CN106569390B - A kind of projection aligner and method - Google Patents
A kind of projection aligner and method Download PDFInfo
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- CN106569390B CN106569390B CN201510646618.XA CN201510646618A CN106569390B CN 106569390 B CN106569390 B CN 106569390B CN 201510646618 A CN201510646618 A CN 201510646618A CN 106569390 B CN106569390 B CN 106569390B
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Abstract
The present invention provides a kind of projection aligner, it successively include: lighting source, mask plate, mask stage, substrate, work stage, control system, all it is equipped with alignment focal plane measuring system and projection objective group side by side in each exposure area and between mask stage and substrate, focal plane measuring system is directed to be used for during the scan exposure crosses Cheng Qian or scan exposure, while carrying out the mask plate and the substrate to locating tab assembly, the focal plane measurement of the substrate is carried out.The present invention also provides a kind of exposure methods, each alignment mark is calculated into original coordinate and compensation rate and is added to obtain compensation coordinate, it calculates the relative position of mask plate and substrate and travelling workpiece platform compensates, position is completed at the same time to be aligned with focal plane, have the advantages that structure is simple, occupy little space, precision it is high.
Description
Technical field
The present invention relates to semiconductor lithography field, in particular to a kind of projection aligner and method.
Background technique
TFT (Thin Film Transistor) is the abbreviation of thin film transistor, be it is a kind of using new material and
The large-scale semiconductive completely inegrated circuit manufacturing technology of new process.TFT is in the on-monocrystallines such as glass or plastic base piece or crystalline substance
On piece forms various films necessary to manufacture circuit by sputtering, chemical deposition process, passes through the processing and fabricating extensive half to film
Conductor integrated circuit.With the development of associated electrical consumer product, increasing, integrated unit is required to the size of TFT
More and more, single lighting system is difficult meet the needs of TFT photoetching.It is generally used in the step such as IC manufacturing, encapsulation
Maximum illumination field of view into lithographic equipment is generally 8 inches, and scanning photoetching is also to have bigger visual field in scanning direction, and one
As also be no more than 10 inches.But present five TFT exposure fields more than generation, all at 17 inches or more, the illumination of single lens regards
Field is far from satisfying the requirement of big visual field photoetching, so more field stitching scan projection aligners just come into being, very well
The contradiction solved between the element manufacturing of large area and yield, be widely used in large-scale semiconductor device, FPD, thin
In the production of film.
More object lens, more visual fields Overlap-scanning put forward higher requirement to Barebone, because exposure device area increase
Greatly, to realize, accurately alignment needs to be arranged multiple alignment visual field points.It is disclosed in the prior art for a kind of more field stitchings
The alignment and focal plane measuring system of exposure device, structure mainly include a lighting source, multiple lighting systems, mask plate,
Exposure mask objective table, multiple projection optical systems, sensitive substrate, substrate objective table are additionally provided with several shiftings in mask plate two sides
Index glass and laser interferometer also set up exposure mask detection system between each exposure area of mask plate, in multiple projection optics systems
Also set up substrate detection system, Autocorrection System of Conveyor-belt between system, further include control device, control device respectively with all lighting systems,
All projection optical systems, all moving lens, all laser interferometer, all exposure mask detection systems, all substrate detection systems
It is several by the way that the pattern for needing to expose to be divided into all Autocorrection System of Conveyor-belt and substrate objective table, exposure mask objective table circuit connection
A exposure area carries out alignment and scan exposure in each exposure area, while alignment and scan exposure, each region
Exposure mask detection system, substrate detection system and the Autocorrection System of Conveyor-belt of two sides detect the parameter exposed in one's respective area respectively, it is ensured that every
Exposure in a region precisely carries out, while control device is modified the exposure parameter in each region, further increases exposure
The precision of light, but this exposure device and exposure method the problem is that: in this exposure device, be responsible for substrate with
The device that the device of mask plate position alignment is aligned with responsible focal plane is not the same device, in semiconductor fabrication processes,
Substrate can generate different degrees of warpage because of heated or discontinuity, and be influenced by sensitive substrate warpage,
When exposure, position alignment and focal plane be not to the focal plane that Barebone is surveyed not on the same face, therefore influence measurement result, and
And within each exposure area, will be arranged on substrate multiple moving lens, laser interferometer, substrate detection system and
Autocorrection System of Conveyor-belt, so that the flexibility of space layout reduces, it is therefore necessary to invent it is a kind of it is easy to operate, structure is simple, it is empty to occupy
Between small, precision it is high and be suitable for the exposure device or exposure method of big visual field photoetching.
Summary of the invention
To solve the above problems, only making the invention proposes a kind of projection aligner and method in each exposure area
With single alignment focal plane measuring system, position alignment and focal plane alignment, behaviour can be carried out simultaneously on the same substrate height face
Make convenient, structure simply and occupy little space, precision is high, improves the flexibility of measuring system space layout.
In order to achieve the above objectives, the present invention provides a kind of projection aligner, successively includes:
One lighting source；
One lamp optical system；
Mask stage, for carrying mask plate；
Projection objective group；
Work stage, for carrying a substrate, during scan exposure, the light beam that the light source occurs, by the photograph
The pattern that bright optical system is irradiated on the mask plate, and the mask plate will be arranged in turns by the projection objective
It prints on the substrate；
And the control system with mask stage circuit connection,
The projection aligner further includes alignment focal plane measuring system, setting the mask stage and the work stage it
Between, for carrying out alignment survey to the mask plate and the substrate during scan exposure crosses Cheng Qian or scan exposure
While amount, the focal plane measurement of the substrate is carried out.
Preferably, the substrate is divided into several exposure areas, it is designed in each exposure area described
It is directed at focal plane measuring system and the projection objective group.
Preferably, the alignment focal plane measuring system is connect with the control system circuit, the alignment focal plane measurement
System includes several alignment focal plane measuring units, and each alignment focal plane measuring unit successively includes area array cameras, first
Image-forming assembly, Amici prism and the second image-forming assembly, also successively include the first light fixture, diaphragm and the second light fixture,
First light fixture is connect with the Amici prism optical path, and second light fixture and the lighting source optical path connect
It connects.
