CN208093590U - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
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- CN208093590U CN208093590U CN201721624940.3U CN201721624940U CN208093590U CN 208093590 U CN208093590 U CN 208093590U CN 201721624940 U CN201721624940 U CN 201721624940U CN 208093590 U CN208093590 U CN 208093590U
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- silica gel
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- lens
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Abstract
The utility model is related to a kind of LED encapsulation structure, which includes：LED bottom plates (11)；First lens jacket (12) is set on the LED bottom plates (11)；First layer of silica gel (13) is set on the LED bottom plates (11) and first lens jacket (12)；Second lens jacket (14) is set on first layer of silica gel (13)；Second layer of silica gel (15) is set on first layer of silica gel (13) and second lens jacket (14).LED encapsulation structure provided by the utility model is on light source using the first lens jacket, the multilayered structure of the first layer of silica gel, the second lens jacket and the second layer of silica gel；Using the different feature of variety classes silica gel refractive index in multilayered structure, lens are formed in silica gel, are improved LED chip and are shone the problem of disperseing, the light that light source is sent out is enable more to concentrate；It can effectively inhibit to be totally reflected and ensure that the light of LED chip can more shine out through encapsulating material.
Description
Technical field
The utility model belongs to LED encapsulation technologies field, more particularly to a kind of LED encapsulation structure.
Background technology
Last century Mo, the breakthrough using GaN base material as the Group III-V compound semiconductor of representative in blue chip field,
Bring an illumination revolution, the mark of this revolution be with large-power light-emitting diodes (Light-Emitting Diode,
LED it is) semiconductor illumination technique (Solid State Lighting, SSL) of light source.
LED has the characteristics that long lifespan, luminous efficiency are high, colour rendering is good, safe and reliable, rich in color and easy to maintain.
In current environmental pollution getting worse, under the background of climate warming and energy growing tension, grown up based on great power LED
Semiconductor illumination technique has been acknowledged as 21 century one of high-tech sector most with prospects.This is shone from coal gas
After bright, incandescent lamp and fluorescent lamp, the mankind illuminate a quantum leap in history, improve the lighting quality of human lives rapidly.
Now, LED mostly uses GaN base blue light wick the mode of yellow fluorescence is added to generate white light, to realize illumination, this side
Formula has following problem.
1, currently, chip majority is packaged on thin heat dissipation metal substrate, due to heat dissipation metal substrate is relatively thin, thermal capacitance compared with
It is small, and be easily deformed, cause it to contact defective tightness with cooling fin bottom surface and influence heat dissipation effect.
2, since the light that LED light source is sent out generally is distributed in divergence expression, i.e. lambertian distribution, this causes light source brightness of illumination not
It is enough to concentrate, it generally requires and carries out secondary reshaping by outer lens, to adapt to the lighting demand of specific occasion, which increase productions
Cost.
Utility model content
In order to improve the working performance of LED chip, the utility model provides a kind of LED encapsulation structure；The utility model
Technical problems to be solved are achieved through the following technical solutions：
The embodiments of the present invention provide a kind of LED encapsulation structure, including：
LED bottom plates 11；
First lens jacket 12 is set on the LED bottom plates 11；
First layer of silica gel 13 is set on the LED bottom plates 11 and first lens jacket 12；
Second lens jacket 14 is set in first layer of silica gel 13；
Second layer of silica gel 15 is set in first layer of silica gel 13 and second lens jacket 14.
In one embodiment of the utility model, the LED bottom plates 11 include heat-radiating substrate and LED chips, wherein
The LED chip is set on the heat-radiating substrate.
In one embodiment of the utility model, the heat-radiating substrate is provided with several circular holes；Wherein, the circular hole edge
The heat-radiating substrate width direction and parallel with the heat-radiating substrate plane.
In one embodiment of the utility model, between a diameter of 0.2-0.4 millimeter of the circular hole, circular hole between
Away from being 0.5-10 millimeters.
In one embodiment of the utility model, first lens jacket 12 and second lens jacket 14 include
The equally distributed silica gel hemisphere of several rectangular or diamond shapes.
In one embodiment of the utility model, second layer of silica gel 15 is covering first layer of silica gel 13 and institute
State the hemisphere layer of silica gel of the second lens jacket 14.
Compared with prior art, the utility model has the advantages that：
1, LED encapsulation structure provided by the utility model, it is several in intensity on heat-radiating substrate by the way of intermediate throughholes
While variation, heat-radiating substrate cost is reduced, meanwhile, increase the channel of air circulation, using the thermal convection current of air,
Increase heat dissipation effect.
3, silica gel hemisphere provided by the utility model can be with rectangular evenly distributed or diamond array.It can ensure light
The light in source is uniformly distributed in concentration zones.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
The attached drawing used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the utility model
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Through the following detailed description with reference to the accompanying drawings, the other aspects and feature of the utility model become apparent.But it answers
When knowing, which is only the purpose design explained, not as the restriction of the scope of the utility model, this is because its
It should refer to appended claims.It should also be noted that unless otherwise noted, it is not necessary to which scale attached drawing, they are only
Try hard to conceptually illustrate structure and flow described herein.
Fig. 1 is the LED encapsulation structure schematic diagram that one embodiment of the utility model provides；
Fig. 2 is the heat-radiating substrate schematic diagram for the LED encapsulation that one embodiment of the utility model provides；
Fig. 3 is the LED encapsulation method flow chart that another embodiment of the utility model provides；
Fig. 4 is three layers of lens LED encapsulation structure schematic diagram that the utility model another embodiment provides；
Fig. 5 is four layers of lens LED encapsulation structure schematic diagram that another embodiment of the utility model provides.
Specific implementation mode
Further detailed description, but the embodiment party of the utility model are done to the utility model with reference to specific embodiment
Formula is without being limited thereto.
Embodiment one
Fig. 1 is referred to, Fig. 1 is the LED encapsulation structure schematic diagram that one embodiment of the utility model provides, including：
LED bottom plates 11；
First lens jacket 12 is set on the LED bottom plates 11；
First layer of silica gel 13 is set on the LED bottom plates 11 and first lens jacket 12；
Second lens jacket 14 is set in first layer of silica gel 13；
Second layer of silica gel 15 is set in first layer of silica gel 13 and second lens jacket 14.
Specifically, the LED bottom plates 11 include heat-radiating substrate and LED chip, wherein the LED chips are set to described
On heat-radiating substrate.
Further, Fig. 2 is referred to, Fig. 2 is the heat-radiating substrate signal for the LED encapsulation that one embodiment of the utility model provides
Figure, the heat-radiating substrate are provided with several circular holes；Wherein, the circular hole along the heat-radiating substrate width direction and with the heat dissipation
Base plan is parallel.
Preferably, the spacing between a diameter of 0.2-0.4 millimeter of the circular hole, circular hole is 0.5-10 millimeters.
Specifically, the first layer of silica gel 13, the refractive index of the first lens jacket 12, the second layer of silica gel 15 and the second lens jacket 14
It successively increases；It can effectively inhibit to be totally reflected and ensure that the light of LED chip can more shine out through encapsulating material.
Preferably, first lens jacket 12 and second lens jacket 14 include that several rectangular or diamond shapes are uniform
The silica gel hemisphere of distribution.
Specifically, second layer of silica gel 15 is to cover the hemisphere of first layer of silica gel 13 and second lens jacket 14
Layer of silica gel.
Further, the first lens jacket 12 is considered as " planoconvex lens " in the LED encapsulation structure, and focal length is preferably
Meet formula 1.：
R1/(n2-n1)；------------①
Wherein, n1For the refractive index of silica gel in the first layer of silica gel 13, n2To form the silica gel material of first lens jacket 12
Refractive index, R1For the radius of silica-gel sphere in the first lens jacket 12；
2. second lens jacket, 14 focal length preferably meets formula：
R2/(n4-n3)；------------②
Wherein, n3For the refractive index of silica gel in the second layer of silica gel 15, n4To form the silica gel material of second lens jacket 14
Refractive index, R2For the radius of silica-gel sphere in the second lens jacket 14.It could ensure the light emission rate highest of LED well in this way.
In addition, being experimentally confirmed, the other parameters of the optimal LED of light emission rate further include：
The thickness H of first layer of silica gel 131Formula should be met 3.：
R1/2+2×R1/(n2-n1)≥H1≥R1/2；----------------③
Wherein, H1For the thickness of the first layer of silica gel 13；
4. the thickness of second layer of silica gel 15 should meet formula：
R2/2+2×R2/(n4-n3)≥H2≥R2/2；----------------④
Wherein, H2For the thickness of the second layer of silica gel 15.Certainly, the thickness of the first layer of silica gel 13 and the second layer of silica gel 15 is not yet
Can be too thick, it is too thick also to influence its light emission rate.
Preferably, R1=R2=R, and R is preferably 5 μm~100 μm, and ball spacing A is preferably 5 μm~100 μm.LED bases
The width of plate 11 is preferably：W=5mil (1mil=1/45mm), thickness D are preferably 90 μm~140 μm.
Wherein, the lens jacket and layer of silica gel of multilayered structure are used on light source；Utilize variety classes silica gel in multilayered structure
The different feature of refractive index forms lens in silica gel, improves LED chip and shines the problem of disperseing, the luminous energy for making light source send out
It is enough more to concentrate.
LED encapsulation structure provided in this embodiment, using on heat-radiating substrate use intermediate throughholes by the way of, solve due to
Heat dissipation metal substrate is relatively thin, thermal capacitance is smaller, and is easily deformed, it is caused to contact defective tightness with cooling fin bottom surface and influence to dissipate
The problem of thermal effect；Meanwhile while intensity has almost no change, heat-radiating substrate cost is reduced, air circulation is increased
Channel increases heat dissipation effect using the thermal convection current of air.
Embodiment two
Fig. 3 is please referred to, Fig. 3 is the LED encapsulation method flow chart that another embodiment of the utility model provides, and the present embodiment exists
On the basis of above-described embodiment, the packaging method of the LED encapsulation structure of the utility model is described in detail as follows.Specifically
Ground includes the following steps：
S21, LED chip is chosen；
S22, heat-radiating substrate and holder are chosen；
S23, the LED chip is welded in the heat-radiating substrate；
S24, in the LED chip successively crossbar system for multiple lens regions and layer of silica gel；
S25, at a temperature of 100-150 DEG C, baking 4-12 hour is to complete LED encapsulation.
Wherein, the refractive index of layer of silica gel successively increases in the multilayered structure of multiple lens regions and layer of silica gel, can be effective
Inhibit the total reflection of light, the refractive index of lens jacket to be more than the refractive index of its adjacent layer of silica gel, it is ensured that LED chip can
More shine out through encapsulating material.
Specifically, S22 may include：
S221, holder and heat-radiating substrate are chosen；
S222, the holder and the heat-radiating substrate are cleaned；
S223, the holder and the heat-radiating substrate are toasted and done.
Preferably, the heat-radiating substrate uses round-meshed iron material；
Wherein, by the way of intermediate tiltedly circular groove, while intensity has almost no change, reduce heat-radiating substrate at
This；The channel for increasing air circulation simultaneously is promoted the thermal convection current rate of air using stack effect, increases heat dissipation effect.
Specifically, S23 may include：
S231, printing solder and the die bond for examining the solder：
S232, using solder reflow process, the LED chip is welded in the heat-radiating substrate, and by the heat dissipation base
Plate is installed on the holder.
Specifically, S24 may include：
S241, the first lens jacket is prepared in the LED chip；
S242, the first silica gel the first layer of silica gel of formation is applied on first lens jacket；
S243, the second lens jacket is prepared in first layer of silica gel；
S244, the second silica gel the second layer of silica gel of formation is applied on second lens jacket.
Further, can also include after S244：
S245, the third lens layer is prepared in second layer of silica gel；
S246, third silica gel formation third layer of silica gel is applied on the third lens layer.
Preferably, can also include after S246：
S247, the 4th lens jacket is prepared in the third layer of silica gel；
S248, the 4th silica gel the 4th layer of silica gel of formation is applied on the 4th lens jacket.
Preferably, S241 may include：
S2411, the 5th silica gel is applied in the LED chip；
S2412, several first hemispherical lens are prepared on the 5th silica gel using hemispherical；
Remove mold after S2413, band mold baking and forms first lens jacket.
Preferably, S242 may include：
S2421, first silica gel is applied on first lens jacket；
First layer of silica gel is formed after S2422, baking；
Further, S243 may include：
S2431, the 6th silica gel is applied in the LED chip；
S2432, several second hemispherical lens are prepared on the 6th silica gel using hemispherical；
Remove mold after S2433, band mold baking and forms second lens jacket.
Preferably, when second layer of silica gel is the outermost layer of LED encapsulation structure, S244 may include：
S2441, second silica gel is applied on second lens jacket；
S2442, outer layer hemisphere is formed on second silica gel using hemispherical；
Remove mold after S2443, band mold baking and forms second layer of silica gel.
Specifically, further include after S25：Packaging is detected to the LED encapsulation structure.
Embodiment three
Further, Fig. 4 is please referred to, Fig. 4 is three layers of lens LED encapsulation knots that the utility model another embodiment provides
Structure schematic diagram, specifically, LED encapsulation structure includes：Include LED bottom plates 31, the first lens jacket 32, first successively from lower to upper
Layer of silica gel 33, the second lens jacket 34, the second layer of silica gel 35, the third lens layer 36 and third layer of silica gel 37.
Preferably, LED bottom plates 31 include heat-radiating substrate and the LED chip being set on heat-radiating substrate.
Further, the first lens jacket 32, the second lens jacket 34 and the third lens layer 36 include several rectangular or water chestnuts
The equally distributed silica gel hemisphere of shape.
Example IV
Further, Fig. 5 is please referred to, Fig. 5 is four layers of lens LED encapsulation knots that another embodiment of the utility model provides
Structure schematic diagram, specifically, LED encapsulation structure includes：Include LED bottom plates 41, the first lens jacket 42, first successively from lower to upper
Layer of silica gel 43, the second lens jacket 44, the second layer of silica gel 45, the third lens layer 46, third layer of silica gel 47, the 4th lens jacket 48 and
4th layer of silica gel 49.
Preferably, LED bottom plates 41 include heat-radiating substrate and the LED chip being set on heat-radiating substrate.
Further, the first lens jacket 42, the second lens jacket 44, the third lens layer 46 and the 4th lens jacket 48 include several
The equally distributed silica gel hemisphere of a rectangular or diamond shape.
LED encapsulation structure provided in this embodiment, using the multilayer knot that multilayer lens jacket and multilayer layer of silica gel are arranged in a crossed manner
Structure；The refractive index of layer of silica gel successively increases in multilayered structure, and the refractive index of each lens jacket is more than the folding of its adjacent layer of silica gel
Rate is penetrated, improves LED chip and shines the problem of disperseing, the light that light source is sent out is enable more to concentrate；It is also ensured that LED chip
It can more shine out through encapsulating material.
In conclusion specific case used herein is expounded the principles of the present invention and embodiment,
The explanation of above example is only intended to help to understand the utility model and its core concept；Meanwhile for the general of this field
Technical staff, according to the thought of the utility model, there will be changes in the specific implementation manner and application range, to sum up institute
It states, the content of the present specification should not be construed as a limitation of the present invention, and the scope of protection of the utility model should be with appended power
Subject to profit requires.
Claims (3)
1. a kind of LED encapsulation structure, which is characterized in that including：
LED bottom plates (11)；
First lens jacket (12) is set on the LED bottom plates (11)；
First layer of silica gel (13) is set on the LED bottom plates (11) and first lens jacket (12)；
Second lens jacket (14) is set on first layer of silica gel (13)；
Second layer of silica gel (15) is set on first layer of silica gel (13) and second lens jacket (14)；
Wherein, the LED bottom plates (11) include heat-radiating substrate and LED chip, and the LED chip is set to the heat-radiating substrate
On；The heat-radiating substrate is provided with several circular holes；The circular hole along the heat-radiating substrate width direction and with the heat-radiating substrate
Plane is parallel；Spacing between a diameter of 0.2-0.4 millimeter of the circular hole, circular hole is 0.5-10 millimeters.
2. encapsulating structure according to claim 1, which is characterized in that first lens jacket (12) and second lens
Layer (14) includes the equally distributed silica gel hemisphere of several rectangular or diamond shapes.
3. encapsulating structure according to claim 1, which is characterized in that second layer of silica gel (15) is covering described first
The hemisphere layer of silica gel of layer of silica gel (13) and second lens jacket (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721624940.3U CN208093590U (en) | 2017-11-28 | 2017-11-28 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721624940.3U CN208093590U (en) | 2017-11-28 | 2017-11-28 | LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208093590U true CN208093590U (en) | 2018-11-13 |
Family
ID=64067843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721624940.3U Active CN208093590U (en) | 2017-11-28 | 2017-11-28 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208093590U (en) |
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2017
- 2017-11-28 CN CN201721624940.3U patent/CN208093590U/en active Active
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