CN208400883U - A kind of LED encapsulation structure body - Google Patents
A kind of LED encapsulation structure body Download PDFInfo
- Publication number
- CN208400883U CN208400883U CN201820721473.4U CN201820721473U CN208400883U CN 208400883 U CN208400883 U CN 208400883U CN 201820721473 U CN201820721473 U CN 201820721473U CN 208400883 U CN208400883 U CN 208400883U
- Authority
- CN
- China
- Prior art keywords
- fixing bolt
- guide post
- led encapsulation
- encapsulation structure
- structure body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of LED encapsulation structure bodies, including encapsulating structure main body, the encapsulating structure body upper surface is equipped with upper mold fixing bolt, upper mold fixing bolt bottom is equipped with battery guide post, luminescence chip is equipped on the right side of the battery guide post, fluorescent powder sheet glass is equipped on the right side of the luminescence chip, fluorescent powder sheet glass bottom is equipped with reflector, the reflector bottom is equipped with cooling fan, emptying valve is equipped on the left of the cooling fan, laser emitter is equipped on the left of the emptying valve, backlight detection pipe is equipped on the left of the laser emitter, backlight detection pipe upper surface is equipped with screw thread regulating valve, guide post fixing bolt is equipped on the left of the screw thread regulating valve, guide post fixing bolt center is equipped with conductive substrate, the conductive substrate upper surface is equipped with thermally conductive crystalline material, the thermally conductive crystalline material bottom Equipped with high temperature resistant pedestal.This kind of LED encapsulation structure body structure is simple, and practical function is able to satisfy functional need of the LED industry to LED encapsulation structure body.
Description
Technical field
The utility model belongs to mounting structure technical field, and in particular to a kind of LED encapsulation structure body.
Background technique
LED encapsulation technology is mostly to develop and be evolved in Discrete device packaging technical foundation, but have very big
Particularity.Under normal circumstances, the tube core of discrete device is sealed in packaging body, the effect of encapsulation mainly protect tube core and
Complete electric interconnection.And LED encapsulation is then to complete output electric signal, protection tube core normal work, the function of output visible light, both
There is electrical parameter, and have the design and technical requirements of optical parameter, discrete device simply can not be packaged for LED.
The core luminous component of LED is the PN junction tube core that P-type semiconductor and N-type semiconductor are constituted.When lacking for injection PN junction
Number carrier and majority carrier compound tense, will issue visible light, ultraviolet or infrared ray.But what PN junction area issued
Photon is non-directional, i.e., has identical probability to all directions transmitting.It therefore, is not that all light that tube core generates are ok
It releases, this depends primarily on semiconductor material quality, tube core structure and geometry, encapsulation internal structure and encapsulating material
Material, application requirement improve inside and outside portion's quantum efficiency of LED.Conventional Φ 5mm type LED encapsulation is by the square of side length 0.25mm
Tube core bonding is sintered on lead frame, and the anode of tube core is lead and a pin by ball contact point and gold wire bonding
It is connected, cathode is connected by emitting cup with another pin of lead frame, then with epoxy resin enclosed at the top of it.The work of reflector
With being the light for collecting tube core side, interface sending, emit into desired deflection.
It is mentioned because existing mounting structure is still in need in terms of its heat dissipation performance, heating conduction and LP blades
The place risen meets the needs of people so we need a kind of LED encapsulation structure body to solve the above problems.
Utility model content
It is mentioned above in the background art to solve the purpose of this utility model is to provide a kind of LED encapsulation structure body
Problem.
To achieve the above object, the utility model provides the following technical solutions: a kind of LED encapsulation structure body, including encapsulation
Main structure body, the encapsulating structure body upper surface are equipped with upper mold fixing bolt, and upper mold fixing bolt bottom is equipped with battery
Guide post, the battery guide post right side are equipped with luminescence chip, are equipped with fluorescent powder sheet glass, the fluorescent powder on the right side of the luminescence chip
Sheet glass bottom is equipped with reflector, and the reflector bottom is equipped with cooling fan, is equipped with emptying valve on the left of the cooling fan,
It is equipped with laser emitter on the left of the emptying valve, backlight detection pipe, the backlight detection are equipped on the left of the laser emitter
Pipe upper surface is equipped with screw thread regulating valve, is equipped with guide post fixing bolt on the left of the screw thread regulating valve, in the guide post fixing bolt
The heart is equipped with conductive substrate, and the conductive substrate upper surface is equipped with thermally conductive crystalline material, and the thermally conductive crystalline material bottom is equipped with resistance to
High temperature pedestal.
Preferably, the battery guide post includes energization spool, accepts battery plate, and the energization spool is arranged at battery guide post bottom
Portion, the undertaking battery plate are arranged in energization spool upper surface.
Preferably, upper mold fixing bolt bottom is equipped with screw thread, and the upper mold fixing bolt and encapsulating structure main body are logical
Cross threads turn connection.
Preferably, the laser emitter includes laser source, transmitting outer ring, and the laser source is arranged in laser emitter
The heart, the transmitting outer ring are arranged on the outside of laser source.
Preferably, the luminescence chip is set as 2, and 2 luminescence chips are symmetrical set respectively to be tied in encapsulation
Structure main body two sides.
Preferably, the cooling fan is embedded in encapsulating structure main body front.
The technical effect and advantage of the utility model: 1, this kind of LED encapsulation structure body is equipped with fluorescent powder sheet glass, can increase
Laser emission effect improves precision；
2, this kind of LED encapsulation structure body is equipped with thermally conductive crystalline material, and heating conduction can be improved and in time remove heat；
3, this kind of LED encapsulation structure body is equipped with cooling fan and high temperature resistant pedestal, can remove waste heat in time.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the battery guide pillar structure schematic diagram of the utility model；
Fig. 3 is the laser emitter structural schematic diagram of the utility model.
In figure: 1 high temperature resistant pedestal；2, conductive substrate；3, thermally conductive crystalline material；4, guide post fixing bolt；5, screw thread is adjusted
Valve；6, backlight detection pipe；7, battery guide post；701, energization spool；702, battery plate is accepted；8, upper mold fixing bolt；9, shine core
Piece；10, laser emitter；1001, laser source；1002, emit outer ring；11, encapsulating structure main body；12, fluorescent powder sheet glass；
13, reflector；14, emptying valve；15, cooling fan.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of LED encapsulation structure body as shown in Figure 1, Figure 2 and Figure 3, including encapsulating structure master
Body 11,11 upper surface of encapsulating structure main body are equipped with upper mold fixing bolt 8, and 8 bottom of upper mold fixing bolt is equipped with battery
Guide post 7 is equipped with luminescence chip 9 on the right side of the battery guide post 7, and fluorescent powder sheet glass 12 is equipped on the right side of the luminescence chip 9, described
12 bottom of fluorescent powder sheet glass is equipped with reflector 13, and 13 bottom of reflector is equipped with cooling fan 15, the cooling fan 15
Left side is equipped with emptying valve 14, and laser emitter 10 is equipped on the left of the emptying valve 14, is set on the left of the laser emitter 10
There is backlight detection pipe 6,6 upper surface of backlight detection pipe is equipped with screw thread regulating valve 5, is equipped with and leads on the left of the screw thread regulating valve 5
Column fixing bolt 4,4 center of guide post fixing bolt are equipped with conductive substrate 2, and 2 upper surface of conductive substrate is equipped with thermally conductive crystalline substance
Body material 3, thermally conductive 3 bottom of crystalline material are equipped with high temperature resistant pedestal 1.
Specifically, the battery guide post 7 includes energization spool 701, accepts battery plate 702, the setting of energization spool 701 exists
7 bottom of battery guide post, the undertaking battery plate 702 are arranged in 701 upper surface of energization spool.
Specifically, 8 bottom of upper mold fixing bolt is equipped with screw thread, the upper mold fixing bolt 8 and encapsulating structure main body
11 are connected by threads turn.
Specifically, the laser emitter 10 includes laser source 1001, transmitting outer ring 1002, the laser source 1001 is arranged
At 10 center of laser emitter, the setting of transmitting outer ring 1002 is in 1001 outside of laser source.
Specifically, the luminescence chip 9 is set as 2,2 luminescence chips 9 are symmetrical set are encapsulating respectively
11 two sides of main structure body.
Specifically, the cooling fan 15 is embedded in 11 front of encapsulating structure main body.
Working principle: this kind of LED encapsulation structure body is in use, first connect power supply, battery guide post 7 for encapsulating structure main body 11
Power supply is carried, electricity is transmitted by conductive substrate 2, upper mold fixing bolt and guide post fixing bolt 4 can reinforce encapsulating structure main body
The fluorescent powder sheet glass 12 of 11 firmness, 9 outside of luminescence chip can increase Laser emission effect, improve precision, reflector
Fluorescent powder on fluorescent powder sheet glass 12 is carried out reflective irradiation by 13, and thermally conductive crystalline material 3 can be improved heating conduction and in time will
Heat removes, and high temperature resistant pedestal 1 and cooling fan 15 can remove waste heat in time, and emptying valve 14 is responsible for unloading extra oil
Amount, backlight detection pipe 6 can detect the light quantity of backlight.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of LED encapsulation structure body, including encapsulating structure main body (11), it is characterised in that: the encapsulating structure main body (11)
Upper surface is equipped with upper mold fixing bolt (8), and upper mold fixing bolt (8) bottom is equipped with battery guide post (7), the battery guide post
(7) right side is equipped with luminescence chip (9), is equipped with fluorescent powder sheet glass (12) on the right side of the luminescence chip (9), the fluorescent powder glass
Piece (12) bottom is equipped with reflector (13), and reflector (13) bottom is equipped with cooling fan (15), the cooling fan (15)
Left side is equipped with emptying valve (14), is equipped with laser emitter (10) on the left of the emptying valve (14), the laser emitter
(10) left side is equipped with backlight detection pipe (6), and backlight detection pipe (6) upper surface is equipped with screw thread regulating valve (5), the screw thread tune
It saves and is equipped with guide post fixing bolt (4) on the left of valve (5), guide post fixing bolt (4) center is equipped with conductive substrate (2), described to lead
Electric base (2) upper surface is equipped with thermally conductive crystalline material (3), and thermally conductive crystalline material (3) bottom is equipped with high temperature resistant pedestal (1).
2. a kind of LED encapsulation structure body according to claim 1, it is characterised in that: the battery guide post (7) includes being powered
Spool (701) accepts battery plate (702), and the energization spool (701) is arranged in battery guide post (7) bottom, the undertaking battery plate
(702) it is arranged in energization spool (701) upper surface.
3. a kind of LED encapsulation structure body according to claim 1, it is characterised in that: upper mold fixing bolt (8) bottom
Equipped with screw thread, the upper mold fixing bolt (8) is connect with encapsulating structure main body (11) by threads turn.
4. a kind of LED encapsulation structure body according to claim 1, it is characterised in that: the laser emitter (10) includes
Laser source (1001), transmitting outer ring (1002), the laser source (1001) are arranged in laser emitter (10) center, the transmitting
Outer ring (1002) setting is on the outside of laser source (1001).
5. a kind of LED encapsulation structure body according to claim 1, it is characterised in that: the luminescence chip (9) is set as 2
A, 2 luminescence chips (9) are symmetrical set respectively in encapsulating structure main body (11) two sides.
6. a kind of LED encapsulation structure body according to claim 1, it is characterised in that: the cooling fan (15) is embedded in
Encapsulating structure main body (11) front.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820721473.4U CN208400883U (en) | 2018-05-15 | 2018-05-15 | A kind of LED encapsulation structure body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820721473.4U CN208400883U (en) | 2018-05-15 | 2018-05-15 | A kind of LED encapsulation structure body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400883U true CN208400883U (en) | 2019-01-18 |
Family
ID=65136356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820721473.4U Expired - Fee Related CN208400883U (en) | 2018-05-15 | 2018-05-15 | A kind of LED encapsulation structure body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208400883U (en) |
-
2018
- 2018-05-15 CN CN201820721473.4U patent/CN208400883U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190118 Termination date: 20200515 |