CN208157850U - A kind of folded battle array of high-temperature solder conduction cooling laser diode annular - Google Patents
A kind of folded battle array of high-temperature solder conduction cooling laser diode annular Download PDFInfo
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- CN208157850U CN208157850U CN201721832014.5U CN201721832014U CN208157850U CN 208157850 U CN208157850 U CN 208157850U CN 201721832014 U CN201721832014 U CN 201721832014U CN 208157850 U CN208157850 U CN 208157850U
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- battle array
- annular
- laser diode
- conduction cooling
- bar
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Abstract
The utility model discloses a kind of high-temperature solder conduction cooling laser diode annulars to fold battle array, one folded battle array is made of 15 bars of items (1), each bar of item is welded by golden tin high temperature hard solder and tungsten copper heat-sink, it is encapsulated on oxygen-free copper heat sink (3) by transition electrical insulation sheet (4), folded battle array is fixed on annular hot and cold water sink with fastener (2) again then.The advantages that the utility model provides a kind of novel heat sink corresponding encapsulating structure of ring-type, has compact-sized, low cost, small in size, light-weight.
Description
Technical field
The utility model relates to laser device fields, and in particular to be a kind of be applied to by heat-radiating semiconductor laser ring
Shape folds battle array encapsulating structure.
Background technique
With the development of semiconductor laser, the innovation of application field, the packaged type and structure of semiconductor laser
It is changeable therewith, it emerges one after another.According to Specifications, structure size and existing product type and technical maturity, needle
Battle array project is folded to high-temperature solder conduction cooling laser diode annular, using the cooling back heat dissipation quasi-continuous lasing diode of conduction
Bar item folds battle array scheme.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of high-temperature solder conduction cooling laser diode annulars
Folded battle array.
It is as follows that the utility model solves the technical solution that above-mentioned technical problem is taken：
A kind of folded battle array of high-temperature solder conduction cooling laser diode annular, a folded battle array are made of 15 Bar items (1), often
A Bar item is welded by golden tin high temperature hard solder and tungsten copper heat-sink, then is encapsulated in oxygen-free copper by transition electrical insulation sheet (4)
On heat sink (3), then folded battle array is fixed on annular hot and cold water sink with fastener (2).
Preferably, the folded battle array terms of overall dimensions, outer annular diameter 80mm, annular diameters 40mm, annular thickness 13mm,
Electrode and water channel are radially projecting, wherein the prominent 10mm of water channel, and the prominent 10mm of electrode, light-emitting area is 40 π X10mm2, and Bar
Item shines section length 10mm.
Preferably, Bar light direction is directed toward annular center, and deviation is less than 0.5 °, the angle of adjacent bar item in ring,
Within the positioning accuracy ± 0.2mm in the ring center direction X/Y, the positioning accuracy of each Bar item is ± 0.2mm in both the tangential and radial directions
Within.
Preferably, on the oxygen-free copper that the folded battle array of one group of laser Bar strip is encapsulated in aquaporin is heat sink, oxygen-free copper is heat sink
Inside is leaked water knot, one end water inlet, one end water outlet；Water intake end pressure about 0.5Mpa, inside water pressure about 0.1~0.5MPa, flow velocity 1~
3L/min, water inlet end size Ф 3mm；Inside is walked aquaporin and is designed using Multi-channel parallel connection, and flow velocity is uniform, good heat dissipation effect；Nothing
It needs deionized water cooling, 25 DEG C of light water is used on the installation carrier of folded battle array；One group of ring laser folds battle array in work
When making, using radiating mode in parallel.
Preferably, folding battle array internal pressure is 1h under 0.5Mpa state, and pressure is dropped by less than 0.05Mpa, as air-tightness
It is qualified.
Preferably, single laser diode laser Bar item is using being connected in series, and electrode structure is using surface gold-plating
Oxygen-free copper TUI production.
Preferably, electrode interface work area 4mmX10mm, and minimum 0.5mmX6mm, surface gold-plating；Each Bar item
Operating voltage is less than 2V, and the voltage of entire folded battle array is less than 30V, when power is greater than 250W, input current about 230A.
The utility model provides a kind of novel heat sink corresponding encapsulating structure of ring-type, have it is compact-sized, it is low at
This, it is small in size, it is light-weight the advantages that.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood and implementing the utility model.The purpose of this utility model and other advantages can pass through
Structure specifically indicated in the written description, claims, and drawings is achieved and obtained.
Detailed description of the invention
The utility model is described in detail with reference to the accompanying drawing, so that the above-mentioned advantage of the utility model is more
It is clear.Wherein,
Fig. 1 is that the utility model high-temperature solder conduction cooling laser diode annular folds battle array structure chart；
Fig. 2 is that the utility model high-temperature solder conduction cooling laser diode annular folds battle array structure chart.
Specific embodiment
The embodiments of the present invention is described in detail below with reference to accompanying drawings and embodiments, whereby to the utility model
How applied technology method solves technical problem, and the realization process for reaching technical effect can fully understand and implement.
If it should be noted that do not constitute conflict, each feature in each embodiment and each embodiment in the utility model
It can be combined with each other, be formed by technical solution and both be within the protection scope of the present invention.
There are many existing semiconductor laser product packaged type, this annular folds the encapsulating structure of battle array, provide one kind and are applied to
Semiconductor laser annular packaging structure, product small integrated are a kind of folded battle array envelopes of the annular within the scope of small scale structures
Dress mode.
Wherein, as shown in Figure 1, a folded battle array is made of 15 Bar items, each Bar item is passed through using special frock clamp
The high temperature such as golden tin hard solder and tungsten copper heat-sink are welded, then by transition electrical insulation sheet be encapsulated in oxygen-free copper it is heat sink on, then
Folded battle array is fixed on annular hot and cold water sink with the fastener of special designing.
Wherein, fold battle array terms of overall dimensions, outer annular diameter 80mm, annular diameters 40mm, annular thickness 13mm, electrode and
Water channel is radially projecting, wherein the prominent 10mm of water channel, and the prominent 10mm of electrode, light-emitting area is 40 (the Bar luminous zones π X10mm2
Length 10mm).
Wherein, from two aspect of design and processes, guarantee that Bar light direction is directed toward annular center, deviation is less than
0.5 °, the angle of adjacent bar item in ring, within the positioning accuracy ± 0.2mm in the ring center direction X/Y, the positioning of each Bar item
Precision (radially and tangentially), within ± 0.2mm.
About water power interface, one group of laser Bar strip fold battle array be encapsulated in aquaporin oxygen-free copper it is heat sink on, oxygen-free copper heat
Heavy inside is leaked water knot, one end water inlet, one end water outlet.Water intake end pressure about 55psi (0.5Mpa), inside water pressure about 0.1~
0.5MPa, 1~3L/min of flow velocity, water inlet end size Ф 3.Inside is walked aquaporin and is designed using Multi-channel parallel connection, and flow velocity is uniform, dissipates
Thermal effect is good.It is cooling without deionized water, 25 DEG C of light water is used on the installation carrier of folded battle array.One group of loop laser
Device folds battle array (8) at work, using radiating mode in parallel.About the air-tightness of folded battle array, generally in folded battle array in assembling plus electric current
, can be according to product requirement, specifically before test, keeping folded battle array internal pressure is 1h under 0.5Mpa state, and pressure is dropped by less than
0.05Mpa, as air-tightness are qualified.
When one annular folds battle array work, it is assumed that cooling water intake temperature is 25 DEG C, and water outlet is 35 DEG C, cooling-water duct
Water inlet end diameter is Ф 3, and flow velocity is 1~3L/min, and the specific heat capacity of cooling water is calculated according to 4.2 × 103J/kg, then every point
The heat that clock cooling water can be taken away is about 4.2~12.6 × 104J.Laser diode is in 250 μ s, 300Hz (i.e. duty ratio
7.5%), each Bar peak power works under the conditions of being 200W, and photoelectric conversion efficiency is calculated according to 50%, and a folded battle array is every
The heat that minute generates is about 1.35 × 104J, the heat that can be taken away well below cooling water.And actual photoelectric conversion
Efficiency is 55% or more, it can be seen that, water-bound design and flow fully meet the radiating requirements when work of folded battle array.
In terms of power supply system, in the course of work, single laser diode laser Bar item is using series connection, electrode
Structure is made of the oxygen-free copper TUI of surface gold-plating, electrode interface work area 4mmX10mm (minimum 0.5mmX6mm), surface
It is gold-plated.Each Bar operating voltage is less than 2V, and the voltage of entire folded battle array is less than 30V, when power is greater than 250W, input current
About 230A.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (4)
1. a kind of high-temperature solder conduction cooling laser diode annular folds battle array, which is characterized in that a folded battle array is by 15 bars of items (1)
Composition, each bar of item is welded by golden tin high temperature hard solder and tungsten copper heat-sink, then is encapsulated in by transition electrical insulation sheet (4)
On oxygen-free copper is heat sink (3), then folded battle array is fixed on annular hot and cold water sink with fastener (2).
2. high-temperature solder conduction cooling laser diode annular according to claim 1 folds battle array, which is characterized in that described folded
Battle array terms of overall dimensions, outer annular diameter 80mm, annular diameters 40mm, annular thickness 13mm, electrode and water channel are radially projecting,
The prominent 10mm of middle water channel, the prominent 10mm of electrode, light-emitting area is 40 π X10mm2, and the luminous section length 10mm of Bar item.
3. high-temperature solder conduction cooling laser diode annular according to claim 1 or 2 folds battle array, which is characterized in that bar
Light direction is directed toward annular center, and deviation is less than 0.5 °, the angle of adjacent bar item in ring, the positioning accurate in the ring center direction X/Y
Within degree ± 0.2mm, the positioning accuracy of each Bar item is within ± 0.2mm in both the tangential and radial directions.
4. high-temperature solder conduction cooling laser diode annular according to claim 1 folds battle array, which is characterized in that single to swash
Using being connected in series, electrode structure is made optical diode laser Bar item of the oxygen-free copper TUI of surface gold-plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721832014.5U CN208157850U (en) | 2017-12-25 | 2017-12-25 | A kind of folded battle array of high-temperature solder conduction cooling laser diode annular |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721832014.5U CN208157850U (en) | 2017-12-25 | 2017-12-25 | A kind of folded battle array of high-temperature solder conduction cooling laser diode annular |
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| Publication Number | Publication Date |
|---|---|
| CN208157850U true CN208157850U (en) | 2018-11-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108199257A (en) * | 2017-12-25 | 2018-06-22 | 苏州长光华芯光电技术有限公司 | A kind of high-temperature solder conduction cooling laser diode annular folds battle array |
-
2017
- 2017-12-25 CN CN201721832014.5U patent/CN208157850U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108199257A (en) * | 2017-12-25 | 2018-06-22 | 苏州长光华芯光电技术有限公司 | A kind of high-temperature solder conduction cooling laser diode annular folds battle array |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215163 No.2 workshop-1-102, No.2 workshop-2-203, zone a, industrial square, science and Technology City, No.189 Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Changguang Huaxin Optoelectronic Technology Co.,Ltd. Address before: 215163 No.2 factory building, No.189 Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU EVERBRIGHT PHOTONICS TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |