CN215988829U

CN215988829U - LED encapsulation subassembly with heat dissipation mechanism

Info

Publication number: CN215988829U
Application number: CN202121714273.4U
Authority: CN
Inventors: 沈蔚; 胡亮
Original assignee: Shenzhen Huasheng Optoelectronics Co ltd
Current assignee: Shenzhen Huasheng Optoelectronics Co ltd
Priority date: 2021-07-26
Filing date: 2021-07-26
Publication date: 2022-03-08
Anticipated expiration: 2031-07-26

Abstract

The utility model discloses an LED packaging assembly with a heat dissipation mechanism, which comprises a plastic reflection cup, wherein the bottom end of the plastic reflection cup is fixedly arranged on the upper surface of a dielectric substrate through organic silicon heat-conducting glue, the center of the dielectric substrate is provided with a through mounting groove, a heat dissipation copper rod is fixedly arranged in the mounting groove, spiral heat dissipation copper rods are fixedly arranged at the bottom of the heat dissipation copper rod in a bilateral symmetry and alternative mode, a heat dissipation base is fixedly arranged on the lower surface of the dielectric substrate, and a heat dissipation support is fixedly arranged in the heat dissipation base corresponding to the spiral heat dissipation copper rod. Through the cooperation installation of mounting groove and heat dissipation copper pole, make heat dissipation copper pole upper surface can laminate heating element such as led wick completely to the heat is conducted the heat fast to inside heat through the material of heat dissipation copper pole, and the helicity design increase heat radiating area of the spiral heat dissipation copper pole through heat dissipation copper pole bottom installation in turn, and be hollow design through spiral heat dissipation copper pole center, make the air current general nature increase with higher speed the heat dissipation.

Description

LED encapsulation subassembly with heat dissipation mechanism

Technical Field

The utility model relates to the technical field of LED packaging heat dissipation, in particular to an LED packaging assembly with a heat dissipation mechanism.

Background

The light emitting diode is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, and is widely applied in the field of illumination. The light emitting diode can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like. At present, after the LED is packaged and put into use, effective heat dissipation cannot be carried out, so that the service life of the LED can be quickly shortened, the damage of the LED is easily caused, meanwhile, due to the fact that the use efficiency and the cost are guaranteed, the maintenance work is inconvenient to carry out after the packaging is finished, the cost is increased when the LED is replaced, the workload of technicians is increased, and therefore a heat dissipation device is required to be added for the LED to guarantee the service life of the LED. There is a need for an LED package assembly having a heat dissipation mechanism.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED packaging assembly with a heat dissipation mechanism, which accelerates the conduction of heat inside a plastic reflection cup by arranging a heat dissipation base capable of increasing air circulation and a spiral heat dissipation copper rod for increasing internal heat dissipation, and achieves the purpose of heat dissipation by matching various heat dissipation materials, so as to solve the problems in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a LED encapsulation subassembly with heat dissipation mechanism, includes the plastics reflection cup, the organic silicon heat-conducting resin fixed mounting is LED to plastics reflection bottom of cup end on the dielectric substrate upper surface, dielectric substrate center runs through and has seted up the mounting groove, the inside fixed mounting of mounting groove has the heat dissipation copper pole, heat dissipation copper pole bottom bilateral symmetry fixed mounting has spiral heat dissipation copper pole in turn, surface fixed mounting has the heat dissipation base under the dielectric substrate, the inside spiral heat dissipation copper pole fixed mounting that corresponds of heat dissipation base has the heat dissipation support.

Preferably, the left side and the right side of the surface of the dielectric substrate are correspondingly and fixedly provided with the soldering tin pads, a closed groove is formed in the outer side circle of the upper surface of the dielectric substrate, the organic silicon heat-conducting glue is uniformly dripped on the upper surface of the closed groove, and the mounting groove is a circular truncated cone-shaped groove.

Preferably, the top end of the heat dissipation copper rod is fixedly provided with a baffle, the heat dissipation copper rod is fixedly arranged on the upper surface of the dielectric substrate through the baffle, and the center of the upper surface of the heat dissipation copper rod is downwards provided with a glue dispensing groove.

Preferably, heat-conducting glue is uniformly dripped in the glue dripping groove, an LED chip is fixedly mounted on the upper surface of the heat-conducting glue, gold wire leads are fixedly mounted on the left side and the right side of the LED chip corresponding to the positions of the soldering tin pads, and gold wire protective glue sleeves are sleeved on the outer surfaces of the gold wire leads.

Preferably, a plastic reflection cup is fixedly bonded on the upper surface of the organic silicon heat conduction adhesive, a heat dissipation aluminum sleeve is fixedly mounted on the outer surface of the plastic reflection cup in a fitting manner, packaging adhesive is filled in the plastic reflection cup, and an organic silicon lens cover is fixedly mounted at the top end of the heat dissipation aluminum sleeve.

Preferably, heat dissipation support surface laminating mounting groove inner wall fixed mounting, heat dissipation support surface equidistance is run through and has been seted up the thermovent, heat dissipation base surface equidistance is run through and has been seted up the thermovent.

Compared with the prior art, the utility model has the beneficial effects that:

1. through the mounting groove that sets up, the heat dissipation copper pole, the spiral heat dissipation copper pole makes the device have better thermal diffusivity in the use, cooperation installation through mounting groove and heat dissipation copper pole, heating element such as led wick of laminating completely makes heat dissipation copper pole upper surface, and the material through heat dissipation copper pole carries out heat conduction fast to inside heat, the spiral design increase heat radiating area of the spiral heat dissipation copper pole of installation in turn through heat dissipation copper pole bottom, and be hollow design through spiral heat dissipation copper pole center, make the air circulation increase, the accelerator dispels the heat.

2. The heat dissipation assembly can be protected through the heat dissipation base and the heat dissipation support that set up to make spiral heat dissipation copper pole can not laminate the mounted position through heat dissipation base and heat dissipation support, increase the air conversion rate, and through heat dissipation support laminating mounting groove design, fix the position of heat dissipation support in spiral heat dissipation copper pole, make heat dissipation support and spiral heat dissipation copper pole contact, utilize the heat conductivity of spiral heat dissipation copper pole, the condition of dispelling the heat with higher speed.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an installation view of the overall structure of the present invention;

FIG. 3 is an exploded view of the internal structure of the plastic reflector cup of the present invention;

fig. 4 is a disassembled view of the internal structure of the heat dissipation base of the present invention.

In the figure: 1. a plastic reflector cup; 2. a dielectric substrate; 3. soldering a tin pad; 4. closing the groove; 5. mounting grooves; 6. a heat-dissipating copper rod; 7. dispensing a glue groove; 8. a spiral heat dissipation copper rod; 9. heat conducting glue; 10. an LED chip; 11. a gold thread protective rubber sleeve; 12. organic silicon heat-conducting glue; 13. a heat-dissipating aluminum jacket; 14. packaging glue; 15. an organic silicon lens cover; 16. a heat dissipation base; 17. a tuyere; 18. a heat dissipation support; 19. and a heat dissipation port.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides: the utility model provides a LED encapsulation subassembly with heat dissipation mechanism, including

plastic reflection cup

1, 12 fixed mounting at dielectric substrate 2 upper surface are LED to organosilicon heat-conducting glue in 1 bottom of plastic reflection cup, 2 centers of dielectric substrate run through and have seted up mounting groove 5, 5 inside fixed mounting of mounting groove have heat

dissipation copper pole

6, 6 bottom bilateral symmetry alternative fixed mounting of heat dissipation copper pole have spiral heat

dissipation copper pole

8, 2 lower fixed mounting of dielectric substrate have

heat dissipation base

16, 16 inside corresponding spiral heat dissipation copper pole 8 fixed mounting of heat dissipation base has heat dissipation support 18, increase the thermal diffusivity through the spiral heat dissipation copper pole 8 of alternative installation, because the spiral framework of spiral heat dissipation copper pole 8 makes the middle part leave the space, can make the air intake make the heat dissipation function promote, improve the functionality of spiral heat dissipation copper pole 8.

The left and right sides of the surface of the dielectric substrate 2 is provided with the solder pads 3 correspondingly and fixedly, a closed groove 4 is formed in the outer side circle of the upper surface of the dielectric substrate 2, the organic silicon heat-conducting glue 12 is uniformly dripped on the upper surface of the closed groove 4, the mounting groove 5 is a circular truncated cone-shaped groove, the LED chip 10 can be more stably installed in the matching manner through the dielectric substrate 2 and the solder pads 3, and the plastic reflector cup 1 and the dielectric substrate 2 are fixedly bonded through the closed groove 4 and the organic silicon heat-conducting glue 12.

6 top fixed mounting of heat dissipation copper pole has the baffle, and heat dissipation copper pole 6 passes through baffle fixed mounting at dielectric substrate 2 upper surface, and the upper surface center of heat dissipation copper pole 6 is seted up downwards and is had some gluey groove 7, runs through mounting groove 5 that dielectric substrate 2 was seted up and not only plays the limiting displacement to heat dissipation copper pole 6, can also fix the use position of heat dissipation support 18, comes to derive the inside temperature of plastics reflection cup 1 through the good heat conductivity of heat dissipation copper pole 6.

The inside even bit of groove 7 that glues of some has heat-conducting glue 9, fixed surface installs LED chip 10 on the heat-conducting glue 9, the corresponding solder pad 3 position fixed mounting of the LED chip 10 left and right sides has the gold wire, and gold wire surface cover has gold wire protective rubber cover 11, it is fixed to make the use mounted position of heat-conducting glue 9 and LED chip 10 through the groove 7 that glues of some setups, and make the heat-conducting glue 9 laminate spiral heat dissipation copper pole 8 completely through some gluey groove 7, and the gold wire that leads to LED chip 10 top setting connects for the LED lamp, because the particularity of gold wire can effectual reduction internal current resistance, reduce the emergence, and reach the purpose that separates the temperature and hinder the temperature through gold wire protective rubber cover 11, increase of service life.

The plastic reflection cup 1 is fixedly adhered to the upper surface of the organic silicon heat conduction glue 12, the heat dissipation aluminum sleeve 13 is fixedly attached to the outer surface of the plastic reflection cup 1, the packaging glue 14 is filled in the plastic reflection cup 1, the organic silicon lens cover 15 is fixedly attached to the top end of the heat dissipation aluminum sleeve 13, the heat dissipation performance of the whole device is improved by the heat dissipation aluminum sleeve 13 attached to the plastic reflection cup 1, the position easy to generate heat is dissipated from the outside at the first time, the temperature of the outer surface can be effectively reduced, the heat generated in the plastic reflection cup 1 can be effectively conducted through the packaging glue 14 filled in the plastic reflection cup 1, the temperature in the plastic reflection cup 1 is stable, the plastic reflection cup 1 and the dielectric substrate 2 are prevented from being separated and dispersed, the heat conductivity is improved by the particularity of the organic silicon heat conduction glue 12, the electric leakage is prevented, and the wider use temperature can provide more stable usability, the organic silicon lens cover 15 not only has the basic function of light condensation, but also accelerates the heat dissipation inside the plastic reflection cup 1.

The surface of the outer surface of the heat dissipation support 18 is attached to the inner wall of the mounting groove 5 and is fixedly mounted, the outer surface of the heat dissipation support 18 is equidistantly penetrated and is provided with the heat dissipation ports 19, the outer surface of the heat dissipation support 16 is equidistantly penetrated and is provided with the heat dissipation ports 19, the heat dissipation ports 19 which are arranged around the heat dissipation support 16 are penetrated to enable air to flow in and out more quickly, the heat dissipation support 18 which is fixedly mounted inside can support and protect the spiral heat dissipation copper rod 8, the heat dissipation ports 19 which are arranged are matched with the spiral heat dissipation copper rod 8 for use, and the heat dissipation effect is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An LED package assembly with a heat dissipation mechanism, comprising a plastic reflector cup (1), characterized in that: organic silicon heat-conducting adhesive (12) fixed mounting is led to plastics reflection cup (1) bottom at dielectric base plate (2) upper surface, dielectric base plate (2) center is run through and has been seted up mounting groove (5), the inside fixed mounting of mounting groove (5) has heat dissipation copper pole (6), heat dissipation copper pole (6) bottom bilateral symmetry fixed mounting has spiral heat dissipation copper pole (8) in turn, fixed surface installs heat dissipation base (16) under dielectric base plate (2), heat dissipation base (16) inside corresponds spiral heat dissipation copper pole (8) fixed mounting has heat dissipation support (18).

2. The LED package assembly with heat dissipation mechanism of claim 1, wherein: the surface left and right sides of the dielectric substrate (2) are correspondingly and fixedly provided with the tin welding pads (3), a closed groove (4) is formed in the outer side circle of the upper surface of the dielectric substrate (2), the organic silicon heat-conducting glue (12) is uniformly dripped on the upper surface of the closed groove (4), and the mounting groove (5) is a circular truncated cone-shaped groove.

3. The LED package assembly with heat dissipation mechanism of claim 2, wherein: the radiating copper rod (6) is fixedly provided with a baffle at the top end, the radiating copper rod (6) is fixedly arranged on the upper surface of the dielectric substrate (2) through the baffle, and the center of the upper surface of the radiating copper rod (6) is downwards provided with a glue dripping groove (7).

4. The LED package assembly with the heat dissipation mechanism of claim 3, wherein: the glue dispensing groove (7) is uniformly dripped with heat-conducting glue (9), the upper surface of the heat-conducting glue (9) is fixedly provided with an LED chip (10), the left side and the right side of the LED chip (10) correspond to the solder pads (3) and are fixedly provided with gold wire leads, and the outer surface of each gold wire lead is sleeved with a gold wire protective rubber sleeve (11).

5. The LED package assembly with the heat dissipation mechanism of claim 4, wherein: the organic silicon heat-conducting glue is characterized in that a plastic reflection cup (1) is fixedly adhered to the upper surface of the organic silicon heat-conducting glue (12), a heat dissipation aluminum sleeve (13) is fixedly attached to the outer surface of the plastic reflection cup (1), packaging glue (14) is filled in the plastic reflection cup (1), and an organic silicon lens cover (15) is fixedly installed at the top end of the heat dissipation aluminum sleeve (13).

6. The LED package assembly with the heat dissipation mechanism of claim 5, wherein: heat dissipation support (18) surface laminating mounting groove (5) inner wall fixed mounting, heat dissipation support (18) surface equidistance runs through and has seted up thermovent (19), heat dissipation base (16) surface equidistance runs through and has seted up thermovent (19).