CN208078013U - LED support and its lamp bead - Google Patents

Abstract

The utility model discloses a kind of LED support and its lamp beads, one end of the conductive pin of the holder is axially extending close to the side of the LED chip along the insulating element, and extend towards chip rest area bending with the comparable position of height at the top of the thermal column, for being conductively connected in the electrode of the LED chip；The other end of the conductive pin is piercing in the insulating element outwardly along the direction of the vertical insulating element axis, for accessing external circuit.

Description

LED support and its lamp bead

Technical field

The utility model is related to LED support and LED lamp beads.

Background technology

LED has been widely used in lighting area, and the conducting wire solder joint functional areas of now widely used LED support and core The distance of piece setting area is long, causes in bonding process, also longer using gold thread, in this way during lens packages gold thread by Stress it is larger, lamp bead generates internal temperature raising when in use, and the silica gel of the inside also will produce effect of expanding with heat and contract with cold, and gold thread is got over The long risk for breaking gold thread is bigger.On the other hand, gold thread is long also wastes material, cost of idleness.

Utility model content

The utility model is to solve above-mentioned gold thread long the technical issues of being easy to break, and is arrived using by the setting of solder joint functional areas Height identical as chip setting area shortens gold thread length so as to shorten solder joint functional areas to the distance of chip setting area, reduces The risk that gold thread is pulled off.

To realize above-mentioned technique effect, the utility model adopts the following technical solution：

LED support, which is characterized in that including：Thermal column, insulating element and conductive pin；

In a ring, the thermal column is arranged on the insulating element insulating element, the top quilt of the thermal column Chip rest area is set as fixing LED chip；

One end of the conductive pin is axially extending close to the side of the LED chip along the insulating element, and with The comparable position of height at the top of the thermal column extends towards chip rest area bending, for being conductively connected in the LED The electrode of chip；The other end of the conductive pin is piercing in the insulation outwardly along the direction of the vertical insulating element axis Component, for accessing external circuit.

More preferably, the LED support includes also lens setting area, for fixing lens.

More preferably, the thermal column is red metal column.

More preferably, the insulating element is made of polyphthalamide (PPA).

On the other hand, the utility model also provides a kind of LED lamp bead, which is characterized in that including LED chip, fluorescent powder Layer, lens and LED support, the LED support are previously described LED support.

More preferably, the LED chip is conductively connected by gold thread and the conductive pin.

On the other hand, the LED chip is flip-chip, is directly conductively connected with the conductive pin.

The advantageous effect that the utility model is reached is prolonged to the chip rest area by the way that the conductive pin is arranged It stretches, shortens the distance between chip and pin, so as to shorten gold thread length, materials cost is reduced, when reducing lid lamp bead lens The risk of gold thread is overwhelmed or broken because gold thread is long.On the other hand, lamp bead using when will produce heat, due to filling inside lamp bead Be silica gel, silica gel has effect of expanding with heat and contract with cold, so the heat that lamp bead generates when in use can be such that the internal stress of lamp bead increases Greatly, gold thread is caused to there is the risk for being pulled off open circuit, the utility model shortens gold thread length, used to reduce lamp bead When the risk that is pulled off of gold thread, be conducive to improve lamp bead and use yield.Furthermore because conductive pin is propped up close to chip one end distance Frame inner wall is farther, therefore also reduces the anti-difficulty beaten of gold thread so that the inlet wire porcelain mouth of routing machine is not easy to encounter when beating gold thread Rack inner wall causes the damage of wire bonder porcelain mouth or holder.Supporting structure provided by the utility model is conducive to negative direction and beats gold Wire bonding line, another advantageous effect are：The LED support of the prior art can be sent out the chip inside lamp bead when using convex lens Luminous point optically focused amplifies, and gold thread line shadow inside lamp bead is presented；Gold thread can be reversely beaten using LED support provided by the utility model, The gold thread line shadow that optically focused is presented under the same terms weakens significantly, and light shape is more attractive.

Description of the drawings

The utility model is described further below in conjunction with the accompanying drawings：

Fig. 1 is the side cross sectional views for the LED lamp bead that the utility model is proposed.

Fig. 2 is the schematic top plan view for the LED lamp bead that the utility model is proposed.

Fig. 3 is the schematic side view that flip LED chips are fixed on the utility model LED support.

Fig. 4 is the schematic diagram that three chips are arranged in the utility model LED lamp bead.

Specific implementation mode

The embodiments of the present invention are described below in detail.

The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.

In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.

In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more, Unless otherwise specifically defined.

In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc. Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be machine Tool connects, and can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary two members Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this hair as the case may be Concrete meaning in bright.

In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower" It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of Fisrt feature level height is less than second feature.

Embodiment one, refering to what is shown in Fig. 1, LED lamp bead includes LED support, LED chip 9 and lens 8.LED support is by just Pole conductive pin 1, cathode conductive pin 5, insulating element 6 and thermal column 10 form.Wherein the insulating element 6 in a ring, It is made of insulation high-temperature-resistant material polyphthalamide (PPA).The thermal column 10 is made of red metal, is set in cylindrical type On insulating element 6, the top side of thermal column is arranged to chip rest area 3, for placing LED chip 9.Anode conductive pin 1 It is conductively connected in the anode of LED chip 9, cathode conductive pin 5 is conductively connected in the cathode of LED chip 9；Anode conductive pin 1 It is axially extending close to the side of the LED chip along the insulating element close to one end of the LED chip, and dissipated with described The comparable position of height at the top of plume extends towards chip rest area bending, so that the anode conductive pin 1 is described in The distance of LED chip is shorter；The other end of anode conductive pin 1 is radially piercing in the insulation along the insulating element Component, for accessing external circuit；Cathode conductive pin 5 is opposite to be symmetrically disposed on the insulation with the anode conductive pin 1 The other side in component axle center；The anode conductive pin 1 and cathode conductive pin 5 are arranged to solder joint close to LED chip one end Functional areas 2.The positive and negative anodes of the LED chip are connected with the anode conductive pin and cathode conductive pin respectively by gold thread 11 It connects.

As shown in Fig. 2, cradle top is integrally rounded, ecto-entad is once provided with lens setting area 7, insulation layer 4, weldering Point functional areas 2 and chip rest area 3；Wherein for fixing lens 8, LED chip 9 is fixed by crystal-bonding adhesive for lens setting area 7 In the chip rest area 3, insulation layer 4 is used to insulate the positive and negative anodes conductive pin and the chip setting area Isolation.LED chip 9 is conductively connected with solder joint functional areas 2 by gold thread.Since conductive pin height is arranged to and the chip 3 height of rest area is suitable, and conductive pin extends in identical elevation plane to 3 center of chip rest area after bending, I.e. solder joint functional areas 2 are closer to LED, therefore required gold thread is shorter, can reduce the stress that gold thread is subject to,

Embodiment two is directly led with the conductive pin as shown in figure 3, the LED chip in embodiment one is flip-chip Electrical connection.

Embodiment three is illustrated in figure 4 the case where three chips are arranged in the LED lamp bead.First chip 12 is indigo plant Optical chip, the second chip 13 are red light chips, and third chip 14 is green light chip.Correspondingly, 6 solder joint functional areas are set, point Not Wei the first solder joint functional areas to the 6th solder joint functional areas, the first solder joint functional areas and first chip 12 are just Pole connects, and the second solder joint functional areas connect with the cathode of a chip 12, the third solder joint functional areas and The anode connection of second chip 13, the 4th solder joint functional areas are connect with the cathode of second chip 13, The anode of the 5th solder joint functional areas and the third chip connect, the 6th solder joint functional areas and described the The cathode of three chips connects；6 conductive pins of setting, respectively the first conductive pin to the 6th conductive pin, described first Conductive pin is conductively connected with the first solder joint functional areas to the 6th solder joint functional areas respectively to the 6th conductive pin one end, The other end extends to outside the insulating element, to access external circuit.

Also can be as needed, plurality of LEDs chip is set in chip rest area, according to set LED chip reasonable quantity The quantity of conductive pin and solder joint functional areas is set, to realize multi-channel control and glory illuminating effect.

In the description of this specification, reference term " embodiment ", " some embodiments ", " an implementation The description of example ", " some embodiments ", " example ", " specific example " or " some examples " etc. means to combine the embodiment or example Particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the utility model.At this In specification, schematic expression of the above terms may not refer to the same embodiment or example.Moreover, description is specific Feature, structure, material or feature can be combined in any suitable manner in any one or more of the embodiments or examples.

The above content is combine specific embodiment further detailed description of the utility model, and it cannot be said that The specific implementation of the utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field For, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made.

Claims (7)

1.LED holders, which is characterized in that including：Thermal column, insulating element and conductive pin；

In a ring, the thermal column is arranged on the insulating element insulating element, is set at the top of the thermal column It is that chip rest area is used to fix LED chip；

One end of the conductive pin is axially extending close to the side of the LED chip along the insulating element, and with it is described The comparable position of height at the top of thermal column extends towards chip rest area bending, for being conductively connected in the LED chip Electrode；The other end of the conductive pin is piercing in the insulation division outwardly along the direction of the vertical insulating element axis Part, for accessing external circuit.

2. LED support according to claim 1, which is characterized in that include also lens setting area, for fixing lens.

3. LED support according to claim 2, which is characterized in that the thermal column is red metal column.

4. according to claim 1-3 any one of them LED supports, which is characterized in that the insulating element is by poly- O-phthalic Amide PPA is made.

5.LED lamp beads, which is characterized in that including LED chip, phosphor powder layer, lens and LED support, the LED support is right It is required that 1-4 any one of them LED supports.

6. LED lamp bead according to claim 5, which is characterized in that the LED chip is drawn by gold thread and the conduction Foot is conductively connected.

7. LED lamp bead according to claim 5, which is characterized in that the LED chip be flip-chip, directly with it is described Conductive pin is conductively connected.