CN208210423U - A kind of flexible circuit board, LCD MODULE and display - Google Patents
A kind of flexible circuit board, LCD MODULE and display Download PDFInfo
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- CN208210423U CN208210423U CN201820737848.6U CN201820737848U CN208210423U CN 208210423 U CN208210423 U CN 208210423U CN 201820737848 U CN201820737848 U CN 201820737848U CN 208210423 U CN208210423 U CN 208210423U
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- layer
- flexible circuit
- circuit board
- copper foil
- coating
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Abstract
The utility model discloses a kind of flexible circuit board, LCD MODULE and displays.The flexible circuit board, substrate layer, copper wire layer and coating including being sequentially overlapped setting, one end of the copper wire layer is golden finger structure, wherein, it is provided with copper foil layer in the one side opposite with the copper wire layer is arranged of the substrate layer, and the copper foil layer is superimposed upon on the golden finger structure region.The utility model passes through setting copper foil layer, on the one hand the preshrunk amount in FPC manufacturing process can be accurately controlled, so as to improve the supplied materials dimensional tolerance problem of FPC bindings bit, on the other hand FPC thermal expansion amount can also be accurately controlled by increasing copper foil layer during high-temperature laminating, and then can significantly improve binding deviation problem.
Description
Technical field
The utility model relates to field of display technology, in particular to a kind of flexible circuit board, LCD MODULE and display
Device.
Background technique
It is one kind of substrate support with highly reliable that flexible circuit board (FPC), which is using polyimides (PI) or polyester film,
Property flexible printed circuit, FPC have been obtained extensively because having the characteristics that Distribution density is high, light-weight, thickness is thin in display device
General application.Fig. 1 is that FPC and LCD screen connection structure schematic side view, FPC include the first coating 10, substrate in the prior art
Layer 20, copper wire layer 30, the second coating 40, copper wire layer one end form golden finger 31, and golden finger 31 passes through ACF(anisotropic conductive adhesive)
50 are pressed on the ITO pin layer 11 of the TFT glass.Fig. 2 is FPC and LCD screen connection structure schematic top plan view in the prior art,
It can be seen from the figure that golden finger needs to correspond with ITO pin layer binding position.In the prior art, ITO pin layer and gold
Finger is by pressing ACF connection conducting, and the heat pressing process needs of ACF are pressed at 150 DEG C of high temperature or so, and FPC is in high temperature
Meeting expanded by heating in bonding processes can first preshrunk (overall length when FPC is designed to guarantee that golden finger is aligned not deviation with TFT ITO
Degree-swell increment) production, but FPC is usually to use PI(polyimides) and copper wire composition, and the big (2*10 of the thermal expansion coefficient of PI-5 ~
3*10-5DEG C), while being easy to be influenced by the humidity of manufacture craft and environment, cause its thermal expansion coefficient very unstable, therefore
FPC preshrunk production be that can not accurately control preshrunk amount, so as to cause FPC itself bindings bit supplied materials dimensional tolerance do not allow it is easily-controllable
It makes, the humidity of environment also will affect FPC swell increment during another aspect high-temperature laminating, and these two aspects factor can all cause to bind
It is easy to appear deviation problem, i.e., golden finger is staggered with LCD binding position or overlapping area does not reach requirement.The big ruler particularly in
Very little display module (is greater than 70mm) when the length of bindings bit is long, and binding deviation problem is especially serious.
Utility model content
The purpose of this utility model is to provide a kind of flexible circuit board, LCD MODULE and displays.The flexible electrical
Road plate is by increasing by a floor copper foil layer, so as to improve binding deviation problem.
To achieve the above object, the technical solution that the utility model is taken are as follows:
A kind of flexible circuit board, substrate layer, copper wire layer and coating including being sequentially overlapped setting, the one of the copper wire layer
End is golden finger structure, wherein it is provided with copper foil layer in the one side opposite with the copper wire layer is arranged of the substrate layer, and
And the copper foil layer is superimposed upon on the golden finger structure region.
Further, the copper foil layer is with a thickness of 1/5oz to 1oz.
Further, the material of the substrate layer includes polyimides.
Further, the coating is polyimide film.
The utility model additionally provides a kind of flexible circuit board, including be sequentially overlapped the first coating of setting, substrate layer,
Copper wire layer and the second coating, one end of the copper wire layer are golden finger structure, and first coating is superimposed upon the golden hand
Refer on structure region, wherein copper foil layer, and the copper are additionally provided between first coating and the substrate layer
Layers of foil is also superimposed upon on the golden finger structure region.
Further, the copper foil layer is with a thickness of 1/5oz to 1oz.
Further, the material of the substrate layer includes polyimides.
Further, first coating is polyimide film, and second coating is polyimide film.
The utility model additionally provides a kind of LCD MODULE, including TFT glass and any of the above-described flexible electrical
Road plate, the TFT glass have ITO pin layer, and the binding bit length of the ITO pin layer is greater than 70mm, the golden finger knot
Structure is pressed on the ITO pin layer of the TFT glass by anisotropic conductive adhesive.
The utility model additionally provides a kind of display, including above-mentioned LCD MODULE.
On the one hand the utility model can accurately control the preshrunk amount in FPC manufacturing process by increase copper foil layer, thus
Improve the supplied materials dimensional tolerance problem of FPC bindings bit, on the other hand increasing copper foil layer during high-temperature laminating can also be accurate
FPC thermal expansion amount is controlled, and then binding deviation problem can be significantly improved.
Detailed description of the invention
Fig. 1 is FPC in the prior art and LCD screen connection structure schematic side view；
Fig. 2 is FPC in the prior art and LCD screen connection structure schematic top plan view；
Fig. 3 is the FPC structure schematic side view of the utility model first embodiment；
Fig. 4 is the FPC structure schematic top plan view of the utility model first embodiment；
Fig. 5 is the FPC structure schematic side view of the utility model second embodiment.
Specific embodiment
The utility model is described in detail with reference to the accompanying drawings and examples.
Fig. 3 is the FPC structure schematic side view of the utility model first embodiment.Flexible circuit board provided in this embodiment
Including the first coating 12, substrate layer 22, copper wire layer 32 and the second coating 42, described 32 one end of copper wire layer is formed with golden finger
Structure 33, first coating 12 are superimposed upon on 33 region of golden finger structure, first coating 12 and institute
It states and is additionally provided with copper foil layer 52 between substrate layer 22, and the copper foil layer 52 is superimposed upon 33 region of golden finger structure
On.Fig. 4 is the FPC structure schematic top plan view of the utility model first embodiment, and copper foil layer 52 is superimposed upon 33 institute of golden finger structure
On region, the length of copper foil layer 52 is greater than the binding region length of golden finger structure.33 institute of golden finger structure in the present embodiment
Refer to the region that needs are bound in region, the binding region length of golden finger structure 33 refers to the length of bindings bit.
In this way, the thermal expansion coefficient due to copper foil material is smaller, generally in 1.7*10-5DEG C or so, while copper foil material heat
The coefficient of expansion will not be influenced by ambient humidity and FPC manufacture craft, therefore the utility model on FPC by increasing copper foil
Layer, on the one hand can accurately control the preshrunk amount in FPC manufacturing process improves the supplied materials dimensional tolerance problem of FPC bindings bit, separately
On the one hand FPC thermal expansion amount can also be accurately controlled during binding high-temperature laminating, so as to significantly improve binding deviation
Problem.
Further, be conducive to improve binding deviation problem, the utility model first embodiment when copper thickness is thicker
Copper thickness is 1/5oz to 1oz.Here, oz be PCB the common international unit of copper thickness is characterized in FPC industry, 1oz is
The weight for referring to uniform copper foil on 1 square feet area is 28.35g, i.e., the average thickness of copper foil is indicated with the weight of unit area
Degree.
Further, the material of substrate layer 22 includes polyimides (PI).
Further, the first coating 12 is polyimide film, and second coating 42 is also polyimide film.