Preferably, light hole is arranged in the diaphragm center, four slits are set in the light hole surrounding, described four
Slit is in a center of symmetry about the diaphragm center, and four shape of slit are round or rectangular.
Preferably, the diaphragm is four slits and the light hole apart from adjustable structure.
Preferably, being equipped with shutter between the diaphragm and second light fixture.
Preferably, the lighting source be with two waveband halogen lamp or two waveband LED, and the diaphragm with
Annular filter wave plate is equipped between second light fixture.
Preferably, the projection objective group is equipped with several projection objectives, the projection objective group is equipped with public focal plane.
Preferably, the lighting source is single-range halogen lamp or single-range LED, the lighting source has
Avoid the optical band of photo resist photosensitive.
Preferably, the baseplate material is glass or silica-base material.
Preferably, the upper surface of base plate is equipped with alignment mark, the alignment mark number is two or more, described to cover
Film version surface is equipped with mask alignment mark, and the mask alignment mark number is two or more.
Preferably, when the mask plate is aligned with the substrate position, in each exposure area, the control
At least show an alignment mark group in system processed, the alignment mark group is the alignment mark and cover described in one
The image that film alignment mark center is overlapped.
The present invention also provides a kind of exposure methods, including alignment actions and exposure actions, in each exposure area
Setting alignment focal plane measuring system drives the movement of datum plate, record by travelling workpiece platform when carrying out alignment actions
The radius change of hot spot circle in each alignment focal plane measuring unit, calculates under each alignment focal plane measuring unit
The work stage at an arbitrary position when relative to projection objective group public focal plane vertical offset and the work stage exist
Inclined light shaft on any position, the then inclined light shaft of the work stage on any position and the on the position work stage
The product of vertical offset relative to the public focal plane is the compensation rate of the alignment mark on each datum plate, and
The coordinate of each alignment mark is compensated, the compensation coordinate of each alignment mark is obtained after compensation, then passes through each institute
The compensation coordinate for stating alignment mark calculates the positional relationship of presently described substrate Yu the mask plate, moves the work stage,
So that the substrate is aligned with the mask plate, it is then exposed movement.
Preferably, method includes the following steps:
Step 1: when carrying out alignment actions, lighting source is opened, the exposure area is arbitrarily selected to expose as first
First exposure area is moved horizontally to the alignment focal plane by the mobile work stage of control system and measured by light region
In the field range of system, calculating carries the mask stage of the mask plate and the relative positional relationship of the work stage at this time；
Step 2: moving horizontally the work stage by the control system, and the datum plate is moved to the alignment
In focal plane measuring system field range, in each alignment focal plane measuring unit, light that the lighting source issues according to
Secondary the second light fixture by the alignment focal plane measuring system, diaphragm, the first light fixture, Amici prism, the second one-tenth
The reflected beams are formed on the substrate as component reaches, the reflected beams successively pass through second image-forming assembly, described point
Light prism, the first image-forming assembly are finally imaged to the area array cameras in the alignment focal plane measuring system, through the diaphragm
The light of four slits four hot spots are then formed on the area array cameras, with all equal with four spot centers distances
Point as at a distance from the center of circle, with any one of spot center be used as radius be formed by circle be the hot spot circle；
Step 3: vertically moving the work stage by the control system, so that the upper surface of the datum plate is located at
The public focal plane of the projection objective group, then the hot spot circle in the alignment focal plane measuring unit each at this time is standard light
Spot circle, the control system record and save in the position coordinates and each alignment focal plane measuring unit of the work stage
Standard hot spot radius of circle r0；
Step 4: arbitrarily vertically moving the work stage by the control system, workpiece when recording mobile every time
The position coordinates of platform and each radius for being directed at hot spot circle in focal plane measuring unit, calculate the work stage and vertically move
Then dynamic position coordinates variation is calculated with each relationship for being directed at the hot spot radius of circle variation in focal plane measuring unit
Under each alignment focal plane measuring unit the work stage at an arbitrary position when vertical shift relative to the public focal plane
Amount；
Step 5: the work stage is arbitrarily vertically moved by control system, when the control system is according to each movement
The coordinate position of the work stage calculates inclined light shaft expression formula existing for optical path in each alignment focal plane measuring unit,
Inclined light shaft when then the control system calculates the work stage at an arbitrary position by the inclined light shaft expression formula；
Step 6: moving horizontally the work stage by the control system, will be all in first exposure area
The alignment mark moves into the field range of the alignment focal plane measuring system, and obtains the level of all alignment marks
Position coordinates are as original coordinate；
Step 7: according to step 4, the control system calculates each alignment mark relative to the public coke
The vertical offset in face calculates the inclined light shaft of each alignment mark according to step 5, then the control system according to
The vertical offset of each alignment mark and the inclined light shaft compensate original coordinate, compensated
Horizontal position coordinate is compensation coordinate；
Step 8: the control system according to the compensation coordinate of the alignment mark calculate the substrate with it is described
The relative positional relationship of work stage, and closed by the relative position of the mask stage and the work stage that are calculated in step 1
System calculates the relative positional relationship of the mask plate Yu the substrate, then the control system pass through the mask plate with it is described
The mobile work stage of the relative positional relationship of substrate or the mask stage, until showing at least one in the control system
A alignment mark group, and at the same time display focal plane has been aligned, then alignment actions are completed；
Step 9: when being exposed movement, the scan exposure program opened in the control system is clicked, scan exposure is opened
Begin, and at the same time the mobile work stage and the mask stage, keep the substrate and the mask plate to exist in moving process
The aligned relationship formed in step 7, until exposure actions are completed；
Step 10: after the completion of the exposure of first exposure area, according to step 1 to step 9 one by one described in remaining
Exposure area carries out alignment actions and exposure actions.
Preferably, the horizontal coordinate of four spot centers described in step 2 is respectively (xa, ya), (xb, yb), (xc,
Yc), (xd, yd), then the calculation formula of the horizontal coordinate (x_ce, y_ce) of the round heart of the hot spot beThe then radius of the hot spot circle
Preferably, the calculation method of four spot centers is the gravity model appoach based on image grayscale or is based on figure
The geometrical center method at edge.
It is measured preferably, work stage described in step 4 vertically moves position coordinates variation with each focal plane that is aligned
The relationship of the hot spot radius of circle variation is that focal plane corrects machine constant in unit, then the control system is according to each described
The focal plane for being directed at focal plane measuring unit corrects machine constantWith the standard hot spot radius of circle r0It is each described right to calculate
Under quasi- focal plane measuring unit the work stage at an arbitrary position when vertical offset relative to the public focal plane.
Preferably, in step 4 under each alignment focal plane measuring unit the work stage at an arbitrary position when it is opposite
In the vertical offset of the public focal plane
Preferably, four vertical position to the coordinates for arbitrarily moving the work stage are (x1, y1, z1) in step, continue
Vertical position to the ordinate for arbitrarily moving the work stage is (x2, y2, z2), and the focal plane corrects machine constantWherein r1 is the radius of (x1, y1, z1) the corresponding hot spot circle, and r2 is (x2, y2, z2) corresponding described
The radius of hot spot circle.
Preferably, the inclined light shaft of each of step 5 alignment focal plane measuring unit is (θRy,θRx), and
Preferably, original coordinate in step 5 is (x, y), the compensation coordinate in step 6 is (X, Y),
Wherein X=x+ Δ Z × θRy, Y=y+ Δ Z × θRx。
Compared with prior art, it the beneficial effects of the present invention are: the present invention provides a kind of projection aligner, successively wraps
It includes: a lighting source；One lamp optical system；Mask stage, for carrying mask plate；Projection objective group；Work stage, for carrying
One substrate, during scan exposure, the light beam that the light source occurs is irradiated to described cover by the lamp optical system
In film version, and the pattern that the mask plate will be arranged in is transferred on the substrate by the projection objective；And with cover
The control system of film platform circuit connection, the projection aligner further include alignment focal plane measuring system, are arranged in the exposure mask
Between platform and the work stage, for during the scan exposure crosses Cheng Qian or scan exposure, to the mask plate and institute
While stating substrate and carry out to locating tab assembly, the focal plane measurement of the substrate is carried out.This avoid use multiple machines respectively into
Measuring locating tab assembly and focal plane for row substrate, simplifies device.
The present invention also provides a kind of exposure methods, in each exposure area, when carrying out alignment actions, first will
Datum plate is moved in the field range of alignment focal plane measuring system, is arbitrarily vertically moved work stage and is obtained each alignment focal plane survey
The variation relation for measuring Workpiece stage vertical position variation and hot spot radius of circle under unit, then calculates when substrate is in projection objective
When the public focal plane of group, the radius of the standard hot spot circle in each alignment focal plane measuring unit can thus calculate workpiece
Platform at an arbitrary position when, upper surface of base plate vertical offset relative to public focal plane in each alignment focal plane measuring unit,
Then work stage is arbitrarily vertically moved, the inclined light shaft expression formula of each alignment focal plane measuring unit is calculated, then by exposure region
All alignment marks in domain are moved in alignment focal plane measuring system field range, calculate each alignment mark each right
Vertical offset and inclined light shaft in quasi- focal plane measuring unit relative to public focal plane, and the product of the two is calculated often
The coordinate compensation rate of one alignment mark, each alignment mark original horizontal coordinate add respective coordinate compensation rate, obtain each
The compensation coordinate of alignment mark is calculated the relative positional relationship of substrate at this time and mask plate by compensating coordinate, and controls
System travelling workpiece platform processed or mask stage until show at least one alignment mark group in control system, and display base plate with
Mask plate position has been aligned, then substrate has all been aligned with mask plate position with focal plane, is exposed movement after the completion of alignment actions,
After the completion of the exposure of the exposure area, remaining exposure area is aligned and is exposed one by one.The present invention is by individually exposing
Setting alignment focal plane measuring system in light region calculates the related coefficient of each alignment focal plane measuring unit by datum plate,
Then the compensation rate of each alignment mark is calculated, and the coordinate of each alignment mark is compensated, obtains practical each alignment
Then the coordinate of label is calculated the relationship of front substrate and mask plate by the coordinate of each alignment mark, then moves work
Part platform, so that substrate is aligned with mask plate, position alignment is aligned with focal plane in this way in alignment focal plane measuring system carries out simultaneously,
And it measures and adjusts based on same plane, therefore precision is higher, single alignment focal plane measuring system is only set and is avoided
Multiple devices are set and carry out position alignment and focal plane alignment respectively, therefore easy to operate, structure is simple, occupies little space, precisely
Degree is high, improves the advantages of flexibility of measuring system space layout.
Detailed description of the invention
Fig. 1 is the exposure device structural schematic diagram of the embodiment of the present invention one；
Fig. 2 is each alignment focal plane measuring unit structural schematic diagram of the embodiment of the present invention one；
Fig. 3 is that optical path moves towards schematic diagram in each alignment focal plane measuring unit in the embodiment of the present invention one；
Fig. 4 is diaphragm right view in the embodiment of the present invention one；
Fig. 5 is the four hot spot schematic diagrames formed on area array cameras in the embodiment of the present invention one；
Fig. 6 is that datum plate is moved to schematic diagram in alignment focal plane measuring system visual field in the embodiment of the present invention one；
Fig. 7 is inclined light shaft schematic diagram in the embodiment of the present invention one；
Fig. 8 is coordinate schematic diagram original on area array cameras in the embodiment of the present invention one；
Fig. 9 is the exposure method flow chart of the embodiment of the present invention one；
Figure 10 is to measure the first line flag schematic diagram in the embodiment of the present invention one；
Figure 11 is to measure the second line flag schematic diagram in the embodiment of the present invention one；
Figure 12 is that focal plane measuring unit structural schematic diagram is directed in the embodiment of the present invention two；
Figure 13 is that focal plane measuring unit structural schematic diagram is directed in the embodiment of the present invention three.
In figure: 1- lighting source, 2- mask plate, 3- mask stage, 4- work stage, 5- substrate, the first alignment mark of 501-,
The second alignment mark of 502-, 503- third alignment mark, the 4th alignment mark of 504-, the 5th alignment mark of 505-, 506- the 6th
Alignment mark, the 7th alignment mark of 507-, the first exposure area 510-, 511- the first row alignment mark, the alignment of the second row of 512-
Label, the second exposure area 520-, 530- third exposure area, the 4th exposure area 540-, 6- datum plate, 7- projection objective
Group, 8- are directed at focal plane measuring system, and 801- first is directed at focal plane measuring unit, and 802- second is directed at focal plane measuring unit, 803-
Third is directed at focal plane measuring unit, and 804- the 4th is directed at focal plane measuring unit, and 805- the 5th is directed at focal plane measuring unit, 806- the
Six alignment focal plane measuring units, the alignment focal plane measuring unit of 807- the 7th, 810- area array cameras, the first image-forming assembly of 820-,
830- Amici prism, 840- diaphragm, 841- light hole, 842- slot set, the first light fixture of 850-, the second illumination group of 860-
Part, the second image-forming assembly of 870-, 880- shutter, 890- annular filter wave plate；
R- hot spot radius of circle.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Embodiment one
Fig. 1, Figure 10, Figure 11 are please referred to, the present invention provides a kind of projection aligner, successively includes: lighting source 1, covers
Film version 2, mask stage 3, substrate 5, work stage 4 and control system (not shown) are equipped with datum plate on 4 table top of work stage
6, generally datum plate 6 is placed on the side of work stage 4, substrate 5 is square, the length of datum plate 6 and the length of substrate 5
It is equal.In the case where 5 area of substrate is very big, substrate 5 is divided into several exposure areas, such as 4 exposure areas, respectively
It is corresponding in this way for the first exposure area 510, the second exposure area 520, third exposure area 530 and the 4th exposure area 540
Ground, according to the division principle of substrate 5, mask plate 2 can also be divided into four identical regions, will in each region in exposure
Primary alignment and exposure are carried out, the alignment and exposure in four regions are then completed one by one, this is because very due to 5 area of substrate
Greatly, and after cumbersome preamble processing, substrate 5 forms the shape that there are protrusion or recess in surface, if by entire substrate 5
Disposable whole face exposure, must make certain protrusions or the more serious position that is recessed generates biggish error, therefore use subregion
Domain alignment and exposure, can be improved the exposure precision in each region.
Preferably, please referring to Figure 10,5 material of substrate is glass or silica-base material, and 5 upper surface of substrate is equipped with
Alignment mark, the alignment mark number is two or more, in each exposure area, is equipped with several row alignment marks, such as
Two row alignment marks, respectively the first row alignment mark 511 and the second row alignment mark are equipped in the first exposure area 510
512, every a line is equipped with several alignment marks, as the first row alignment mark 511 is equipped with seven alignment marks, the mask plate 2
Surface is equipped with mask alignment mark (not shown), and the mask alignment mark number is two or more, when the mask plate 2 and institute
When stating 5 position alignment of substrate, an alignment mark group is at least shown in each exposure area, in the control system
(not shown), the alignment mark group are the figure that an alignment mark is overlapped with a mask alignment mark center
Picture.
All it is equipped with alignment focal plane measuring system 8 and projection objective group 7 side by side in each exposure area, and described
Focal plane measuring system 8 and the projection objective group 7 are directed between the mask stage 3 and the substrate 5.
The control system connects with focal plane measuring system 8, the mask stage 3,4 circuit of the work stage of being aligned respectively
It connects.In alignment or exposure process, the real time data of alignment focal plane measuring system 8, mask stage 3 and work stage 4 is also to pass through
Circuit transmission to control system, control system itself is additionally provided with simulation software, is used for analyzing and processing data, works as Data Analysis Services
Then send movement directive to mask stage 3 and work stage after the completion, then mask stage 3 and work stage 4 according to the order of control system come
Realize the movement of horizontal or vertical direction.
Preferably, the projection objective group 7 is equipped with several projection objectives, the projection objective group 7 is equipped with public focal plane,
When point all in some exposure area on the upper surface of the substrate 5 is all located at public focal plane, then control system is regarded as
The exposure area focal plane has been aligned.
Referring to figure 2., Fig. 6, Figure 10, generally, it is single that alignment focal plane measuring system 8 is equipped with several alignment focal plane measurements
Member, such as 7, the respectively first alignment focal plane measuring unit 801, second is directed at focal plane measuring unit 802, third is directed at focal plane
Measuring unit the 803, the 4th is directed at focal plane measuring unit the 804, the 5th and is directed at the alignment focal plane measurement of focal plane measuring unit the 805, the 6th
Unit the 806, the 7th is directed at focal plane measuring unit 807, and each alignment focal plane measuring unit successively includes area array cameras 810, first
Image-forming assembly 820, Amici prism 830 and the second image-forming assembly 870 also successively include the first light fixture 850, diaphragm 840
With the second light fixture 860, first light fixture 850 is connect with 830 optical path of Amici prism, second illumination group
Part 860 is connect with 1 optical path of lighting source.
Referring to figure 3., in each alignment focal plane measuring unit, optical path trend is what the lighting source 1 issued
Light successively passes through second light fixture 860, the diaphragm 840, first light fixture 850, the Amici prism
830, second image-forming assembly 870, which reaches, forms the reflected beams on the substrate 5, the reflected beams are successively passed through the second one-tenth described
As component 870, the Amici prism 830, first image-forming assembly 820, finally it is imaged to the area array cameras 810.
Preferably, referring to figure 4., light hole 841 is arranged in 840 center of diaphragm, it is arranged in 841 surrounding of light hole
Slot set 842, slot set 842 include four slits, and slot set 842 is in a center of symmetry about 840 center of diaphragm, and four narrow
Slit shape is all round or rectangular.Slot set 842 is with the light hole 841 apart from adjustable.
