CN208210556U - The radiator of power device in a kind of radio frequency power amplification modules - Google Patents
The radiator of power device in a kind of radio frequency power amplification modules Download PDFInfo
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- CN208210556U CN208210556U CN201820785691.4U CN201820785691U CN208210556U CN 208210556 U CN208210556 U CN 208210556U CN 201820785691 U CN201820785691 U CN 201820785691U CN 208210556 U CN208210556 U CN 208210556U
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- power device
- radiator
- cooling fin
- radio frequency
- mounting groove
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Abstract
The utility model relates to telecommunications fields, disclose a kind of radiator of power device in radio frequency power amplification modules, it include radiator bottom plate, cooling fin, power device, power device bracket, pass through Optimal Structure Designing, using the mounting plate of original power device as radiating bottom plate, and mounting groove is opened up, replace traditional silicone oil or soldering to radiate by setting indium stannum alloy cooling fin；By the radiator being rationally arranged, to power device adding power device bracket, heat dissipation is directly contacted with indium stannum alloy cooling fin by vertical mounting plate, forms the radiator structure of multilayer.
Description
Technical field
The utility model relates to telecommunications field, the heat dissipation dress of power device in especially a kind of radio frequency power amplification modules
It sets.
Background technique
Currently, the main failure forms of electronic equipment are exactly thermal failure.According to statistics, it is temperature that the failure of electronic equipment, which has 55%,
Caused by degree is more than specified value, as the temperature increases, the crash rate of electronic equipment is exponentially increased.So power device is warm
Design is the link that can not ignore in Structural Design of Electronic System, directly determines the success or not of product, good heat
Design is to guarantee that stable equipment operation is reliably basic.
There are two types of the heat dissipating methods for being widely used in power device at present:
1. applying heat-conducting silicone grease under power device: heat-conducting silicone grease is a kind of high heat conductive insulating organosilicon material.It is not when use
What is applied is The more the better, and overbrushing has no benefit, influences heat conduction efficiency instead.It is very little then not can guarantee and fill up gap, to practical behaviour
The proficiency for making personnel has relatively high requirement.And a part of silicone grease as cooling system, it can rapid aging under long term high temperature
Failure.
2. power device is welded on heat-conducting base: power device is placed on the heat conducting base that one piece was smeared tin cream,
Power device is welded on heat conducting base by heating welding bench.Since pcb board will also be consolidated together while welding
It is fixed, so replacement is just very time-consuming after power device damage.It needs pcb board monolith to disassemble out of casing, then puts again
It heats on warm table, power device could finally be taken off, it is fairly time consuming laborious.
Summary of the invention
The purpose of this utility model is to provide a kind of radiators of power device in radio frequency power amplification modules, on solving
State problem.
To realize above-mentioned technical purpose and the technique effect, the utility model discloses a kind of radio frequency power amplification modules
The radiator of middle power device includes radiator bottom plate, cooling fin, power device, power device bracket, radiator
The mounting groove of same size with power device is offered on bottom plate, cooling fin is placed in mounting groove, the installation of power device bracket
It in power device bottom, is then fixedly mounted in mounting groove, cooling fin and power device bracket are successively set in mounting groove.
Wherein, installation groove width is identical as power device, and length is 1.2-1.5 times of power device.
Wherein, mounting groove is rectangular slot or round rectangle slot.
Wherein, cooling fin is indium stannum alloy cooling fin, and cooling fin matches with mounting groove size.
Wherein, power device bracket includes vertical mounting plate and several fins, and vertical mounting plate is arranged in power device
Bottom, the two sides of power device are arranged in several fins.
The utility model has the following beneficial effects:
1. the utility model using the mounting plate of original power device as radiating bottom plate, and is opened by Optimal Structure Designing
If mounting groove, replaces traditional silicone oil or soldering to radiate by setting indium stannum alloy cooling fin, indium is added by base of tin and forms
Non-ferrous alloy.Indium stannum alloy fusing point is low, and intensity and hardness are low, it has higher thermal conductivity and lower thermal expansion coefficient,
Atmospheric corrosion resistance has excellent antifriction performance.Its quality is very soft simultaneously, can use nail indentation, and plasticity is strong, there is ductility,
Piece can be pressed into.
2. by the radiator that is rationally arranged, to power device adding power device bracket, by vertical mounting plate with
Indium stannum alloy cooling fin directly contacts heat dissipation, forms the radiator structure of multilayer.
Detailed description of the invention
Fig. 1 is the top view of the utility model.
Fig. 2 is structural schematic diagram in the mounting groove of the utility model.
Main component symbol description:
1: radiator bottom plate, 2: mounting groove, 3: cooling fin, 4: power device, 5: vertical mounting plate, 6: fin.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.
As shown in Figure 1, 2, the utility model discloses a kind of radiators of power device in radio frequency power amplification modules, including
Radiator bottom plate 1, cooling fin 3, power device 4, power device bracket, offer on radiator bottom plate 1 and power device
The mounting groove 2 of same size of part 4, cooling fin 3 are placed in mounting groove 2, and power device bracket is installed on 4 bottom of power device,
Then it is fixedly mounted in mounting groove 2, cooling fin 3 and power device bracket are successively set in mounting groove 2.
2 width of mounting groove is identical as power device 4, and length is 1.2-1.5 times of power device 4, and mounting groove 2 is rectangle
Slot or round rectangle slot.
Cooling fin 3 is indium stannum alloy cooling fin, and cooling fin 3 matches with 2 size of mounting groove.
Power device bracket includes vertical mounting plate 5 and several fins 6, and power device 4 is arranged in vertical mounting plate 5
The two sides of power device 4 are arranged in bottom, several fins 6.
Product installation:
Original power part mounting plate is changed to radiator bottom plate 1 by the application utility model, and opens up corresponding installation
Slot 2, and place cooling fin 3 in mounting groove 2 with secondary and be equipped with the power device bracket of power device 4, by screw by function
Rate device bracket is fixedly mounted in slot 2.
The application utility model, using indium stannum alloy as the main material of cooling fin 3, indium stannum alloy cooling fin can add in advance
Work is not oxidizable under room temperature at required shape, and it is convenient to save.Unlike heat-conducting silicone grease is inconvenient for use and tin cream needs special low temperature
It saves.
Indium stannum alloy cooling fin quality is very soft, can use nail indentation, plasticity is strong, has ductility, so working as power device
After part 4 is fixed by screw, extruding, deformation of the cooling fin 3 by 4 bottom of power device, this feature are just used to be fabricated to
Gasket closely fills up the minim gap between 4 bottom of power device and mounting groove 2.Without being needed as using heat-conducting silicone grease
The amount for wanting stringent grasp to use also need not carry out constant power device 4 using tin cream and high-temperature heating platform.
It is simple and convenient when replacement power device 4, as long as power device 4 can be dismantled by removing the fixed installation screw in both ends
Get off.Indium stannum alloy cooling fin can reuse.When unlike using silica gel as heat eliminating medium, need when replacement to dry
Net original silicone grease, then smears silicone grease again again.Also troublesomely monolith PCB need not be disassembled from mounting base, then
Upper warm table disassembly.Process saves a large amount of time and materials.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in
Change or replacement, should be covered within the scope of the utility model.
Claims (5)
1. the radiator of power device in a kind of radio frequency power amplification modules, which is characterized in that include radiator bottom plate, heat dissipation
Piece, power device, power device bracket offer the installation of same size with power device on the radiator bottom plate
Slot, the cooling fin are placed in mounting groove, and the power device bracket is installed on power device bottom, then fixed peace
In mounting groove, the cooling fin and power device bracket are successively set in mounting groove.
2. the radiator of power device in a kind of radio frequency power amplification modules as described in claim 1, it is characterised in that: described
Installation groove width is identical as power device, and length is 1.2-1.5 times of power device.
3. the radiator of power device in a kind of radio frequency power amplification modules as claimed in claim 1 or 2, it is characterised in that: institute
The mounting groove stated is rectangular slot or round rectangle slot.
4. the radiator of power device in a kind of radio frequency power amplification modules as described in claim 1, it is characterised in that: described
Cooling fin is indium stannum alloy cooling fin, and the cooling fin matches with mounting groove size.
5. the radiator of power device in a kind of radio frequency power amplification modules as described in claim 1, it is characterised in that: described
Power device bracket includes vertical mounting plate and several fins, and the bottom of power device is arranged in the vertical mounting plate,
The two sides of power device are arranged in several fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820785691.4U CN208210556U (en) | 2018-05-25 | 2018-05-25 | The radiator of power device in a kind of radio frequency power amplification modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820785691.4U CN208210556U (en) | 2018-05-25 | 2018-05-25 | The radiator of power device in a kind of radio frequency power amplification modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208210556U true CN208210556U (en) | 2018-12-07 |
Family
ID=64516251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820785691.4U Active CN208210556U (en) | 2018-05-25 | 2018-05-25 | The radiator of power device in a kind of radio frequency power amplification modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208210556U (en) |
-
2018
- 2018-05-25 CN CN201820785691.4U patent/CN208210556U/en active Active
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