As shown in figure 5, the utility model second embodiment provides another flexible circuit board, the prior art is made
Improvement and first embodiment it is essentially identical, be only targeted flexible circuit board basic structure and first embodiment slightly not
Together, it should be understood that the two belongs to same inventive concept.Specifically, the flexible circuit board includes the substrate for being sequentially overlapped setting
Layer 23, copper wire layer 34 and coating 43, one end of the copper wire layer 34 are formed with golden finger structure 35, wherein in the substrate
It is provided with copper foil layer 53 in the one side opposite with the copper wire layer is arranged of layer 23, and the copper foil layer 53 is superimposed upon the gold
On 35 region of finger structure.In this way, the thermal expansion coefficient due to copper foil material is small, while copper foil thermal expansion coefficient will not be by
Ambient humidity and FPC manufacture craft influence, thus on the one hand the present embodiment can be accurately controlled by adding one layer of copper foil layer
Preshrunk amount in FPC manufacturing process improves the supplied materials dimensional tolerance problem of FPC bindings bit, on the other hand in binding high-temperature laminating mistake
FPC thermal expansion amount can also be accurately controlled in journey, so as to significantly improve binding deviation problem.
Further, the copper foil layer is with a thickness of 1/5oz to 1oz.
Further, the material of the substrate layer includes polyimides.
Further, the coating is polyimide film.
The utility model 3rd embodiment provides a kind of LCD MODULE, including TFT glass and above-described embodiment institute
The FPC of offer, the TFT glass have ITO pin layer, and the binding bit length of the ITO pin layer is greater than 70mm, the gold hand
Refer to that structure is pressed on the ITO pin layer of the TFT glass by anisotropic conductive adhesive.It should be noted that for middle large scale liquid
(it is greater than 70mm) when the length of brilliant display module, especially bindings bit is long, binding deviation problem is especially serious, and this implementation
Example is bound by using FPC and the ITO pin layer that first embodiment and second embodiment provide, can significantly improve in greatly
Sized liquid crystal display module binds deviation problem.
The utility model fourth embodiment provides a kind of display, including liquid crystal display mode described in above-described embodiment
Block.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model embodiment rather than right
It is limited, although the utility model embodiment is described in detail referring to preferred embodiment, this field it is common
Technical staff should understand that still be modified or replaced equivalently the technical solution of the utility model embodiment, and this
A little ranges modified or equivalent replacement cannot also make modified technical solution be detached from the utility model embodiment technical solution.
Claims (10)
1. a kind of flexible circuit board, substrate layer, copper wire layer and coating including being sequentially overlapped setting, one end of the copper wire layer
For golden finger structure, which is characterized in that be provided with copper foil in the one side opposite with the copper wire layer is arranged of the substrate layer
Layer, and the copper foil layer is superimposed upon on the golden finger structure region.
2. flexible circuit board according to claim 1, which is characterized in that the copper foil layer is with a thickness of 1/5oz to 1oz.
3. flexible circuit board according to claim 1, which is characterized in that the material of the substrate layer includes polyimides.
4. flexible circuit board according to claim 1, which is characterized in that the coating is polyimide film.
5. a kind of flexible circuit board, the first coating, substrate layer, copper wire layer and the second coating including being sequentially overlapped setting,
One end of the copper wire layer is golden finger structure, and first coating is superimposed upon on the golden finger structure region,
It is characterized in that, copper foil layer is additionally provided between first coating and the substrate layer, and the copper foil layer is also superimposed upon
On the golden finger structure region.
6. flexible circuit board according to claim 5, which is characterized in that the copper foil layer is with a thickness of 1/5oz to 1oz.
7. flexible circuit board according to claim 5, which is characterized in that the material of the substrate layer includes polyimides.
8. flexible circuit board according to claim 5, which is characterized in that first coating is polyimide film, institute
Stating the second coating is polyimide film.
9. a kind of LCD MODULE, which is characterized in that including any flexible circuit of TFT glass and claim 1 ~ 8
Plate, the TFT glass have ITO pin layer, and the binding bit length of the ITO pin layer is greater than 70mm, the golden finger structure
It is pressed on the ITO pin layer of the TFT glass by anisotropic conductive adhesive.
10. a kind of display, which is characterized in that including LCD MODULE as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820737848.6U CN208210423U (en) | 2018-05-17 | 2018-05-17 | A kind of flexible circuit board, LCD MODULE and display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820737848.6U CN208210423U (en) | 2018-05-17 | 2018-05-17 | A kind of flexible circuit board, LCD MODULE and display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208210423U true CN208210423U (en) | 2018-12-07 |
Family
ID=64517440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820737848.6U Active CN208210423U (en) | 2018-05-17 | 2018-05-17 | A kind of flexible circuit board, LCD MODULE and display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208210423U (en) |
-
2018
- 2018-05-17 CN CN201820737848.6U patent/CN208210423U/en active Active
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