Preferably, the lighting source 1 is single-range halogen lamp or single-range LED, the lighting source 1 has
Avoid the optical band of photo resist photosensitive.
Fig. 9 is please referred to, the present invention also provides a kind of exposure method using above-mentioned projection aligner, including it is right
Quasi- movement and exposure actions, method includes the following steps:
Step 1: when carrying out alignment actions, the lighting source 1 is opened, when being exposed, the exposure of exposure area is suitable
Sequence is arbitrary, and the present embodiment selection first exposes the first exposure area 510, and in the first exposure area 510, substrate 5 is equipped with
Two row alignment marks, respectively the first row alignment mark 511 and the second row alignment mark 512, in the first row alignment mark 511
Equipped with 7 alignment marks, respectively the first alignment mark 501, the second alignment mark 502, third alignment mark 503, the 4th pair
Fiducial mark remembers the 504, the 5th alignment mark 505, the 6th alignment mark 506, the 7th alignment mark 507, and the mobile work stage 4 is by the
One exposure area 510 is moved horizontally in the field range of the alignment focal plane measuring system 8, i.e., surveys in each alignment focal plane
It measures in unit, the alignment mark in the first exposure area 510 can be shown on area array cameras 810, calculate described at this time cover
The relative positional relationship of film platform 3 and the work stage 4, in entire exposure device, using vertically upward direction as Z axis, water
The plane that plane is then made of X, Y-axis, then the horizontal coordinate of a point is (x, y), and three-dimensional coordinate is (x, y, z)；Step
Two: please referring to Fig. 6, the work stage 4 is moved horizontally by the control system, the datum plate 6 is moved to the alignment
In 8 field range of focal plane measuring system, referring to figure 5., through the diaphragm 840 four slits light then in face battle array
Four hot spots are formed on camera 810, using with four all equal points of spot centers distance as the center of circle, with any one institute
It is hot spot circle that the distance for stating spot center, which is formed by circle as radius,.
Preferably, control system can be according to the gravity model appoach based on image grayscale or based on the geometric center of graphic edge
Method calculates the center of four hot spots, the horizontal coordinates of this four spot centers is respectively (xa, ya), (xb, yb), (xc, yc),
(xd, yd), then the calculation formula of the horizontal coordinate (x_ce, y_ce) of the round heart of hot spot beThe then radius of the hot spot circle
Step 3: vertically moving the work stage 4 by control system, so that the upper surface of the datum plate 6 is located at institute
Public focal plane is stated, then the hot spot circle in the alignment focal plane measuring unit each at this time is standard hot spot circle, the control
System records and saves the standard hot spot radius of circle in the position coordinates and each alignment focal plane measuring unit of the work stage 4
r0, the first alignment focal plane measuring unit 801, second is directed at focal plane measuring unit 802, third alignment focal plane measurement in the present embodiment
Unit the 803, the 4th is directed at focal plane measuring unit the 804, the 5th and is directed at the alignment focal plane measuring unit of focal plane measuring unit the 805, the 6th
806, the 7th standard hot spot radius of circle that measures of alignment focal plane measuring unit 807 be respectively r0A, r0B, r0C, r0D, r0E, r0F,
r0G；
Step 4: arbitrarily vertically moving the work stage 4 by control system, for example movement is twice, after mobile for the first time
The three-dimensional coordinate of certain point is (x1, y1, z1) in work stage 4, three-dimensional of the same point after second mobile in work stage 4
Coordinate is (x2, y2, z2), records the radius of the hot spot circle in each alignment focal plane measuring unit when moving each time,
Respectively r1, r2, calculate the work stage 4 and vertically move position coordinates variation and described be directed at institute in focal plane measuring unit with each
The relationship of hot spot radius of circle variation is stated, i.e., the focal plane of each alignment focal plane measuring unit corrects machine constantThe first alignment focal plane measuring unit 801, second is directed at focal plane measuring unit 802, third alignment in the present embodiment
Focal plane measuring unit the 803, the 4th is directed at focal plane measuring unit the 804, the 5th and is directed at the alignment focal plane of focal plane measuring unit the 805, the 6th
Measuring unit the 806, the 7th is directed at the standard hot spot radius of circle that focal plane measuring unit 807 measuresThen the control system is measured according to each alignment focal plane
The focal plane of unit corrects machine constantWith the standard hot spot radius of circle r0Calculate each alignment focal plane measurement
Under unit the work stage 4 at an arbitrary position when vertical offset relative to the public focal planeIts
Middle r is the hot spot radius of circle at any position of work stage 4, that is to say, that no matter which position is work stage 4 be moved to, as long as
It measures in each alignment focal plane measuring unit in hot spot radius of circle at that time, when can calculate in the position, each alignment is burnt
The vertical offset of work stage 4 in interface measurement unit；
Step 5: please referring to Fig. 7, and lighting source 1 reaches base by projection objective group 7 and alignment focal plane measuring system 8
When 5 surface of plate, level detection branch can generate inclined light shaft, that is to say, that when detecting the horizontal direction position of alignment mark,
Due to the influence of defocus, alignment mark can generate translation when in imaging to area array cameras 810, lead to the horizontal coordinate of detection simultaneously
Inaccuracy, but since this inclined light shaft is system deviation caused by entire exposure device, inclined light shaft is calculated, and
And this deviation will can be corrected in inclined light shaft compensation when each alignment mark horizontal coordinate of subsequent calculating.Calculation method
Are as follows: the work stage 4 is arbitrarily vertically moved by control system, for example movement is twice, it is a certain in work stage 4 after movement for the first time
The three-dimensional coordinate of point is (x3, y3, z3), in work stage 4 three-dimensional coordinate of the same point after second mobile be (x4, y4,
Z4), then the inclined light shaft expression formula of each alignment focal plane measuring unit is
Step 6: moving horizontally the work stage 4 by the control system, will be in first exposure area 510
All alignment marks move into the field range of the alignment focal plane measuring system 8, please refer to Figure 10, alignment focal plane measurement
System 8 first measures the first row alignment mark 511, please refers to Fig. 8, each coordinate in the first row alignment mark 511 is in face battle array
The horizontal coordinate shown on camera 810 is as original coordinate, please continue to refer to Figure 10, each alignment focal plane measuring unit alignment
Each label in the first row alignment mark 511, that is to say, that the first alignment focal plane measuring unit 801, second is directed at focal plane
Measuring unit 802, third alignment focal plane measuring unit the 803, the 4th are directed at focal plane measuring unit the 804, the 5th and are directed at focal plane measurement
Unit the 805, the 6th is directed at the alignment of focal plane measuring unit the 806, the 7th focal plane measuring unit 807 and measures the first alignment mark respectively
501, the second alignment mark 502, third alignment mark 503, the 4th alignment mark 504, the alignment of the 5th alignment mark the 505, the 6th
Label 506, the 7th alignment mark 507, obtained original coordinate be respectively (xA, yA), (xB, yB), (xC, yC), (xD, yD),
(xE,yE),(xF,yF),(xG,yG)；
Step 7: according to step 4, the control system calculates each alignment mark relative to the public coke
The vertical offset in face is as follows respectively:
Wherein Δ ZA, Δ ZB, Δ ZC, Δ ZD, Δ ZE, Δ ZF, Δ ZG are respectively first
The corresponding vertical offset of 501 to the 7th alignment mark of alignment mark 507, andThe respectively first alignment alignment of focal plane measuring unit 801 to the 7th is burnt
The corresponding focal plane of interface measurement unit 807 corrects machine constant, and rA, rB, rC, rD, rE, rF, rG are respectively the first alignment coke
Interface measurement unit 801 to the 7th is directed at focal plane measuring unit 807 and respectively measures the first alignment mark 501 to the 7th pair of fiducial mark
Remember obtained hot spot radius of circle when 507, and r0A, r0B, r0C, r0D, r0E, r0F, r0G are respectively the measurement of the first alignment focal plane
Unit 801 to the 7th is directed at the respective standard hot spot radius of circle of focal plane measuring unit 807.
According to step 5, the inclined light shaft of 501 to the 7th alignment mark 507 of the first alignment mark is calculated, is respectively as follows:
(θRyA,θRxA), (θRyB,θRxB), (θRyC,θRxC), (θRyD,θRxD), (θRyE,θRxE), (θRyF,θRxF), (θRyG,θRxG), then
The control system is according to the vertical offset and the inclined light shaft of each alignment mark to original coordinate
It compensates, is specifically expressed from the next:
XA=xA+ Δ ZA × θRyA, YA=YA+ Δ ZA* θRxA；
XB=xB+ Δ ZB × θRyB, YB=YB+ Δ ZB* θRxB；
XC=xC+ Δ ZC × θRyC, YC=YC+ Δ ZC* θRxC
XD=xD+ Δ ZD × θRyD, YD=YD+ Δ ZD* θRxD；
XE=xE+ Δ ZE × θRyE, YE=YE+ Δ ZE* θRxE；
XF=xF+ Δ ZF × θRyF, YF=YF+ Δ ZF* θRxF；
XG=xG+ Δ ZG × θRyG, YG=YG+ Δ ZG* θRxG, wherein (XA, YA), (XB, YB), (XC, YC), (XD,
YD), (XE, YE), (XF, YF), (XG, YG) are respectively that the respective compensation of 501 to the 7th alignment mark of the first alignment mark 507 is sat
Mark.
Figure 11 is please referred to, after calculating the compensation coordinate of all alignment marks of the first row alignment mark 511, with same
Method calculate the second row alignment mark 512 all alignment marks compensation coordinate.
Step 8: the control system calculates the phase of the substrate 5 with the work stage 4 according to calculated compensation coordinate
To positional relationship, and the mask stage 3 and the relative positional relationship of the work stage 4 by calculating in step 1 calculate
The relative positional relationship of the mask plate 2 and the substrate 5, then the control system passes through the mask plate 2 and the substrate 5
Relative positional relationship travelling workpiece platform 4 or mask stage 3 so that work stage 4 and mask stage 3 generate relative motion, until institute
It states and shows at least one alignment mark group in control system, and show that substrate 5 and the focal plane of mask plate 2 have been aligned, then position
It sets alignment and is aligned with focal plane and is completed at the same time, alignment actions terminate；
Step 9: when being exposed movement, the scan exposure program opened in the control system is clicked, scan exposure is opened
Begin, and at the same time the mobile work stage 4 and the mask stage 3, keep the substrate 5 and the mask plate in moving process
2 aligned relationships formed in step 7, until exposure actions are completed；
Step 10: after the completion of the exposure of the first exposure area 510, according to step 1 to step 9 one by one to the second exposure region
Domain 520, third exposure area 530, the 4th exposure area 540 carry out alignment actions and exposure actions, the so far exposure of entire substrate 5
Light is completed.
Embodiment two
Please refer to Figure 12, the difference between this embodiment and the first embodiment lies in, diaphragm 840 and the second light fixture 860 it
Between be equipped with shutter 880, when opening shutter 880, light hole 841 and slot set 842 then light passing, work as closing on the diaphragm 840
When shutter 880, light hole 841 and slot set 842 then not light passing control diaphragm 840 by controlling the opening time of shutter 880
The light passing time.
Embodiment three
Figure 13 is please referred to, the difference between this embodiment and the first embodiment lies in the lighting source 1 is with two waveband halogen
Lamp or two waveband LED, the two waveband of lighting source 1 refer to first band and suitable focal plane including suitable position to locating tab assembly
To the second band of locating tab assembly, and annular filter wave plate is equipped between the diaphragm 840 and second light fixture 860
890, the intermediate region of annular filter wave plate 890 can penetrate first band, and peripheral region can penetrate second band, in this way by position
It sets and locating tab assembly and light wave of the focal plane to locating tab assembly is separated, so that position alignment measurement and focal plane use locating tab assembly respectively respectively
Suitable light, to improve the accuracy of measurement alignment.
