TWI817786B - Device and method for adjusting wafer position - Google Patents
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Abstract
本發明公開了一種用於調節晶圓位置的裝置和方法，其主要包括：光源，光源用於向晶圓照射光束以在晶圓的表面上形成第一光斑和第二光斑，其中，第一光斑和第二光斑都呈直線狀並且各自的兩個端點位於晶圓的周緣處； 感測器，感測器用於根據第一光斑和第二光斑感測器晶圓的實際中心位置； 處理器，處理器用於獲得實際中心位置與晶圓的目標中心位置之間的偏差； 控制器，控制器用於根據偏差控制晶圓移動以使實際中心位置與目標中心位置重合。The invention discloses a device and method for adjusting the position of a wafer, which mainly includes: a light source, the light source is used to irradiate a light beam to the wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot Both the light spot and the second light spot are linear and their two endpoints are located at the periphery of the wafer; a sensor, which is used to sense the actual center position of the wafer based on the first light spot and the second light spot; processing The processor is used to obtain the deviation between the actual center position and the target center position of the wafer; the controller is used to control the movement of the wafer according to the deviation so that the actual center position coincides with the target center position.
Description
本發明屬於半導體生產技術領域，尤指一種用於調節晶圓位置的裝置和方法。The invention belongs to the technical field of semiconductor production, and in particular, refers to a device and method for adjusting the position of a wafer.
用於傳送儲存在晶圓盒中的晶圓的多手臂晶圓傳送設備在相關技術中是已知的。 晶圓盒通常具有多個以層疊的方式排列在晶圓盒內的槽位，每個槽位都適於放置單個晶圓，而多手臂晶圓傳送設備具有多個夾取手臂，可以同時地或一次性地夾取與多個夾取手臂對應的槽位中的相應的多個晶圓，並且多個夾取手臂可以隨該設備的機械手臂一起移動以將夾取的晶圓傳送至目標位置。 在晶圓生產過程中，為了對晶圓執行研磨/刻蝕/拋光/檢測等操作，通常需要由機械手頻繁將晶圓取出/放入片盒中，並需要經常對晶圓位置進行檢測。Multi-arm wafer transfer apparatuses for transferring wafers stored in wafer cassettes are known in the related art. The wafer cassette usually has multiple slots arranged in a stacked manner within the wafer cassette, each slot is suitable for placing a single wafer, while the multi-arm wafer transfer equipment has multiple gripping arms that can simultaneously Or multiple wafers in slots corresponding to multiple clamping arms can be clamped at one time, and the multiple clamping arms can move together with the robotic arm of the equipment to transfer the clamped wafers to the target. Location. During the wafer production process, in order to perform operations such as grinding/etching/polishing/inspection on the wafer, a robot usually needs to frequently take out/put the wafer into the cassette, and the wafer position needs to be frequently detected.
常見的晶圓位置檢測方式是指使機械手在攜帶晶圓的狀態下穿過特定檢測裝置，檢測裝置中特定的感測器將記錄晶圓進入感測器的時刻和離開感測器的時刻，利用時間及速度來確定晶圓位置。A common wafer position detection method is to make the robot pass through a specific detection device while carrying the wafer. A specific sensor in the detection device will record the moment the wafer enters the sensor and the moment it leaves the sensor. Use time and speed to determine wafer position.
然而，目前的檢測方式的精度受到感測器回應時間、通訊延時及機械手加減速速度等的影響較大，因此檢測精度低，而且機械手攜帶晶圓經過特定檢測裝置的過程會影響生產進度，進而影響產能。However, the accuracy of the current detection method is greatly affected by sensor response time, communication delay, and robot acceleration and deceleration speed. Therefore, the detection accuracy is low, and the process of the robot carrying the wafer through a specific detection device will affect the production progress. This in turn affects production capacity.
為解決上述技術問題，本發明期望提供一種通過非接觸方式感測晶圓位置並將晶圓調節至目標位置的裝置和方法。In order to solve the above technical problems, the present invention is expected to provide a device and method for sensing the position of a wafer in a non-contact manner and adjusting the wafer to a target position.
本發明的技術方案是這樣實現的：第一方面，本發明提供了一種用於調節晶圓位置的裝置，其主要包括：光源，光源用於向晶圓照射光束以在晶圓的表面上形成第一光斑和第二光斑，其中，第一光斑和第二光斑都呈直線狀並且各自的兩個端點位於晶圓的周緣處；感測器，感測器用於根據第一光斑和第二光斑感測器晶圓的實際中心位置；處理器，處理器用於獲得實際中心位置與晶圓的目標中心位置之間的偏差； 控制器，控制器用於根據偏差控制晶圓移動以使實際中心位置與目標中心位置重合。The technical solution of the present invention is implemented as follows: First, the present invention provides a device for adjusting the position of a wafer, which mainly includes: a light source, and the light source is used to irradiate a beam of light to the wafer to form a pattern on the surface of the wafer. The first light spot and the second light spot, wherein the first light spot and the second light spot are linear and their two endpoints are located at the periphery of the wafer; the sensor is used to detect the first light spot and the second light spot according to the first light spot and the second light spot. The actual center position of the spot sensor wafer; the processor, which is used to obtain the deviation between the actual center position and the target center position of the wafer; the controller, which is used to control the movement of the wafer according to the deviation to achieve the actual center position coincides with the target center position.
第二方面，本發明提供了一種用於調節晶圓位置的方法，其步驟包括：向晶圓照射光束以在晶圓的表面上形成第一光斑和第二光斑，其中，第一光斑和第二光斑都呈直線狀並且各自的兩個端點位於晶圓的周緣處； 根據第一光斑和第二光斑感測晶圓的實際中心位置； 獲得實際中心位置與晶圓的目標中心位置之間的偏差； 根據偏差控制晶圓移動以使實際中心位置與目標中心位置重合。In a second aspect, the present invention provides a method for adjusting the position of a wafer, the steps of which include: irradiating a light beam to the wafer to form a first light spot and a second light spot on the surface of the wafer, wherein the first light spot and the second light spot are Both light spots are linear and their two endpoints are located at the periphery of the wafer; the actual center position of the wafer is sensed based on the first light spot and the second light spot; the distance between the actual center position and the target center position of the wafer is obtained Deviation; Control the wafer movement according to the deviation so that the actual center position coincides with the target center position.
本發明提供了一種用於調節晶圓位置的裝置和方法； 該裝置包括光源、感測器、處理器和控制器，感測器根據由光源投射在晶圓表面上的光束形成的光斑感測器的實際中心位置，控制器根據由處理器獲得的實際中心位置與目標中心位置之間的偏差控制晶圓移動，以使晶圓的實際中心位置與目標中心位置重合，由此，通過非接觸的方式便可確定晶圓的實際中心位置，而且感測器、處理器和控制器形成閉環控制， 控制器根據感測器根據感測器及計算結果執行調節晶圓位置的操作，實現了以簡便並且精度高的方式調整晶圓的位置。The invention provides a device and method for adjusting the position of a wafer; the device includes a light source, a sensor, a processor and a controller. The sensor senses the light spot formed by the light beam projected by the light source on the surface of the wafer. The controller controls the movement of the wafer based on the deviation between the actual center position obtained by the processor and the target center position, so that the actual center position of the wafer coincides with the target center position. The actual center position of the wafer can be determined in this way, and the sensor, processor and controller form a closed-loop control. The controller performs the operation of adjusting the wafer position according to the sensor and the calculation results, realizing the Adjust wafer position easily and with high precision.
下面將結合本發明實施例中的附圖，對本發明實施例中的技術方案進行清楚、完整地描述。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
參見圖1，本發明實施例提供了一種用於調節晶圓位置的裝置1，裝置1包括：光源10，光源10用於向晶圓W照射光束以在晶圓W的表面上形成第一光斑B1和第二光斑B2，其中，第一光斑B1和第二光斑B2都呈直線狀並且各自的兩個端點位於晶圓W的周緣WP處； 感測器11，感測器11用於根據第一光斑B1和第二光斑B2感測器晶圓W的實際中心位置PA； 處理器12，處理器12用於獲得實際中心位置PA與晶圓W的目標中心位置PP之間的偏差DA； 控制器13，控制器13用於根據偏差DA控制晶圓W移動以使實際中心位置PA與目標中心位置PP重合。Referring to Figure 1, an embodiment of the present invention provides a device 1 for adjusting the position of a wafer. The device 1 includes: a light source 10. The light source 10 is used to irradiate a light beam onto the wafer W to form a first light spot on the surface of the wafer W. B1 and the second light spot B2, wherein the first light spot B1 and the second light spot B2 are linear and their respective two endpoints are located at the peripheral edge WP of the wafer W; the sensor 11, the sensor 11 is used according to The first light spot B1 and the second light spot B2 sensor the actual center position PA of the wafer W; The processor 12 is used to obtain the deviation DA between the actual center position PA and the target center position PP of the wafer W; The controller 13 is used to control the movement of the wafer W according to the deviation DA so that the actual center position PA coincides with the target center position PP.
本發明實施例提供了一種用於調節晶圓位置的裝置； 該裝置1包括光源10、感測器11、處理器12和控制器13，感測器11根據由光源10投射在晶圓W表面上的光束形成的兩個光斑感測器W的實際中心位置PA，控制器13根據由處理器12獲得的實際中心位置PA與目標中心位置PP之間的偏差DA控制晶圓W移動，以使晶圓W的實際中心位置PA與目標中心位置PP重合，由此， 通過非接觸的方式便可確定晶圓W的實際中心位置PA，而且感測器11、處理器12和控制器13形成閉環控制，控制器13根據感測器及計算結果執行調節晶圓W位置的操作，實現了以簡便並且精度高的方式調整晶圓W的位置。The embodiment of the present invention provides a device for adjusting the position of a wafer; the device 1 includes a light source 10, a sensor 11, a processor 12 and a controller 13. The sensor 11 is projected on the surface of the wafer W by the light source 10. The controller 13 controls the movement of the wafer W according to the deviation DA between the actual center position PA obtained by the processor 12 and the target center position PP, so that The actual center position PA of the wafer W coincides with the target center position PP. Therefore, the actual center position PA of the wafer W can be determined in a non-contact manner, and the sensor 11, the processor 12 and the controller 13 form a closed loop. The controller 13 performs the operation of adjusting the position of the wafer W according to the sensor and calculation results, thereby realizing the adjustment of the position of the wafer W in a simple and high-precision manner.
下面將通過不同實施例說明感測器11感測器11感測器的實際中心位置的方式。The actual center position of the sensor 11 will be explained below through different embodiments.
根據本發明的一個可選實施例，參見圖2，感測器11獲取第一光斑B1的第一端點D1的第一位置P1、第一光斑B1的第二端點D2的第二位置P2、第二光斑B2的第一端點D3的第三位置P3和第二光斑B2的第二端點D4的第四位置P4中的至少三個位置， 並且將連接至少三個位置的兩條線段的中垂線的交點的位置作為晶圓W的實際中心位置PA。 在圖2中示出的實施例中，連接第一光斑B1的第一端點D1的第一位置P1和第一光斑B1的第二端點D2的第二位置P2形成第一線段N1，並且連接第一光斑B1的第一端點D1的第一位置P1和第二光斑B2的第二端點D4的第四位置P4形成第二線段N2，第一線段N1的中垂線為O1，第二線段N2的中垂線為O2， 中垂線O1的一端在點M1處垂直相交於第一線段N1，中垂線O2的一端在點M2處垂直於相交第二線段N2，中垂線O1的另一端與中垂線O2的另一端相交，二者的交點即為晶圓W的實際中心位置PA。According to an optional embodiment of the present invention, referring to Figure 2, the sensor 11 acquires the first position P1 of the first endpoint D1 of the first light spot B1 and the second position P2 of the second endpoint D2 of the first light spot B1. , at least three positions among the third position P3 of the first endpoint D3 of the second light spot B2 and the fourth position P4 of the second endpoint D4 of the second light spot B2, and will connect two line segments of at least three positions. The position of the intersection point of the mid-perpendicular line is regarded as the actual center position PA of the wafer W. In the embodiment shown in FIG. 2 , connecting the first position P1 of the first endpoint D1 of the first light spot B1 and the second position P2 of the second endpoint D2 of the first light spot B1 forms a first line segment N1, And connecting the first position P1 of the first endpoint D1 of the first light spot B1 and the fourth position P4 of the second endpoint D4 of the second light spot B2 to form a second line segment N2, the center perpendicular of the first line segment N1 is O1, The center perpendicular line of the second line segment N2 is O2. One end of the center perpendicular line O1 perpendicularly intersects the first line segment N1 at point M1. One end of the center perpendicular line O2 is perpendicular to the intersecting second line segment N2 at point M2. The other end of the center perpendicular line O1 One end intersects with the other end of the center vertical line O2, and the intersection point of the two is the actual center position PA of the wafer W.
為了使所感測到的晶圓的實際中心位置更精準，可選地，每條線段連接的兩個位置不相鄰，具體而言，如圖3所示，連接第一光斑B1的第一端點D1的第一位置P1和第二光斑B2的第一端點D3的第三位置P3形成第一線段N1，連接第一光斑B1的第二端點D2的第二位置P2和第二光斑B2的第二端點D4的第四位置P4形成第二線段N2， 根據圖2可以看出，第一線段N1的兩個端點沿晶圓的圓周方向彼此並不相鄰，而是被第一光斑B1的第二端點D2間隔開，同樣，第二線段N2的兩個端點沿晶圓的圓周方向彼此也不相鄰，而是被第二光斑B2的第一端點D3間隔開，由此可以將兩個光斑的四個端點的位置同時作為獲取的晶圓的實際中心位置的條件值。 通過獲得第一線段N1的中垂線與第二線段N2的中垂線的交點的位置即可以確定晶圓W的實際中心位置PA。In order to make the actual center position of the wafer sensed more accurate, optionally, the two positions connected by each line segment are not adjacent. Specifically, as shown in Figure 3, the first end of the first light spot B1 is connected. The first position P1 of point D1 and the third position P3 of the first endpoint D3 of the second light spot B2 form a first line segment N1, connecting the second position P2 of the second endpoint D2 of the first light spot B1 and the second light spot. The fourth position P4 of the second endpoint D4 of B2 forms a second line segment N2. According to Figure 2, it can be seen that the two endpoints of the first line segment N1 are not adjacent to each other along the circumferential direction of the wafer, but are The second endpoint D2 of the first light spot B1 is spaced apart. Similarly, the two endpoints of the second line segment N2 are not adjacent to each other along the circumferential direction of the wafer, but are separated by the first endpoint D3 of the second light spot B2. Open, thus the positions of the four endpoints of the two light spots can be simultaneously used as the conditional value of the actual center position of the acquired wafer. The actual center position PA of the wafer W can be determined by obtaining the intersection position of the mid-perpendicular line of the first line segment N1 and the mid-perpendicular line of the second line segment N2.
根據本發明的一個可選實施例，參見圖4，第一光斑B1的第一端點D1與第二光斑B2的第二端點D4重合並且第一光斑B1與第二光斑B2彼此垂直，感測器11獲取第一光斑B1的第二端點D2的第一位置P1和第二光斑B2的第一端點D3的第二位置P2， 並且將連接第一位置P1和第二位置P2的線段的中點的位置作為晶圓W的實際中心位置PA。According to an optional embodiment of the present invention, referring to Figure 4, the first end point D1 of the first light spot B1 coincides with the second end point D4 of the second light spot B2, and the first light spot B1 and the second light spot B2 are perpendicular to each other. The detector 11 acquires the first position P1 of the second endpoint D2 of the first light spot B1 and the second position P2 of the first endpoint D3 of the second light spot B2, and connects the line segment between the first position P1 and the second position P2. The position of the midpoint is taken as the actual center position PA of the wafer W.
具體地，參見圖4，第一光斑B1的第一端點D1與第二光斑B2的第二端點D4重合，並且第一光斑B1與第二光斑B2彼此垂直，在這種情況下，連接第一光斑B1的第二端點D2的第一位置P1與第二光斑B2的第一端點D3的第二位置P2可以獲得第一線段N1，第一線段N1的中點的位置即可作為晶圓W的實際中心位置PA。Specifically, referring to Figure 4, the first end point D1 of the first light spot B1 coincides with the second end point D4 of the second light spot B2, and the first light spot B1 and the second light spot B2 are perpendicular to each other. In this case, the connection The first line segment N1 can be obtained from the first position P1 of the second endpoint D2 of the first light spot B1 and the second position P2 of the first endpoint D3 of the second light spot B2. The position of the midpoint of the first line segment N1 is It can be used as the actual center position PA of the wafer W.
根據本發明另一可選實施例，參見圖5，第一光斑B1與第二光斑B2彼此垂直並且第二光斑B2通過第一光斑B1的中點，感測器11獲取第二光斑B2的中點的位置，並且將第二光斑B2的中點的位置作為晶圓W的實際中心位置PA。According to another optional embodiment of the present invention, referring to Figure 5, the first light spot B1 and the second light spot B2 are perpendicular to each other and the second light spot B2 passes through the midpoint of the first light spot B1. The sensor 11 acquires the midpoint of the second light spot B2. point position, and the position of the midpoint of the second light spot B2 is regarded as the actual center position PA of the wafer W.
對於光源10，可選地，參見圖1，光源10包括用於發射光束的發光本體101和用於將光束引導成直線狀的引導部102。Regarding the light source 10, optionally, referring to Fig. 1, the light source 10 includes a light-emitting body 101 for emitting a light beam and a guide portion 102 for guiding the light beam into a straight line.
在晶圓的加工過程中，晶圓在不同工位之間的轉運通常由機械臂執行，對此，可選地，參見圖1，光源10設置在用於取放晶圓W的機械臂R上。During the processing of wafers, the transfer of wafers between different workstations is usually performed by a robotic arm. For this purpose, optionally, referring to FIG. 1 , the light source 10 is provided on the robotic arm R used to pick and place the wafer W. superior.
進一步可選地，控制器13通過控制機械臂R移動以使被機械臂R抓持的晶圓W的實際中心位置PA與目標中心位置PP重合。Further optionally, the controller 13 controls the robot arm R to move so that the actual center position PA of the wafer W grasped by the robot arm R coincides with the target center position PP.
通過控制機械臂R的移動來控制晶圓的位置，可以在使晶圓與目標位置對準後一次性將晶圓放置在目標位置處，避免了反覆拾取和放置晶圓的過程，由此也降低了機械手損傷晶圓的風險，而且提高了操作效率。By controlling the movement of the robotic arm R to control the position of the wafer, the wafer can be placed at the target position at one time after aligning the wafer with the target position, avoiding the process of repeatedly picking up and placing the wafer, thereby also The risk of robot damage to the wafer is reduced and operating efficiency is improved.
參見圖6，本發明實施例還提供了一種用於調節晶圓位置的方法，其步驟包括：S101：向晶圓照射光束以在晶圓的表面上形成第一光斑和第二光斑，其中，第一光斑和第二光斑都呈直線狀並且各自的兩個端點位於晶圓的周緣處；S102：根據第一光斑和第二光斑感測晶圓的實際中心位置；S103：獲得實際中心位置與晶圓的目標中心位置之間的偏差；S104：根據偏差控制晶圓移動以使實際中心位置與目標中心位置重合。Referring to Figure 6, an embodiment of the present invention also provides a method for adjusting the position of a wafer, the steps of which include: S101: irradiate a light beam to the wafer to form a first light spot and a second light spot on the surface of the wafer, wherein, Both the first light spot and the second light spot are linear and their two endpoints are located at the periphery of the wafer; S102: Detect the actual center position of the wafer based on the first light spot and the second light spot; S103: Obtain the actual center position Deviation from the target center position of the wafer; S104: Control the movement of the wafer according to the deviation so that the actual center position coincides with the target center position.
根據第一光斑和第二光斑感測晶圓的實際中心位置包括：獲取第一光斑的第一端點的第一位置、第一光斑的第二端點的第二位置、第二光斑的第一端點的第三位置和第二光斑的第二端點的第四位置中的至少三個位置； 將連接至少三個位置的兩條線段的中垂線的交點的位置作為晶圓的實際中心位置。Sensing the actual center position of the wafer according to the first light spot and the second light spot includes: obtaining the first position of the first endpoint of the first light spot, the second position of the second endpoint of the first light spot, the third position of the second light spot. At least three of the third position of one endpoint and the fourth position of the second endpoint of the second light spot; the position of the intersection of the mid-perpendicular line of the two line segments connecting at least three positions is regarded as the actual center of the wafer Location.
根據本發明的可選實施例，每條線段連接的兩個位置不相鄰。According to an optional embodiment of the present invention, two positions connected by each line segment are not adjacent.
需要說明的是：本發明實施例所記載的技術方案之間，在不衝突的情況下，可以任意組合。It should be noted that the technical solutions recorded in the embodiments of the present invention can be combined arbitrarily as long as there is no conflict.
以上所述，僅為本發明的具體實施方式，但本發明的保護範圍並不局限於此，任何熟悉本技術領域具通常之是者在本發明揭露的技術範圍內，可輕易想到變化或替換，都應涵蓋在本發明的保護範圍之內。 因此，本發明的保護範圍應以所述申請專利範圍的保護範圍為準。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Anyone familiar with the ordinary skills in this technical field can easily think of changes or substitutions within the technical scope disclosed in the present invention. , should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the patent application.
1:用於調節晶圓位置的裝置 11:感測器 12:處理器 13:控制器 10:光源 101:發光本體 102:引導部 B1:第一光斑 B2:第二光斑 D1:第一端點 D2:第二端點 D3:第三端點 D4:第四端點 DA:偏差 M1:點 M2:點 N1:第一線段 N2:第二線段 O1:第一線段的中垂線 O2:第二線段的中垂線 P1:第一位置 P2:第二位置 P3:第三位置 P4:第四位置 PA:實際中心位置 PP:目標中心位置 R:機械臂 W:晶圓 WP:周緣 S101~S104:步驟流程 1: Device for adjusting wafer position 11: Sensor 12: Processor 13:Controller 10:Light source 101: Luminous body 102: Guidance Department B1: first light spot B2: The second light spot D1: first endpoint D2: second endpoint D3: The third endpoint D4: The fourth endpoint DA: deviation M1: point M2: point N1: first line segment N2: second line segment O1: The center perpendicular of the first line segment O2: the center perpendicular of the second line segment P1: first position P2: second position P3: third position P4: fourth position PA: actual center position PP: target center position R: Robot arm W:wafer WP:Periphery S101~S104: step process
圖1示出了根據本發明實施例的用於調節晶圓位置的裝置的示意圖； 圖2示出了根據本發明實施例的用於調節晶圓位置的裝置感測晶圓的實際中心位置的示意圖； 圖3示出了根據本發明的另一實施例的用於調節晶圓位置的裝置感測晶圓的實際中心位置的示意圖； 圖4示出了根據本發明的另一實施例的用於調節晶圓位置的裝置感測晶圓的實際中心位置的示意圖； 圖5示出了根據本發明的另一實施例的用於調節晶圓位置的裝置感測晶圓的實際中心位置的示意圖； 圖6示出了根據本發明實施例的用於調節晶圓位置的方法的示意圖。 Figure 1 shows a schematic diagram of a device for adjusting a wafer position according to an embodiment of the present invention; 2 shows a schematic diagram of a device for adjusting a wafer position sensing the actual center position of a wafer according to an embodiment of the present invention; 3 shows a schematic diagram of a device for adjusting the position of a wafer sensing the actual center position of the wafer according to another embodiment of the present invention; 4 shows a schematic diagram of a device for adjusting the position of a wafer sensing the actual center position of the wafer according to another embodiment of the present invention; 5 shows a schematic diagram of a device for adjusting the position of a wafer sensing the actual center position of the wafer according to another embodiment of the present invention; FIG. 6 shows a schematic diagram of a method for adjusting a wafer position according to an embodiment of the present invention.
1:用於調節晶圓位置的裝置 1: Device for adjusting wafer position
11:感測器 11: Sensor
12:處理器 12: Processor
13:控制器 13:Controller
10:光源 10:Light source
101:發光本體 101: Luminous body
102:引導部 102: Guidance Department
B1:第一光斑 B1: first light spot
B2:第二光斑 B2: The second light spot
DA:偏差 DA: deviation
PA:實際中心位置 PA: actual center position
PP:目標中心位置 PP: target center position
R:機械臂 R: Robot arm
W:晶圓 W:wafer
WP:周緣 WP:Periphery
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