CN208253531U - A kind of flexible circuit board radiator in conjunction with temperature-uniforming plate - Google Patents
A kind of flexible circuit board radiator in conjunction with temperature-uniforming plate Download PDFInfo
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- CN208253531U CN208253531U CN201820930186.4U CN201820930186U CN208253531U CN 208253531 U CN208253531 U CN 208253531U CN 201820930186 U CN201820930186 U CN 201820930186U CN 208253531 U CN208253531 U CN 208253531U
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- temperature
- uniforming plate
- circuit board
- flexible circuit
- led
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Abstract
The utility model relates to a kind of flexible circuit board in conjunction with temperature-uniforming plate radiator.Including flexible circuit board, PI glue film and temperature-uniforming plate, the positive and negative section pad of LED is communicated with the circuit part in flexible circuit board, the heat dissipation bonding pad of LED is directly welded with temperature-uniforming plate, is related to the part hollow out of LED heat dissipation bonding pad in the flexible circuit board, flexible circuit board is pressed together on temperature-uniforming plate by PI glue film.The utility model is effectively combined hollow out wiring board with temperature-uniforming plate using PI glue film, realize that LED heat is electrically separated, LED heat dissipation bonding pad, which is directly welded with temperature-uniforming plate, to radiate, it realizes the direct High Efficiency Thermal of temperature-uniforming plate and carries LED heat flow characteristic, reduce operating temperature of the chip of LED after thermal balance, chip temperature, which reduces, promotes chip light-emitting efficiency, improves lamps and lanterns light efficiency.
Description
Technical field
The utility model relates to a kind of flexible circuit board in conjunction with temperature-uniforming plate radiator.
Background technique
Existing Equalized temperature plate radiator, be by aluminum-based circuit board painting heat-conducting silicone grease be directly attached on temperature-uniforming plate, wherein
Many places thermal resistance is increased, such as aluminium-base plate insulating layer, aluminum substrate, heat-conducting silicone grease.These material thermal resistances are all larger than copper, and samming is not achieved
Plate heating conduction, these material thermal resistance reasons export LED junction warm amount can not quickly, lead to LED lamp initial failure, and
LED lamp is more demanding for heat dissipation aspect, and what the prior art can only be unlimited enhances performance using increase heat dissipation area.Lamps and lanterns dissipate
Heat demand and the contradiction of fitting structure size limitation lead to existing LED lamp power generally all less.And heat dissipation area increase is
Samming plate suqare increases, so that increased costs, lamps and lanterns volume also increases.Because material thermal resistance is big cause chip light-emitting efficiency it is low,
The serious problems such as light decay is big, the lamps and lanterns product life cycle is short.
Utility model content
The utility model aims at the problems existing in the prior art, and provides a kind of flexible circuit board to radiate in conjunction with temperature-uniforming plate
Device reduces heat dissipation area, reduces the volume of lamps and lanterns, reduce the temperature of light source chip, promote light source and go out by improving heat dissipation performance
Light efficiency reduces attenuation and improves lamps and lanterns service life.
The technical solution adopted in the utility model is: a kind of flexible circuit board radiator in conjunction with temperature-uniforming plate, feature exist
In including flexible circuit board, PI glue film and temperature-uniforming plate, the positive and negative section pad of LED is communicated with the circuit part in flexible circuit board, LED
Heat dissipation bonding pad directly welded with temperature-uniforming plate, be related to the part hollow out of LED heat dissipation bonding pad, flexible wires in the flexible circuit board
Road plate is pressed together on temperature-uniforming plate by PI glue film.
The utility model is made of the part such as flexible circuit board, PI glue film, temperature-uniforming plate；Flexible circuit board is related to LED to dissipate
Hot weld disc portion hollow out presses curing technology, by flexible circuit board pressing on temperature-uniforming plate, hollow out using PI glue film and temperature-uniforming plate
Part may be implemented LED heat dissipation bonding pad and be directly welded on temperature-uniforming plate, and heat is passed directly on temperature-uniforming plate, and temperature-uniforming plate steams at runtime
Hair section directly absorbs the heat of LED generation, so that LED junction temperature of chip is directly led on temperature-uniforming plate, steams liquid chemical conversion in cavity
Vapour, it is mobile to cooling section with heat, and carry out heat and conduct.
It is this effectively to be combined hollow out wiring board with temperature-uniforming plate using PI glue film, realize that LED heat is electrically separated, LED heatsink welding
Disk, which is directly welded with temperature-uniforming plate, to radiate, and realizes the direct High Efficiency Thermal of temperature-uniforming plate and carries LED heat flow characteristic, the chip for reducing LED exists
Operating temperature after thermal balance, chip temperature, which reduces, promotes chip light-emitting efficiency, improves lamps and lanterns light efficiency.Lamps and lanterns attenuation is reduced, is mentioned
High lamps and lanterns service life.Its high cooling efficiency characteristic is utilized simultaneously, is reduced the volume of radiator, can further be promoted lamps and lanterns function
Rate meets the needs of corresponding occasion is for relatively high power lamps and lanterns.
Flexible circuit board radiator in conjunction with temperature-uniforming plate, common type radiator more in the market, installation procedure is simple, nothing
Heat-conducting silicone grease need to be applied, is generated without other materials thermal resistance, it can be achieved that high efficiency and heat radiation, promotes lamp light source among LED and temperature-uniforming plate
Chip light-emitting efficiency improves lamps and lanterns light efficiency, reduces lamps and lanterns attenuation, lamps and lanterns service life is improved, to further reach energy saving drop
The purpose of consumption.And lamps and lanterns LED junction warm amount is directly shed by temperature-uniforming plate, reduces radiator volume, power can be mentioned further
It rises, meets the needs of LED lamp application is for big LED lamp.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the utility model flexible circuit board schematic diagram.
Fig. 3 is the utility model PI glue film schematic diagram.
Fig. 4 is the schematic diagram of the utility model temperature-uniforming plate.
Specific embodiment
With reference to the accompanying drawing, the utility model is described in detail.
A kind of flexible circuit board as Figure 1-Figure 4 radiator in conjunction with temperature-uniforming plate, including flexible circuit board 1, LED light
3, PI glue film 8, temperature-uniforming plate 2 and radiator 4, the positive and negative section pad 7 of LED are communicated with the circuit part in flexible circuit board, and LED's dissipates
Hot weld disk 5 is directly welded with temperature-uniforming plate 2, is related to the part hollow out 6 of LED heat dissipation bonding pad, flexible circuitry in the flexible circuit board
Plate is pressed together on 2 on temperature-uniforming plate by PI glue film 8.
The utility model is made of the part such as flexible circuit board, PI glue film, temperature-uniforming plate；Flexible circuit board is related to LED to dissipate
Hot weld disc portion hollow out presses curing technology, by flexible circuit board pressing on temperature-uniforming plate, hollow out using PI glue film and temperature-uniforming plate
Part may be implemented LED heat dissipation bonding pad and be directly welded on temperature-uniforming plate, and heat is passed directly on temperature-uniforming plate, and temperature-uniforming plate steams at runtime
Hair section directly absorbs the heat of LED generation, so that LED junction temperature of chip is directly led on temperature-uniforming plate, steams liquid chemical conversion in cavity
Vapour, it is mobile to cooling section with heat, and carry out heat and conduct.
Listed above is only specific embodiment of the utility model, and the utility model is not limited to above embodiment,
It is acceptable that there are many deformations.Those skilled in the art directly can export or associate from content disclosed by the utility model
All deformations, be considered as the protection scope of the utility model.
Claims (1)
1. a kind of flexible circuit board radiator in conjunction with temperature-uniforming plate, it is characterised in that including flexible circuit board, PI glue film and samming
Plate, the positive and negative section pad of LED are communicated with the circuit part in flexible circuit board, and the heat dissipation bonding pad of LED is directly welded with temperature-uniforming plate, institute
It states and is related to the part hollow out of LED heat dissipation bonding pad in flexible circuit board, flexible circuit board is pressed together on temperature-uniforming plate by PI glue film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820930186.4U CN208253531U (en) | 2018-06-15 | 2018-06-15 | A kind of flexible circuit board radiator in conjunction with temperature-uniforming plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820930186.4U CN208253531U (en) | 2018-06-15 | 2018-06-15 | A kind of flexible circuit board radiator in conjunction with temperature-uniforming plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208253531U true CN208253531U (en) | 2018-12-18 |
Family
ID=64654739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820930186.4U Active CN208253531U (en) | 2018-06-15 | 2018-06-15 | A kind of flexible circuit board radiator in conjunction with temperature-uniforming plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208253531U (en) |
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2018
- 2018-06-15 CN CN201820930186.4U patent/CN208253531U/en active Active
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