CN110391169A - Nozzle unit - Google Patents

Nozzle unit Download PDF

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Publication number
CN110391169A
CN110391169A CN201910752868.XA CN201910752868A CN110391169A CN 110391169 A CN110391169 A CN 110391169A CN 201910752868 A CN201910752868 A CN 201910752868A CN 110391169 A CN110391169 A CN 110391169A
Authority
CN
China
Prior art keywords
hollow
sucker
soup stick
holes
nozzle unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910752868.XA
Other languages
Chinese (zh)
Inventor
何玉平
刘建强
肖康
杨祖洪
曾永强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interface Optoelectronics Shenzhen Co Ltd
Cheng Cheng Technology Chengdu Co Ltd
General Interface Solution Ltd
Original Assignee
Interface Optoelectronics Shenzhen Co Ltd
Cheng Cheng Technology Chengdu Co Ltd
General Interface Solution Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interface Optoelectronics Shenzhen Co Ltd, Cheng Cheng Technology Chengdu Co Ltd, General Interface Solution Ltd filed Critical Interface Optoelectronics Shenzhen Co Ltd
Priority to CN201910752868.XA priority Critical patent/CN110391169A/en
Priority to TW108129530A priority patent/TWI726389B/en
Publication of CN110391169A publication Critical patent/CN110391169A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

System of the present invention discloses a kind of nozzle unit, is comprising a suction nozzle body and a hollow soup stick.Suction nozzle body has a sucker for running through itself, and hollow soup stick has a plurality of through-holes through itself, and hollow soup stick is set in sucker, and to be connected to all through-holes and sucker, the bottom of hollow soup stick is located at the surface of the bottom of sucker.The present invention plays the role of carrying, prevents the further deformation of film using hollow soup stick as support construction when suction nozzle body draws film.

Description

Nozzle unit
Technical field
The present disclosure generally relates to a kind of suction means, and especially in regard to a kind of nozzle unit.
Background technique
With scientific and technological progress, the product of semiconductor industry now is increasingly accurate also with scientific and technological progress, more gradually The volume of product is reduced, therefore when carrying out the automated production processing procedure of semiconductor element, can be provided by a vacuum slot The absorption of film and function is placed, make vacuum slot under the drive of mechanical arm, and vacuum suction device of arranging in pairs or groups, to by institute It states film and is moved to scheduled machining area from dark zone.However, in suction process, due to the inside and outside differential pressure of binding domain, It is be easy to cause excessive deformation and injured, the bad generation such as adjoint bubble in following process, as shown in Figure 1, by taking optical cement 10 as an example, It is placed on optical cement 10 using suction nozzle 12, and cooperates the mode of vacuum attraction, sucking action is carried out to optical cement 10.However, because There is no any support for binding domain, causes the inside and outside differential pressure of suction nozzle 12 to make optical cement 10 that excessive deformation occur, therefore close Optical cement 10 at the bottom margin of suction nozzle 12, and the optical cement 10 near the inside of suction nozzle 10, will form injured.
Therefore, the present invention is tied up to for above-mentioned puzzlement, proposes a kind of nozzle unit, with solve it is known caused by ask Topic.
Summary of the invention
The main object of the present invention is to provide a kind of nozzle unit, using hollow soup stick as support construction, when When suction nozzle body draws film, plays the role of carrying, prevent the further deformation of film.
In order to achieve the above object, the present invention provides a kind of nozzle unit, include a suction nozzle body and a hollow soup stick.Suction nozzle sheet Body has a sucker for running through itself, and hollow soup stick has a plurality of through-holes through itself, and hollow soup stick is set in sucker, with It is connected to all through-holes and sucker, the bottom of hollow soup stick is located at the surface of the bottom of sucker.
In one embodiment of this invention, the shortest distance of the bottom of hollow soup stick at a distance of the bottom of sucker is 1.0~1.5 Millimeter (mm), and the diameter of section of each through-hole is 0.8 millimeter.
In one embodiment of this invention, all through-holes in longitudinal direction and are alternatively arranged.
In one embodiment of this invention, all through-holes are arranged in a Concentric circle array in the same plane.
In one embodiment of this invention, sucker is in horn-like, and the perimeter of sucker is from top to bottom cumulative.
In one embodiment of this invention, suction nozzle body up extends to form a hollow sleeve, the center of hollow sleeve Sets of holes are connected to sucker and all through-holes.
In one embodiment of this invention, hollow soup stick up extends to sequentially form one first hollow cylinder and one second Hollow cylinder, the first hollow cylinder is between hollow soup stick and the second hollow cylinder, and the outer perimeter of the first hollow cylinder is small In the outer perimeter of the second hollow cylinder, the centrally located sets of holes of the first hollow cylinder, the second hollow cylinder is set to hollow sleeve Top, the second central perforation of the first central perforation the second hollow cylinder of connection of the first hollow cylinder and all through-holes.
In one embodiment of this invention, the most short perimeter of sucker is equal to the outer perimeter of hollow soup stick.
In one embodiment of this invention, hollow soup stick and the suction nozzle body person of being integrally formed.
In one embodiment of this invention, hollow soup stick is fixed in suction nozzle body through adhesive agent, and is located in sucker.
Hereby to make, your juror to structure feature of the invention and it is reached the effect of more have further understanding and recognize Know, careful assistant is illustrated as after with preferred embodiment figure and cooperation detailed description.
Detailed description of the invention
Fig. 1 is the suction nozzle of prior art and the structural schematic diagram of optical cement.
Fig. 2 is the structural schematic diagram of the first embodiment of nozzle unit of the invention.
Fig. 3 is the structure sectional view of the A-A ' line of the invention along Fig. 2.
Fig. 4 is the structural schematic diagram of the running of the first embodiment of nozzle unit of the invention.
Fig. 5 is the structural schematic diagram of the second embodiment of nozzle unit of the invention.
Fig. 6 is the structure sectional view of the B-B ' line of the invention along Fig. 5.
Fig. 7 is the structural schematic diagram of the running of the second embodiment of nozzle unit of the invention.
Fig. 8 is the structural schematic diagram of the 3rd embodiment of nozzle unit of the invention.
Fig. 9 is the structure sectional view of the C-C ' line of the invention along Fig. 8.
Figure 10 is the structural schematic diagram of the running of the 3rd embodiment of nozzle unit of the invention.
Appended drawing reference:
10 optical cements
12 suction nozzles
14 suction nozzle bodies
16 hollow soup sticks
18 suckers
20 through-holes
22 adhesive agents
24 exhaust pipes
26 air extractors
28 films
30 suction nozzle bodies
32 hollow soup sticks
34 suckers
36 through-holes
38 exhaust pipes
40 air extractors
42 films
44 suction nozzle bodies
46 hollow soup sticks
48 suckers
50 through-holes
52 hollow sleeves
54 central sets of holes
56 first hollow cylinders
58 second hollow cylinders
60 first central perforations
62 second central perforations
64 exhaust pipes
66 air extractors
68 films
Specific embodiment