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment.Obvious this field
Technical staff can carry out various modification and variations without departing from the spirit and scope of the present invention to invention.If in this way, this hair
These bright modifications and variations within the scope of the claims of the present invention and its equivalent technology, then the invention is also intended to include
Including these modification and variations.
Claims (21)
1. a kind of projection aligner, successively includes:
One lighting source；
One lamp optical system；
Mask stage, for carrying mask plate；
Projection objective group, the projection objective group are equipped with several projection objectives；
Work stage, for carrying a substrate, during scan exposure, the light beam of the lighting source transmitting, by the photograph
The pattern that bright optical system is irradiated on the mask plate, and the mask plate will be arranged in turns by the projection objective
It prints on the substrate；And the control system with mask stage circuit connection, which is characterized in that
The projection aligner further includes alignment focal plane measuring system, is arranged between the mask stage and the work stage,
For carrying out the mask plate and the substrate to the same of locating tab assembly during scan exposure crosses Cheng Qian or scan exposure
When, the focal plane measurement of the substrate is carried out, the alignment focal plane measuring system includes several alignment focal plane measuring units, each
The alignment focal plane measuring unit successively includes area array cameras, the first image-forming assembly, Amici prism and the second image-forming assembly, is gone back
It successively include the first light fixture, diaphragm and the second light fixture, first light fixture and the Amici prism optical path connect
It connects, second light fixture is connect with the lighting source optical path, and light hole is arranged in the diaphragm center, in the light hole
Four slits are arranged in surrounding, and four slits are in a center of symmetry about the diaphragm center.
2. projection aligner as described in claim 1, which is characterized in that the substrate is divided into several exposure areas,
The alignment focal plane measuring system and the projection objective group are designed in each exposure area.
3. projection aligner as described in claim 1, which is characterized in that the alignment focal plane measuring system and the control
Circuit system connection.
4. projection aligner as described in claim 1, which is characterized in that four shape of slit are round or side
Shape.
5. projection aligner as claimed in claim 4, which is characterized in that the diaphragm is that four slits lead to described
Unthreaded hole is apart from adjustable structure.
6. projection aligner as claimed in claim 3, which is characterized in that the diaphragm and second light fixture it
Between be equipped with shutter.
7. projection aligner as claimed in claim 6, which is characterized in that the lighting source is with two waveband halogen lamp
Or two waveband LED, and annular filter wave plate is equipped between the diaphragm and second light fixture.
8. projection aligner as described in claim 1, which is characterized in that the projection objective group is equipped with public focal plane.
9. projection aligner as described in claim 1, which is characterized in that the lighting source be single-range halogen lamp or
The single-range LED of person, the lighting source have the optical band for avoiding photo resist photosensitive.
10. projection aligner as described in claim 1, which is characterized in that the baseplate material is glass or silicon substrate
Material.
11. projection aligner as claimed in claim 2, which is characterized in that the upper surface of base plate is equipped with alignment mark, institute
Alignment mark number is stated as two or more, the mask plate surface is equipped with mask alignment mark, the mask alignment mark number
For two or more.
12. projection aligner as claimed in claim 11, which is characterized in that when the mask plate and the substrate position pair
On time, an alignment mark group, the alignment mark are at least shown in each exposure area, in the control system
Group is the image that an alignment mark is overlapped with a mask alignment mark center.
13. a kind of exposure method, using projection aligner as claimed in claim 3, the exposure method packet
Include alignment actions and exposure actions, which is characterized in that the setting alignment focal plane measuring system in each exposure area is carrying out pair
When quasi- movement, the movement for the datum plate being located on the workpiece table top is driven by travelling workpiece platform, is recorded each described
It is directed at the radius change of the hot spot circle in focal plane measuring unit, calculates the workpiece under each alignment focal plane measuring unit
Platform at an arbitrary position when relative to projection objective group public focal plane vertical offset and the work stage at an arbitrary position
On inclined light shaft, then the inclined light shaft of the work stage on any position is opposite with the work stage described on any position
In the compensation rate that the product of the vertical offset of the public focal plane is the alignment mark on each datum plate, and will be every
The coordinate of a alignment mark compensates, and the compensation coordinate of each alignment mark is obtained after compensation, then by each described right
The compensation coordinate of fiducial mark note calculates the positional relationship of presently described substrate Yu the mask plate, moves the work stage, so that
The substrate is aligned with the mask plate, can be exposed movement.
14. exposure method as described in claim 13, which is characterized in that method includes the following steps:
Step 1: when carrying out alignment actions, opening lighting source, arbitrarily select an exposure area as the first exposure area,
First exposure area is moved horizontally to the alignment focal plane measuring system by the mobile work stage of control system
In field range, calculating carries the mask stage of the mask plate and the relative positional relationship of the work stage at this time；
Step 2: moving horizontally the work stage by the control system, and the datum plate is moved to the alignment focal plane
In measuring system field range, in each alignment focal plane measuring unit, the light that the lighting source issues successively is passed through
Cross the second light fixture, the diaphragm, the first light fixture, Amici prism, the second imaging group in the alignment focal plane measuring system
Part reaches and forms the reflected beams on the substrate, and the reflected beams successively pass through second image-forming assembly, the light splitting rib
Mirror, the first image-forming assembly are finally imaged to the area array cameras in the alignment focal plane measuring system, through the four of the diaphragm
The light of a slit then forms four hot spots on the area array cameras, with four all equal points of spot centers distance
It is hot spot circle as being used as radius to be formed by circle at a distance from the center of circle, with any one of spot center；
Step 3: vertically moving the work stage by the control system, so that the upper surface of the datum plate is positioned at described
The public focal plane of projection objective group, then the hot spot circle in the alignment focal plane measuring unit each at this time is standard hot spot
Circle, the control system record and save the mark in the position coordinates and each alignment focal plane measuring unit of the work stage
Quasi-optical spot radius of circle r0；
Step 4: arbitrarily vertically moving the work stage by the control system, work stage when recording mobile every time
Position coordinates and each radius for being directed at hot spot circle in focal plane measuring unit, calculate the work stage and vertically move position
Changes in coordinates is set described to be directed at the relationship of hot spot radius of circle variation in focal plane measuring unit with each and then calculate each
Under the alignment focal plane measuring unit work stage at an arbitrary position when vertical offset relative to the public focal plane；
Step 5: the work stage is arbitrarily vertically moved by control system, the control system is according to when each mobile
The coordinate position of work stage calculates inclined light shaft expression formula existing for optical path in each alignment focal plane measuring unit, then institute
State inclined light shaft when control system calculates the work stage at an arbitrary position by the inclined light shaft expression formula；
Step 6: moving horizontally the work stage by the control system, will be all described in first exposure area
Alignment mark moves into the field range of the alignment focal plane measuring system, and obtains the horizontal position of all alignment marks
Coordinate is as original coordinate；
Step 7: according to step 4, the control system calculates each alignment mark relative to the public focal plane
Vertical offset calculates the inclined light shaft of each alignment mark according to step 5, then the control system is according to each
The vertical offset of the alignment mark and the inclined light shaft compensate original coordinate, compensated level
Position coordinates are compensation coordinate；
Step 8: the control system calculates the substrate and the workpiece according to the compensation coordinate of the alignment mark
The relative positional relationship of platform, and pass through the relative positional relationship meter of the mask stage and the work stage that calculate in step 1
The relative positional relationship of the mask plate Yu the substrate is calculated, then the control system passes through the mask plate and the substrate
The mobile work stage of relative positional relationship or the mask stage, until showing that at least one is right in the control system
Quasi- mark group, and at the same time display focal plane has been aligned, then alignment actions are completed；
Step 9: when being exposed movement, clicking the scan exposure program opened in the control system, and scan exposure starts,
And at the same time the mobile work stage and the mask stage, keep the substrate and the mask plate in step in moving process
The aligned relationship formed in seven, until exposure actions are completed；
Step 10: after the completion of the exposure of first exposure area, according to step 1 to step 9 one by one remaining exposure
Region carries out alignment actions and exposure actions.
15. exposure method as described in claim 14, which is characterized in that four spot centers described in step 2
Horizontal coordinate is respectively (xa, ya), (xb, yb), (xc, yc), (xd, yd), the then horizontal coordinate (x_ of the round heart of the hot spot
Ce, y_ce) calculation formula beThe then hot spot circle
Radius
16. exposure method as described in claim 15, which is characterized in that the calculation method of four spot centers
For the gravity model appoach based on image grayscale or based on the geometrical center method of graphic edge.
17. exposure method as described in claim 15, which is characterized in that work stage described in step 4 vertically moves
Position coordinates variation is that focal plane corrects machine with each relationship for being directed at the hot spot radius of circle variation in focal plane measuring unit
Device constantThen the control system corrects machine constant according to the focal plane of each alignment focal plane measuring unitWith
The standard hot spot radius of circle r0Calculate under each alignment focal plane measuring unit work stage phase at an arbitrary position
For the vertical offset of the public focal plane.
18. exposure method as described in claim 17, which is characterized in that each alignment focal plane is surveyed in step 4
Vertical offset relative to public focal plane when measuring under unit the work stage at an arbitrary position
19. exposure method as described in claim 18, which is characterized in that four arbitrarily move the work stage in step
Vertical position to coordinate be (x1, y1, z1), continue the vertical position of any movement work stage to ordinate be (x2,
Y2, z2), the focal plane corrects machine constantWherein r1 is the half of (x1, y1, z1) corresponding described hot spot circle
Diameter, r2 are the radius of (x2, y2, z2) the corresponding hot spot circle.
20. exposure method as described in claim 19, which is characterized in that each of step 5 alignment focal plane
The inclined light shaft of measuring unit is (θRy,θRx), and
21. exposure method as described in claim 20, which is characterized in that original coordinate in step 6 is
(x, y), the compensation coordinate in step 7 are (X, Y), wherein X=x+ Δ Z × θRy, Y=y+ Δ Z × θRx。
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| CN109273380B (en) * | 2017-07-17 | 2022-02-15 | 上海微电子装备（集团）股份有限公司 | Scanning alignment device and scanning method thereof |
| CN109856930B (en) * | 2017-11-30 | 2021-05-25 | 京东方科技集团股份有限公司 | Alignment mark, substrate, manufacturing method of substrate and exposure alignment method |
| WO2019127552A1 (en) * | 2017-12-29 | 2019-07-04 | 深圳市柔宇科技有限公司 | Alignment method and system for substrates |
| CN108519726B (en) * | 2018-04-03 | 2020-06-05 | 京东方科技集团股份有限公司 | Method and device for correcting exposure pattern and exposure equipment |
| CN111158216A (en) * | 2018-11-08 | 2020-05-15 | 上海矽越光电科技有限公司 | Exposure device |
| CN109597224B (en) * | 2018-11-27 | 2021-04-23 | Tcl华星光电技术有限公司 | Mosaic splicing product splicing area adjusting method and device |
| CN109725503B (en) * | 2018-12-24 | 2021-03-02 | 无锡影速半导体科技有限公司 | Multi-band time-division optical exposure device and method |
| JP7204507B2 (en) * | 2019-02-05 | 2023-01-16 | キオクシア株式会社 | Exposure method and exposure apparatus |
| CN113625532B (en) * | 2020-05-08 | 2022-10-25 | 上海微电子装备（集团）股份有限公司 | Substrate mark position detection method and device |
| CN112453691B (en) * | 2020-12-01 | 2022-03-29 | 强一半导体（苏州）有限公司 | Pinhole structure for MEMS probe laser etching device |
| CN112453688B (en) * | 2020-12-01 | 2022-03-29 | 强一半导体（苏州）有限公司 | Optical quasi-focus structure for MEMS probe laser etching device |
| CN112453690B (en) * | 2020-12-01 | 2022-03-29 | 强一半导体（苏州）有限公司 | Optical focusing method for MEMS probe laser etching device |
| CN114518221B (en) * | 2022-03-16 | 2024-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Method and device for detecting focal plane inclination value of objective lens based on exposure system |
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