CN208158989U

CN208158989U - A kind of IC chip PCB circuit board bonded of half bore conducting

Info

Publication number: CN208158989U
Application number: CN201820278248.8U
Authority: CN
Inventors: 马兴光
Original assignee: Huangshi Xingguang Electronics Co Ltd
Current assignee: Huangshi Xingguang Electronics Co Ltd
Priority date: 2018-02-28
Filing date: 2018-02-28
Publication date: 2018-11-27
Anticipated expiration: 2028-02-28

Abstract

The utility model discloses a kind of IC chip PCB circuit boards bonded of half bore conducting, including substrate, ink layer is coated on the bottom surface of substrate, conductive hole is set on substrate, metal conducting layer is coated on the half hole wall of conductive hole in the vertical direction, face-up IC chip is set on substrate, route is equipped on the two sides of substrate, route is equipped with and the one-to-one tie point of solder joint in IC chip, pass through binding conducting wire connection between tie point and solder joint, black glue cured layer is set on binding conducting wire, the first cover board and the second cover board of fitting are set on substrate, first cover board is equipped with the embedded hole that can hold the insertion of black glue cured layer, ink layer is also coated on the top surface of second cover board.Circuit board provided by the utility model is at low cost, and service efficiency is high, and lower to equipment requirement needed for production.

Description

A kind of IC chip PCB circuit board bonded of half bore conducting

Technical field

The utility model design field of circuit boards, and in particular to it is a kind of apply M2M wireless communication in half bore conducting IC chip PCB circuit board bonded.

Background technique

M2M is that machine, people are formed a huge network by various wireless communication techniques, real by this network Existing various applications are such as to the control of intelligent terminal, and M2M is gradually being pushed all over the world in recent years, using throughout electric power, friendship Multiple industries such as logical, Industry Control, medical treatment, Administration of Public Affairs.The development of mobile communication technology especially 5G mobile radio communication The commercialization of network make the more simple, cost of M2M communication may also can be lower, global system for mobile communications is all over the world, and enterprise can To set up oneself communication network soon.The existing PCB circuit board applied in M2M wireless communication is usually all by IC Chip is installed on circuit boards by way of quad flat non-pin package, and this board production is at high cost, service efficiency It is low and also higher to the production equipment requirement.

Utility model content

The purpose of this utility model is to provide a kind of IC chip PCB circuit boards bonded of half bore conducting, on solving State the problem of proposing in background technique.

To achieve the above object, the utility model provides the following technical solutions：A kind of IC chip of half bore conducting is bonded PCB circuit board, including：

Substrate is coated with ink layer on the bottom surface of the substrate, and the substrate is equipped with upper and lower perforative conductive hole, described Metal conducting layer is coated on the half hole wall of conductive hole in the vertical direction；

IC chip, face-up setting is on the substrate；

Conductive structure comprising the function route on the top surface of the substrate is set and is arranged in the substrate bottom surface Conductive via pad corresponding with the conductive hole, functional line road is equipped with and the solder joint of the IC chip corresponds Tie point；

Conducting wire is bound, is connected between the solder joint of the IC chip and the tie point；

Black glue cured layer is covered in the binding conducting wire and the IC chip；

First cover board, fitting are arranged on the top surface of the substrate, and first cover board is equipped with solid with the black glue The corresponding cured layer embedded hole of the location and shape of given layer, the black glue cured layer are embedded in the cured layer embedded hole；

Second cover board is covered on first cover board and is bonded together by high-temperature glue therebetween, described Ink layer is also coated on the top surface of second cover board.

Preferably, for the IC chip PCB circuit board bonded of the half bore conducting, the functional line road is equipped with five A tie point, respectively ground connection, power supply line connection point, reset line connection point, time line connection point and data are led Enter to export line connection point.

Preferably, for the IC chip PCB circuit board bonded of the half bore conducting, the thickness of first cover board is rigid It is greater than the thickness of the black glue cured layer well.

Preferably, for the IC chip PCB circuit board bonded of the described half bore conducting, the binding conducting wire for gold thread or One of aluminum steel.