The embodiment of the present invention will further be explained by hereafter cooperation correlative type.As far as possible, in attached drawing with In specification, identical label system represents same or similar component.In attached drawing, based on simplification and facilitate mark, shape and thickness It may be by exaggerating expression.It is understood that it is not expressly shown in attached drawing or the element that is described in specification, it is affiliated There is form known to usual operator in technical field.The usual operator of this field can content according to the present invention and carry out A variety of changes and modification.
When an element be referred to as " ... on " when, it can refer to the element directly in other elements, be also possible to have Other elements are present among the two.On the contrary, it is that cannot have other when an element is referred to as " directly existing " another element Element is present in the centre of the two.As used herein, vocabulary " and/or " contain one or more of the associated item listed Any combination.
The description as described in " one embodiment " or " embodiment " is meant about institute's phase in an at least embodiment below A particular element, structure or the feature of connection.Therefore, " one embodiment " or " embodiment " that many places occur below Multiple descriptions not directed to the same embodiment.Furthermore the particular elements, structure and feature in one or more embodiments can be according to It is combined according to an appropriate ways.
Fig. 2 and Fig. 3 are please referred to below, and introduce the first embodiment of nozzle unit of the invention.Nozzle unit includes one Suction nozzle body 14 and a hollow soup stick 16.The material of hollow soup stick 16 can be the engineering plastic of a kind of easy processing and high mechanical strength Material, such as polyether-ether-ketone high molecular material (peek).Suction nozzle body 14 has a sucker 18 for running through itself, and hollow soup stick 16 has There are a plurality of through-holes 20 through itself, hollow soup stick 16 is set in sucker 18, hollow to be connected to all through-holes 20 and sucker 18 The bottom of soup stick 16 is located at the surface of the bottom of sucker 18.In the first embodiment, hollow soup stick 16 is solid through adhesive agent 22 Due in suction nozzle body 14, and it is located in sucker 18.In certain embodiments of the present invention, the bottom of hollow soup stick 16 is at a distance of suction The shortest distance d1 of the bottom in hole 18 is 1.0~1.5 millimeters (mm), preferably is 1.5 millimeters, and the section of each through-hole 20 is straight Diameter d2 is 0.8 millimeter, but the present invention is not limited thereto.In certain embodiments of the present invention, all through-holes 20 in longitudinal and It is alternatively arranged, such as all through-holes 20 are arranged in a Concentric circle array in the same plane.
Fig. 2 and Fig. 4 are please referred to below, and introduce the absorption mode of the first embodiment of nozzle unit of the invention.Suction nozzle Ontology 14 connect an air extractor 26 through an exhaust pipe 24 with hollow soup stick 16, to be connected to exhaust pipe 24, all through-holes 20 with sucker 18, and place a film 28 in the bottom of suction nozzle body 14, such as it is anti-reflection with a thickness of 70 microns (μm) of antireflection Film (ARF, Anti-reflection Film).When air extractor 26 is opened through exhaust pipe 24, all through-holes 20 with sucker 18 When beginning vacuumizes, film 28 contacts the bottom of suction nozzle body 14, makes the feather edge elder generation contact of suction nozzle body 14, plays buffering Effect.As the inside and outside differential pressure of suction nozzle body 14 is more and more big, film 28 will touch hollow soup stick after generating slight deformation 16 bottom, plays the role of carrying, prevents the excessive deformation of film 28 and leads to injured, makes the bad ratio of injured by original 0.3% be reduced to 0.01% hereinafter, promoted simultaneously board operation when stability.Wherein, the bottom of hollow soup stick 16 is at a distance of suction The shortest distance d1 of the bottom in hole 18 corresponds to the thickness and hardness of film 28, when film 28 thickness and hardness it is at least one of Person is bigger, and the shortest distance d1 of bottom of the bottom of hollow soup stick 16 at a distance of sucker 18 is smaller, because of if the bottom of hollow soup stick 16 Shortest distance d1 of the portion at a distance of the bottom of sucker 18 is too big, still will cause the excessive deformation of film 28 and leads to injured.
Fig. 5 and Fig. 6 are please referred to below, and introduce the second embodiment of nozzle unit of the invention.Nozzle unit includes one Suction nozzle body 30 and a hollow soup stick 32.The material of hollow soup stick 32 can be the engineering plastic of a kind of easy processing and high mechanical strength Material, such as polyether-ether-ketone high molecular material (peek).Suction nozzle body 30 has a sucker 34 for running through itself, and hollow soup stick 32 has There are a plurality of through-holes 36 through itself, hollow soup stick 32 is set in sucker 34, hollow to be connected to all through-holes 36 and sucker 34 The bottom of soup stick 32 is located at the surface of the bottom of sucker 34.In a second embodiment, hollow soup stick 32 is with suction nozzle body 30 Integrated molding person, therefore the material of suction nozzle body 30 is similarly polyether-ether-ketone high molecular material.In certain embodiments of the present invention In, the shortest distance d3 of bottom of the bottom of hollow soup stick 32 at a distance of sucker 34 is 1.0~1.5 millimeters (mm), preferably is 1.5 Millimeter, and the diameter of section d4 of each through-hole 36 is 0.8 millimeter, but the present invention is not limited thereto.In certain realities of the invention It applies in example, all through-holes 36 are in longitudinal direction and are alternatively arranged, such as all through-holes 36 are arranged in a concentric circles battle array in the same plane Column.
Fig. 5 and Fig. 7 are please referred to below, and introduce the absorption mode of the second embodiment of nozzle unit of the invention.Suction nozzle Ontology 30 connect an air extractor 40 through an exhaust pipe 38 with hollow soup stick 32, to be connected to exhaust pipe 38, all through-holes 36 with sucker 34, and place a film 42 in the bottom of suction nozzle body 30, such as it is anti-reflection with a thickness of 70 microns (μm) of antireflection Film (ARF, Anti-reflection Film).When air extractor 40 is opened through exhaust pipe 38, all through-holes 36 with sucker 34 When beginning vacuumizes, film 42 contacts the bottom of suction nozzle body 30, makes the feather edge elder generation contact of suction nozzle body 30, plays buffering Effect.As the inside and outside differential pressure of suction nozzle body 30 is more and more big, film 42 will touch hollow soup stick after generating slight deformation 32 bottom, plays the role of carrying, prevents the excessive deformation of film 42 and leads to injured, makes the bad ratio of injured by original 0.3% be reduced to 0.01% hereinafter, promoted simultaneously board operation when stability.Wherein, the bottom of hollow soup stick 32 is at a distance of suction The shortest distance d3 of the bottom in hole 34 corresponds to the thickness and hardness of film 42, when film 42 thickness and hardness it is at least one of Person is bigger, and the shortest distance d3 of bottom of the bottom of hollow soup stick 32 at a distance of sucker 34 is smaller, because of if the bottom of hollow soup stick 32 Shortest distance d3 of the portion at a distance of the bottom of sucker 34 is too big, still will cause the excessive deformation of film 42 and leads to injured.
Fig. 8 and Fig. 9 are please referred to below, and introduce the 3rd embodiment of nozzle unit of the invention.Nozzle unit includes one Suction nozzle body 44 and a hollow soup stick 46.The material of hollow soup stick 46 can be the engineering plastic of a kind of easy processing and high mechanical strength Material, such as polyether-ether-ketone high molecular material (peek).Suction nozzle body 44 has a sucker 48 for running through itself, and hollow soup stick 46 has There are a plurality of through-holes 50 through itself, hollow soup stick 46 is set in sucker 48, hollow to be connected to all through-holes 50 and sucker 48 The bottom of soup stick 46 is located at the surface of the bottom of sucker 48.In certain embodiments of the present invention, the bottom of hollow soup stick 46 Shortest distance d5 at a distance of the bottom of sucker 48 is 1.0~1.5 millimeters (mm), preferably it is 1.5 millimeters, and each through-hole 50 Diameter of section d6 is 0.8 millimeter, but the present invention is not limited thereto.In certain embodiments of the present invention, all through-holes 50 are in It longitudinal direction and is alternatively arranged, such as all through-holes 50 are arranged in a Concentric circle array in the same plane.
In the third embodiment, sucker 48 is in horn-like, and the perimeter of sucker 48 is from top to bottom cumulative, makes sucker 48 most Short perimeter is equal to the outer perimeter of hollow soup stick 46, in order to accommodate hollow soup stick 46 in sucker 48.In addition, suction nozzle body 44 is past To form a hollow sleeve 52, the central sets of holes 54 of hollow sleeve 52 are connected to sucker 48 and all through-holes 50 for upper extension.Middle suction Bar 46 up extends to sequentially form one first hollow cylinder 56 and one second hollow cylinder 58, thus the first hollow cylinder 56 with The material of second hollow cylinder 58 is all polyether-ether-ketone high molecular material, and the height d7 of the second hollow cylinder 58 is 10 millimeters, in The total height d8 of suction bar 46, the first hollow cylinder 56 and the second hollow cylinder 58 is 20 millimeters.First hollow cylinder 56 is located at Between hollow soup stick 46 and the second hollow cylinder 58, and the outer perimeter of the first hollow cylinder 56 is outer less than the second hollow cylinder 58 Perimeter, in the centrally located sets of holes 54 of the first hollow cylinder 56, the second hollow cylinder 58 is set to the top of hollow sleeve 52, in first Second central perforation 62 of the first central perforation 60 the second hollow cylinder 58 of connection of void column body 56 and all through-holes 50.
Fig. 8 and Figure 10 are please referred to below, and introduce the absorption mode of the 3rd embodiment of nozzle unit of the invention.Second Hollow cylinder 58 connects an air extractor 66 through an exhaust pipe 64, to be connected to exhaust pipe 64, the second central perforation 62, the One central perforation 60, all through-holes 50 and sucker 48, and a film 68 is placed in the bottom of suction nozzle body 44, such as with a thickness of 70 The antireflection anti-reflection film (ARF, Anti-reflection Film) of micron (μm).When air extractor 66 through exhaust pipe 64, When second central perforation 62, the first central perforation 60, all through-holes 50 and sucker 48 start to vacuumize, film 68 contacts suction nozzle sheet The bottom of body 44 makes the feather edge elder generation contact of suction nozzle body 44, plays buffer function.With the interior external pressure of suction nozzle body 44 Difference is more and more big, and the bottom of hollow soup stick 46 will be touched after the generation slight deformation of film 68, plays the role of carrying, prevents thin The excessive deformation of film 68 and lead to injured, be reduced to the bad ratio of injured 0.01% hereinafter, elevator simultaneously by original 0.3% Stability when platform is run.Wherein, the shortest distance d5 of bottom of the bottom of hollow soup stick 46 at a distance of sucker 48 corresponds to film 68 Thickness and hardness, when the thickness of film 68 and the one at least within of hardness are bigger, the bottom of hollow soup stick 46 is at a distance of sucker The shortest distance d5 of 48 bottom is smaller because if the bottom of hollow soup stick 46 at a distance of the bottom of sucker 48 shortest distance d5 too Greatly, it still will cause the excessive deformation of film 68 and lead to injured.
In conclusion hollow soup stick is placed in suction nozzle by the present invention, to work as suction nozzle using hollow soup stick as support construction When ontology draws film, plays the role of carrying, prevent the further deformation of film.
As described above, only a preferred embodiment of the present invention is not used to limit the scope of implementation of the present invention, therefore Such as according to shape, construction described in scope of the present invention patent, feature and spirit carried out by equivalent changes and modifications, should all wrap It includes in claim of the invention.

Claims (10)

1. a kind of nozzle unit, characterized by comprising:
One suction nozzle body, the sucker for running through itself with one;And
One hollow soup stick has a plurality of through-holes through itself, which is set in the sucker, to be connected to those through-holes With the sucker, the bottom of the hollow soup stick is located at the surface of the bottom of the sucker.
2. nozzle unit as described in claim 1, wherein the bottom of the hollow soup stick at a distance of the bottom of the sucker most Short distance is 1.0~1.5 millimeters, and the diameter of section of each through-hole is 0.8 millimeter.
3. nozzle unit as claimed in claim 2, wherein those through-holes in longitudinal direction and are alternatively arranged.
4. nozzle unit as claimed in claim 2, wherein those through-holes are arranged in a Concentric circle array in the same plane.
5. nozzle unit as described in claim 1, wherein the sucker is in horn-like, and the perimeter of the sucker is from top to bottom gradually Increase.
6. nozzle unit as claimed in claim 5, wherein the suction nozzle body up extends to form a hollow sleeve, this is hollow The central sets of holes of sleeve are connected to the sucker and those through-holes.
7. nozzle unit as claimed in claim 6, wherein the hollow soup stick up extends to sequentially form one first hollow posts Body and one second hollow cylinder, first hollow cylinder are located between the hollow soup stick and second hollow cylinder, and this first The outer perimeter of hollow cylinder is less than the outer perimeter of second hollow cylinder, which is located in the center sets of holes, should Second hollow cylinder is set to the top of the hollow sleeve, and the first central perforation of first hollow cylinder is connected to second hollow posts Second central perforation of body and those through-holes.
8. nozzle unit as claimed in claim 5, wherein most short perimeter of the sucker is equal to the outer perimeter of the hollow soup stick.
9. nozzle unit as described in claim 1, the wherein hollow soup stick and the suction nozzle body person of being integrally formed.
10. nozzle unit as described in claim 1, wherein the hollow soup stick is fixed in the suction nozzle body through adhesive agent, And it is located in the sucker.
CN201910752868.XA 2019-08-15 2019-08-15 Nozzle unit Pending CN110391169A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910752868.XA CN110391169A (en) 2019-08-15 2019-08-15 Nozzle unit
TW108129530A TWI726389B (en) 2019-08-15 2019-08-19 Nozzle device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910752868.XA CN110391169A (en) 2019-08-15 2019-08-15 Nozzle unit

Publications (1)

Publication Number Publication Date
CN110391169A true CN110391169A (en) 2019-10-29

Family

ID=68288883

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910752868.XA Pending CN110391169A (en) 2019-08-15 2019-08-15 Nozzle unit

Country Status (2)

Country Link
CN (1) CN110391169A (en)
TW (1) TWI726389B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH091487A (en) * 1995-06-15 1997-01-07 Shinano Electron:Kk Vacuum gripping device and ic test handler
DE102006019671A1 (en) * 2006-04-27 2007-10-18 Datacon Technology Gmbh Multi-bonding head for removing electronic chip from e.g. adhesive film, and bonding chip on e.g. wafer, has suction nozzles arranged diagonally to each other over part of their length, such that nozzles run in succession towards free ends
CN101335191A (en) * 2007-06-19 2008-12-31 株式会社瑞萨科技 Manufacturing method for semiconductor integrated device
CN102664156A (en) * 2012-05-15 2012-09-12 日月光半导体制造股份有限公司 Suction head for sucking solder ball, device and semiconductor process
CN107369642A (en) * 2017-06-08 2017-11-21 太极半导体(苏州)有限公司 A kind of suction method for being avoided that ultra-thin chip fragmentation
CN107768395A (en) * 2017-11-01 2018-03-06 无锡中微高科电子有限公司 Oversize optical image sensor chip load process and suction nozzle
CN209000897U (en) * 2018-11-30 2019-06-18 华天科技(西安)有限公司 A kind of chip high temperature resistant nozzle unit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463580B (en) * 2007-06-19 2014-12-01 Renesas Electronics Corp Manufacturing method of semiconductor integrated circuit device
TWM537712U (en) * 2016-10-07 2017-03-01 Unitech Tech Yeh Corp Sucking apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH091487A (en) * 1995-06-15 1997-01-07 Shinano Electron:Kk Vacuum gripping device and ic test handler
DE102006019671A1 (en) * 2006-04-27 2007-10-18 Datacon Technology Gmbh Multi-bonding head for removing electronic chip from e.g. adhesive film, and bonding chip on e.g. wafer, has suction nozzles arranged diagonally to each other over part of their length, such that nozzles run in succession towards free ends
CN101335191A (en) * 2007-06-19 2008-12-31 株式会社瑞萨科技 Manufacturing method for semiconductor integrated device
CN102664156A (en) * 2012-05-15 2012-09-12 日月光半导体制造股份有限公司 Suction head for sucking solder ball, device and semiconductor process
CN107369642A (en) * 2017-06-08 2017-11-21 太极半导体(苏州)有限公司 A kind of suction method for being avoided that ultra-thin chip fragmentation
CN107768395A (en) * 2017-11-01 2018-03-06 无锡中微高科电子有限公司 Oversize optical image sensor chip load process and suction nozzle
CN209000897U (en) * 2018-11-30 2019-06-18 华天科技(西安)有限公司 A kind of chip high temperature resistant nozzle unit

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Publication number Publication date
TW202109711A (en) 2021-03-01
TWI726389B (en) 2021-05-01

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Application publication date: 20191029