CN209000897U - A kind of chip high temperature resistant nozzle unit - Google Patents
A kind of chip high temperature resistant nozzle unit Download PDFInfo
- Publication number
- CN209000897U CN209000897U CN201822005166.9U CN201822005166U CN209000897U CN 209000897 U CN209000897 U CN 209000897U CN 201822005166 U CN201822005166 U CN 201822005166U CN 209000897 U CN209000897 U CN 209000897U
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- China
- Prior art keywords
- temperature resistant
- high temperature
- suction nozzle
- chip
- nozzle unit
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Abstract
The utility model discloses a kind of chip high temperature resistant nozzle unit, which includes mounting head and high temperature resistant suction nozzle, and mounting head top vertically offers venthole；Several vertical vacuum holes are offered inside high temperature resistant suction nozzle；The gas being blown into from venthole, or the gas sucked from venthole, pass through vacuum hole；The lower surface of high temperature resistant suction nozzle is the suction of outer convex；Nozzle unit evagination curved surfaces are effectively guaranteed chip center position and first contact substrate or bottom chip, intermediate air extrusion are removed, it is therefore prevented that chip center heaves position, there is lamination problem, improves product quality；The equally distributed vacuum hole of nozzle unit ensure that the adsorption capacity uniformity to chip.
Description
[technical field]
The utility model belongs to technical field of semiconductor encapsulation, and in particular to a kind of chip high temperature resistant nozzle unit.
[background technique]
In the pickup patch process of storage chip encapsulation process, since chip thickness is relatively thin (< 50um), chip warpage
Greatly, easily because suction nozzle vacuum unevenly causes sliver problem during pickup, there is chip bonding in chip center position after patch
Film (DAF) and underlying substrate or chip lamination problem；On the other hand, patch process selects rubber suction nozzle, because pasting during patch
Piece temperature drift can cause the problem on deformation of rubber suction nozzle, influence the product quality and yield of semiconductor packages.
[utility model content]
The shortcomings that the purpose of the utility model is to overcome the above-mentioned prior arts provides a kind of chip high temperature resistant suction nozzle dress
It sets, solves chip warpage, chip center position DAF layering, the deformation of rubber suction nozzle and chip production yield in the prior art
The problems such as.
In order to achieve the above objectives, the utility model is achieved using following technical scheme:
A kind of chip high temperature resistant nozzle unit, including mounting head and high temperature resistant suction nozzle, mounting head top vertically open up
There is venthole, the lower part of mounting head is groove；High temperature resistant suction nozzle is fixedly mounted in groove, if offering inside high temperature resistant suction nozzle
Dry vertical vacuum hole；The contact of the inner sidewall of four side walls of high temperature resistant suction nozzle and groove, the upper surface of high temperature resistant suction nozzle and
It is had the gap between the bottom of groove；The lower surface of high temperature resistant suction nozzle is outer convex.
Further improvement of the utility model is:
Preferably, the top of mounting head is installation arm, and venthole is located at the level cross-sectionn center of installation arm.
Preferably, groove is cubic shaped.
Preferably, vent board is fixedly installed between the bottom of groove and the upper surface of high temperature resistant suction nozzle；Vent board and recessed
Gap is provided between the bottom of slot and between vent board and the upper surface of high temperature resistant suction nozzle；If being offered on vent board
Dry vacuum tank.
Preferably, vacuum tank is transversely offered on vent board, the distance between vacuum tank of adjacent transverse is equal.
Preferably, vacuum tank is offered on vent board along longitudinal direction, the distance between adjacent longitudinal vacuum tank is equal；Laterally
Confluce on vent board of vacuum tank and longitudinal vacuum tank be cross vacuum tank.
Preferably, along the vertical of high temperature resistant suction nozzle, the corresponding vacuum hole of each cross vacuum tank.
Preferably, high temperature resistant suction nozzle selects high-temperature resistant rubber.
Compared with prior art, the utility model has the following beneficial effects:
The utility model discloses a kind of chip high temperature resistant nozzle unit, which includes that mounting head and high temperature resistant are inhaled
Mouth, mounting head top vertically offer venthole；Several vertical vacuum holes are offered inside high temperature resistant suction nozzle；From ventilation
The gas that hole is blown into, or the gas sucked from venthole, pass through vacuum hole；The lower surface of high temperature resistant suction nozzle is outer convex
It inhales；Nozzle unit evagination curved surfaces are effectively guaranteed chip center position and first contact substrate or bottom chip, by centre
Air extrusion removes, it is therefore prevented that chip center heaves position, there is lamination problem, improves product quality；Nozzle unit uniformly divides
The vacuum hole of cloth ensure that the adsorption capacity uniformity to chip.
Further, venthole is located at the cross-section center position of installation arm, the gas that venthole is exported
Uniform dispersion can uniformly be inhaled from each vacuum hole to the gas that the vacuum hole or venthole of super heated rubber suction nozzle suck
Enter.
Further, groove is cubic shaped, can effectively prevent high temperature resistant suction nozzle when picking up chip due to by
Extrusion deformation to external force is serious, influences to pick up effect.
Further, it is provided with vent board between groove and high temperature resistant suction nozzle, offers vacuum tank on vent board, so that from
The gas of venthole outflow first passes through vacuum tank dispersion, finally flows into vacuum hole, further uniform gas；It sucks same when gas
Reason.
Further, vacuum tank transversely and is longitudinally arranged, and intersection is cross vacuum tank, each vacuum tank corresponding one
A vacuum hole, the gas that further uniform dispersion is flowed out.
Further, suction nozzle selects high-temperature resistant rubber material, enables suction nozzle high temperature resistant, prevents suction nozzle from deforming；It is another
Aspect is made it have better adsorptivity and uses that the material is soft, core can be more effectively protected due to the roughness of rubber
Piece does not cause chip rupture and scuffing.
[Detailed description of the invention]
Fig. 1 is schematic cross-section of this practical device along center line；
Fig. 2 is the vacuum tank schematic diagram of vent board in this practical device
Fig. 3 is the vacuum hole schematic diagram of high temperature resistant suction nozzle in this practical device；
Wherein: 1- mounting head；2- high temperature resistant suction nozzle；3- installs arm；4- groove；5- venthole；6- vacuum tank；7- ventilation
Plate；8- vacuum hole；9- cross vacuum tank.
[specific embodiment]
The utility model is described in further detail with reference to the accompanying drawing:
Referring to Fig. 1, the utility model includes mounting head 1 and high temperature resistant suction nozzle 2.Mounting head 1 is divided for two parts, including top
Installation arm 3 and lower part groove 4, groove 4 be provided with installation arm 3 lower part, be cube；Installation arm 3 is assembled in
In the equipment for manufacturing chip, the design of the installation vertical center of arm 3 has venthole 5, perforation installation arm 3 and groove 4, makes gas
Body can flow freely in mounting head 1, and the lower section of groove 4 is fixedly installed vent board 7, the bottom of vent board 7 and groove 4 it
Between there are gap, vent board 7 offers vacuum tank 6 along horizontal, longitudinal direction；4 assembled inside of groove has high temperature resistant suction nozzle 2, mounting head 1
Vertical centerline with high temperature resistant suction nozzle 2 is same center line；High temperature resistant suction nozzle 2 is in the lower section of vent board 7；The groove of cube
4 can effectively prevent high temperature resistant suction nozzle 2 when picking up since the extrusion deformation by external force is serious.
High temperature resistant suction nozzle 2 is plane with five faces that groove 4 cooperates at cube, and only lower surface design is outer convex arc
Shape, high temperature resistant suction nozzle 2 offer several vacuum holes 8 up and down, these vacuum holes 8 along high temperature resistant suction nozzle 2 section
Transverse and longitudinal is uniformly distributed.
There is the cross vacuum tank 9 intersected on vent board 7 in the vacuum tank 6 laterally opened up and the vacuum tank longitudinally opened up 6,
Each vacuum hole 8 and a cross vacuum tank 9 are corresponding, so that the gas that venthole 5 flows out is flowed from each cross vacuum tank 9
Maximum out, similarly, the big flow gas at these positions exports air-breathing from vacuum hole 8, and then from corresponding high temperature resistant suction nozzle 2
The output of vacuum hole 8 or sucking, guarantee gas flowing smooth in entire nozzle unit.
High temperature resistant suction nozzle 2 selects high-temperature resistant rubber material, while preventing suction nozzle from deforming, due to the roughness of rubber,
It makes it have better adsorptivity and uses that the material is soft, chip can more be effectively protected, do not cause chip rupture and scuffing.
Working principle:
In manufacture patch type chip processes, chip or chip placement can be adsorbed by high temperature resistant suction nozzle；In vacuum shape
Under state, when high temperature resistant suction nozzle 2 adsorbs chip, chip center is effectively guaranteed in the evagination curved surfaces of absorption high temperature resistant suction nozzle 2
Position first contacts substrate, and the air extrusion among suction nozzle 2 and chip is removed, it is therefore prevented that the blistering of chip center position influences to produce
Then quality gradually adsorbs chip outward, when ensure that absorption chip, to the adsorption capacity uniformity of chip；When high temperature resistant is inhaled
When 2 eluting gas of mouth, 2 evagination curved surfaces of high temperature resistant suction nozzle uniformly flow out, and ensure that chip being capable of uniform stressed.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection scope within.
Claims (8)
1. a kind of chip high temperature resistant nozzle unit, which is characterized in that including mounting head (1) and high temperature resistant suction nozzle (2), mounting head
(1) top vertically offers venthole (5), and the lower part of mounting head (1) is groove (4)；High temperature resistant suction nozzle (2) is fixedly mounted on
In groove (4), several vertical vacuum holes (8) are offered inside high temperature resistant suction nozzle (2)；Four sides of high temperature resistant suction nozzle (2)
The contact of the inner sidewall of wall and groove, has the gap between the upper surface of high temperature resistant suction nozzle (2) and the bottom of groove (4)；High temperature resistant is inhaled
The lower surface of mouth (2) is outer convex.
2. chip according to claim 1 high temperature resistant nozzle unit, which is characterized in that the top of mounting head (1) is peace
It fills arm (3), venthole (5) is located at the level cross-sectionn center of installation arm (3).
3. chip according to claim 1 high temperature resistant nozzle unit, which is characterized in that groove (4) is cubic shaped.
4. chip according to claim 1 high temperature resistant nozzle unit, which is characterized in that the bottom of groove (4) and Nai Gao
Vent board (7) are fixedly installed between the upper surface of warm suction nozzle (2)；Between vent board (7) and the bottom of groove (4), Yi Jitong
Gap is provided between gas plate (7) and the upper surface of high temperature resistant suction nozzle (2)；Vent board offers several vacuum tanks on (7)
(6)。
5. chip according to claim 4 high temperature resistant nozzle unit, which is characterized in that vent board is transversely opened on (7)
Equipped with vacuum tank (6), the distance between vacuum tank (6) of adjacent transverse is equal.
6. chip according to claim 5 high temperature resistant nozzle unit, which is characterized in that vent board is opened along longitudinal direction on (7)
Equipped with vacuum tank (6), the distance between adjacent longitudinal vacuum tank (6) is equal；The vacuum tank of lateral vacuum tank (6) and longitudinal direction
(6) confluce on vent board (7) is cross vacuum tank (6).
7. chip according to claim 6 high temperature resistant nozzle unit, which is characterized in that along high temperature resistant suction nozzle (2)
Vertically, the corresponding vacuum hole (8) of each cross vacuum tank (9).
8. chip according to claim 1-7 high temperature resistant nozzle unit, which is characterized in that high temperature resistant suction nozzle
(2) high-temperature resistant rubber is selected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822005166.9U CN209000897U (en) | 2018-11-30 | 2018-11-30 | A kind of chip high temperature resistant nozzle unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822005166.9U CN209000897U (en) | 2018-11-30 | 2018-11-30 | A kind of chip high temperature resistant nozzle unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209000897U true CN209000897U (en) | 2019-06-18 |
Family
ID=66808214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822005166.9U Active CN209000897U (en) | 2018-11-30 | 2018-11-30 | A kind of chip high temperature resistant nozzle unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209000897U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110391169A (en) * | 2019-08-15 | 2019-10-29 | 业成科技（成都）有限公司 | Nozzle unit |
| CN113119150A (en) * | 2021-04-09 | 2021-07-16 | 华天科技(南京)有限公司 | Suction nozzle for product pickup in cutting process and using method |
-
2018
- 2018-11-30 CN CN201822005166.9U patent/CN209000897U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110391169A (en) * | 2019-08-15 | 2019-10-29 | 业成科技（成都）有限公司 | Nozzle unit |
| CN113119150A (en) * | 2021-04-09 | 2021-07-16 | 华天科技(南京)有限公司 | Suction nozzle for product pickup in cutting process and using method |
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