CN208068673U - A kind of cavity structure of semiconductor packaging mold to lead frame vacuum suction - Google Patents
A kind of cavity structure of semiconductor packaging mold to lead frame vacuum suction Download PDFInfo
- Publication number
- CN208068673U CN208068673U CN201721640383.4U CN201721640383U CN208068673U CN 208068673 U CN208068673 U CN 208068673U CN 201721640383 U CN201721640383 U CN 201721640383U CN 208068673 U CN208068673 U CN 208068673U
- Authority
- CN
- China
- Prior art keywords
- vacuum
- adsorption
- lead frame
- cavity
- semiconductor packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 238000001179 sorption measurement Methods 0.000 claims abstract description 62
- 238000010079 rubber tapping Methods 0.000 claims abstract description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of cavity structure of the semiconductor packaging mold to lead frame vacuum suction, cavity upper surface intermediate region is vacuum adsorption table, multiple adsorption zones are provided with according to chip packaging unit position on lead frame in the vacuum adsorption table, and multiple nonpenetrating adsorption holes are distributed in each adsorption zone, in the vacuum adsorption table there is vacuum passage to be connected to multiple adsorption holes, and there is vacuum passage an external tapping to be connected to cavity side, cavity upper surface circumferentially-spaced is provided with multiple vacuum stomatas, and vacuum stomata bottom is interconnected, and vacuum passage is connected to by air flue, one long side of the cavity upper surface is equipped at intervals with a plurality of vacuum air drain being mutually parallel, the vacuum air drain is half slot, and outer end is connected to cavity side.
Description
Technical field
The utility model is related to a kind of semiconductor packaging mold more particularly to a kind of partly leading to lead frame vacuum suction
The cavity structure of body encapsulating mould.
Background technology
With the rapid development of electronics industry, highdensity QFN/DFN classes surface mount product is more and more widely used.
Corresponding semiconductor packaging mold is the important composition in its production process.Since the operating temperature of semiconductor packaging mold is higher
（170 ~ 200 degree）, lead frame is put into the influence buckling deformation frequent occurrence due to temperature after mold, to influence product gold
Wire shaped and size, and in clamping process, the gold thread of downlead frame warpage position is easy to touch die cavity, to cause gold
Line collapse-deformation, the problem of influencing product yield.
In view of the above problems, traditional moulds are provided with vacuum suction structure in mould, come mostly in the form of trepanning or groove
It realizes, but since the structure of QFN/DFN class lead frames causes these vacuum points that can only be arranged in frame surrounding position.So
The problem of frame centre position still suffers from buckling deformation, and surrounding due to the groove of vacuum suction and the size in hole it is larger,
Lead to that the problem in excessive glue to product pin easily occurs between lead frame and the film at its back side.
Utility model content
The purpose of the utility model is to overcome the defects of the prior art, provide a kind of to the half of lead frame vacuum suction
The cavity structure of conductor encapsulating mould, not only realizes the absorption to lead frame surrounding, or under to each chip packaging unit
Center absorption, prevent from carrying out collapse-deformation problem caused by buckling deformation.
To achieve the above object, the utility model proposes following technical solutions：It is a kind of to the half of lead frame vacuum suction
The cavity structure of conductor encapsulating mould, cavity upper surface intermediate region are vacuum adsorption table, basis in the vacuum adsorption table
Chip packaging unit position is provided with multiple adsorption zones on lead frame, and multiple nonpenetrating suctions are distributed in each adsorption zone
Attached hole, the vacuum adsorption table is interior, and there is vacuum passage to be connected to multiple adsorption holes, and there is vacuum passage an external tapping to be connected to
Cavity side, cavity upper surface circumferentially-spaced is provided with multiple vacuum stomatas, and vacuum stomata bottom is interconnected, and leads to
Air flue connection vacuum passage is crossed, a long side of the cavity upper surface is equipped at intervals with a plurality of vacuum air drain being mutually parallel, should
Vacuum air drain is half slot, and outer end is connected to cavity side, and ventilative steel is filled in the adsorption hole.
Preferably, the adsorption hole in the adsorption zone is arranged at equal intervals in surrounding, and center also has that there are one adsorption holes.
Preferably, the adsorption hole in multiple adsorption zones is connected to by the vacuum passage that transverse and longitudinal connects.
Preferably, the hardness of the ventilative steel is HRC50.
Preferably, the vacuum air drain between each two adsorption zone is to lengthen air drain, extend between two adsorption zones,
And end has multiple parallel lateral air drains, increases adsorption plane.
Compared with prior art, a kind of semiconductor packaging mold to lead frame vacuum suction that the utility model discloses
Cavity structure, have following usefulness：
Special absorption platform is set in cavity intermediate region, according to the position of chip packaging unit on the absorption platform
Setting adsorption hole also adsorbs central area other than being adsorbed to surrounding, while coordinating lead frame entirety surrounding
Vacuum suction, it can be ensured that entire lead frame is bonded mold cavity surface completely.
