WO2019127552A1 - Alignment method and system for substrates - Google Patents

Abstract

An alignment method and system for substrates. The alignment method comprises: forming a group of electrode pairs respectively arranged at a first substrate (10) and a second substrate (20), the group of electrode pairs including alignment electrodes provided at the first substrate (10) and an electrode array provided at the second substrate (20); and outputting a drive signal to the group of electrode pairs, detecting a coupling parameter between the group of electrode pairs, and moving the first substrate (10) and/or the second substrate (20) according to the detected coupling parameter and a reference parameter, such that the first substrate (10) and the second substrate (20) are at alignment positions.

Description

Method and system for aligning substrates Technical field

The present invention relates to the field of device display, and in particular, to a method and system for aligning a substrate.

Background technique

There are two common alignment methods commonly used in the prior art: one is manual compensation by manual software, and the other is automatic compensation calculation by CCD alignment. Among the two alignment modes, the CCD alignment accuracy is higher than the manual alignment accuracy. The alignment accuracy of the general CCD automatic alignment device is ±0.15mm, and the alignment accuracy of the manual alignment semi-automatic device is ±0.3mm. If it is necessary to achieve higher precision alignment requirements, it is difficult to meet the requirements by manual alignment/CCD alignment. For example, we need to achieve 0.1mm or even 50um high-precision alignment. The manual alignment method can obviously not meet the requirements. If CCD alignment is used, the precision of marking points and feature points will be higher. For example, the cover plate is attached to the touch screen, and the VA right angle vertex of the cover ink is generally used as the feature point). Therefore, the existing methods cannot meet the requirements of precise alignment.

technical problem

The technical problem to be solved by the present invention is that the existing method of manual alignment and CCD alignment cannot meet the requirements of accurate alignment.

Technical solution

The technical solution adopted by the present invention to solve the technical problem thereof is: constructing a aligning method for a substrate, comprising:

Forming a set of electrode pairs on the first substrate and the second substrate, the set of electrode pairs comprising a counter electrode disposed on the first substrate and an electrode array disposed on the second substrate;

Outputting a driving signal to the pair of electrode pairs, detecting a coupling parameter between the pair of electrode pairs, and moving the first substrate and/or the second substrate according to the detected coupling parameter and a standard parameter to make the first substrate and the second substrate In the aligned position, the standard parameter is the coupling parameter when the alignment electrode of the first substrate is aligned with the target electrode in the electrode array of the second substrate.

Preferably, the coupling parameter is a capacitance value, an inductance value or an electromagnetic value.

Preferably, the coupling parameter comprises a coupling position and a coupling value.

Preferably, the driving signal is outputted to the pair of electrode pairs, the coupling parameter between the pair of electrodes is detected, and the first substrate and/or the second substrate are moved according to the detected coupling parameter and the standard parameter, including:

S21. output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and calculate a region compensation value according to the coupling parameter detected in the step and the position of the target electrode on the second substrate, so as to The relative position between the first substrate and the second substrate is compensated once.

Preferably, the driving signal is outputted to the set of electrode pairs, the coupling parameter between the pair of electrodes is detected, and the first substrate and/or the second substrate are moved according to the detected coupling parameter and the standard parameter, and the method further includes:

S22. After one compensation, output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and calculate an accurate compensation value according to the coupling parameter detected by the step and the standard parameter, so as to The relative position between the first substrate and the second substrate is compensated twice.

Preferably, the step S21 comprises the following steps:

S2111. Output a driving signal to the counter electrode in the pair of electrode pairs and each electrode in the electrode array, and detect a first coupling parameter between the pair of electrode electrodes in the pair of electrode pairs and each electrode in the electrode array;

S2112. Comparing the alignment electrode with a first coupling parameter between each electrode in the electrode array, and determining an electrode corresponding to the largest first coupling parameter as a reference electrode;

S2113. Calculate a first region compensation value according to a position of the reference electrode and the target electrode on the second substrate, respectively;

S2114. Move the first substrate and/or the second substrate according to the first region compensation value to perform one compensation.

Preferably, the electrode array is an M*N electrode array, and M=m*p, N=n*q, wherein m, n, p, and q are integers greater than 1, respectively, and

The alignment method further includes:

The M*N electrode array is divided into m*n electrode blocks.

Preferably, the step S21 comprises the following steps:

S2121. Output a driving signal to the alignment electrode and each electrode block in the pair of electrode pairs, and detect a second coupling parameter between the alignment electrode and the respective electrode block in the pair of electrode pairs;

S2122. Comparing the alignment electrode with a second coupling parameter between each electrode block, and determining an electrode block corresponding to the largest second coupling parameter as a reference electrode block;

S2123. Calculating a second region compensation value according to a position of the reference electrode block and the electrode block where the target electrode is located on the second substrate, respectively;

S2124. Move the first substrate and/or the second substrate according to the second region compensation value to perform one compensation.

Preferably, the step S22 includes the following steps:

S221. After one compensation, output a driving signal to the counter electrode in the pair of electrode pairs and the target electrode and the surrounding electrode in the electrode array, and detect the alignment electrode between the pair of electrode pairs and the target electrode and the surrounding electrode respectively. Third coupling parameter;

S222. Calculate an accurate compensation value according to the third coupling parameter and the standard parameter;

S223. Move the first substrate and/or the second substrate according to the accurate compensation value to perform secondary compensation.

Preferably, the number of surrounding electrodes is plural and is disposed around the target electrode.

Preferably, the third coupling parameter is associated with at least one of an X-axis offset, a Y-axis offset, a Z-axis offset, and an angular offset of the counter electrode relative to the target electrode.

Preferably, when the third coupling parameter of the alignment electrode and one of the surrounding electrodes exceeds a preset threshold, the control electrode is moved along a direction of the one of the surrounding electrodes toward the target electrode.

Preferably, another set of electrode pairs are respectively formed on the first substrate and the second substrate, and the orientation of the other set of electrode pairs is different from the orientation of the pair of electrode pairs.

Preferably, the coupling parameter between the pair of electrodes is detected, and the first substrate and/or the second substrate are moved according to the detected coupling parameter and the standard parameter, including:

Detecting coupling parameters of the counter electrode and each electrode in the electrode array, and determining a difference between the coupling parameter and the standard parameter of the counter electrode and the target electrode;

By relatively moving the first substrate and/or the second substrate, the coupling parameters of the alignment electrode and the target electrode are approximated to standard parameters.

Preferably, when the coupling parameter of the alignment electrode and the target electrode is smaller than the coupling parameter of the alignment electrode and the certain electrode, the control of the alignment electrode moves along the certain electrode toward the target electrode.

Preferably, when the coupling parameter of the alignment electrode and the target electrode is greater than the coupling parameter with the other electrode and smaller than the standard parameter, the coupling parameter of the alignment electrode and the surrounding electrode of the target electrode is determined, when the alignment electrode and a surrounding electrode are When the coupling parameter exceeds the preset threshold, the control electrode moves along the certain surrounding electrode toward the target electrode.

The invention also constructs a aligning system for a substrate, comprising:

a coupling parameter measuring device for outputting a driving signal to the pair of electrodes and detecting a coupling parameter between the pair of electrodes, wherein the pair of electrodes are respectively formed on the first substrate and the second substrate, the pair of electrode pairs being disposed in the first a counter electrode on a substrate and an electrode array disposed on the second substrate;

a processing device, configured to calculate a direction and a displacement to be moved according to the detected coupling parameter and a standard parameter, wherein the standard parameter is when the alignment electrode of the first substrate is aligned with the target electrode in the electrode array of the second substrate Coupling parameter

And a moving device for controlling movement of the first substrate and/or the second substrate according to the calculated moving direction and displacement, so that the first substrate and the second substrate are in an aligned position.

Preferably, the coupling parameter is a capacitance value, an inductance value or an electromagnetic value.

Preferably, the coupling parameter comprises a coupling position and a coupling value.

Preferably,

a coupling parameter measuring device, configured to output a driving signal to the pair of electrode pairs, and detect a coupling parameter between the pair of electrode pairs;

Processing means for calculating a region compensation value according to the detected coupling parameter and a position of the target electrode on the second substrate;

And a moving device, configured to control the movement of the first substrate and/or the second substrate according to the calculated area compensation value to perform a compensation for the relative position between the first substrate and the second substrate.

Preferably,

The coupling parameter measuring device is further configured to output a driving signal to the pair of electrode pairs after one compensation, and detect a coupling parameter between the pair of electrode pairs;

The processing device is further configured to calculate an accurate compensation value according to the detected coupling parameter and the standard parameter;

The mobile device is further configured to control the movement of the first substrate and/or the second substrate according to the calculated accurate compensation value to perform secondary compensation on a relative position between the first substrate and the second substrate.

Preferably, the coupling parameter measuring device is configured to output a driving signal to each of the counter electrode and the electrode array in the pair of electrode pairs, and detect the alignment electrode between the pair of electrode pairs and each electrode in the electrode array First coupling parameter;

a processing device, configured to compare the alignment electrode with a first coupling parameter between each electrode in the electrode array, and determine an electrode corresponding to the largest first coupling parameter as a reference electrode, and then according to the Calculating a first region compensation value by using a position of the reference electrode and the target electrode on the second substrate respectively;

And a moving device, configured to control the first substrate and/or the second substrate to move according to the calculated first region compensation value to perform one compensation.

Preferably, the electrode array is an M*N electrode array, and M=m*p, N=n*q, wherein m, n, p, and q are integers greater than 1, respectively, and the M*N The electrode array is divided into m*n electrode blocks.

Preferably, the coupling parameter measuring device is configured to output a driving signal to the alignment electrode and each electrode block of the pair of electrode pairs, and detect a second coupling parameter between the alignment electrode and the respective electrode block of the pair of electrode pairs. ;

a processing device, configured to compare the alignment electrode with a second coupling parameter between each electrode block, and determine an electrode block corresponding to the largest second coupling parameter as a reference electrode block, and then according to the reference Calculating a second region compensation value by the position of the electrode block and the electrode block where the target electrode is located on the second substrate;

And a moving device, configured to control the movement of the first substrate and/or the second substrate according to the calculated second region compensation value to perform one compensation.

Preferably, the coupling parameter measuring device is further configured to: after one compensation, output a driving signal to the counter electrode in the pair of electrode pairs and the target electrode and the surrounding electrode in the electrode array, and detect the counter electrode in the pair of electrode pairs a third coupling parameter between the target electrode and the surrounding electrode, respectively;

The processing device is further configured to calculate an accurate compensation value according to the third coupling parameter and the standard parameter;

The mobile device is further configured to control the movement of the first substrate and/or the second substrate according to the calculated precise region compensation value for secondary compensation.

Preferably, the number of surrounding electrodes is plural and is disposed around the target electrode.

Preferably, the third coupling parameter is associated with at least one of an X-axis offset, a Y-axis offset, a Z-axis offset, and an angular offset of the counter electrode relative to the target electrode.

Preferably, the processing device is further configured to: when the third coupling parameter of the alignment electrode and one of the surrounding electrodes exceeds a preset threshold, by controlling movement of the mobile device, causing the alignment electrode to face the target electrode along the one of the surrounding electrodes Move in direction.

Preferably, another set of electrode pairs are respectively formed on the first substrate and the second substrate, and the orientation of the other set of electrode pairs is different from the orientation of the pair of electrode pairs.

Preferably,

a coupling parameter measuring device for detecting coupling parameters of the counter electrode and each electrode in the electrode array;

The processing device is configured to determine a difference between the coupling parameter and the standard parameter of the aligning electrode and the target electrode, and to approximate the standard of the coupling parameter of the aligning electrode and the target electrode by controlling the moving device to relatively move the first substrate and/or the second substrate parameter.

Preferably, the processing device is configured to: when the coupling parameter of the alignment electrode and the target electrode is smaller than the coupling parameter of the alignment electrode and the certain electrode, by controlling the moving device to relatively move the first substrate and/or the second substrate to make the alignment The electrode moves along the certain electrode toward the target electrode.

Preferably, the processing device is configured to determine a coupling parameter of the alignment electrode and the surrounding electrode of the target electrode when the coupling parameter of the alignment electrode and the target electrode is greater than a coupling parameter with the other electrode and less than a standard parameter, when the alignment electrode is When the coupling parameter of a certain surrounding electrode exceeds a preset threshold, the positional electrode is moved along the certain surrounding electrode toward the target electrode by controlling the moving device to relatively move the first substrate and/or the second substrate.

Beneficial effect

According to the technical solution of the present invention, since a pair of electrode pairs are respectively disposed on the two substrates, when the alignment test is performed, the relative movement of the two substrates can be controlled according to the currently detected coupling parameters and preset standard parameters. By placing the first substrate and the second substrate in an aligned position, the problem of insufficient alignment accuracy in the prior art can be well solved.

In addition, the method of the other party can be used for the bonding of the two substrates, and can also be used for the precision detection in the line manufacturing process, for example, detecting the manufacturing process of the TFT process and the CF process line. In the process of the precision detection, the first substrate is used as a standard precision confirmation sheet. When it is necessary to measure whether the patterning of the second substrate is accurate, the first substrate and the second substrate are aligned, if the alignment of the first substrate is performed. The alignment of the electrode with the target electrode of the second substrate indicates that the pattern of the second substrate is accurately fabricated.

DRAWINGS

BRIEF DESCRIPTION OF THE DRAWINGS In the following, the embodiments of the present invention will be briefly described, and the drawings in the following description are merely exemplary embodiments of the present invention. For the skilled person, other drawings can be obtained from these drawings without any creative work. In the figure:

1 is a flow chart of an embodiment of a method for aligning a substrate of the present invention;

2 is a structural view of an embodiment of a first substrate and a second substrate in an aligned position of the present invention;

Figure 3 is a flow chart of an embodiment of step S20 of Figure 1;

4A and 4B are schematic diagrams showing changes in relative positions of the bit electrode and the electrode array in step S20, respectively;

Figure 5 is a schematic view showing the first embodiment of the electrode array of the present invention;

6A to 6C are diagrams showing the relationship between the relative positions of the counter electrode and the target electrode in several cases after one compensation;

7A and 7B are schematic diagrams showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the first case;

8A and 8B are schematic diagrams showing projections of the alignment electrodes on the second substrate in the two sets of electrode pairs in the second case;

9A and FIG. 9B are schematic diagrams showing projections of the alignment electrodes on the second substrate in the two sets of electrode pairs in the third case;

10A and FIG. 10B are schematic diagrams showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the fourth case;

11A and FIG. 11B are schematic diagrams showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the fifth case;

Figure 12 is a structural view showing a first embodiment of the alignment system for a substrate of the present invention.

Embodiments of the invention

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

1 is a flow chart of Embodiment 1 of a method for aligning a substrate of the present invention, and the alignment method of the embodiment includes the following steps:

S10. Forming a set of electrode pairs on the first substrate and the second substrate, the set of electrode pairs including a counter electrode disposed on the first substrate and an electrode array disposed on the second substrate.

In this step, in the process of making the circuit, high-precision electrode patterns are respectively formed on the two substrates. For example, in conjunction with FIG. 2, the first substrate 10 and the second substrate 20 are two rectangular substrates to be bonded. Moreover, a pair of bit electrodes are respectively disposed at positions of the four corners of the first substrate 10, the four alignment electrodes are respectively 11, 12, 13, and 14, and an electrode array is disposed at each of the four corners of the second substrate 20, four The electrode arrays are 21, 22, 23, and 24, respectively, and each of the electrode arrays is a 3*3 electrode array, and the electrode at the center of each electrode array is the target electrode. The counter electrode 11 and the electrode array 21 form a first set of electrode pairs, the counter electrode 12 and the electrode array 22 form a second set of electrode pairs, and the counter electrode 13 and the electrode array 23 form a third set of electrode pairs, the counter electrode 14 and The electrode array 24 forms a fourth set of electrode pairs. When the first substrate 10 and the second substrate 20 are in the aligned position, the orthographic projection of the alignment electrode 11 on the second substrate covers only the target electrode in the electrode array 21, and the orthographic projection of the alignment electrode 12 on the second substrate Covering only the target electrode in the electrode array 22, the orthographic projection of the alignment electrode 13 on the second substrate covers only the target electrode in the electrode array 23, and the orthographic projection of the alignment electrode 14 on the second substrate covers only the electrode array 24. The target electrode, that is, in each set of electrode pairs, the coupling parameter between the counter electrode and the target electrode in the electrode array is a standard parameter value. It can be understood that when the alignment electrode and the target electrode are completely aligned, the coupling parameter between the two is maximized, for example, the capacitance value between the two is the largest. In addition, each of the electrodes on the first substrate 10 and the second substrate 20 is connected to an electrode lead-out line. For example, the counter electrode 13 is connected with an electrode lead-out line 15 for connecting the coupling parameter measuring device.

Preferably, in each set of electrode pairs, the counter electrode and the respective electrodes in the electrode array have the same shape and size, for example, are square. Further, in the four sets of electrode pairs, the orientation of the electrode array 21 and the electrode array 23 are the same, the orientation of the electrode array 22 and the electrode array 24 are the same, and the electrode array 21 (or the electrode array 23) and the electrode array 22 (or the electrode array) The orientation of 24) is different and at a certain angle, preferably 45 degrees. For the sake of simplicity, the following is described with one set of electrode pairs, but it will be understood that both sets of electrode pairs can be aligned in the following manner.

S20. output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and move the first substrate and/or the second substrate according to the detected coupling parameter and the standard parameter to make the first substrate and the first substrate The two substrates are in an aligned position, and the standard parameter is a coupling parameter when the alignment electrode of the first substrate is aligned with the target electrode in the electrode array of the second substrate.

In this step, the coupling parameters are, for example, a capacitance value, an inductance value, an electromagnetic value, preferably a capacitance value. In addition, the coupling parameters include the coupling position and the coupling value. It should be noted that during the alignment test, one of the substrates can be kept stationary, and only the position of the other substrate can be adjusted, thereby changing the relative positions of the two substrates. Of course, the positions of the two substrates can also be adjusted at the same time.

Regarding this embodiment, it should be noted that the shape of the two substrates is not limited to a rectangular shape, and may be a planar substrate of other regular or irregular shapes, and may also be a 2D curved surface or a 3D curved substrate. In addition, the number of groups of electrode pairs is not limited to four groups. In other embodiments, it may be any number of groups greater than or equal to 1, and the position of each pair of electrode pairs is not limited to the positions of the four corners of the substrate. At the office. In addition, when the number of groups of electrode pairs is large, after obtaining the coupling parameters between the respective electrode pairs, a part of the coupling parameters are used for the calculation of the compensation value, and another part of the coupling parameters can be used to confirm the accuracy of the calculated compensation values, for example, In Figure 2, the coupling parameters of the first group or the third group are used to calculate the compensation value, which is confirmed by comparing the difference between the coupling parameters of the second group (fourth group) and the coupling parameters of the first group (third group). The accuracy of the compensation value.

3 is a flow chart of an embodiment of the test step of FIG. 1. The test step S20 of the embodiment includes the following steps:

S21. output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and calculate a region compensation value according to the coupling parameter detected in the step and the position of the target electrode on the second substrate, so as to The relative position between the first substrate and the second substrate is compensated once;

S22. After one compensation, output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and calculate an accurate compensation value according to the coupling parameter detected by the step and the standard parameter, so as to The relative position between the first substrate and the second substrate is compensated twice.

In this embodiment, when the first substrate and the second substrate are subjected to the alignment test, the compensation value between the relative positions of the two substrates is calculated by detecting the coupling parameter between each pair of electrode pairs on the two substrates, and performing Fractional compensation, thus completing high-precision alignment.

The process of the alignment test will be described below with reference to FIG. 4A and FIG. 4B. Initially, the two substrates are in the pre-bonding position, that is, the alignment electrode of the first substrate can be orthographically projected into the electrode array region of the second substrate. As shown in FIG. 4A, the initial position of one of the alignment electrodes of the first substrate (upper substrate) is at the point P1, and then the relative position between the two substrates is compensated once by step S21, for example, maintaining the position of the second substrate. Unchanged, the alignment electrode is moved from the initial position P1 point to the P2 point by moving the first substrate, that is, the x coordinate moves by x1 distance in the positive direction, and the y coordinate moves by y1 distance in the positive direction. Then, the relative position between the two substrates is secondarily compensated by step S22, for example, the position of the second substrate is kept unchanged, and the positional electrode is moved from the position P2 to the point P3 by moving the first substrate, that is, The x coordinate moves in the positive direction by Δx1 distance. In the figure, Δx1 is 0, and the y coordinate moves by Δy1 distance in the positive direction, thereby achieving accurate alignment.

Regarding the primary compensation, in the first alternative embodiment, step S21 specifically includes the following steps:

S2111. Output a driving signal to the counter electrode in the pair of electrode pairs and each electrode in the electrode array, and detect a first coupling parameter between the pair of electrode electrodes in the pair of electrode pairs and each electrode in the electrode array;

S2112. Comparing the alignment electrode with the first coupling parameter between each electrode in the electrode array, and determining the electrode corresponding to the largest first coupling parameter as the reference electrode;

S1113. Calculating a first region compensation value according to a position of the reference electrode and the target electrode on the second substrate, respectively;

S2114. Move the first substrate and/or the second substrate according to the first region compensation value to perform one compensation.

In this embodiment, in conjunction with FIG. 5, the electrode array of the second substrate is a 9*9 electrode array, and the target electrode is the electrode at the center position (fifth row and fifth column), denoted as E-e. In the align test, a first coupling parameter, such as a capacitance, between the aligning electrode and each of the electrodes in the array of electrodes is separately detected. By comparing the 81 capacitance values detected, if it is determined that the capacitance between the counter electrode and the electrode at the first column of the first row in the electrode array (referred to as Aa) is the largest, the electrode Aa can be determined as a reference. electrode. In addition, since the distance between each adjacent two electrodes in the electrode array is stored in advance, the distance between the reference electrode Aa and the target electrode Ee can be calculated, and then, by moving the first substrate or the second substrate, or simultaneously The two substrates are moved, the distance of the four electrodes is compensated to the right in the x direction, and the distance of the four electrodes is compensated downward in the y direction, thereby completing one compensation.

Further, in step S10, the electrode array may be divided into a plurality of electrode blocks, for example, for an M*N electrode array, and M=m*p, N=n*q, where m, n, p, q respectively For an integer greater than 1, preferably an odd number greater than 1, the M*N electrode array can be divided into m*n electrode blocks. Referring to FIG. 5, for a 9*9 electrode array, m, n, p, and q are all equal to three, so the electrode array can be divided into nine electrode blocks A, B, C, D, E, F, G, H, I.

Regarding the primary compensation, in the second alternative embodiment, step S21 specifically includes the following steps:

S2121. Output a driving signal to the alignment electrode and each electrode block in the pair of electrode pairs, and detect a second coupling parameter between the alignment electrode and the respective electrode block in the pair of electrode pairs;

S2122. Comparing the alignment electrode with the second coupling parameter between each electrode block, and determining the electrode block corresponding to the largest second coupling parameter as the reference electrode block;

S2123. Calculating a second region compensation value according to a position of the reference electrode block and the electrode block where the target electrode is located on the second substrate, respectively;

S2124. Move the first substrate and/or the second substrate according to the second region compensation value to perform one compensation.

In this embodiment, in conjunction with FIG. 5, the electrode array of the second substrate is a 9*9 electrode array, and the target electrode is the electrode at the center position (fifth row and fifth column), denoted as E-e. In the alignment test, a second coupling parameter, such as a capacitance, between the alignment electrode and each of the electrode arrays is detected, respectively. By comparing the detected nine capacitance values, if it is determined that the capacitance between the registration electrode and the electrode block A is the largest, it can be determined that the electrode block A is the reference electrode block. In addition, since the distance between each adjacent two electrode blocks in the electrode array is stored in advance, the distance between the reference electrode block A and the electrode block E where the target electrode is located can be calculated, and then, by moving the first substrate or The second substrate, or both substrates, simultaneously compensates the distance of one electrode block to the right in the x direction, and compensates the distance of one electrode block downward in the y direction, thereby completing one compensation.

After the compensation, in the pair of electrodes, the relative positions between the counter electrode and the target electrode may be as follows: In conjunction with FIG. 6A to FIG. 6C, first, the left figure is the alignment of the first substrate. A schematic diagram of the electrode and the target electrode of the second substrate in an aligned position, that is, the projected area of the alignment electrode on the target electrode is S0, and the distance between the two is d. For the right diagram of FIG. 6A, the alignment electrode and the target electrode are offset in the x and y directions, and the projection area of the alignment electrode on the target electrode is S1, S1<S0, that is, the target electrode is not completely covered; For the right diagram of FIG. 6B, the target electrode is offset in the z direction compared to the position of the alignment electrode and the target electrode at the alignment position, that is, the distance between the two is d + Δd; for FIG. 6C In the right figure, there is an angular offset between the alignment electrode and the target electrode compared to the position of the alignment electrode and the target electrode when the position is aligned. At this time, the projection area of the alignment electrode on the target electrode is S2, and S2<S0. In addition, it is possible that the above three situations occur simultaneously. Therefore, it is necessary to perform secondary compensation for the relative position between the two substrates.

Regarding the secondary compensation, in an optional embodiment, step S22 specifically includes the following steps:

S221. After one compensation, output a driving signal to the counter electrode in the pair of electrode pairs and the target electrode and the surrounding electrode in the electrode array, and detect the alignment electrode between the pair of electrode pairs and the target electrode and the surrounding electrode respectively. The third coupling parameter.

In this step, regarding the surrounding electrodes, it is to be noted that the number of surrounding electrodes is plural and is disposed around the target electrode. Moreover, if the area compensation value is determined according to the position of the reference electrode and the target electrode on the second substrate at the time of one compensation, then the surrounding electrode can only take the eight electrodes adjacent to the target electrode and surrounding the target electrode. If the compensation value is determined according to the position of the electrode block where the reference electrode block and the target electrode are located on the second substrate, the target electrode and the surrounding electrode may refer to the entire electrode block where the target electrode is located. The electrode, or the electrode of the entire electrode block where the target electrode is located and a ring of electrodes around the electrode block.

Further, regarding the third coupling parameter, it is associated with at least one of an X-axis offset amount, a Y-axis offset amount, a Z-axis offset amount, and an angular offset amount of the registration electrode with respect to the target electrode.

S222. Calculate an accurate compensation value according to the third coupling parameter and the standard parameter;

S223. Move the first substrate and/or the second substrate according to the accurate compensation value to perform secondary compensation.

The following describes several cases of the relative positions of the two substrates after one compensation:

First, the target electrode in the electrode array is the electrode e, and the peripheral electrodes have electrodes a, b, c, d, f, g, h, i.

7A and 7B are respectively a schematic view showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the first case, in which case the two substrates are in an aligned position, that is, in the first set of electrode pairs. The projection area of the alignment electrode in the second substrate just covers the target electrode; in the second group of electrode pairs, the projection area of the alignment electrode in the second substrate also covers the target electrode, and the electrodes in the two pairs of electrode pairs The arrangement of the arrays differs by 45 degrees. At this time, it is determined by capacitance detection that in the first group of electrode pairs, a capacitance is generated between the alignment electrode and only the target electrode e, and the detected capacitance Ce1=f(X, Y, Z, θ), Where f is a specific functional relationship, such as C = εS / d, where ε is the dielectric constant, S is the facing area, d is the distance, Z is related, S is the shape of the facing area, X, Y, θ are all related. X, Y, and Z are the deviation values of the counter electrode and the target electrode in the x, y, and z directions, respectively, and θ is the angular deviation value of the counter electrode from the target electrode, and X, Y, and θ are respectively 0. Z is a fixed value; in the second set of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e, and the detected capacitance Ce2=f(X, Y, Z, θ), wherein, X, Y , θ is 0, and Z is a fixed value. In this embodiment, the value of S is the largest, that is, the area of the counter electrode itself.

8A and FIG. 8B are schematic diagrams showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the second case, in which case the two substrates are not aligned, in the first set of electrode pairs, The projection area of the bit electrode in the second substrate covers the target electrode e and the electrode f; in the second set of electrode pairs, the projection area of the counter electrode in the second substrate covers the target electrode e and the electrodes f, i, h. At this time, it is determined by capacitance detection that in the first group of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrode f, and the detected capacitance Ce1=f(X, Y, Z, θ), Cf1=f(X, Y, Z, θ), where θ is 0, X is greater than 0, Y=0, and Z is a constant value. For Cel, f(X, Y, Z, θ) = εA2*(A1-X)/d, where A1 and A2 are the side lengths of the alignment electrode in the x direction and the y direction, respectively. For Cf1, f(X, Y, Z, θ) = εA2*X/d. In the second set of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrodes f, i, h, and the detected capacitance Ce2 = f (X, Y, Z, θ), Cf2 = f (X, Y, Z, θ), Ci2 = f (X, Y, Z, θ), Ch2 = f (X, Y, Z, θ), where θ is 0, X is greater than 0, Y = 0, Z is a fixed value. Similarly, the values of Ce2, Cf2, Ci2, and Ch2 can be calculated.

9A and FIG. 9B are schematic diagrams showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the third case, in which case the two substrates are not aligned, and in the first set of electrode pairs, a projection area of the bit electrode in the second substrate covers the target electrode e and the electrodes a, b, d; in the second set of electrode pairs, the projection area of the alignment electrode in the second substrate covers the target electrode e and the electrodes a, b , d. At this time, it is determined by capacitance detection that in the first group of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrodes a, b, and d, and the detected capacitance Ce1=f(X, Y, Z, θ), Ca1 = f (X, Y, Z, θ), Cb1 = f (X, Y, Z, θ), Cd1 = f (X, Y, Z, θ), where θ is 0, X is less than 0, Y is greater than 0, and Z is a fixed value; in the second set of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrodes a, b, and d, and the detected capacitance Ce2 =f(X,Y,Z,θ), Ca2=f(X,Y,Z,θ), Cb2=f(X,Y,Z,θ), Cd2=f(X,Y,Z,θ) Where θ is 0, X is less than 0, Y is greater than 0, and Z is a fixed value. Similarly, the capacitance values can be calculated according to the above method.

10A and FIG. 10B are respectively a schematic view showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the fourth case, in which case the two substrates are not aligned, in the first set of electrode pairs, a projection area of the bit electrode in the second substrate covers the target electrode e and the electrodes a, b, d; in the second set of electrode pairs, the projection area of the alignment electrode in the second substrate covers the target electrode e and the electrodes a, b , f. At this time, it is determined by capacitance detection that in the first group of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrodes a, b, and d, and the detected capacitance Ce1=f(X, Y, Z, θ), Ca1 = f (X, Y, Z, θ), Cb1 = f (X, Y, Z, θ), Cd1 = f (X, Y, Z, θ), where X < 0, Y>0, θ>0, Z is a fixed value; in the second set of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrodes a, b, d, and the detected capacitance Ce2 =f(X,Y,Z,θ), Ca2=f(X,Y,Z,θ), Cb2=f(X,Y,Z,θ), Cf2=f(X,Y,Z,θ) Where X<0, Y>0, θ>0, Z is a fixed value. Similarly, the capacitance values can be calculated according to the above method.

11A and FIG. 11B are schematic diagrams showing the projection of the alignment electrode on the second substrate in the two sets of electrode pairs in the fifth case, in which case the two substrates are not aligned, in the first set of electrode pairs, The projection area of the bit electrode in the second substrate covers the target electrode e and the electrodes b, d, f, h; in the second set of electrode pairs, the projection area of the counter electrode in the second substrate covers the target electrode e and the electrode b , d, f, h. At this time, it is determined by capacitance detection that in the first group of electrode pairs, a capacitance is generated between the counter electrode and the target electrode e and the electrodes b, d, f, h, and the detected capacitance Ce1=f ( X, Y, Z, θ), Cb1 = f (X, Y, Z, θ), Cd1 = f (X, Y, Z, θ), Cf1 = f (X, Y, Z, θ), Ch1 = f(X, Y, Z, θ), wherein X<0, Y<0, θ>0, Z is a fixed value; in the second set of electrode pairs, the counter electrode and the target electrode e and the electrodes b, d Capacitance is generated between f and h, and the detected capacitance Ce2=f(X,Y,Z,θ), Cb2=f(X,Y,Z,θ), Cd2=f(X,Y, Z, θ), Cf2 = f (X, Y, Z, θ), Ch2 = f (X, Y, Z, θ), where X > 0, Y < 0, θ > 0, and Z is a constant value. Similarly, the capacitance values can be calculated according to the above method.

After one compensation, if the two substrates are still misaligned, as shown in FIGS. 8A, 8B to 11A, 11B, the accurate compensation value can be calculated according to the detected capacitance value and the standard capacitance value, thereby Complete the second compensation. Specifically, by measuring the actual capacitance value of the counter electrode and the target electrode, the difference between the standard capacitance value and the standard capacitance value is determined. If the difference is 0, indicating that it is fully aligned, it is the case of Figures 7A-7B. When the difference is not 0, the actual capacitance value of the counter electrode and the surrounding electrode of the target electrode is determined. When it is determined that the actual capacitance value of the registration electrode and a surrounding electrode is greater than a certain threshold (such as 0), The bit electrode is biased toward the surrounding electrode, and the relative positional relationship between the surrounding electrode and the target electrode on the second substrate can be adjusted to adjust the direction of the counter electrode toward the target electrode toward the target electrode until the counter electrode and the surrounding electrode The actual capacitance value is less than or equal to the threshold. Similarly, for the case where the actual capacitance value of the alignment electrode and the plurality of surrounding electrodes is greater than the set threshold, the alignment electrode can be adjusted in each direction in turn until the purpose is achieved.

In another optional embodiment, step S20 may specifically include the following steps:

S23. Detecting a coupling parameter between the alignment electrode and each electrode in the electrode array, and determining a difference between a coupling parameter and a standard parameter of the alignment electrode and the target electrode;

S24. By relatively moving the first substrate and/or the second substrate, the coupling parameters of the counter electrode and the target electrode are approximated to standard parameters.

For example, in a specific example, when the coupling parameter of the alignment electrode and the target electrode is smaller than the coupling parameter of the alignment electrode and the certain electrode, the control alignment electrode moves along the certain electrode toward the target electrode. In another specific example, when the coupling parameter of the alignment electrode and the target electrode is greater than the coupling parameter with the other electrode and less than the standard parameter, the coupling parameter of the alignment electrode and the surrounding electrode of the target electrode is determined, when the alignment electrode and the certain electrode When the coupling parameter of a surrounding electrode exceeds a preset threshold, the positional electrode is controlled to move along the certain surrounding electrode toward the target electrode.

12 is a structural diagram of Embodiment 1 of a aligning system for a substrate of the present invention, the aligning system includes a coupling parameter measuring device 10, a processing device 20, and a moving device 30, wherein the coupling parameter measuring device 10 is used for an electrode pair And outputting a driving signal, and detecting a coupling parameter between the pair of electrodes, wherein the first substrate and the second substrate are formed with a pair of electrode pairs, the pair of electrodes includes a matching electrode disposed on the first substrate and disposed at An electrode array on the second substrate; the processing device 20 is configured to calculate a direction and a displacement that need to be moved according to the detected coupling parameter and a standard parameter, wherein the standard parameter is a counter electrode and a second substrate of the first substrate The coupling parameter of the target electrode in the electrode array is aligned; the moving device 30 is configured to control the movement of the first substrate and/or the second substrate according to the calculated moving direction and displacement, so that the first substrate and the second substrate are in an aligned position .

In this embodiment, it should be noted that the coupling parameter is a capacitance value, an inductance value or an electromagnetic value, and the coupling parameter includes a coupling position and a coupling value. In addition, the coupling parameter measuring device 10 may be a capacitance measuring instrument, an inductance measuring instrument, an electromagnetic measuring instrument, or the like. Processing device 20 may be a computer with a processor, a server, a mobile terminal, or the like. Mobile device 30 can be a mechanical moving device such as a robotic arm, slider, slider, or the like. For different coupling parameters, the type of electrode selected and the coupling parameter measuring device are also different.

In an alternative embodiment, the coupling parameter measuring device 10 is operative to output a drive signal to the set of electrode pairs to detect coupling parameters between the set of electrode pairs. The processing device 20 is configured to calculate a region compensation value according to the detected coupling parameter and a position of the target electrode on the second substrate. The mobile device 30 is configured to control the movement of the first substrate and/or the second substrate according to the calculated area compensation value to compensate the relative position between the first substrate and the second substrate once. Further, the coupling parameter measuring device 10 is further configured to output a driving signal to the pair of electrode pairs after one compensation, and detect a coupling parameter between the pair of electrodes. The processing device 20 is configured to calculate an accurate compensation value based on the detected coupling parameter and the standard parameter. The mobile device 30 is configured to control the movement of the first substrate and/or the second substrate according to the calculated accurate compensation value to perform secondary compensation on the relative position between the first substrate and the second substrate.

In a specific embodiment, in a specific embodiment, the coupling parameter measuring device 10 is configured to output a driving signal to each of the counter electrode and the electrode array in the pair of electrode pairs, and detect the alignment of the pair of electrode pairs. The first coupling parameter between the electrodes and the respective electrodes in the array of electrodes. The processing device 20 is configured to compare the alignment electrode with a first coupling parameter between each electrode in the electrode array, and determine an electrode corresponding to the largest first coupling parameter as a reference electrode, and then according to the The first region compensation value is calculated by the position of the reference electrode and the target electrode on the second substrate, respectively. The mobile device 30 is configured to control the movement of the first substrate and/or the second substrate according to the calculated first region compensation value to perform one compensation.

When performing one compensation, in another specific embodiment, first, the electrode array is an M*N electrode array, and M=m*p, N=n*q, where m, n, p, q Each is an integer greater than 1, and the M*N electrode array is divided into m*n electrode blocks. Moreover, the coupling parameter measuring device 10 is configured to output a driving signal to the alignment electrode and each electrode block in the pair of electrode pairs, and detect a second coupling parameter between the alignment electrode and the respective electrode block in the pair of electrode pairs. The processing device 20 is configured to compare the alignment electrode with the second coupling parameter between the respective electrode blocks, and determine the electrode block corresponding to the largest second coupling parameter as the reference electrode block, and then according to the reference The second region compensation value is calculated by the position of the electrode block and the electrode block where the target electrode is located on the second substrate. The mobile device 30 is configured to control the movement of the first substrate and/or the second substrate according to the calculated second region compensation value to perform one compensation.

In the second compensation, in a specific embodiment, the coupling parameter measuring device 10 is further configured to output a driving signal to the target electrode and the target electrode and the surrounding electrode in the electrode array after the primary compensation. And detecting a third coupling parameter between the pair of electrode pairs and the target electrode and the surrounding electrode, wherein the third coupling parameter and the X-axis offset of the counter electrode relative to the target electrode, and the Y-axis offset At least one of a quantity, a Z-axis offset, and an angular offset is associated. The processing device 20 is further configured to calculate an accurate compensation value according to the third coupling parameter and the standard parameter. The mobile device 30 is further configured to control the movement of the first substrate and/or the second substrate according to the calculated precise region compensation value for secondary compensation.

Specifically, the number of surrounding electrodes is multiple and is disposed around the target electrode, and the processing device 20 is configured to control the movement of the mobile device 30 when the third coupling parameter of the alignment electrode and one of the surrounding electrodes exceeds a preset threshold. The counter electrode moves in a direction in which one of the surrounding electrodes faces the target electrode.

In an alternative embodiment, the coupling parameter measuring device 10 is configured to detect coupling parameters of the counter electrode and each electrode in the electrode array. The processing device 20 is configured to determine a difference between a coupling parameter and a standard parameter of the alignment electrode and the target electrode, and approximate the coupling parameter of the alignment electrode and the target electrode by controlling the movement device 30 to relatively move the first substrate and/or the second substrate. Standard parameters. Specifically, the processing device 20 is configured to: when the coupling parameter of the alignment electrode and the target electrode is smaller than the coupling parameter of the alignment electrode and the certain electrode, by controlling the mobile device to relatively move the first substrate and/or the second substrate to make the alignment The electrode moves along the certain electrode toward the target electrode. Alternatively, the processing device 20 is configured to determine coupling parameters of the alignment electrode and the surrounding electrode of the target electrode when the coupling parameter of the alignment electrode and the target electrode is greater than the coupling parameter with the other electrode and less than the standard parameter, when the alignment electrode and the certain electrode When the coupling parameter of a surrounding electrode exceeds a preset threshold, by moving the first substrate and/or the second substrate relative to the moving device 30, the counter electrode is moved along the certain surrounding electrode toward the target electrode.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any tampering, equivalent substitution, improvement, etc., within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

Claims (32)

1. A method for aligning a substrate, comprising the steps of:

   Forming a set of electrode pairs on the first substrate and the second substrate, the set of electrode pairs comprising a counter electrode disposed on the first substrate and an electrode array disposed on the second substrate;

   Outputting a driving signal to the pair of electrode pairs, detecting a coupling parameter between the pair of electrode pairs, and moving the first substrate and/or the second substrate according to the detected coupling parameter and a standard parameter to make the first substrate and the second substrate In the aligned position, the standard parameter is the coupling parameter when the alignment electrode of the first substrate is aligned with the target electrode in the electrode array of the second substrate.
2. The method for aligning a substrate according to claim 1, wherein the coupling parameter is a capacitance value, an inductance value, or an electromagnetic value.
3. The method for aligning a substrate according to claim 1, wherein the coupling parameter comprises a coupling position and a coupling value.
4. The method for aligning substrates according to claim 1, wherein a driving signal is outputted to the pair of electrode pairs, a coupling parameter between the pair of electrodes is detected, and the coupling parameter and the standard parameter are moved according to the detected coupling parameter and the standard parameter. The first substrate and/or the second substrate include:

   S21. output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and calculate a region compensation value according to the coupling parameter detected in the step and the position of the target electrode on the second substrate, so as to The relative position between the first substrate and the second substrate is compensated once.
5. The method for aligning a substrate according to claim 4, wherein a driving signal is outputted to the pair of electrode pairs, a coupling parameter between the pair of electrodes is detected, and the coupling parameter and the standard parameter are moved according to the detected coupling parameter and the standard parameter. The first substrate and/or the second substrate further includes:

   S22. After one compensation, output a driving signal to the pair of electrode pairs, detect a coupling parameter between the pair of electrode pairs, and calculate an accurate compensation value according to the coupling parameter detected by the step and the standard parameter, so as to The relative position between the first substrate and the second substrate is compensated twice.
6. The aligning method for a substrate according to claim 4, wherein the step S21 comprises the following steps:

   S2111. Output a driving signal to the counter electrode in the pair of electrode pairs and each electrode in the electrode array, and detect a first coupling parameter between the pair of electrode electrodes in the pair of electrode pairs and each electrode in the electrode array;

   S2112. Comparing the alignment electrode with a first coupling parameter between each electrode in the electrode array, and determining an electrode corresponding to the largest first coupling parameter as a reference electrode;

   S2113. Calculate a first region compensation value according to a position of the reference electrode and the target electrode on the second substrate, respectively;

   S2114. Move the first substrate and/or the second substrate according to the first region compensation value to perform one compensation.
7. The method for aligning a substrate according to claim 4, wherein the electrode array is an M*N electrode array, and M=m*p, N=n*q, wherein m, n, p And q are integers greater than 1, respectively, and

   The alignment method further includes:

   The M*N electrode array is divided into m*n electrode blocks.
8. The method for aligning a substrate according to claim 7, wherein the step S21 comprises the following steps:

   S2121. Output a driving signal to the alignment electrode and each electrode block in the pair of electrode pairs, and detect a second coupling parameter between the alignment electrode and the respective electrode block in the pair of electrode pairs;

   S2122. Comparing the alignment electrode with a second coupling parameter between each electrode block, and determining an electrode block corresponding to the largest second coupling parameter as a reference electrode block;

   S2123. Calculating a second region compensation value according to a position of the reference electrode block and the electrode block where the target electrode is located on the second substrate, respectively;

   S2124. Move the first substrate and/or the second substrate according to the second region compensation value to perform one compensation.
9. The method for aligning a substrate according to claim 5, wherein the step S22 comprises the following steps:

   S221. After one compensation, output a driving signal to the counter electrode in the pair of electrode pairs and the target electrode and the surrounding electrode in the electrode array, and detect the alignment electrode between the pair of electrode pairs and the target electrode and the surrounding electrode respectively. Third coupling parameter;

   S222. Calculate an accurate compensation value according to the third coupling parameter and the standard parameter;

   S223. Move the first substrate and/or the second substrate according to the accurate compensation value to perform secondary compensation.
10. The alignment method for a substrate according to claim 9, wherein the number of surrounding electrodes is plural and is disposed around the target electrode.
11. The method for aligning a substrate according to claim 9, wherein the third coupling parameter and the X-axis offset of the counter electrode relative to the target electrode, the Y-axis offset, the Z-axis offset, and the angle At least one of the offsets is associated.
12. The method for aligning a substrate according to claim 10, wherein when the third coupling parameter of the alignment electrode and one of the surrounding electrodes exceeds a predetermined threshold, controlling the alignment electrode along the one of the surrounding electrodes Moves in the direction toward the target electrode.
13. The aligning method for a substrate according to claim 1, wherein another pair of electrode pairs are further formed on the first substrate and the second substrate, and the other pair of electrode pairs are oriented differently than the pair of electrode pairs. The orientation.
14. The method for aligning substrates according to claim 1, wherein the coupling parameters between the pair of electrodes are detected, and the first substrate and/or the second substrate are moved according to the detected coupling parameters and standard parameters. ,include:

    Detecting coupling parameters of the counter electrode and each electrode in the electrode array, and determining a difference between the coupling parameter and the standard parameter of the counter electrode and the target electrode;

    By relatively moving the first substrate and/or the second substrate, the coupling parameters of the alignment electrode and the target electrode are approximated to standard parameters.
15. The method for aligning a substrate according to claim 14, wherein when the coupling parameter of the alignment electrode and the target electrode is smaller than the coupling parameter of the alignment electrode and the certain electrode, controlling the alignment electrode along the certain one The electrode moves in the direction of the target electrode.
16. The method for aligning a substrate according to claim 14, wherein when the coupling parameter of the alignment electrode and the target electrode is greater than the coupling parameter with the other electrode and smaller than the standard parameter, determining the alignment electrode and the target electrode a coupling parameter of the surrounding electrode, when the coupling parameter of the alignment electrode and a surrounding electrode exceeds a preset threshold, controlling the positional electrode to move along the certain surrounding electrode toward the target electrode.
17. A aligning system for a substrate, comprising:

    a coupling parameter measuring device for outputting a driving signal to the pair of electrodes and detecting a coupling parameter between the pair of electrodes, wherein the pair of electrodes are respectively formed on the first substrate and the second substrate, the pair of electrode pairs being disposed in the first a counter electrode on a substrate and an electrode array disposed on the second substrate;

    a processing device, configured to calculate a direction and a displacement to be moved according to the detected coupling parameter and a standard parameter, wherein the standard parameter is when the alignment electrode of the first substrate is aligned with the target electrode in the electrode array of the second substrate Coupling parameter

    And a moving device for controlling movement of the first substrate and/or the second substrate according to the calculated moving direction and displacement, so that the first substrate and the second substrate are in an aligned position.
18. The alignment system for a substrate according to claim 17, wherein the coupling parameter is a capacitance value, an inductance value, or an electromagnetic value.
19. The alignment system for a substrate according to claim 17, wherein the coupling parameter comprises a coupling position and a coupling value.
20. The alignment system for a substrate according to claim 17, wherein

    a coupling parameter measuring device, configured to output a driving signal to the pair of electrode pairs, and detect a coupling parameter between the pair of electrode pairs;

    Processing means for calculating a region compensation value according to the detected coupling parameter and a position of the target electrode on the second substrate;

    And a moving device, configured to control the movement of the first substrate and/or the second substrate according to the calculated area compensation value to perform a compensation for the relative position between the first substrate and the second substrate.
21. The alignment system for a substrate according to claim 20, wherein

    The coupling parameter measuring device is further configured to output a driving signal to the pair of electrode pairs after one compensation, and detect a coupling parameter between the pair of electrode pairs;

    The processing device is further configured to calculate an accurate compensation value according to the detected coupling parameter and the standard parameter;

    The mobile device is further configured to control the movement of the first substrate and/or the second substrate according to the calculated accurate compensation value to perform secondary compensation on a relative position between the first substrate and the second substrate.
22. The alignment system for a substrate according to claim 20, wherein

    a coupling parameter measuring device, configured to output a driving signal to each of the counter electrode and the electrode array in the pair of electrode pairs, and detect the first between the pair of electrode pairs and the respective electrodes in the electrode array Coupling parameter

    a processing device, configured to compare the alignment electrode with a first coupling parameter between each electrode in the electrode array, and determine an electrode corresponding to the largest first coupling parameter as a reference electrode, and then according to the Calculating a first region compensation value by using a position of the reference electrode and the target electrode on the second substrate respectively;

    And a moving device, configured to control the first substrate and/or the second substrate to move according to the calculated first region compensation value to perform one compensation.
23. The alignment system for a substrate according to claim 20, wherein the electrode array is an M*N electrode array, and M=m*p, N=n*q, wherein m, n, p And q are each an integer greater than 1, and the M*N electrode array is divided into m*n electrode blocks.
24. The alignment system for a substrate according to claim 23, wherein

    a coupling parameter measuring device, configured to output a driving signal to the alignment electrode and each electrode block of the pair of electrode pairs, and detect a second coupling parameter between the alignment electrode and the respective electrode block of the pair of electrode pairs;

    a processing device, configured to compare the alignment electrode with a second coupling parameter between each electrode block, and determine an electrode block corresponding to the largest second coupling parameter as a reference electrode block, and then according to the reference Calculating a second region compensation value by the position of the electrode block and the electrode block where the target electrode is located on the second substrate;

    And a moving device, configured to control the movement of the first substrate and/or the second substrate according to the calculated second region compensation value to perform one compensation.
25. The alignment system for a substrate according to claim 21, wherein

    The coupling parameter measuring device is further configured to: after one compensation, output a driving signal to the counter electrode in the pair of electrode pairs and the target electrode and the surrounding electrode in the electrode array, and detect the pair of electrodes in the pair of electrodes and the target respectively a third coupling parameter between the electrode and the surrounding electrode;

    The processing device is further configured to calculate an accurate compensation value according to the third coupling parameter and the standard parameter;

    The mobile device is further configured to control the movement of the first substrate and/or the second substrate according to the calculated precise region compensation value for secondary compensation.
26. The alignment system for a substrate according to claim 25, wherein the number of peripheral electrodes is plural and is disposed around the target electrode.
27. The alignment system for a substrate according to claim 25, wherein the third coupling parameter and the X-axis offset of the counter electrode relative to the target electrode, the Y-axis offset, the Z-axis offset, and the angle At least one of the offsets is associated.
28. The alignment system for a substrate according to claim 26, wherein

    The processing device is further configured to move the alignment electrode along a direction of the one of the surrounding electrodes toward the target electrode by controlling movement of the mobile device when the third coupling parameter of the alignment electrode and one of the surrounding electrodes exceeds a preset threshold.
29. The aligning system for a substrate according to claim 17, wherein another set of electrode pairs are further formed on the first substrate and the second substrate, and the other pair of electrode pairs are oriented differently than the pair of electrode pairs. The orientation.
30. The alignment system for a substrate according to claim 17, wherein

    a coupling parameter measuring device for detecting coupling parameters of the counter electrode and each electrode in the electrode array;

    The processing device is configured to determine a difference between the coupling parameter and the standard parameter of the aligning electrode and the target electrode, and to approximate the standard of the coupling parameter of the aligning electrode and the target electrode by controlling the moving device to relatively move the first substrate and/or the second substrate parameter.
31. The alignment system for a substrate according to claim 30, wherein

    Processing means, when the coupling parameter of the alignment electrode and the target electrode is smaller than the coupling parameter of the alignment electrode and the certain electrode, by controlling the moving device to relatively move the first substrate and/or the second substrate, the alignment electrode is along the An electrode moves in the direction of the target electrode.
32. The alignment system for a substrate according to claim 30, wherein

    a processing device, configured to determine a coupling parameter of the alignment electrode and a surrounding electrode of the target electrode when the coupling parameter of the alignment electrode and the target electrode is greater than a coupling parameter with the other electrode and less than a standard parameter, when the alignment electrode and a certain circumference When the coupling parameter of the electrode exceeds the preset threshold, the relative movement of the first electrode and the second substrate is controlled by the moving device to move the counter electrode along the certain surrounding electrode toward the target electrode.