CN205752253U - A kind of LED with high efficiency and heat radiation substrate - Google Patents
A kind of LED with high efficiency and heat radiation substrate Download PDFInfo
- Publication number
- CN205752253U CN205752253U CN201620783648.5U CN201620783648U CN205752253U CN 205752253 U CN205752253 U CN 205752253U CN 201620783648 U CN201620783648 U CN 201620783648U CN 205752253 U CN205752253 U CN 205752253U
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- heat
- substrate
- led
- conducting bar
- heat conducting
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Abstract
This utility model belongs to technical field of LED light illumination, it is specifically related to a kind of LED with high efficiency and heat radiation substrate, including substrate and setting LED chip on the substrate, it is additionally provided with on the substrate and described LED chip is encapsulated in interior packaging part, the side deviating from described LED chip on described substrate is provided with thermal component, described thermal component includes the heat sink fitted on the substrate, described heat sink is provided with some conducting-heat elements towards the side of described substrate, described conducting-heat elements includes the first heat conducting bar and the second heat conducting bar, described first heat conducting bar extend in described substrate, described second heat conducting bar passes described substrate, and extend in described packaging part, the side deviating from described substrate at described heat sink is additionally provided with some radiating fins, it is spaced apart between described radiating fin.The LED of the application, can not only further improve the service life of LED, but also can improve the safety and reliability that its LED uses.
Description
Technical field
This utility model belongs to technical field of LED light illumination, is specifically related to a kind of LED with high efficiency and heat radiation substrate.
Background technology
In current lighting technical field, LED light source is widely used, because of its life-span length and low power consumption and other advantages
It is increasingly becoming the main flow lighting source in present society life.Although it is low etc. excellent that LED light source has above-mentioned life-span length, energy consumption
Point, but, it there is also the deficiency that can not be ignored, and in its deficiency, of paramount importance is exactly its heat-sinking capability, due at LED
During light source works, substantial amounts of heat can be produced, and the small volume of LED light source own, heat is difficult to shed, so generally making
Must have higher temperature in the periphery of LED light source, not only shorten the service life of LED light source, so that LED light source
There is certain potential safety hazard.So, the LED light source that design a kind of can quickly shed heat is presently required.
Utility model content
The purpose of this utility model is, the problem that there is not easy heat radiation for current LED light source, it is provided that one can be fast
Speed sheds the LED light source of heat.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of LED with high efficiency and heat radiation substrate, including substrate and setting LED chip on the substrate, in institute
State to be additionally provided with on substrate and described LED chip is encapsulated in interior packaging part, described substrate deviates from the side of described LED chip
Being provided with thermal component, described thermal component includes the heat sink fitted on the substrate, and described heat sink is towards described base
The side of plate is provided with some conducting-heat elements, is spaced apart between described conducting-heat elements, and described conducting-heat elements includes the first heat conduction
Bar and the second heat conducting bar, described first heat conducting bar extend in described substrate, and described second heat conducting bar passes described substrate, and stretches
Entering in described packaging part, described second heat conducting bar staggers with described LED chip, deviates from the one of described substrate at described heat sink
Side is additionally provided with some radiating fins, is spaced apart between described radiating fin.
The LED of the application, arranges heat sink on substrate, and the heat on substrate is quickly delivered to by the first heat conducting bar
On heat sink, and the heat on packaging part is quickly delivered on heat sink by the second heat conducting bar, heat sink and heat radiation thereon
Fin, is quickly scattered to outside by the heat on heat sink, so, it is achieved the high efficiency and heat radiation of LED, and can not only be further
Improve the service life of LED, but also the safety and reliability that its LED uses can be improved；Above-mentioned in the application
In scheme, due to the first heat conducting bar and the setting of the second heat conducting bar, on the one hand it is to improve on substrate heat on heat and packaging part
The transmission speed that amount is delivered on heat sink, on the other hand, also improves the reliability being connected between heat sink with substrate, enters one
Step the application reliability of structure.
Preferably, described conducting-heat elements also includes the 3rd heat conducting bar, and described 3rd heat conducting bar passes described substrate, and fits
The back side in described LED chip.By arranging the 3rd heat conducting bar, it is possible to make the heat in LED chip fast by the 3rd heat conducting bar
Being delivered on heat sink and radiating fin of speed, further improves the service life of the application LED, safety and reliable
Property.
Preferably, described first heat conducting bar, the second heat conducting bar and the 3rd heat conducting bar are prism-shaped.
Preferably, it is provided with insulation glue-line between described 3rd heat conducting bar and described LED chip.On the one hand the 3rd is made to lead
Connection between hot rod and LED chip is the tightst, on the other hand also makes to insulate between the 3rd heat conducting bar and LED chip, it is to avoid
It is short-circuited between LED chip and exterior components, further improves the reliability that the application LED uses.
Preferably, described heat sink, the first heat conducting bar, the second heat conducting bar, the 3rd heat conducting bar and radiating fin are metal material
Material prepares.Metal material has good heat-conductive characteristic and heat dispersion.
Preferably, described heat sink, the first heat conducting bar, the second heat conducting bar, the 3rd heat conducting bar and radiating fin are integral type
Structure.Further improve the transmission efficiency of heat between each part.
Preferably, it is parallel to each other between described radiating fin.Make to be formed between radiating fin air flow channel, further
Improve radiating efficiency.
Owing to have employed technique scheme, the beneficial effects of the utility model are:
The LED of the application, arranges heat sink on substrate, and the heat on substrate is quickly delivered to by the first heat conducting bar
On heat sink, and the heat on packaging part is quickly delivered on heat sink by the second heat conducting bar, heat sink and heat radiation thereon
Fin, is quickly scattered to outside by the heat on heat sink, so, it is achieved the high efficiency and heat radiation of LED, and can not only be further
Improve the service life of LED, but also the safety and reliability that its LED uses can be improved；Above-mentioned in the application
In scheme, due to the first heat conducting bar and the setting of the second heat conducting bar, on the one hand it is to improve on substrate heat on heat and packaging part
The transmission speed that amount is delivered on heat sink, on the other hand, also improves the reliability being connected between heat sink with substrate, enters one
Step the application reliability of structure.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model,
In figure: 1, substrate；2, LED chip；3, packaging part；4, heat sink；5, conducting-heat elements；6, the first heat conducting bar；7,
Two heat conducting bars；8, radiating fin；9, the 3rd heat conducting bar；10, insulation glue-line.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, new below in conjunction with this practicality
Accompanying drawing in type embodiment, is clearly and completely described the technical scheme in this utility model embodiment, it is clear that retouched
The embodiment stated is a part of embodiment of this utility model rather than whole embodiments, based on the enforcement in this utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into
The scope of this utility model protection.
Embodiment 1, as shown in Figure 1:
A kind of LED with high efficiency and heat radiation substrate, including substrate 1 and the LED chip 2 that is arranged on described substrate 1,
It is additionally provided with on described substrate 1 and described LED chip 2 is encapsulated in interior packaging part 3, described substrate 1 deviates from described LED chip
The side of 2 is provided with thermal component, and described thermal component includes the heat sink 4 being fitted on described substrate 1, described heat sink 4
It is provided with some conducting-heat elements 5 towards the side of described substrate 1, is spaced apart between described conducting-heat elements 5, described conducting-heat elements
5 include the first heat conducting bar 6 and the second heat conducting bar 7, and described first heat conducting bar 6 extend in described substrate 1, described second heat conducting bar
7 pass described substrate 1, and extend in described packaging part 3, and described second heat conducting bar 7 staggers with described LED chip 2, described
Heat sink 4 deviates from the side of described substrate 1 and is additionally provided with some radiating fins 8, is spaced apart between described radiating fin 8.
The LED of the application, arranges heat sink 4 on substrate 1, and the heat on substrate 1 is quickly passed by the first heat conducting bar 6
Be delivered on heat sink 4, and the heat on packaging part 3 be quickly delivered on heat sink 4 by the second heat conducting bar 7, heat sink 4 and
On radiating fin 8, the heat on heat sink 4 is quickly scattered to outside, so, it is achieved the high efficiency and heat radiation of LED, can not only
The enough service life further improving LED, but also the safety and reliability that its LED uses can be improved；At this
In the such scheme of application, due to the first heat conducting bar 6 and setting of the second heat conducting bar 7, it is on the one hand to improve heat on substrate 1
It is delivered to the transmission speed on heat sink 4 with heat on packaging part 3, on the other hand, also improves between heat sink 4 and substrate 1
The reliability connected, further the application reliability of structure.
Preferably, described conducting-heat elements 5 also includes that the 3rd heat conducting bar 9, described 3rd heat conducting bar 9 pass described substrate 1, and
It is fitted in the back side of described LED chip 2.By arranging the 3rd heat conducting bar 9, it is possible to make the heat in LED chip 2 lead by the 3rd
Hot rod 9 is quickly delivered on heat sink 4 and radiating fin 8, further improves the service life of the application LED, peace
Full property and reliability.
Preferably, described first heat conducting bar the 6, second heat conducting bar 7 and the 3rd heat conducting bar 9 are prism-shaped.
Preferably, insulation glue-line 10 it is provided with between described 3rd heat conducting bar 9 and described LED chip 2.On the one hand the is made
Connection between three heat conducting bars 9 and LED chip 2 is the tightst, on the other hand also makes between the 3rd heat conducting bar 9 and LED chip 2 exhausted
Edge, it is to avoid be short-circuited between LED chip 2 and exterior components, further improves the reliable of the application LED use
Property.
Preferably, described heat sink the 4, first heat conducting bar the 6, second heat conducting bar the 7, the 3rd heat conducting bar 9 and radiating fin 8 are gold
Belong to material to prepare.Metal material has good heat-conductive characteristic and heat dispersion.
Preferably, described heat sink the 4, first heat conducting bar the 6, second heat conducting bar the 7, the 3rd heat conducting bar 9 and radiating fin 8 are one
Body formula structure.Further improve the transmission efficiency of heat between each part.
Preferably, it is parallel to each other between described radiating fin 8.Make to be formed between radiating fin 8 air flow channel, further
Raising radiating efficiency.
The above, detailed description of the invention the most of the present utility model, but protection domain of the present utility model does not limit to
In this, any those familiar with the art, in the technical scope that this utility model discloses, can readily occur in change
Or replace, all should contain within protection domain of the present utility model.Therefore, protection domain of the present utility model should be wanted with right
The protection domain asked is as the criterion.
Claims (7)
1. a LED with high efficiency and heat radiation substrate, it is characterised in that: include substrate and LED on the substrate is set
Chip, is additionally provided with on the substrate and described LED chip is encapsulated in interior packaging part, described substrate deviates from described LED
The side of chip is provided with thermal component, and described thermal component includes the heat sink fitted on the substrate, described heat sink
It is provided with some conducting-heat elements towards the side of described substrate, is spaced apart between described conducting-heat elements, described conducting-heat elements bag
Including the first heat conducting bar and the second heat conducting bar, described first heat conducting bar extend in described substrate, and described second heat conducting bar passes institute
Stating substrate, and extend in described packaging part, described second heat conducting bar staggers with described LED chip, deviates from described heat sink
The side of described substrate is additionally provided with some radiating fins, is spaced apart between described radiating fin.
There is the LED of high efficiency and heat radiation substrate the most as claimed in claim 1, it is characterised in that: described conducting-heat elements also includes
3rd heat conducting bar, described 3rd heat conducting bar passes described substrate, and is fitted in the back side of described LED chip.
There is the LED of high efficiency and heat radiation substrate the most as claimed in claim 2, it is characterised in that: described first heat conducting bar, second
Heat conducting bar and the 3rd heat conducting bar are prism-shaped.
There is the LED of high efficiency and heat radiation substrate the most as claimed in claim 3, it is characterised in that: described 3rd heat conducting bar and institute
State and between LED chip, be provided with insulation glue-line.
There is the LED of high efficiency and heat radiation substrate the most as claimed in claim 4, it is characterised in that: described heat sink, the first heat conduction
Bar, the second heat conducting bar, the 3rd heat conducting bar and radiating fin are that metal material prepares.
There is the LED of high efficiency and heat radiation substrate the most as claimed in claim 5, it is characterised in that: described heat sink, the first heat conduction
Bar, the second heat conducting bar, the 3rd heat conducting bar and radiating fin are integral type structure.
There is the LED of high efficiency and heat radiation substrate the most as claimed in claim 6, it is characterised in that: phase between described radiating fin
The most parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620783648.5U CN205752253U (en) | 2016-07-01 | 2016-07-01 | A kind of LED with high efficiency and heat radiation substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620783648.5U CN205752253U (en) | 2016-07-01 | 2016-07-01 | A kind of LED with high efficiency and heat radiation substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752253U true CN205752253U (en) | 2016-11-30 |
Family
ID=57375777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620783648.5U Expired - Fee Related CN205752253U (en) | 2016-07-01 | 2016-07-01 | A kind of LED with high efficiency and heat radiation substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752253U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107565421A (en) * | 2017-08-24 | 2018-01-09 | 义乌市华辉输配电设备有限公司 | A kind of electrical energy metering tank |
| CN108685409A (en) * | 2018-06-01 | 2018-10-23 | 深圳市拾汇科技有限公司 | A kind of wall-mounted photo-frame that can adjust angle |
-
2016
- 2016-07-01 CN CN201620783648.5U patent/CN205752253U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107565421A (en) * | 2017-08-24 | 2018-01-09 | 义乌市华辉输配电设备有限公司 | A kind of electrical energy metering tank |
| CN108685409A (en) * | 2018-06-01 | 2018-10-23 | 深圳市拾汇科技有限公司 | A kind of wall-mounted photo-frame that can adjust angle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20170701 |