Vacuum passage is arranged inside cavity to be connected to adsorption hole, and vacuum passage is interconnected, it can be ensured that each to inhale
The adsorption capacity in attached hole is consistent, and the vacuum stomata bottom of surrounding is interconnected, then is connected to vacuum passage, it can be ensured that surrounding
Vacuum stomata adsorption capacity is consistent, realizes that there is no certain point or a certain region adsorption capacity are big to the Planar adsorbent of lead frame
And there is the case where warpage.
Filling is breathed freely steel in adsorption hole, and the aperture for steel of breathing freely is less than 0.007 μm, and the material that its precision is HRC50, can be with
Prevent material hardness it is not high caused by collapse-deformation, while lead frame will not be caused to be carried on the back with it because of adsorption hole aperture is excessive
Excessive glue between the film in face.
The vacuum air drain of cavity side setting, can form vacuum after molding, be placed in the cavity vacuumized in mold
When, the vacuum air drain of side carries out vacuumize process from side, and the vacuum air drain between each two adsorption zone is to lengthen air drain,
It extends between two adsorption zones, increases adsorption plane.
Description of the drawings
Fig. 1 is the cavity structure figure of the utility model；
Fig. 2 is the utility model cavity internal perspective view；
Fig. 3 is the side sectional view after the utility model molding.
Specific implementation mode
Below in conjunction with the attached drawing of the utility model, the technical solution of the utility model embodiment is carried out clear, complete
Description.
As shown in Fig. 1 ~ 3, a kind of revealed semiconductor packaging mold to lead frame vacuum suction of the utility model
Cavity structure, which is vacuum adsorption table 1, according to chip on lead frame in the vacuum adsorption table
Encapsulation unit position is provided with multiple adsorption zones, and multiple nonpenetrating adsorption holes 2 are distributed in each adsorption zone, the adsorption hole root
It is spacedly distributed in surrounding according to chip packaging unit shape, and is also provided with there are one adsorption hole in center, realize surrounding
It is adsorbed simultaneously with centre, filled with ventilative steel 11, hardness HRC50 in adsorption hole, and the air vent aperture of ventilative steel surface is not
More than 0.007 μm, from the problem of spilling without glue, the adsorption hole bottom is logical by the vacuum being built in cavity
Road 3 is connected to, and vacuum passage connects for transverse and longitudinal, which there is an external tapping 4 to be connected to cavity side, is realized and outside
Vaccum-pumping equipment connects, and vacuum is formed in vacuum passage, to realize the vacuum suction of each adsorption hole.
Cavity upper surface surrounding is also equipped with multiple vacuum stomatas 5 at equal intervals, and vacuum stomata bottom is logical by first
Road 6 is connected to, and is connected to by air flue 7 between first passage and vacuum passage so that it is vacuumized simultaneously in first passage, these
Vacuum stomata realizes the absorption to lead frame surrounding.
One long side of the cavity upper surface is equipped at intervals with a plurality of vacuum air drain 8 being mutually parallel, which is
Half slot, and outer end is connected to cavity side, the vacuum air drain between each two adsorption zone is to lengthen air drain 9, extends to two
Between a adsorption zone, and end has multiple parallel lateral air drains 10, increases adsorption plane.
A kind of cavity structure of the revealed semiconductor packaging mold to lead frame vacuum suction of the utility model,
Operation principle is that lead frame 12 is placed on cavity and is molded, and connecting vaccum-pumping equipment by the external tapping of side carries out
It vacuumizes, due to the presence of bottom adsorption hole and vacuum stomata, realizes the vacuumizing and adsorbing to lead frame surrounding and bottom,
It is placed in operating cavity in mold clamping, the side vacuum air drain after molding forms similar pumping pore structure, is carried out to operating cavity
Vacuumize process vacuumizes lead frame inside from vacuum air drain.
The technology contents and technical characteristic of the utility model have revealed that as above, however those skilled in the art still may be used
Teaching and announcement that can be based on the utility model and make various replacements and modification without departing substantially from the spirit of the present invention, therefore, this
Utility model protection range should be not limited to the revealed content of embodiment, and should include the various replacements without departing substantially from the utility model
And modification, and covered by present patent application claim.
Claims (5)
1. a kind of cavity structure of semiconductor packaging mold to lead frame vacuum suction, it is characterised in that：On the cavity
Surface intermediate region is vacuum adsorption table, is provided with according to chip packaging unit position on lead frame in the vacuum adsorption table more
A adsorption zone, and multiple nonpenetrating adsorption holes are distributed in each adsorption zone, there is vacuum passage in the vacuum adsorption table
Multiple adsorption holes are connected to, and there is vacuum passage an external tapping to be connected to cavity side, cavity upper surface circumferentially-spaced is set
Multiple vacuum stomatas are equipped with, and vacuum stomata bottom is interconnected, and vacuum passage, the cavity upper surface are connected to by air flue
A long side be equipped at intervals with a plurality of vacuum air drain being mutually parallel, which is half slot, and outer end is connected to cavity
Side, the adsorption hole are interior filled with ventilative steel.
2. the cavity structure of the semiconductor packaging mold according to claim 1 to lead frame vacuum suction, feature
It is：Adsorption hole in the adsorption zone is arranged at equal intervals in surrounding, and center also has there are one adsorption hole.
3. the cavity structure of the semiconductor packaging mold according to claim 2 to lead frame vacuum suction, feature
It is：Adsorption hole in multiple adsorption zones is connected to by the vacuum passage that transverse and longitudinal connects.
4. the cavity structure of the semiconductor packaging mold according to claim 1 to lead frame vacuum suction, feature
It is：The hardness of the ventilative steel is HRC50.
5. the cavity structure of the semiconductor packaging mold according to claim 1 to lead frame vacuum suction, feature
It is：Vacuum air drain between each two adsorption zone is to lengthen air drain, is extended between two adsorption zones, and end is with more
A parallel lateral air drain increases adsorption plane.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721640383.4U CN208068673U (en) | 2017-11-30 | 2017-11-30 | A kind of cavity structure of semiconductor packaging mold to lead frame vacuum suction |
| PCT/CN2018/099968 WO2019105063A1 (en) | 2017-11-30 | 2018-08-10 | Cavity structure of semiconductor package mold capable of vacuum adsorption of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721640383.4U CN208068673U (en) | 2017-11-30 | 2017-11-30 | A kind of cavity structure of semiconductor packaging mold to lead frame vacuum suction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208068673U true CN208068673U (en) | 2018-11-09 |
Family
ID=64033013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721640383.4U Expired - Fee Related CN208068673U (en) | 2017-11-30 | 2017-11-30 | A kind of cavity structure of semiconductor packaging mold to lead frame vacuum suction |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN208068673U (en) |
| WO (1) | WO2019105063A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111376437A (en) * | 2020-03-24 | 2020-07-07 | 环维电子(上海)有限公司 | Double-sided plastic package mold and one-time double-sided plastic package method |
| CN111391221A (en) * | 2020-03-24 | 2020-07-10 | 环维电子(上海)有限公司 | Plastic packaging mold based on one-time double-sided plastic packaging technology, plastic packaging method and mold cleaning method thereof |
| CN111761762A (en) * | 2020-06-23 | 2020-10-13 | 太仓顶艺半导体科技有限公司 | Vacuum die cavity panel mould capable of increasing suction force |
| CN111958482A (en) * | 2020-09-16 | 2020-11-20 | 大连达利凯普科技股份公司 | Vacuum suction tool for ultrathin single-layer ceramic capacitor substrate and manufacturing process |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2971834B2 (en) * | 1997-06-27 | 1999-11-08 | 松下電子工業株式会社 | Method for manufacturing resin-encapsulated semiconductor device |
| JP4081397B2 (en) * | 2002-07-31 | 2008-04-23 | 第一精工株式会社 | Film sticking apparatus and film sticking method |
| JP4243177B2 (en) * | 2003-12-22 | 2009-03-25 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
| JP2011014606A (en) * | 2009-06-30 | 2011-01-20 | Sanyo Electric Co Ltd | Method of manufacturing semiconductor apparatus |
| CN204760367U (en) * | 2015-06-29 | 2015-11-11 | 杰群电子科技（东莞）有限公司 | Lead frame fixing device |
| CN205572905U (en) * | 2016-04-29 | 2016-09-14 | 饰而杰汽车制品（苏州）有限公司 | Forming die |
-
2017
- 2017-11-30 CN CN201721640383.4U patent/CN208068673U/en not_active Expired - Fee Related
-
2018
- 2018-08-10 WO PCT/CN2018/099968 patent/WO2019105063A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111376437A (en) * | 2020-03-24 | 2020-07-07 | 环维电子(上海)有限公司 | Double-sided plastic package mold and one-time double-sided plastic package method |
| CN111391221A (en) * | 2020-03-24 | 2020-07-10 | 环维电子(上海)有限公司 | Plastic packaging mold based on one-time double-sided plastic packaging technology, plastic packaging method and mold cleaning method thereof |
| CN111761762A (en) * | 2020-06-23 | 2020-10-13 | 太仓顶艺半导体科技有限公司 | Vacuum die cavity panel mould capable of increasing suction force |
| CN111958482A (en) * | 2020-09-16 | 2020-11-20 | 大连达利凯普科技股份公司 | Vacuum suction tool for ultrathin single-layer ceramic capacitor substrate and manufacturing process |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019105063A1 (en) | 2019-06-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181109 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |