CN108538988A - A kind of uniform vapour-pressure type molding press and pressing film method - Google Patents
A kind of uniform vapour-pressure type molding press and pressing film method Download PDFInfo
- Publication number
- CN108538988A CN108538988A CN201810655041.2A CN201810655041A CN108538988A CN 108538988 A CN108538988 A CN 108538988A CN 201810655041 A CN201810655041 A CN 201810655041A CN 108538988 A CN108538988 A CN 108538988A
- Authority
- CN
- China
- Prior art keywords
- nacelle
- pedestal
- cover board
- silica gel
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 33
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000741 silica gel Substances 0.000 claims abstract description 25
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000012528 membrane Substances 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 108010025899 gelatin film Proteins 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of uniform vapour-pressure type molding press and pressing film methods, LED for upside-down mounting, it is formed in sealing cabin through outlet hole array by nacelle pedestal and nacelle cover board, it is pressed to one layer of fluorescence silica gel or including at least the multilayer laminate and LED chip of one layer of fluorescence silica gel and layer of transparent pellosil, the multilayer laminate of one layer of fluorescence silica gel and layer of transparent pellosil of pressing, it is formed at the edge of chip upper surface and chip ladder-like, the equal property of fluorescence silica gel pressing is pressed between ± 5 μm ~ ± 0.5 μm, the uniformity of transparent silica gel pressing is between ± 5 μm ~ ± 0.5 μm, ensure that different product all has stable thickness evenness.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, and in particular to a kind of uniform vapour-pressure type pressing mold for chip pressing
Machine and LED chip pressing film method.
Background technology
With the increasingly maturation of LED flip chip technology, LED application demand diversifications, the development of LED encapsulation technologies starts
It is intended to high-density packages, CSP encapsulation technologies are come into being under such development trend.CSP encapsulation technologies are since appearance, just
In the field of business to create much of a stir, insider's CSP encapsulation technologies are referred to as the mark post of next-generation encapsulation technology, are final encapsulation technology shapes
Formula.CSP encapsulation technologies because it eliminates a variety of necessary materials of gold thread, holder, crystal-bonding adhesive etc. needed for conventional packaging techniques,
Largely reduce cost；Flip-chip is used in technique, effectively raises product light efficiency；Its encapsulating products
Size is smaller, has many advantages, such as that the status that better flexibility keeps its in the field of business is come out top in practical applications.
It is increasingly ripe also with development that technique is made in CSP.Dispensing, dust, the techniques such as model are skillfully used already, but
It is to be limited to these techniques limitations of itself, manufactured CSP products still have the defect for being difficult to change.Such as fluorescence in powder injection process
Powder is unevenly distributed；Gluing process is difficult to that the luminous product in five faces is made, and light efficiency is relatively low；Model process costs are excessively high.And it presses
Membrane process can be easily accomplished being made for CSP products using the means for pressing fluorescent film on the chip matrix sequenced, manufactured
Product uniformity, luminous efficiency and cost is made etc. compared to it is several before mode be made all have it is prodigious excellent
Gesture.When pressing fluorescent film with chip in present press mold technique, gravity pressing and air bag is generally used to press two ways, weight
Forcing conjunction and relying on product surface and apply pressure makes products with adhesive, and air bag pressing mode is one balloon of placement in sealed compartment,
By giving balloon inflation, its expansion is made to press product.But the uniformity for the fluorescence film thickness that both modes press still needs
Improve, and in chip gap film be difficult to be formed it is ladder-like at a urgent need to resolve the problem of.So optimization press mold technique
It is extremely important that means are made.
Invention content
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, a kind of uniform vapour-pressure type for chip pressing is provided
Molding press, the uniform vapour-pressure type molding press include：Nacelle, the nacelle are a cuboid, are hollow out cavity in cabin, described
Nacelle is made of nacelle pedestal and nacelle cover board, and nacelle pedestal and nacelle cover plate lid are sealed when closing by sealing element, nacelle cover board
Surrounding is four wall of nacelle, and cover board middle and upper part is provided with outlet hole array, wherein each described venthole has a snorkel
Connect the aerostatic press being arranged outside nacelle, the snorkel cluster area collection that the snorkel is arranged in nacelle cover board middle upper part
Beam, baroceptor are arranged on nacelle cover board；Nacelle pedestal, the nacelle pedestal are used to place the LED of upside-down mounting to be laminated
Chip and fluorescent film；Pedestal lifting gear, the pedestal lifting gear are used for the lifting of pedestal；It is also set up on the nacelle pedestal
There is exhaust tube, for vacuumizing nacelle；Nacelle cover board lifting gear is used for the lifting of nacelle cover board；Sealing element is used for nacelle
Sealing between cover board and nacelle pedestal；Pneumatic controller, the pressure for gas in control cabinet body.Pedestal nacelle cover board
Lifting gear is spiral lifting, hydraulic lifting, electric up-down or chain drive.
Preferably, the LED chip is fixed on nacelle bottom by the way that locating clip is modeled, marked and be arranged on nacelle bottom plate
On plate.
Preferably, the lifting gear of the pedestal nacelle cover board is spiral lifting, hydraulic lifting, electric up-down or chain
Driving.
Preferably, the venthole is cylindrical hole or inverted conical shape hole.
Preferably, the multiple venthole is matrix array.
Preferably, covering the ventilative cover net of intensive evenly dispersed formula at the venthole.
The present invention also provides a kind of methods of LED chip pressing mold, including：Step 1）One or more to be laminated is fallen
The modeling of dress LED chip is marked and is fixed on the locating clip of nacelle pedestal, wherein have between each chip it is certain away from
From；Step 2）Glued membrane is placed on one or more flip LED chips as one layer of fluorescence silica gel or includes at least one layer of fluorescence silicon
The multilayer laminate of glue and layer of transparent pellosil；Step 3）Pedestal lifting gear and nacelle cover board lifting gear are opened, pedestal is made
Rise and/or nacelle cover board declines, so that nacelle cover board is passed through sealing element with nacelle pedestal and close reality completely；Step 4）Pass through nacelle bottom
Exhaust tube on seat vacuumizes nacelle；Step 5）Stop pumping, by aerostatic press via constriction snorkel and venthole to
Nacelle presses, and by the air pressure in the baroceptor survey room body that is arranged on nacelle cover board, is pressed, wherein described glimmering
Light pellosil or or including at least the multilayer film of one layer of fluorescence silica gel and the multilayer laminate of layer of transparent pellosil in chip upper table
Face and the edge of chip form ladder-like；Step 6）By the gas in exhaust tube release body, make pedestal lifting gear and cabin
Body cover board lifting gear is restored to former setting position, takes out the LED chip of pressing.
Preferably, the air pressure of the pressing is 3-15 atmospheric pressure.
Beneficial effects of the present invention are as follows：
Between ± 5 μm ~ ± 0.5 μm, the uniformity of transparent silica gel pressing exists the equal property of the pressing fluorescence silica gel pressing of the present invention
Between ± 5 μm ~ ± 0.5 μm, ensure that different product all has stable thickness evenness.
The multilayer laminate of one layer of fluorescence silica gel and layer of transparent pellosil of the pressing of the present invention, in chip upper surface and core
The edge of piece forms ladder-like.
Description of the drawings
Fig. 1 is the vertical view of the uniform vapour-pressure type molding press nacelle of the present invention, in figure：1 nacelle pedestal, 2 chips and glued membrane,
3 nacelle cover boards；
Fig. 2 is the upward view of the uniform vapour-pressure type molding press nacelle of the present invention, in figure：1 nacelle pedestal, 2 chips and glued membrane, 3 cabins
Body cover board, 4 ventholes；
Fig. 3 is the uniform vapour-pressure type molding press structural schematic diagram of the present invention, in figure：1 nacelle pedestal, 2 chips and glued membrane, 3 nacelles
Cover board, 4 ventholes, 5 exhaust tubes, 6 nacelles, 7 snorkel cluster areas, 8 nacelle cover board lifting gears, 9 pedestal lifting gears；
Fig. 4 is the air outlet hole structure of the uniform vapour-pressure type molding press nacelle cover board of the present invention, in figure：4 ' cylindrical ventholes, 4 ' '
Inverted conical shape venthole：
Fig. 5 is the chip of the method pressing of the LED chip pressing mold of the present invention, in figure：10 glued membranes, 11LED chips.
Specific implementation mode
Embodiment 1
Referring to Fig. 1-4, a kind of uniform vapour-pressure type molding press, the vapour-pressure type molding press includes：Nacelle 6, the nacelle are one
Cuboid is hollow out cavity in cabin, and the nacelle is made of nacelle pedestal 1 and nacelle cover board 3, nacelle pedestal 1 and nacelle cover board 3
Lid is sealed when closing by sealing element, and nacelle cover board surrounding is four wall of nacelle, and cover board middle and upper part is provided with 4 array of venthole, outlet
Hole array is preferably matrix array, as shown in figure 4, venthole 4 is cylindrical hole 4 ' or inverted conical shape hole 4 ", wherein it is described each
There is venthole 4 snorkel to connect the aerostatic press being arranged outside nacelle, and the snorkel is in nacelle cover board middle upper part
7 boundling of snorkel cluster area of setting, baroceptor are arranged on nacelle cover board 3；Nacelle pedestal 1, the nacelle pedestal are used
In the LED chip and glued membrane 2 of placing upside-down mounting to be laminated, the glued membrane is one layer of fluorescence silica gel or includes at least one layer of fluorescence silicon
The multilayer laminate of glue and layer of transparent pellosil, LED chip are fixed by the way that locating clip is modeled, marked and be arranged on nacelle bottom plate
On nacelle bottom plate；Pedestal lifting gear 9, the pedestal lifting gear 9 are used for the lifting of pedestal；It is also set on the nacelle pedestal
It is equipped with exhaust tube 5, for vacuumizing nacelle 6；Nacelle cover board lifting gear 8 is used for the lifting of nacelle cover board；Sealing element（Figure
In be not shown）, for the sealing between nacelle cover board and nacelle pedestal, the groove in nacelle cover board bottom is arranged in the sealing element
Rubber ring between nacelle base groove is constituted；Pneumatic controller, the pressure for gas in control cabinet body.
Embodiment 2
The ventilative cover net of intensive evenly dispersed formula is covered according to uniform vapour-pressure type molding press described in embodiment 1, at the venthole,
To further increase the uniformity of outlet.Deflector diagonally downward is provided on nacelle side wall below the venthole, with
The uniformity further pressed
Embodiment 3
Referring to Fig. 1-5, a kind of method that uniform vapour-pressure type molding press carries out LED chip pressing mold, including：Step 1）It will be to be laminated
One or more flip LED chips modelings are marked and are fixed on the locating clip of nacelle pedestal, wherein between each chip
With a certain distance；Step 2）Glued membrane is placed on one or more flip LED chips to be one layer of fluorescence silica gel or at least wrap
Multilayer laminate containing one layer of fluorescence silica gel and layer of transparent pellosil；Step 3）Open pedestal lifting gear and the lifting of nacelle cover board
Device makes pedestal rising and/or nacelle cover board decline, and so that nacelle cover board is passed through sealing element with nacelle pedestal and closes reality completely；Step
4）Nacelle is vacuumized by the exhaust tube on nacelle pedestal；Step 5）Stop pumping, by aerostatic press via the ventilation of constriction
Pipe and venthole press to nacelle, by the air pressure in the baroceptor survey room body that is arranged on nacelle cover board, are pressed
Close, wherein the fluorescence silica gel film or or including at least one layer of fluorescence silica gel and the multilayer laminate of layer of transparent pellosil multilayer
Film forms ladder-like at the edge of chip upper surface and chip；Step 6）By the gas in exhaust tube release body, make pedestal
Lifting gear and nacelle cover board lifting gear are restored to former setting position, take out the LED chip of pressing.
As shown in figure 5, the wherein described fluorescent film or the multilayer film 10 comprising fluorescent film form protrusion in 11 upper surface of chip,
Form multiple recess portions between multiple chips, the edge of piece upper surface and chip forms ladder-like.
Between ± 5 μm ~ ± 0.5 μm, the uniformity of transparent silica gel pressing exists the equal property of the pressing fluorescence silica gel pressing
Between ± 5 μm ~ ± 0.5 μm.
Finally it should be noted that：Obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Go out other various forms of variations or variation.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (8)
1. a kind of uniform vapour-pressure type molding press, it is characterised in that：The vapour-pressure type molding press includes：Nacelle, the nacelle are one
A cuboid is hollow out cavity in cabin, and the nacelle is made of nacelle pedestal and nacelle cover board, nacelle pedestal and nacelle cover plate lid
It is sealed by sealing element when conjunction, nacelle cover board surrounding is four wall of nacelle, and cover board middle and upper part is provided with outlet hole array, wherein described
There is each venthole a snorkel to connect the aerostatic press being arranged outside nacelle, and the snorkel is among nacelle cover board
The snorkel cluster area boundling of top setting, baroceptor are arranged on nacelle cover board；Nacelle pedestal, the nacelle pedestal
LED chip for placing upside-down mounting to be laminated and glued membrane, the glued membrane is one layer of fluorescence silica gel or includes at least one layer of fluorescence
The multilayer laminate of silica gel and layer of transparent pellosil；Pedestal lifting gear, the pedestal lifting gear are used for the lifting of pedestal；Institute
It states and is additionally provided with exhaust tube on nacelle pedestal, for vacuumizing nacelle；Nacelle cover board lifting gear is used for the liter of nacelle cover board
Drop；Sealing element, for the sealing between nacelle cover board and nacelle pedestal；Pneumatic controller, for gas in control cabinet body
Pressure.
2. uniform vapour-pressure type molding press according to claim 1, it is characterised in that：The LED chip passes through at nacelle bottom
Locating clip is modeled, marked and is arranged on plate to be fixed on nacelle bottom plate.
3. uniform vapour-pressure type molding press according to claim 1, it is characterised in that：The lifting of the pedestal nacelle cover board fills
It is set to spiral lifting, hydraulic lifting, electric up-down or chain drive.
4. uniform vapour-pressure type molding press according to claim 1, it is characterised in that：The venthole is cylindrical hole or falls
Conical hole.
5. uniform vapour-pressure type molding press according to claim 1, it is characterised in that：The multiple venthole is matrix battle array
Row.
6. uniform vapour-pressure type molding press according to claim 1, it is characterised in that：It is covered at the venthole intensive uniform
Distributing is breathed freely cover net.
7. a kind of method that uniform vapour-pressure type molding press using described in any one of claim 1-6 carries out LED chip pressing mold,
Including：Step 1）The locating clip that one or more flip LED chips to be laminated are modeled, marks and is fixed on nacelle pedestal
On, wherein there is a certain distance between each chip；Step 2）Glued membrane is placed on one or more flip LED chips
For one layer of fluorescence silica gel or including at least the multilayer laminate of one layer of fluorescence silica gel and layer of transparent pellosil；Step 3）Open pedestal
Lifting gear and nacelle cover board lifting gear make pedestal rising and/or nacelle cover board decline, and keep nacelle cover board logical with nacelle pedestal
It crosses sealing element and closes reality completely；Step 4）Nacelle is vacuumized by the exhaust tube on nacelle pedestal；Step 5）Stop pumping, passes through
Aerostatic press presses via the snorkel and venthole of constriction to nacelle, is measured by the baroceptor being arranged on nacelle cover board
Air pressure in nacelle, is pressed, wherein the fluorescence silica gel film or or include at least one layer of fluorescence silica gel and layer of transparent silicon
The multilayer film of the multilayer laminate of glued membrane forms ladder-like at the edge of chip upper surface and chip；Step 6）It is discharged by exhaust tube
Gas in nacelle makes pedestal lifting gear and nacelle cover board lifting gear be restored to former setting position, takes out the LED core of pressing
Piece.
8. according to the method for the LED chip pressing mold in claim 7, it is characterised in that：The pressing fluorescence silica gel presses equal
Property between ± 5 μm ~ ± 0.5 μm, transparent silica gel pressing uniformity between ± 5 μm ~ ± 0.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810655041.2A CN108538988A (en) | 2018-06-23 | 2018-06-23 | A kind of uniform vapour-pressure type molding press and pressing film method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810655041.2A CN108538988A (en) | 2018-06-23 | 2018-06-23 | A kind of uniform vapour-pressure type molding press and pressing film method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108538988A true CN108538988A (en) | 2018-09-14 |
Family
ID=63486823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810655041.2A Pending CN108538988A (en) | 2018-06-23 | 2018-06-23 | A kind of uniform vapour-pressure type molding press and pressing film method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108538988A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110260266A (en) * | 2019-06-27 | 2019-09-20 | 宁波朗德光电有限公司 | A kind of lamps and lanterns and lamps and lanterns seal closure adhesive bonding method |
| CN112750711A (en) * | 2019-10-30 | 2021-05-04 | 梭特科技股份有限公司 | Method and device for mass die bonding |
| CN113459494A (en) * | 2021-06-01 | 2021-10-01 | 范冬利 | Wisdom community related transparent circuit doubling LED ornamental material processing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040108625A1 (en) * | 2002-12-06 | 2004-06-10 | Moder Jerry R. | Pneumatically assisted contour bonding system and formed laminated products produced thereby |
| CN201380981Y (en) * | 2009-02-23 | 2010-01-13 | 阳习云 | Roll paper stacked-side wrapping hot-seal adhesive component |
| CN208637454U (en) * | 2018-06-23 | 2019-03-22 | 江苏罗化新材料有限公司 | A kind of uniform vapour-pressure type molding press |
-
2018
- 2018-06-23 CN CN201810655041.2A patent/CN108538988A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040108625A1 (en) * | 2002-12-06 | 2004-06-10 | Moder Jerry R. | Pneumatically assisted contour bonding system and formed laminated products produced thereby |
| CN201380981Y (en) * | 2009-02-23 | 2010-01-13 | 阳习云 | Roll paper stacked-side wrapping hot-seal adhesive component |
| CN208637454U (en) * | 2018-06-23 | 2019-03-22 | 江苏罗化新材料有限公司 | A kind of uniform vapour-pressure type molding press |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110260266A (en) * | 2019-06-27 | 2019-09-20 | 宁波朗德光电有限公司 | A kind of lamps and lanterns and lamps and lanterns seal closure adhesive bonding method |
| CN112750711A (en) * | 2019-10-30 | 2021-05-04 | 梭特科技股份有限公司 | Method and device for mass die bonding |
| CN112750711B (en) * | 2019-10-30 | 2024-05-17 | 梭特科技股份有限公司 | Method and device for huge amount of die bonding |
| CN113459494A (en) * | 2021-06-01 | 2021-10-01 | 范冬利 | Wisdom community related transparent circuit doubling LED ornamental material processing apparatus |
| CN113459494B (en) * | 2021-06-01 | 2023-11-10 | 深圳市全局照明科技有限公司 | Intelligent community related transparent circuit laminating LED decorative material processing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108538988A (en) | A kind of uniform vapour-pressure type molding press and pressing film method | |
| KR100822944B1 (en) | Resin Sealing and Molding Method of Electronic Component | |
| CN106486026A (en) | A kind of method for packing of COB display module and its display module | |
| CN107968101A (en) | A kind of high definition LED display modular structure and its manufacture method | |
| US20130244358A1 (en) | Method of manufacturing light emitting diode | |
| CN205920952U (en) | Chip paster equipment | |
| CN208637454U (en) | A kind of uniform vapour-pressure type molding press | |
| CN106166887A (en) | Display adhering device | |
| CN106384738A (en) | Micro-LED display device based on imprinting process | |
| US10546980B2 (en) | Process method using thermoplastic resin photoconverter to bond-package LED by rolling | |
| CN102729457B (en) | Artificial diamond blister tray molding equipment | |
| CN205553171U (en) | Water bores that arrange and water bores former of plastic uptake | |
| CN204480614U (en) | A kind of modified LED dot array module | |
| CN201134439Y (en) | LED chip structure for illuminance | |
| CN209000897U (en) | A kind of chip high temperature resistant nozzle unit | |
| CN107346801A (en) | LED integrated encapsulation structures and its method for packing | |
| CN106469778B (en) | A kind of special-shaped organic siliconresin light conversion body fitting encapsulation LED process | |
| TW201344977A (en) | Method for manufacturing LED package | |
| CN206179898U (en) | Chip level white light LED packaging structure | |
| CN102931296B (en) | Packaging fixture component and packaging method for surface mounted device (SMD) light emitting diode (LED) | |
| CN207097855U (en) | A kind of quantum dot LED encapsulation structure | |
| CN206040708U (en) | CSP chip scale package structure | |
| CN106992239B (en) | A kind of LED package element and its manufacturing method based on heterogeneous double light conversion sheets | |
| CN108231972A (en) | A kind of LED chip packaging method | |
| CN202487642U (en) | Packaging fixture assembly of SMD (surface mount device) light emitting diodes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |