CN208385398U - Window-type ball grid array package assembling - Google Patents
Window-type ball grid array package assembling Download PDFInfo
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- CN208385398U CN208385398U CN201820759345.9U CN201820759345U CN208385398U CN 208385398 U CN208385398 U CN 208385398U CN 201820759345 U CN201820759345 U CN 201820759345U CN 208385398 U CN208385398 U CN 208385398U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model provides a kind of window-type ball grid array package assembling, it include: substrate, with opposite first surface and second surface, it is formed through the window of first surface and second surface, the pad of a plurality of contacts for abutting window and matrix arrangement is provided on first surface, second surface includes chip installation area, window both ends are respectively formed with glue-feeder and upper mold stream slowly collects mouth, upper mold stream slowly collects mouth and is open compared to the unhurried current that glue-feeder is dimension enlargement, and the end portion width that upper mold stream slowly collects mouth is greater than the channel width of window；Chip, part covers window, and it is exposed except chip so that the glue-feeder of window and upper mold stream is slowly collected mouth；Bonding wire across window and is electrically connected chip and substrate；And plastic-sealed body, chip and bonding wire are wrapped up, and fill up upper mold stream and slowly collect mouth.The empty problem that the utility model can avoid the excessive glue problem occurred on substrate and occur in plastic-sealed body.
Description
Technical field
The utility model relates to semiconductor memory device assembly more particularly to a kind of window-type ball grid array (Window
Ball Grid Array, WBGA) package assembling.
Background technique
In the encapsulated type of numerous semiconductor devices, window-type ball grid array encapsulating structure is will be to carry chip
Substrate opens up the window of perforation, in order to which bonding wire passes through window, is electrically connected substrate and chip.
As shown in Figure 1, a kind of well known window-type ball grid array packaging part includes substrate 110, the core with window 111
Piece 120, bonding wire 130, adhesive layer 140, plastic-sealed body 150 and soldered ball, soldered ball are planted in the pad on the engagement surface of substrate 110
112.Chip 120 is fixed on the mounting surface of substrate 110 by adhesive layer 140, and bonding wire 130 passes through window 111 and is electrically connected chip 120
With substrate 110, plastic-sealed body 150 wraps up chip 120 and bonding wire 130.In injection moulding process, substrate 110 is placed in by upper mold
11 and lower mold 12 composition injection mold 10 in, be then injected into plastic packaging material (EMC, Epoxy Molding Compound, ring
Oxygen resin injected molded compound), form the plastic-sealed body 150 of package chip 120 and bonding wire 130.
As shown in Fig. 2, plastic packaging material enters the inner cavity of mold 10 from sprue gate 13, along lower die stream direction 14B in injection molding
The plastic packaging material of flowing, part can flow into window 111 via the glue-feeder 111A of 111 one end of substrate window, along upper mold stream direction
14A flowing, since the inner cavity of upper mold 11 is smaller than the inner cavity of lower mold 12, plastic packaging material is in the case where the flowing velocity of upper mold 11 is faster than
Mold 12 keeps upper and lower mould mould stream uneven and leads to occur cavity 151 in the plastic packaging material filled in lower 12 cavity of mold.Together
When, since upper and lower mould flow velocity degree is different, when upper mold stream is greater than lower die stream, it is big to will cause 110 top mould flowing pressure of substrate, substrate
110 non-clamping area 113 will deform sinking, will increase upper mold because flow velocity is too fast when plastic packaging material flow to gum outlet 111B
Stream struts the pressure of substrate 110, causes plastic packaging material to spill on substrate 110 from the gap between upper cavity and substrate 110 and produces
Raw excessive glue 152, excessive glue 152 even can cover pad 112, make the external failure of packaging part.As shown in figure 3, as fruit chip 120 to
The direction opposite with glue-feeder 111A ' produce displacement, will lead to the region gum outlet 111B ' compared to the area glue-feeder 111A '
Domain becomes narrower, and cavity and excessive glue problem will become more serious.
The present inventor has found when implementing the utility model, even the setting region gum outlet 111B is compared to glue-feeder
The sectional dimension in the region 111A is bigger, but since the width of gum outlet 111B is still the same as the width of substrate window, also still
It is difficult to have the function that carry out upper mold stream slow.
It on the other hand, is the package assembling of array type based on this packaging part, then the plastic-sealed body that upper mold stream is formed is one one
Item it is in a strip shape be distributed in substrate 110 for being arranged the upper surface of soldered ball, the plastic-sealed body that lower die stream is formed be whole piece cover
Cover the lower surface that chip 120 is adhesive in substrate 110.During injection molding, based on above-mentioned glue-feeder 111A and plastic emitting
The setting of mouth 111B, the injection moulding speed of upper mold stream can be too fast, and the injection moulding speed of lower die stream is relatively slow, but since upper mold stream is formed
Plastic-sealed body be it is in a strip shape, then the chamber of upper mold 11 be also present strip be distributed, as upper mold stream constantly fills modeling
Envelope material is in upper mold 11 but lower die stream filling plastic packaging material can not follow up in the filling speed of lower mold 12, and especially upper mold stream passes through
The upper mold stream being extruded slowly collects mouth and makes mould flow velocity degree accelerate to flow back into lower mold 12 and then interfere the flowing of lower die stream, leads
Cause subsequent plastic packaging material that can not inject from sprue gate 13.
Utility model content
In view of this, the present invention provides a kind of window-type ball grid array package assemblings, comprising:
Substrate has opposite first surface and second surface, and is formed through the first surface and second surface
Window, the pad of a plurality of contacts for abutting the window and a plurality of matrix arrangements, institute are provided on the first surface
Stating second surface includes chip installation area, and the window both ends are respectively formed with more than the chip installation area and when for injection molding into glue
Slowly collect mouth to be divided into the upper mold stream of the glue-feeder of upper mold stream and lower die stream and the injection moulding speed of the buffering upper mold stream, it is described
Upper mold stream slowly collects mouth and is open compared to the unhurried current that the glue-feeder is dimension enlargement, and the upper mold stream slowly collects the width of mouth
Degree is greater than the channel width of the window；
Chip is fixed on the second surface of the substrate by adhesive layer and in alignment with the chip installation area, the core
Piece part covers the window, and it is exposed except the chip so that the glue-feeder of the window and upper mold stream is slowly collected mouth,
And the chip has a plurality of weld pads, is located in the window；
Bonding wire across the window and is electrically connected the weld pad of the chip and the contact of the substrate；With
And
Plastic-sealed body, the first Plastic Division and shape including being formed partially on the substrate first surface and filling the window
The second Plastic Division on second substrate surface described in Cheng Yu, first Plastic Division be less than second Plastic Division, described second
Plastic Division is formed by the lower die stream, and to wrap up the chip, first Plastic Division wraps up the bonding wire and by the weldering
The weld pad of the chip of line connection and the contact of the substrate, and the upper mold is filled up in first Plastic Division
Stream slowly collects mouth to be mutually connected to second Plastic Division, and the pad is exposed to except the plastic-sealed body, and the upper mold
Stream slowly collects height of the width of mouth greater than first Plastic Division formed by the upper mold stream on the substrate, but not
Greater than the cover width of first Plastic Division on the substrate.
Further, the window is in hammer shape, wherein it is tup shape that the upper mold stream, which slowly collects mouth,.
Further, it is rectangle that the upper mold stream, which slowly collects mouth,.
Further, the glue-feeder is semicircle or half elliptic.
Alternatively, the edge of the glue-feeder includes arc, the arc is less than semicircle or half elliptic.
Further, the window-type ball grid array package assembling further includes a plurality of implantings in the soldered ball of the pad.
Further, the perforated area that the upper mold stream slowly collects mouth is more than or equal to the channel transverse cross-sectional of the window
Product.
Further, apart from the upper mold stream slowly collect the nearest substrate side of mouth with it is nearest apart from the substrate side
The distance between pad slowly collect the distance between mouth no more than the substrate side and the upper mold stream.
The utility model by adopting the above technical scheme, has the advantages that
The window-type ball grid array package assembling of the utility model can avoid in injection moulding process because of the mould flow velocity in upper mold
It spends fastly and in the excessive glue problem occurred on substrate and the empty problem occurred in plastic-sealed body and avoidable upper mold
Mould stream spill into substrate for the surface of pad to be arranged.
Above-mentioned general introduction is merely to illustrate that the purpose of book, it is not intended to be limited in any way.Except foregoing description
Schematical aspect, except embodiment and feature, by reference to attached drawing and the following detailed description, the utility model is into one
Aspect, embodiment and the feature of step, which will be, to be readily apparent that.
Detailed description of the invention
In the accompanying drawings, unless specified otherwise herein, otherwise indicate the same or similar through the identical appended drawing reference of multiple attached drawings
Component or element.What these attached drawings were not necessarily to scale.It should be understood that these attached drawings are depicted only according to originally practical
Novel disclosed some embodiments, and should not be taken as the limitation to the scope of the utility model.
Fig. 1 is that structure of the window-type ball grid array packaging part after injection moulding process in crosscutting window direction is cutd open in the prior art
Face schematic diagram.
Fig. 2 is that section of the window-type ball grid array packaging part in injection moulding process along window extending direction shows in the prior art
It is intended to.
Fig. 3 is that section of the window-type ball grid array packaging part in injection moulding process along window extending direction shows in the prior art
It is intended to (when chip is subjected to displacement).
Fig. 4 is the diagrammatic cross-section of the window-type ball grid array package structure of the utility model.
Fig. 5 is that the injection molding of the utility model does not complete the substrate first surface vertical view of front window shape of the mouth as one speaks BGA packages
Figure.
Fig. 6 is the second substrate surface top view of the window-type ball grid array packaging part of the utility model.
Fig. 7 is diagrammatic cross-section of the window-type ball grid array package structure of the utility model in injection moulding process.
Fig. 8 is that the substrate first surface vertical view of rear window shape of the mouth as one speaks BGA packages is completed in the injection molding of the utility model
Figure.
10: mold 11: upper mold 12: lower mold 13: note cast gate
14A: upper mold stream 14B: lower die stream
110: substrate 111: window 111A: glue-feeder 111B: gum outlet
111A ': glue-feeder 111B ': gum outlet 112: pad 113: nip area
120: chip 130: bonding wire 140: adhesive layer
150: plastic-sealed body 151: hole 152: excessive glue
210: substrate 211: window 211A: glue-feeder 211B: upper mold stream slowly collects mouth
211C: upper mold stream slowly collects the width 211D: channel width of mouth
212: first surface 213: second surface
214: chip installation area 215: contact 216: pad
220: chip 221: weld pad 230: bonding wire 240: adhesive layer
250: 251: the first Plastic Division of plastic-sealed body
The width of the 251B: the first Plastic Division of height of 251A: the first Plastic Division
252: the second Plastic Divisions
260: soldered ball
210A: upper mold stream slowly collects the mouth distance nearest apart from substrate side
210B: slowly collect between the nearest substrate side of mouth and the pad nearest apart from the substrate side apart from upper mold stream
Distance
20: mold 21: upper mold 22: lower mold 23: note cast gate
24A: upper mold stream 24B: lower die stream
Specific embodiment
Hereinafter, certain exemplary embodiments are simply just described.As one skilled in the art will recognize that
Like that, without departing from the spirit or scope of the present utility model, it can be modified by various different modes described real
Apply example.Therefore, attached drawing and description are considered essentially illustrative rather than restrictive.
As shown in Figure 4, Figure 5 and Figure 6, the window-type ball grid array package assembling of the present embodiment includes substrate 210, chip
220, bonding wire 230, adhesive layer 240, plastic-sealed body 250 and soldered ball 260.
Substrate 210 has opposite first surface 212 and second surface 213, and is formed through the first surface 212
And the window 211 of second surface 213.A plurality of contacts 215 for abutting window 211 are provided on the first surface 212 of substrate 210
And the pad 216 of a plurality of matrix arrangements.The second surface 213 of substrate 210 includes chip installation area 214.
211 both ends of window be respectively formed with more than chip installation area 214 and for injection molding when into glue glue stream is divided into upper mold stream
Flow into the glue-feeder 211A that upper mold and lower die stream flow into lower mold, and buffering upper mold stream injection moulding speed upper mold stream it is slow
Collect a mouthful 211B.Wherein, upper mold stream slowly collects opening of mouthful 211B compared to glue-feeder 211A for dimension enlargement, in favor of
The injection moulding speed of upper mold stream is buffered, the width 211C that upper mold stream slowly collects mouthful 211B is greater than the channel width of window 211
211D can play the effect slow to the injection moulding speed of upper mold stream.In the present embodiment, the shape of window 211 is hammer shape, on
Mould stream slowly collects the tup that mouthful 211B is equivalent to hammer.It is preferably rectangle that upper mold stream, which slowly collects a mouthful 211B, can make area most
Bigization.Glue-feeder 211A is preferably semicircle or half elliptic, or following shape: its edge be include less than semicircle or
Less than the arc of semiellipse.
Chip 220 is fixed on the second surface 213 of substrate 210 by adhesive layer 240, and in alignment with chip installation area 214.
220 part of chip covers window 211, is exposed to except chip 220 so that glue-feeder 211A and upper mold stream slowly collect a mouthful 211B.
With a plurality of weld pads 221 in window 211 on chip 220.
Bonding wire 230 passes through window 211, and one end connects the weld pad 221 of chip 210, the contact of other end connecting substrate 210
215, realize the electric connection of chip 220 and substrate 210.
Plastic-sealed body 250 wraps up chip 220 and bonding wire 230, forms protection, and the pad 216 on substrate first surface 212 is answered naked
It is exposed to except plastic-sealed body 250.Plastic-sealed body 250 fills up upper mold stream and slowly collects a mouthful 211B, it includes being formed partially in substrate first
On surface 212 and to fill the first of window 211 Plastic Division 251 and the second Plastic Division for being formed on second substrate surface 213
252.Second Plastic Division 252 is formed by lower die stream, for wrapping up the non-adhesive surface of chip 220.First Plastic Division 251 is by upper mold
Stream is formed, and for wrapping up the weld pad 221 and contact 215 of bonding wire 230 and the connection of 230 both ends of bonding wire, and the first Plastic Division 251 is filled out
Full upper mold stream collects mouthful 211B slowly to be mutually connected to the second Plastic Division 252.And first Plastic Division 251 volume less than second
Plastic Division 252.The perforated area that upper mold stream slowly collects mouthful 211B is more than or equal to the channel transverse cross-sectional product of window 211, crosscutting
Direction is perpendicular to upper mold stream direction and the surface of substrate 210.
The corresponding implanting of a plurality of soldered balls 260 is in the pad 216 on substrate first surface 212, to provide external connection.
As shown in fig. 7, substrate 210 to be placed in the mold 20 being made of upper mold 21 and lower mold 22 in injection moulding process
In, note cast gate 23 is offered on lower mold 22, from note cast gate 23 to the intracavitary injection plastic packaging material of the type of mold 20.Plastic packaging material is under
The plastic packaging material of mould stream direction 24B flowing, part can flow into window 211 via the glue-feeder 211A of 211 one end of substrate window, and
It is flowed along upper mold stream direction 24A.Since upper mold stream slowly collects mouthful 211B greater than glue-feeder 211A, plastic packaging material is in upper mold 21
Type chamber and upper mold stream, which slowly collect the flowing velocity at mouthful 211B, can all slow down, to avoid the type chamber and base from upper mold 21
Between plate 210 at gap the problem of excessive glue, reduce pad 216 Joint failure rate, while plastic packaging material upper mold type it is intracavitary and
The intracavitary flowing velocity of lower mould type tends to balance, and can avoid being formed in production in the second intracavitary Plastic Division 252 of lower 22 type of mold
Raw cavity.
Further, as shown in Figure 4 and Figure 8, the width 211C that upper mold stream slowly collects mouthful 211B is greater than the first Plastic Division
251 height 251A over the substrate 210, but it is not more than the cover width 251B of the first Plastic Division 251 over the substrate 210.Such as
This, upper mold stream slowly collects mouthful 211B and forms a flat but also wide port not only, even if upper mold stream slowly collects a mouthful 211B and is not more than
Glue-feeder 211A can also buffer the speed of upper mold stream, balanced with the speed of lower die stream.Moreover, because mould stream is slow
The width 211C for collecting mouthful 211B is not more than the cover width 251B of the first Plastic Division 251 over the substrate 210, can be further
It avoids upper mold stream from slowly collecting mouthful 211B upper mold stream when carrying out slow to upper mold stream to spill into substrate 210 equipped with pad 216
Surface, i.e. each surface 212 of substrate reduces the Joint failure rate of pad 216.
It is not less than as shown in figure 8, upper mold stream slowly collects mouthful 211B distance 210A nearest apart from substrate side apart from upper
Mould stream slowly collects the distance between the nearest substrate side of mouthful 211B pad 216 nearest with it 210B, to maintain substrate 210
Slowly collecting a mouthful structural strength for the side 211B close to upper mold stream.
Therefore, the window-type ball grid array package assembling of the utility model can avoid in injection moulding process because of the mould in upper mold
Flow excessive velocities and the excessive glue problem occurred on substrate and the empty problem and avoidable upper mold that occur in plastic-sealed body
Mould stream in tool spills into substrate the surface for being equipped with pad.
It should be noted that the orientation such as "front", "rear" as described herein, "upper", "lower" are for the convenience of description and set, and
It is not centainly to be completely corresponded up and down with front and back spatially in actual work.
In the description of this specification, referring to term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.Moreover, description specific features, structure, material or
Feature may be combined in any suitable manner in any one or more of the embodiments or examples.In addition, in not conflicting situation
Under, those skilled in the art can be by different embodiments or examples described in this specification and different embodiments or examples
Feature be combined.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or hidden
It include at least one this feature containing ground.The meaning of " plurality " is two or more in the description of the present invention, unless
Separately there is clearly specific restriction.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, it is each can to readily occur in it
Kind change or replacement, these should be covered within the scope of the utility model.Therefore, the protection scope of the utility model
It should be based on the protection scope of the described claims.
Claims (8)
1. a kind of window-type ball grid array package assembling characterized by comprising
Substrate has opposite first surface and second surface, and is formed through the window of the first surface and second surface
Mouthful, it is provided with the pad of a plurality of contacts for abutting the window and a plurality of matrix arrangements on the first surface, described the
Two surfaces include chip installation area, the window both ends be respectively formed with more than the chip installation area and for injection molding when into glue with point
Upper mold stream at the injection moulding speed of the glue-feeder and the buffering upper mold stream of upper mold stream and lower die stream slowly collects mouth, the upper mold
Stream slowly collects mouth and is open compared to the unhurried current that the glue-feeder is dimension enlargement, and the width that the upper mold stream slowly collects mouth is big
In the channel width of the window；
Chip is fixed on the second surface of the substrate by adhesive layer and in alignment with the chip installation area, the chip portion
Point covering window, and it is exposed except the chip so that the glue-feeder of the window and upper mold stream is slowly collected mouth, and
The chip has a plurality of weld pads, is located in the window；
Bonding wire across the window and is electrically connected the weld pad of the chip and the contact of the substrate；And
Plastic-sealed body, including being formed partially on the substrate first surface and filling the first Plastic Division of the window and be formed in
The second Plastic Division on the second substrate surface, first Plastic Division are less than second Plastic Division, second plastic packaging
Portion is formed by the lower die stream, and to wrap up the chip, the bonding wire and bonding wire connection are wrapped up in first Plastic Division
The chip the weld pad and the substrate the contact, and to fill up the upper mold stream slow for first Plastic Division
Collect mouth to be mutually connected to second Plastic Division, the pad is exposed to except the plastic-sealed body, and the upper mold stream is slow
Collect height of the width of mouth greater than first Plastic Division formed by the upper mold stream on the substrate, but is not more than institute
State the cover width of the first Plastic Division on the substrate.
2. window-type ball grid array package assembling according to claim 1, which is characterized in that the window is in hammer shape,
Wherein, it is tup shape that the upper mold stream, which slowly collects mouth,.
3. window-type ball grid array package assembling according to claim 2, which is characterized in that the upper mold stream slowly collects
Mouth is rectangle.
4. window-type ball grid array package assembling according to claim 3, which is characterized in that the glue-feeder is semicircle
Or half elliptic.
5. window-type ball grid array package assembling according to claim 3, which is characterized in that the edge packet of the glue-feeder
Bracket, the arc are less than semicircle or half elliptic.
6. window-type ball grid array package assembling according to claim 1, which is characterized in that the window-type ball grid array
Package assembling further includes a plurality of implantings in the soldered ball of the pad.
7. window-type ball grid array package assembling according to claim 1, which is characterized in that the upper mold stream slowly collects mouth
Perforated area be more than or equal to the window channel transverse cross-sectional product.
8. window-type ball grid array package assembling according to any one of claims 1 to 7, which is characterized in that described in distance
Upper mold stream slowly collects the distance between the nearest substrate side of mouth and the pad nearest apart from substrate side no more than the base
Plate side and the upper mold stream slowly collect the distance between mouth.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710569914.3A CN107369655A (en) | 2017-07-13 | 2017-07-13 | A kind of window-type ball grid array package assembling |
| CN2017105699143 | 2017-07-13 |
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| CN208385398U true CN208385398U (en) | 2019-01-15 |
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| CN201710569914.3A Pending CN107369655A (en) | 2017-07-13 | 2017-07-13 | A kind of window-type ball grid array package assembling |
| CN201820759345.9U Active CN208385398U (en) | 2017-07-13 | 2018-05-21 | Window-type ball grid array package assembling |
| CN201810487209.3A Active CN108447843B (en) | 2017-07-13 | 2018-05-21 | Window type ball grid array package assembly |
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| CN201710569914.3A Pending CN107369655A (en) | 2017-07-13 | 2017-07-13 | A kind of window-type ball grid array package assembling |
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| CN201810487209.3A Active CN108447843B (en) | 2017-07-13 | 2018-05-21 | Window type ball grid array package assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109501149A (en) * | 2018-12-20 | 2019-03-22 | 华天科技（西安）有限公司 | A kind of novel flow channel structure of metaideophone molding IC package mold |
| CN113284856B (en) * | 2020-02-19 | 2022-03-18 | 长鑫存储技术有限公司 | Package structure and method for forming the same |
| CN113276348B (en) * | 2020-02-19 | 2023-01-24 | 长鑫存储技术有限公司 | Injection mold and injection molding method |
| CN116564857B (en) * | 2023-05-25 | 2024-02-02 | 深圳市伟方成科技有限公司 | LED lamp bead packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6642136B1 (en) * | 2001-09-17 | 2003-11-04 | Megic Corporation | Method of making a low fabrication cost, high performance, high reliability chip scale package |
| CN100365782C (en) * | 2003-05-23 | 2008-01-30 | 矽品精密工业股份有限公司 | Open-window type ball grid array semiconductor packaging elements and its producing method and used chip bearing elements |
| CN1992248A (en) * | 2005-12-30 | 2007-07-04 | 华东科技股份有限公司 | Packaging structure of chip with slot type metallic film supporting wire bonding |
| US20070278692A1 (en) * | 2006-06-01 | 2007-12-06 | Powertech Technology Inc. | Structure of semiconductor substrate and molding method |
| CN101145549A (en) * | 2006-09-13 | 2008-03-19 | 力成科技股份有限公司 | Ball grating array package structure and package method |
| CN101207105A (en) * | 2006-12-20 | 2008-06-25 | 矽品精密工业股份有限公司 | Windowing type ball grid array substrate and semiconductor package |
| CN100490131C (en) * | 2006-12-21 | 2009-05-20 | 力成科技股份有限公司 | Encapsulation construction of ball lattice array for preventing glue overflow |
| CN101350335B (en) * | 2007-07-19 | 2010-06-02 | 矽品精密工业股份有限公司 | Open window type ball grid array semiconductor packaging piece and web board structure used thereby |
| CN100587946C (en) * | 2007-11-19 | 2010-02-03 | 华东科技股份有限公司 | Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream |
| JP4845952B2 (en) * | 2008-11-10 | 2011-12-28 | 力成科技股▲分▼有限公司 | Window type semiconductor package |
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| Publication number | Publication date |
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| CN107369655A (en) | 2017-11-21 |
| CN108447843A (en) | 2018-08-24 |
| CN108447843B (en) | 2023-08-18 |
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