CN208263624U - For producing the functional release film of wiring board hot pressing - Google Patents
For producing the functional release film of wiring board hot pressing Download PDFInfo
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- CN208263624U CN208263624U CN201820553265.8U CN201820553265U CN208263624U CN 208263624 U CN208263624 U CN 208263624U CN 201820553265 U CN201820553265 U CN 201820553265U CN 208263624 U CN208263624 U CN 208263624U
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- release film
- film
- wiring board
- hot pressing
- intermediate layer
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Abstract
The functional release film provided by the utility model for being used to produce wiring board hot pressing, including high temperature resistant release film and intermediate layer film；The two sides of the intermediate layer film are equipped with the high temperature resistant release film；The intermediate layer film and the high temperature resistant release film are equipped with coating composite layer.The functional release film provided by the utility model for being used to produce wiring board hot pressing, can guarantee that upper and lower release film layer is identical with the length and width dimensions of intermediate layer film when making functional release film；Three-layer thin-film is completely combined, and forms the membrane structure of an integration, solves the problems, such as that release film and middle layer are separated, overlapped naturally.Using provided by the utility model for producing the functional release film of wiring board hot pressing, automated production efficiency is greatly promoted, film cost is reduced；A series of problems, such as all kinds of excessive glue pollution problems, sideslip problem, plate face harmomegathus problem, plate face buckling problems, impurity are scrapped is improved simultaneously.
Description
Technical field
The utility model relates to release technical field of membrane, in particular to release for producing the functionality of wiring board hot pressing
Film.
Background technique
At this stage, multilayer printed circuit board PCB, flexible circuit board FPC, Rigid Flex r igid-flex PCB are in warm
In bonding processes, the prepreg or pure glue material combined due to wiring board can flow after high temperature melting, prepreg
The glue overflowed after equal material at high temperature fusing, can be flow in wiring board hole slot, the metal welding of surface of circuit board by the gap of plate face
Connect region, some meetings flow to other regions for being controlled of surface of circuit board.In addition to viscous surface of circuit board, overflow after high temperature melting
On steel plate when glue out can also adhere to pressing, cause residual treatment on the steel plate difficult, strong influence wiring board is normal
Hot pressing production.
The prior art: by each quasi-polyethylene (PE) or polypropylene (PP), or mixtures thereof etc. can at a certain temperature can be with
For the film of softening or fusing as middle layer, the upper and lower surface of middle layer respectively places a polyethylene terephthalate (PET),
Polybutylene terephthalate (PBT) (PBT) release film or other have the film of certain heat resistance and release stripping ability
As upper and lower layer.Upper, middle and lower-ranking film using all kinds of adhesive glues or double-sided adhesive etc. the positions such as film side edge, centre into
Row is adhesively fixed, also or on the edge placement of three-layer thin-film contact or four corners, with electronic heat sealer heating, ultrasound
The forms such as wave carry out scalding point melting fixed form.It can make upper and lower layer release film in such a way that high temperature or ultrasonic wave melting are fixed
Melting is penetrated to melt wiring board hot pressing is likely to result in intermediate layer film softening fusing when producing after from upper and lower layer release film
It is overflowed at hole, glues glutinous PCB surface or surface of steel plate, cause problems to hot pressing production.It is crucial that no matter using each
Class adhesive glue or double-sided adhesive etc. are adhesively fixed or high temperature or the fixed mode of ultrasonic wave melting, and intermediate layer film is in certain temperature
After melting under degree, it is easy to flow to the surrounding of intermediate layer film, in order to avoid being left on wiring board or steel plate, existing way
Be by the length and width dimensions of intermediate layer film be less than upper and lower layer release film length and width dimensions (as shown in Fig. 2, wherein A be one or
Two polyethylene terephthalate (PET) or polybutylene terephthalate (PBT) (PBT)；B is a polyethylene (PE)), it gives
Give the buffer area flowed after intermediate layer film fusing.Three films to bond together, lower film size is big thereon, intermediate
Layer film size is small, and inefficiency when production is unfavorable for the demand of automated production.
Above-mentioned film has the drawback that in production and use process
(1) due to being that three films are stacked a kind of false membrane structure to be formed naturally, when production needs will be intermediate
Layer film length and width dimensions change it is small, cannot be big as upper and lower level release film length and width dimensions, manual operation process is complicated, substantially reduces
Production efficiency, improves the cost of product；
(2) three films are fixed using all kinds of adhesive glues or the modes such as double-sided adhesive or high temperature or ultrasonic bonding are fixed
Together, handwork is more, automated production level is low, and production efficiency is low；
(3) film side along and four corners plus the fixed structures such as heat or ultrasonic it is de- to be easy layering in conjunction with insecure
It opens, causes the quality of production process bad；
(4) due to be three films natural overlapping, be not integrated film, there are gaps between each layer film, very
It is easy to adsorb and hides dust, sundries etc., lead to problems such as the out-of-flatness of film entirety and film impurities excessive, to cause
The risk that wiring board hot pressing is scrapped；
(5) due to being that three films overlap naturally, the integrated film being not firmly combined, in addition three-layer thin-film is all more
It is smooth, under the conditions of pressing temperature rise period at the beginning and high pressure, it is easy to produce sideslip, wiring board during hot pressing is caused to rise
The problems such as wrinkle；
The existing heating of (6) three films and ultrasonic wave fixed form, intermediate layer film high temperature melting overflow viscous route
Plate, steel plate influence wiring board quality, pollution hot press, cause to tear plate difficulty open；
(7) it is easily melted after the intermediate layer film high temperature hot pressing of the prior art closes, easily flows, flows the problems such as big, can also drawn
Play the problems such as wiring board moves with X-Y axis direction is intended to intermediate layer film, causes plate face harmomegathus, plate face fold；
(8) the intermediate layer film high temperature hot pressing of the prior art flows excessive after closing, and surrounding is distributed to after compression and becomes excessive glue,
Lower resistance glue significantly and covers type effect.
Utility model content
To solve the above problems, the utility model provides the functional release film for producing wiring board hot pressing, including
High temperature resistant release film and intermediate layer film；The two sides of the intermediate layer film are equipped with the high temperature resistant release film；It is described
Intermediate layer film and the high temperature resistant release film are equipped with coating composite layer.
Further, the high temperature resistant release film by polyethylene terephthalate, polybutylene terephthalate (PBT),
TPX, PA, PP, BOPP, PTFE, PI are made by one of the release film of coating release agent material.
Further, the high temperature resistant release film with a thickness of 10 μm -75 μm.
Further, the coating composite layer is made of acrylic glue or polyurethane adhesive.
Further, it is described coating composite layer with a thickness of 8 μm -15 μm.
Further, the intermediate layer film is by low density polyethylene (LDPE), linear low density polyethylene and a small amount of modified additive
Layer is combined.
Further, the intermediate layer film with a thickness of 40 μm -400 μm.
The functional release film provided by the utility model for being used to produce wiring board hot pressing is few using LDPE+LLDPE+
The intermediate layer film for measuring modified additive, reduces the shrinking percentage of intermediate layer film and the spilling flow field problem of high-temperature fusion, makes
Make to guarantee that upper and lower release film layer is identical with the length and width dimensions of intermediate layer film when functional release film；Using Asia
Gram force glue or polyurethane glue-line, in conjunction with compound mode is coated with, make upper and lower two layers of release film and intermediate layer film direct combination at
Type, three-layer thin-film are completely combined, and form the membrane structure of an integration, are solved release film and middle layer and are separated, is naturally folded
The problem of conjunction.Using provided by the utility model for producing the functional release film of wiring board hot pressing, greatly promote automatic
Change production efficiency, reduces film cost；All kinds of excessive glue pollution problems, sideslip problem, plate face harmomegathus problem, plate face are improved simultaneously
A series of problems, such as buckling problems, impurity are scrapped.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is provided by the utility model for producing the functional release film of wiring board hot pressing；
Fig. 2 is prior art membrane structure schematic diagram.
Appended drawing reference:
10 high temperature resistant release films 20 are coated with 30 intermediate layer film of composite layer
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
In the description of the present invention, it should be noted that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.In addition, term " first ", " second " are used for description purposes only, and should not be understood as instruction or
Imply relative importance.
It is provided by the utility model for producing the functional release film of wiring board hot pressing, including resistance to height as shown in Figure 1:
Warm release film 10 and intermediate layer film 30；The two sides of the intermediate layer film 30 are equipped with the high temperature resistant release film 10；
The intermediate layer film 30 is equipped with coating composite layer 20 with the high temperature resistant release film 10.
When it is implemented, coating composite layer 20 makes high temperature resistant release film 10 and middle layer by being coated with compound mode
The molding of 30 direct combination of film, three-layer thin-film are completely combined, and form the membrane structure of an integration.
Preferably, the high temperature resistant release film 10 by polyethylene terephthalate, polybutylene terephthalate (PBT),
TPX, PA, PP, BOPP, PTFE, PI are made by one of the release film of coating release agent material.
Preferably, the high temperature resistant release film 10 with a thickness of 10 μm -75 μm.
Preferably, the coating composite layer 20 is made of acrylic glue or polyurethane adhesive.
Preferably, it is described coating composite layer 20 with a thickness of 8 μm -15 μm.
Preferably, the intermediate layer film 30 is by low density polyethylene (LDPE), linear low density polyethylene and a small amount of modified additive
Layer is combined.
Preferably, the intermediate layer film 30 with a thickness of 40 μm -400 μm.
The functional release film provided by the utility model for being used to produce wiring board hot pressing is few using LDPE+LLDPE+
The intermediate layer film for measuring modified additive, reduces the shrinking percentage of intermediate layer film and the spilling flow field problem of high-temperature fusion, makes
Make to guarantee that upper and lower release film layer is identical with the length and width dimensions of intermediate layer film when functional release film；Using Asia
Gram force glue or polyurethane glue-line, in conjunction with compound mode is coated with, make upper and lower two layers of release film and intermediate layer film direct combination at
Type, three-layer thin-film are completely combined, and form the membrane structure of an integration, are solved release film and middle layer and are separated, is naturally folded
The problem of conjunction.Using provided by the utility model for producing the functional release film of wiring board hot pressing, greatly promote automatic
Change production efficiency, reduces film cost；All kinds of excessive glue pollution problems, sideslip problem, plate face harmomegathus problem, plate face are improved simultaneously
A series of problems, such as buckling problems, impurity are scrapped.
Functional release film provided by the utility model for producing wiring board hot pressing is due to three layers of main film
Length and width dimensions can be the same, forms the release membrane structure of functionality an of entirety, is improving existing all kinds of problems of film product
While, it is suitble to automated production, greatly improves production efficiency, reduces the cost；Meanwhile three-layer thin-film being made to be entirely incorporated in one
It rises, the binding force between enhanced film, prevents all kinds of sundries absorption from hiding, the spilling of intermediate layer film high temperature melting, and reduce line
Sideslip, impurity scrap problem when the plate hot pressing of road, substantially improve surface of circuit board fold, plate face harmomegathus and pollution surface of circuit board,
The problems such as hot press；On the other hand, the user-friendly operation of integrated film is also convenient for user according to itself route board foot
Very little size is cut, and wiring board hot pressing production efficiency is greatly improved.
Although herein more has used high temperature resistant release film, has been coated with the arts such as composite layer and intermediate layer film
Language, but it does not exclude the possibility of using other terms.The use of these items is only for be more convenient to describe and explain this
The essence of utility model；It is contrary to the spirit of the present invention to interpret them as any one of the additional limitations.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (6)
1. the functional release film for producing wiring board hot pressing, it is characterised in that: including high temperature resistant release film and centre
Layer film；The two sides of the intermediate layer film are equipped with the high temperature resistant release film；The intermediate layer film and the resistance to height
Warm release film is equipped with coating composite layer.
2. according to claim 1 for producing the functional release film of wiring board hot pressing, it is characterised in that: described resistance to
High temperature release film is by polyethylene terephthalate, polybutylene terephthalate (PBT), TPX, PA, PP, BOPP, PTFE, PI
Or it is made by one of the release film of coating release agent material.
3. according to claim 1 for producing the functional release film of wiring board hot pressing, it is characterised in that: described resistance to
High temperature release film with a thickness of 10 μm -75 μm.
4. according to claim 1 for producing the functional release film of wiring board hot pressing, it is characterised in that: the painting
Cloth composite layer is made of acrylic glue or polyurethane adhesive.
5. according to claim 1 for producing the functional release film of wiring board hot pressing, it is characterised in that: the painting
Cloth composite layer with a thickness of 8 μm -15 μm.
6. according to claim 1 for producing the functional release film of wiring board hot pressing, it is characterised in that: in described
Between layer film with a thickness of 40 μm -400 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820553265.8U CN208263624U (en) | 2018-04-18 | 2018-04-18 | For producing the functional release film of wiring board hot pressing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820553265.8U CN208263624U (en) | 2018-04-18 | 2018-04-18 | For producing the functional release film of wiring board hot pressing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208263624U true CN208263624U (en) | 2018-12-21 |
Family
ID=64680194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820553265.8U Active CN208263624U (en) | 2018-04-18 | 2018-04-18 | For producing the functional release film of wiring board hot pressing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208263624U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993708A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
-
2018
- 2018-04-18 CN CN201820553265.8U patent/CN208263624U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993708A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111993708B (en) * | 2019-05-27 | 2023-12-05 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
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