Compared with prior art, the utility model has the beneficial effects that：

The PCB circuit board of the utility model is respectively formed binding conducting wire and IC chip by black glue cured layer and cover board Protection, circuit board is more durable, and function route designs accordingly according to the solder joint in IC chip, the service efficiency of circuit board It is higher, and the mode system of jigsaw in flakes can be used in the ability of designed PCB circuit board combination binding machine sealed in unit production Make, will cover the tester substrate for enclosing IC chip sealed of plate it is complete after cut into it is single only, form new M2M chip module, such as This can realize quick large batch of production, reduce the requirement to production equipment, improve production efficiency.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the utility model,

Wherein, 1, substrate, 2, ink layer, 3, conductive hole, 4, IC chip, 5, function route, 6, binding conducting wire, 7, black glue it is solid Change layer, the 8, first cover board, the 9, second cover board, 10 metal conducting layers.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Referring to Fig. 1, the utility model provides a kind of technical solution：A kind of IC chip of half bore conducting PCB electricity bonded Road plate, including：

Substrate 1, ink layer 2 is coated on the bottom surface of the substrate 1, and the substrate 1 is equipped with upper and lower perforative conductive hole 3, metal conducting layer 10 is coated on the half hole wall of the conductive hole 3 in the vertical direction；

IC chip 4, it is face-up to be arranged on the substrate 1；

Conductive structure comprising the function route 5 on the top surface of the substrate 1 is set and is arranged at 1 bottom of substrate Conductive via pad corresponding with the conductive hole 3 on face, the function route 5 are equipped with the solder joint with the IC chip 4 One-to-one tie point；

Conducting wire 6 is bound, is connected between the solder joint and the tie point of the IC chip 4；

Black glue cured layer 7 is covered in the binding conducting wire 6 and the IC chip 4；

First cover board 8, fitting are arranged on the top surface of the substrate 1, and first cover board 7 is equipped with and the black glue The corresponding cured layer embedded hole of the location and shape of fixing layer 7, the black glue cured layer 7 are embedded in the cured layer embedded hole It is interior；

Second cover board 9 is covered on first cover board 8 and is bonded together by high-temperature glue therebetween, institute It states and is also coated with ink layer 2 on the top surface of the second cover board 9.

Functional line road sets that there are five the tie points, respectively ground connection, power supply line connection point, reset line Tie point, time line connection point and data import output line connection point.

The thickness of first cover board 8 is just greater than the thickness of the black glue cured layer 7.

The binding conducting wire 6 is one of gold thread or aluminum steel.

The PCB circuit board of the utility model, respectively by black glue cured layer 7 and cover board to binding conducting wire 6 and 4 shape of IC chip At protection, circuit board is more durable, and function route 5 designs accordingly according to the solder joint in IC chip 4, the use of circuit board It is more efficient, and the side of jigsaw in flakes can be used in the ability of designed PCB circuit board combination binding machine sealed in unit production Formula production will cover after the substrate 1 for enclosing IC chip 4 that plate is sealed is tested and cut into single, and form new M2M chip dies Block so can be achieved quickly large batch of production, reduce the requirement to production equipment, improve production efficiency.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of IC chip PCB circuit board bonded of half bore conducting, which is characterized in that including：

Substrate, ink layer is coated on the bottom surface of the substrate, and the substrate is equipped with upper and lower perforative conductive hole, the conduction Metal conducting layer is coated on the half hole wall of hole in the vertical direction；

IC chip, face-up setting is on the substrate；

Conductive structure comprising the function route that is arranged on the top surface of the substrate and be arranged in the substrate bottom surface with The corresponding conductive via pad of the conductive hole, the functional line road is equipped with to be connected correspondingly with the solder joint of the IC chip Contact；

First cover board, fitting are arranged on the top surface of the substrate, and first cover board is equipped with and the black glue fixing layer The corresponding cured layer embedded hole of location and shape, the black glue cured layer is embedded in the cured layer embedded hole；

Second cover board is covered on first cover board and is bonded together by high-temperature glue therebetween, and described second Ink layer is also coated on the top surface of cover board.

2. the IC chip PCB circuit board bonded of half bore conducting according to claim 1, which is characterized in that the function It is set on route there are five the tie point, respectively ground connection, power supply line connection point, reset line connection point, timeline connects Contact and data import output line connection point.

3. the IC chip PCB circuit board bonded of half bore conducting according to claim 1, which is characterized in that described first The thickness of cover board is just greater than the thickness of the black glue cured layer.

4. the IC chip PCB circuit board bonded of half bore conducting according to claim 1, which is characterized in that the binding Conducting wire is one of gold thread or aluminum steel.