connecting the first end point D1 of the first spot B1 and a third position P3 connecting the first end point D3 of the second spot B2 form a first line segment N1, a second position P2 connecting the second end point D2 of the first spot B1 and a fourth position P4 connecting the second end point D4 of the second spot B2 form a second line segment N2, as can be seen from fig. 2, the two end points of the first line segment N1 are not adjacent to each other along the circumferential direction of the wafer, but is spaced apart from the second end point D2 of the first spot B1, and likewise, the two end points of the second line segment N2 are not adjacent to each other in the circumferential direction of the wafer, but is spaced apart by the first end point D3 of the second spot B2 so that the positions of the four end points of the two spots can be simultaneously taken as conditional values of the acquired actual center position of the wafer. The actual center position PA of the wafer W can be determined by obtaining the position of the intersection of the perpendicular bisector of the first line segment N1 and the perpendicular bisector of the second line segment N2.
According to a preferred embodiment of the present invention, referring to fig. 4, the first end point D1 of the first spot B1 coincides with the second end point D4 of the second spot B2 and the first spot B1 and the second spot B2 are perpendicular to each other, the sensor 11 acquires the first position P1 of the second end point D2 of the first spot B1 and the second position P2 of the first end point D3 of the second spot B2, and takes the position of the midpoint of a line segment connecting the first position P1 and the second position P2 as the actual center position PA of the wafer W.
Specifically, referring to fig. 4, the first end point D1 of the first light spot B1 coincides with the second end point D4 of the second light spot B2, and the first light spot B1 and the second light spot B2 are perpendicular to each other, in this case, the first line segment N1 can be obtained from the first position P1 of the second end point D2 of the first light spot B1 and the second position P2 of the first end point D3 of the second light spot B2, and the position of the midpoint of the first line segment N1 can be used as the actual center position PA of the wafer W.
According to another preferred embodiment of the present invention, referring to fig. 5, the first spot B1 and the second spot B2 are perpendicular to each other and the second spot B2 passes through the midpoint of the first spot B1, the sensor 11 acquires the position of the midpoint of the second spot B2, and the position of the midpoint of the second spot B2 is taken as the actual center position PA of the wafer W.
As for the light source 10, preferably, referring to fig. 1, the light source 10 includes a light emitting body 101 for emitting a light beam and a guide portion 102 for guiding the light beam in a straight line.
During the processing of the wafer, the transfer of the wafer between the different stations is generally performed by a robot arm, for which, preferably, referring to fig. 1, the light source 10 is arranged on a robot arm R for taking and placing the wafer W.
Further preferably, the controller 13 controls the robot arm R to move so that the actual center position PA of the wafer W held by the robot arm R coincides with the target center position PP.
The position of the wafer is controlled by controlling the movement of the mechanical arm R, the wafer can be placed at the target position at one time after being aligned with the target position, the process of repeatedly picking and placing the wafer is avoided, the risk that the wafer is damaged by a mechanical arm is reduced, and the operation efficiency is improved.
Referring to fig. 6, an embodiment of the present invention further provides a method for adjusting a wafer position, where the method includes:
s101: irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are linear and two end points of each light spot are located at the periphery of the wafer;
s102: sensing the actual central position of the wafer according to the first light spot and the second light spot;
s103: obtaining a deviation between the actual center position and a target center position of the wafer;
s104: and controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
The sensing the actual center position of the wafer according to the first light spot and the second light spot comprises:
acquiring at least three positions of a first position of a first end point of the first light spot, a second position of a second end point of the first light spot, a third position of the first end point of the second light spot and a fourth position of the second end point of the second light spot;
and taking the position of the intersection point of the perpendicular bisectors of the two line segments connecting the at least three positions as the actual central position of the wafer.
According to a preferred embodiment of the invention, the two positions where each line segment connects are not adjacent.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. An apparatus for adjusting a position of a wafer, the apparatus comprising:
the device comprises a light source, a first light source and a second light source, wherein the light source is used for irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, the first light spot and the second light spot are linear, and two end points of each light spot are located at the periphery of the wafer;
the sensor is used for sensing the actual central position of the wafer according to the first light spot and the second light spot;
a processor for obtaining a deviation between the actual center position and a target center position of the wafer;
a controller for controlling the wafer to move according to the deviation so that the actual center position coincides with the target center position.
2. The apparatus of claim 1, wherein the sensor obtains at least three positions of a first position of a first end point of the first spot, a second position of a second end point of the first spot, a third position of the first end point of the second spot, and a fourth position of the second end point of the second spot, and uses a position of an intersection of perpendicular bisectors of two line segments connecting the at least three positions as the actual center position of the wafer.
3. The apparatus of claim 2, wherein the two locations where each line segment connects are not adjacent.
4. The apparatus of claim 1, wherein a first end of the first spot coincides with a second end of the second spot and the first spot and the second spot are perpendicular to each other, the sensor acquires a first position of the second end of the first spot and a second position of the second end of the second spot, and a position of a midpoint of a line segment connecting the first position and the second position is taken as the actual center position of the wafer.
5. The apparatus of claim 1, wherein the first and second spots are perpendicular to each other and the second spot passes through a midpoint of the first spot, and wherein the sensor acquires a position of the midpoint of the second spot and uses the position of the midpoint of the second spot as the actual center position of the wafer.
6. The apparatus of any one of claims 1 to 5, wherein the light source is disposed on a robotic arm for handling wafers.
7. The apparatus of claim 6, wherein the controller controls the robot arm to move so that the actual center position of the wafer gripped by the robot arm coincides with the target center position.
8. A method for adjusting a position of a wafer, the method comprising:
irradiating a light beam to a wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are linear and two end points of each light spot are located at the periphery of the wafer;
sensing the actual central position of the wafer according to the first light spot and the second light spot;
obtaining a deviation between the actual center position and a target center position of the wafer;
and controlling the wafer to move according to the deviation so as to enable the actual center position to coincide with the target center position.
9. The method of claim 8, wherein sensing the actual center position of the wafer from the first and second spots comprises:
acquiring at least three positions of a first position of a first end point of the first light spot, a second position of a second end point of the first light spot, a third position of a first end point of the second light spot and a fourth position of a second end point of the second light spot;
and taking the position of the intersection point of the perpendicular bisectors of the two line segments connecting the at least three positions as the actual central position of the wafer.
10. The method of claim 9, wherein the two locations where each line segment connects are not adjacent.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210767535.6A CN114823455B (en) | 2022-07-01 | 2022-07-01 | Device and method for adjusting wafer position |
| TW111140347A TWI817786B (en) | 2022-07-01 | 2022-10-25 | Device and method for adjusting wafer position |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210767535.6A CN114823455B (en) | 2022-07-01 | 2022-07-01 | Device and method for adjusting wafer position |
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| CN114823455A true CN114823455A (en) | 2022-07-29 |
| CN114823455B CN114823455B (en) | 2023-05-12 |
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| CN202210767535.6A Active CN114823455B (en) | 2022-07-01 | 2022-07-01 | Device and method for adjusting wafer position |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117080119A (en) * | 2023-08-17 | 2023-11-17 | 泓浒(苏州)半导体科技有限公司 | Method and system for detecting and calibrating semiconductor wafer position |
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- 2022-10-25 TW TW111140347A patent/TWI817786B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202312340A (en) | 2023-03-16 |
| CN114823455B (en) | 2023-05-12 |
| TWI817786B (en) | 2023-10-01 |
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |