CN208369940U - A kind of novel printed board - Google Patents
A kind of novel printed board Download PDFInfo
- Publication number
- CN208369940U CN208369940U CN201821080114.1U CN201821080114U CN208369940U CN 208369940 U CN208369940 U CN 208369940U CN 201821080114 U CN201821080114 U CN 201821080114U CN 208369940 U CN208369940 U CN 208369940U
- Authority
- CN
- China
- Prior art keywords
- substrate
- printed board
- cooling device
- copper sheet
- conductive copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a kind of novel printed board, including first substrate, the second substrate, airflow channel, metal layer, insulating layer, the first cooling device, the second cooling device, the first conductive copper sheet, the second conductive copper sheet, protects pipeline, leads warm copper wire, semiconductor chilling plate and temperature sensor；The utility model structure is simple, compact and reasonable, easy to assembly quick, connection is reliable, and the heat transfer path during shortening reduces the temperature for the component installed in printed board, solder joint bonding strength is stronger, improves the reliability of assembly, it is ensured that obtains complete and accurate signal.
Description
Technical field
The utility model relates to the technical fields of electronic component, specifically design a kind of novel printed board.
Background technique
In recent ten years, printed circuit board manufacturing in China's is quickly grown, and the gross output value, total output occupy the world in pairs
One.Since electronic product makes rapid progress, price war changes the structure of supply chain, and China has both industry distribution, cost and market
Advantage has become the most important printed circuit board production base in the whole world.
In recent years, printed circuit board developed to dual platen, multi-layer board and flex plate from single layer, and constantly to high-precision,
High density and high reliability direction are developed.Volume is constantly reduced, cost is reduced, improves performance, so that printed circuit board will be in future
In the development process of electronic product, powerful vitality is still maintained.
The phenomenon that existing printed board is easy to produce viscous tin shows so as to cause the circuit connection mistake of electronic component short circuit
As heat-sinking capability is weaker, and printed board is easy because high temperature is deformed, and stability is poor, shortens the use of printed board
Service life, meanwhile, existing printed board solder joint bonding strength is weaker, reduces the reliability of assembly, it is difficult to which guarantee obtains complete
And accurate high-frequency signal, greatly reduce the reliability of printed board work.Meanwhile the conducting wire of existing printed board printing, it leads
Electric energy power is smaller, it is difficult to the conducting to high current is realized, when needing to pass through high current in printed board, generally by high current
Printed board, then be introduced on power original part by short-circuiting bar, increase the width and thickness of conducting wire, overcurrent capability has
Limit, using big specification Square wire welding conducting can make the configuration in printed board more mixed and disorderly cumbersome, be unfavorable for giving birth to
It produces.
Summary of the invention
In view of this, it is necessary to presently, there are aiming at the problem that, a kind of novel printed board is provided.
A kind of novel printed board, including first substrate, the second substrate, airflow channel, metal layer, insulating layer, the first cooling
Device, the second cooling device, the first conductive copper sheet, the second conductive copper sheet, protect pipeline, lead warm copper wire, semiconductor chilling plate and
Temperature sensor；
It is provided with airflow channel between the first substrate and the second substrate, is provided with metal layer on the first substrate,
It is additionally provided with insulating layer on the metal layer, first cooling device is set to the upper side of first substrate, and described second
Cooling device is set to the top other side of first substrate, and first conductive copper sheet and the second conductive copper sheet are set to the first base
Above plate, the protection pipeline, which spirals, is set to first substrate top, described to lead warm copper wire and be set to the protection pipeline, first
It inside cooling device and the second cooling device, and is connected to, is all provided in first cooling device and second cooling device
It is equipped with semiconductor chilling plate, the semiconductor chilling plate is connected by conducting wire with the processor in printed board, the protecting tube
Road is internally provided with temperature sensor, the processor in the output end connection printed board of the temperature sensor.
It further include photoelectric converter and electric light converter, the photoelectric converter and electric light converter are set to insulating layer
Side.
The first substrate and the second substrate two sides are equipped with heat release hole.
There are four mounting holes for setting on the first substrate and the second substrate, and the first substrate and the second substrate pass through spiral shell
Line connection.
The metal layer uses aluminium flake.
It is described to lead between warm copper wire and the protection pipeline, the first cooling device and the second cooling device filled with glue rouge.
The copper wire quantity that warm copper wire is led described in composition is 5-10 root.
The utility model has the beneficial effects that
The utility model proposes a kind of novel printed boards, and structure is simple, compact and reasonable, easy to assembly quick, even
Reliable heat transfer path during shortening is connect, reduces the temperature for the component installed in printed board, solder joint bonding strength compares
By force, the reliability of assembly is improved, it is ensured that obtain complete and accurate signal.First conductive copper sheet is set in printed board
It can be used for the second conductive copper sheet through high current, to enhance the overcurrent capability of printed board, conductive copper sheet can be used for
The two o'clock in printed board is connected, can be used for two components in electrical connection printed board, be fixed conveniently using conductive copper sheet,
It is firm, guarantee the reliability of printed board.
Detailed description of the invention
Fig. 1 is the perspective view of novel printed board in specific embodiment of the present invention；
Numeral mark in attached drawing is respectively:
1: first substrate；2: the second substrate；3: airflow channel；4: metal layer；5: insulating layer；6: the first cooling devices；7:
Second cooling device；8: the first conductive copper sheets；9: the second conductive copper sheets；10: protection pipeline；11: leading warm copper wire；14: photoelectricity turns
Parallel operation；15: electric light converter；16: heat release hole.
Specific embodiment
The embodiments of the present invention are described in detail with reference to the accompanying drawing.
Embodiment described below only expresses a kind of embodiment of the utility model, and the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
The utility model proposes a kind of novel printed boards, as shown in Figure 1, logical including first substrate 1, the second substrate 2, air-flow
Road 3, metal layer 4, insulating layer 5, the first cooling device 6, the second cooling device 7, the first conductive copper sheet 8, the second conductive copper sheet 9,
Protection pipeline 10 leads warm copper wire 11, semiconductor chilling plate and temperature sensor；
It is provided with airflow channel 3 between the first substrate 1 and the second substrate 2, is provided with metal on the first substrate 1
Layer 4 is additionally provided with insulating layer 5 on the metal layer 4, and first cooling device 6 is set to the upper side of first substrate 1,
Second cooling device 7 is set to the top other side of first substrate, first conductive copper sheet 8 and the second conductive copper sheet 9
It is set to above first substrate, the protection pipeline 10, which spirals, to be set to above first substrate 1, described to lead warm copper wire 11 and be set to
It inside the protection pipeline 10, the first cooling device 6 and the second cooling device 7, and is connected to, 6 He of the first cooling device
Semiconductor chilling plate is provided in second cooling device 7, the semiconductor chilling plate passes through on conducting wire and printed board
Processor is connected, and the protection pipeline 10 is internally provided with temperature sensor, and the output end of the temperature sensor connects print
Processor in making sheet.
In the present embodiment the first conductive copper sheet 8 and the second conductive copper sheet 9 using structure consistent, the consistent sheet rectangle of size
Copper sheet is installed on first substrate 1 by way of bolt or screw.
The first conductive copper sheet 8 and the second conductive copper sheet 9 is arranged in the present embodiment in printed board can be used for through high current,
To enhance the overcurrent capability of printed board, conductive copper sheet can be used for being connected the two o'clock in printed board, can be used for being electrically connected
Two components in printed board are connect, conductive copper sheet is fixed conveniently, consolidates, and guarantees the reliability of printed board.
Novel printed board in the present embodiment further includes photoelectric converter 14 and electric light converter 15, the photoelectric conversion
Device 14 and electric light converter 15 are set to the side of insulating layer 5.
The first substrate 1 and 2 two sides of the second substrate are equipped with heat release hole 16.
There are four mounting hole, the first substrate 1 and the second substrate 2 are logical for setting on the first substrate 1 and the second substrate 2
Cross threaded connection.
The metal layer 4 uses aluminium flake.
Described lead is filled between warm copper wire 11 and the protection pipeline 10, the first cooling device 6 and the second cooling device 7
Glue rouge.
The copper wire quantity that warm copper wire 11 is led described in composition is 5-10 root, and thickness is temperature sensing in 1.5-2mm the present embodiment
Device is set to inside protection pipeline 10, is tested the temperature of first substrate 1, is transmitted to processor, by the half of processor control printed board
Conductor cooling piece refrigeration, by inside protection pipeline 10, the first cooling device 6 and the second cooling device 7 to lead warm copper wire 11 right
Printed board is radiated, and the working efficiency of printed board is improved.The utility model structure is simple, compact and reasonable, easy to assembly
Fast, connection is reliable, the heat transfer path during shortening, and reduces the temperature for the component installed in printed board, solder joint connection
Intensity is stronger, improves the reliability of assembly, it is ensured that obtains complete and accurate signal.
It should be appreciated that although this specification is described in terms of embodiments, not each embodiment only includes one
Independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should be by specification
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art and can manage
The other embodiments of solution.
Claims (7)
1. a kind of novel printed board, it is characterised in that: including first substrate (1), the second substrate (2), airflow channel (3), metal
Layer (4), insulating layer (5), the first cooling device (6), the second cooling device (7), the first conductive copper sheet (8), the second conductive copper sheet
(9), pipeline (10) are protected, lead warm copper wire (11), semiconductor chilling plate and temperature sensor；
It is provided with airflow channel (3) between the first substrate (1) and the second substrate (2), is provided on the first substrate (1)
Metal layer (4) is additionally provided with insulating layer (5) on the metal layer (4), and first cooling device (6) is set to first substrate
(1) upper side, second cooling device (7) are set to the top other side of first substrate, first conductive copper sheet
(8) it is set to above first substrate with the second conductive copper sheet (9), the protection pipeline (10), which is spiraled, is set to first substrate (1)
Top, the warm copper wire (11) of leading are set to the protection pipeline (10), the first cooling device (6) and the second cooling device (7)
Inside, and be connected to, it is provided with semiconductor chilling plate in first cooling device (6) and second cooling device (7),
The semiconductor chilling plate is connected by conducting wire with the processor in printed board, and the protection pipeline (10) is internally provided with temperature
Spend sensor, the processor in the output end connection printed board of the temperature sensor.
2. novel printed board as described in claim 1, it is characterised in that: further include photoelectric converter (14) and electric light converter
(15), the photoelectric converter (14) and electric light converter (15) are set to the side of insulating layer (5).
3. novel printed board as described in claim 1, it is characterised in that: the first substrate (1) and the second substrate (2) two sides
Equipped with heat release hole (16).
4. novel printed board as described in claim 1, it is characterised in that: set in the first substrate (1) and the second substrate (2)
Mounting hole there are four setting, the first substrate (1) and the second substrate (2) are connected through a screw thread.
5. novel printed board as described in claim 1, it is characterised in that: the metal layer (4) uses aluminium flake.
6. novel printed board as described in claim 1, it is characterised in that: described to lead warm copper wire (11) and the protection pipeline
(10), glue rouge is filled between the first cooling device (6) and the second cooling device (7).
7. novel printed board as described in claim 1, it is characterised in that: the copper wire quantity for leading warm copper wire (11) described in composition is
5-10 root.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080114.1U CN208369940U (en) | 2018-07-09 | 2018-07-09 | A kind of novel printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080114.1U CN208369940U (en) | 2018-07-09 | 2018-07-09 | A kind of novel printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208369940U true CN208369940U (en) | 2019-01-11 |
Family
ID=64925001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821080114.1U Active CN208369940U (en) | 2018-07-09 | 2018-07-09 | A kind of novel printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208369940U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115623706A (en) * | 2022-12-14 | 2023-01-17 | 四川超声印制板有限公司 | Printed circuit board compression fittings |
-
2018
- 2018-07-09 CN CN201821080114.1U patent/CN208369940U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115623706A (en) * | 2022-12-14 | 2023-01-17 | 四川超声印制板有限公司 | Printed circuit board compression fittings |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101888740B (en) | Convex metal printed circuit board and manufacturing method thereof | |
| CN105627122B (en) | It is a kind of directly using metal heat sink as the LED light source module of positive and negative electrode circuit | |
| CN208369940U (en) | A kind of novel printed board | |
| CN102401360A (en) | High-power light emitting diode (LED) radiating structure | |
| CN201655852U (en) | LED backlight light bar encapsulated by adopting surface mount technology | |
| CN208185964U (en) | A kind of flexible LED circuit board module | |
| CN207053869U (en) | A kind of layer-stepping wiring board | |
| WO2008141500A1 (en) | A circuit board for heat dispersion | |
| CN207455482U (en) | A kind of mounting structure of car light LED chip | |
| CN209472830U (en) | Copper-plated ceramic circuit board | |
| CN209298095U (en) | Semiconductor element with two-sided heat conduction and heat radiation structure | |
| CN209640269U (en) | LED street lamp radiator thermo-resistance measurement heating module | |
| CN202721197U (en) | High-power LED packaging module | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN207382663U (en) | New Anti-interference heat radiating type circuit board | |
| WO2015124036A1 (en) | Switching circuit structure based on printed circuit board | |
| CN208434206U (en) | Multilayer power device stack structure | |
| CN111341740A (en) | Novel power management chip packaging system | |
| CN202738247U (en) | Circuit board provided with improved heat dissipation performance | |
| CN207719849U (en) | Charger core body | |
| CN205793613U (en) | A kind of high-frequency resistance circuit board | |
| CN208016188U (en) | A kind of high-frequency converter | |
| CN211670191U (en) | High heat dissipating's paster rectifier bridge | |
| CN207854270U (en) | A kind of circuit board of ceramic material | |
| CN101351081B (en) | Illumination application circuit board with pins type LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |