CN208045477U - A kind of nano-sized carbon radiates pad pasting without base material - Google Patents
A kind of nano-sized carbon radiates pad pasting without base material Download PDFInfo
- Publication number
- CN208045477U CN208045477U CN201820041637.9U CN201820041637U CN208045477U CN 208045477 U CN208045477 U CN 208045477U CN 201820041637 U CN201820041637 U CN 201820041637U CN 208045477 U CN208045477 U CN 208045477U
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- China
- Prior art keywords
- heat dissipation
- nano
- film layer
- sized carbon
- base material
- Prior art date
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 56
- 239000002105 nanoparticle Substances 0.000 title claims abstract description 55
- 239000000463 material Substances 0.000 title claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 94
- 239000003595 mist Substances 0.000 claims description 8
- 239000004965 Silica aerogel Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- FYIBGDKNYYMMAG-UHFFFAOYSA-N ethane-1,2-diol;terephthalic acid Chemical compound OCCO.OC(=O)C1=CC=C(C(O)=O)C=C1 FYIBGDKNYYMMAG-UHFFFAOYSA-N 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of nano-sized carbons to radiate pad pasting without base material, including heat dissipation film layer, is set to the laminated release layer of the heat dissipation film and is set to the carrying film layer of the heat dissipation film layer another side, and the heat dissipation film layer is nano-sized carbon heat dissipation film layer.The utility model proposes nano-sized carbon not only there are the characteristics such as inviscid, shading, dumb light without base material heat dissipation pad pasting, but also have the characteristics that reduce cost, shorten technique, reduce loss and excellent appearance, with the stronger market competitiveness.
Description
Technical field：
The utility model belongs to heat sink material technical field, and in particular to a kind of nano-sized carbon radiates pad pasting without base material.
Background technology：
The euthermic chip circuit of most of consumer electrical product is hidden in inside casing, in sealing space,
Lack forced convertion heat dissipation, chip is caused to be chronically under high Warm status, shortens electronic product service life.
Graphite flake is widely used in the electronic products such as mobile phone or tablet solving its heat dissipation as equal backing asking now
Topic, can only do heat transfer and can not radiate, expensive but effect is not notable.And graphite flake such as will use be attached to heat generating core
On piece, since itself does not have viscosity, so must first be covered with ultrathin double-face glue just has medium to go to attach other affixed objects, in addition
Graphite flake itself is conductive and leads to the risk of fault in the presence of graphite break flour is fallen, therefore need to be other the one of graphite flake
Wheat of insulating in face paste is drawn to ensure that electric appliance circuits are normal, in summary two kinds of situations its increase the cost of material (ultra-thin pair for a moment
Face glue, insulation wheat are drawn)；The second is material is laminating need to pass through secondary operation, working hour expense necessarily will produce；Thirdly being exactly multiple in material
Spillage of material must be had by closing in process.In summary three kinds of situations will certainly increase many costs, it would be highly desirable to propose a kind of
Heat sinking pad pasting solves problems of the prior art.
Utility model content：
The purpose of this utility model is to provide a kind of nano-sized carbon without base material radiate pad pasting, the utility model proposes nanometer
Carbon belongs to the adhesive film material of no base material, there is gum without base material heat dissipation pad pasting, can be affixed directly to the IC or carrying heat of fever
On the object in source, application method is simple, easy to use.
The purpose of this utility model is to provide a kind of nano-sized carbon and radiates pad pasting without base material, including heat dissipation film layer, is set to institute
The laminated release layer of the heat dissipation film stated and the carrying film layer for being set to the heat dissipation film layer another side, the heat dissipation film layer
For nano-sized carbon heat dissipation film layer.Release layer is release paper or release film.The utility model proposes nano-sized carbon be to utilize more than 3000
DEG C arc process standard carbon nanotubes is made, three-dimensional hollow six face balls (bus chou made of the graphene transformation by plane
Structure), diameter will produce molecule (electronics) spin, other than the basic characteristic with graphite, also have between 10~60nm
The function of heat loss through radiation can be radiated in middle low temperature (35 DEG C~400 DEG C) range with radiation mode, reinforcement conduction originally and strong
The heat dissipation problem that convection current processed cann't be solved.
It is preferred that being provided with heat dissipation film enhancement layer between the release layer and nano-sized carbon heat dissipation film layer.Described
Heat dissipation film enhancement layer is silica aerogel layer, and the thickness of heat dissipation film enhancement layer is 10~30 μm.The material of heat dissipation film enhancement layer is carbon black, charcoal
Black layer helps to reinforce the cooling effect of nano-sized carbon heat dissipation film layer.
It is preferred that the thickness of the nano-sized carbon heat dissipation film layer is 10~50 μm, further, the nano-sized carbon heat dissipation film
The thickness of layer is 10~30 μm.Nano-sized carbon heat dissipation film layer is laminating in release layer by modes such as spraying, roller coating, brushing or dip-coatings
On.
It is preferred that the release layer is release paper or release film；The release layer thickness is 25~100 μm.First,
Release layer has supporting role for containing heat dissipation film layer, since the size dimension of PET release papers or PET release films is controllable,
Therefore also size is controllable for the heat dissipation film layer being set together with it；Secondly, PET release papers or PET release films are for heat dissipation film
Layer has protective effect, avoids heat dissipation film layer edge breakage.In use, stripping release layer, electronics is fitted in by heat dissipation film layer
It is easy to use on device, it is applied widely.
It is preferred that the thickness of the carrying film layer is 25~125 μm.
It is preferred that the carrying film layer is mist film layer or release film, the material of the carrying film layer is selected from PET film and (gathers
Ethylene glycol terephthalate film), one kind in PI films (Kapton) and PC films (polycarbonate membrane).
The utility model proposes nano-sized carbon without base material heat dissipation pad pasting use when：First release film is torn, heat dissipation film plus
Strong layer is attached to affixed object surface, and after pressure sensitive adhesive and affixed object are adjacent to completely (>=30min), carrier film is torn, entire to paste
Examination process is completed, and it is nano-sized carbon heat dissipation film layer to be contacted with air.
The utility model has the beneficial effects that：
1, the utility model proposes nano-sized carbon there is the characteristics such as inviscid, shading, dumb light, carrying without base material heat dissipation pad pasting
When film is mist film, heat dissipation pad pasting has the characteristic of matt.
2, the utility model proposes nano-sized carbon without base material heat dissipation pad pasting have reduce cost, shorten technique, reduce loss
And the features such as excellent appearance, there is the stronger market competitiveness.
3, the utility model belongs to the adhesive film material of no base material, there is gum, can be affixed directly to the IC of fever or hold
On the object in heat-carrying source, application method is simple, easy to use.
4, nano-sized carbon heat dissipation thicknesses of layers is thin, only 10~50 μm, and non-conductive, and it is ultra-thin to be used directly for some
The internal heat dissipating of electronic product (mobile phone or ultrabook).
Description of the drawings：
Fig. 1 is structural schematic diagram of the utility model nano-sized carbon without base material heat dissipation pad pasting；
Reference sign：1, heat dissipation film enhancement layer；2, release layer；3, film layer is carried；4, nano-sized carbon heat dissipation film layer.
Specific implementation mode：
Following embodiment is the further explanation to the utility model, rather than limitations of the present invention.
Embodiment：
As shown in Figure 1：A kind of nano-sized carbon radiates pad pasting without base material, including heat dissipation film layer, to be set to heat dissipation film laminated
Release layer 2 and the carrying film layer 3 for being set to heat dissipation film layer another side are provided with scattered between release layer 2 and nano-sized carbon heat dissipation film layer 4
The thickness of hotting mask enhancement layer 1, heat dissipation film enhancement layer 1 is 10~30 μm.The material of heat dissipation film enhancement layer 1 is carbon black, and silica aerogel layer has
Help reinforce the cooling effect of heat dissipation film.The film layer that radiates is nano-sized carbon heat dissipation film layer 4.The utility model proposes nano-sized carbon be to adopt
It is made of more than 3000 DEG C arc process standard carbon nanotubes, three-dimensional hollow six face ball made of the graphene transformation by plane
(bus spherical structure), diameter between 10~60nm, will produce molecule (electronics) spin, in addition to the basic characteristic with graphite it
Outside, also have the function of heat loss through radiation, can be radiated with radiation mode in middle low temperature (35 DEG C~400 DEG C) range, reinforcement is originally
The heat dissipation problem that conduction and forced convertion cann't be solved, therefore, heat dissipation effect are better than graphite flake.
Nano-sized carbon as shown in Figure 1 is disposed with carrying film layer 3, nano-sized carbon from top to bottom without base material heat dissipation pad pasting
Radiate film layer 4, heat dissipation film enhancement layer 1 and release layer 2, realizes the nano-sized carbon without base material heat dissipation pad pasting one side toughness (release layer
2), on one side inviscid (carrying film layer 3), meet actual heat dissipation needs.
It can be mist film layer or release film to carry film layer 3, and mist film layer has photoextinction, when mist film layer is as carrying film layer
When, nano-sized carbon will not be reflective without base material heat dissipation pad pasting, and when release film is as carrying film layer, nano-sized carbon is easily anti-without base material heat dissipation pad pasting
Therefore light to avoid light reflection, influences the use of other component, the present embodiment carrying film layer 3 is preferential to select mist film layer as holding
Film carrier layer.
The thickness of carrying film layer 3 can do appropriate adjusting according to actual needs, in the present embodiment, carry the thickness of film layer 3
It is 25~125 μm.When it is mist film layer to carry film layer 3, nano-sized carbon has the characteristic of dumb light, carrier film choosing without base material heat dissipation pad pasting
One kind from PET film (polyethylene terephthalate film), PI films (Kapton) and PC films (polycarbonate membrane).
The thickness of nano-sized carbon heat dissipation film layer 4 or area those skilled in the art can suitably be adjusted according to the actual needs, be received
The thickness of rice carbon heat dissipation film layer 4 is 10~50 μm；In the present embodiment, the thickness of preferably nano-sized carbon heat dissipation film layer 4 is 10~20 μ
m.Nano-sized carbon heat dissipation film layer 4 is laminating on release layer 2 by modes such as spraying, roller coating, brushing or dip-coatings.Nano-sized carbon heat dissipation film layer
4 thickness are thin, only 10~50 μm, and non-conductive, and being used directly for some ultra-thin electronic products, (mobile phone is super
Originally internal heat dissipating).
Release layer 2 is release paper or release film；2 thickness of release layer is 25~100 μm, in the present embodiment release layer 2
Preferably PET release films.First, release layer 2 has supporting role for containing heat dissipation film layer, due to the size of PET release films
Size is controllable, therefore also size is controllable for the heat dissipation film layer being set together with it；Secondly, PET release films are for heat dissipation film layer tool
There is protective effect, avoids heat dissipation film layer edge breakage.In use, stripping release layer 2, electricity is fitted in by heat dissipation film enhancement layer 1
Easy to use on sub- device, applied widely, 3 plane materiel of carrying film layer being connected with nano-sized carbon heat dissipation film layer has very
Degree, it is ensured that heat dissipation pad pasting will not deform in the case of very soft, very thin.
The utility model proposes nano-sized carbon there are the characteristics such as inviscid, shading and dumb light without base material heat dissipation pad pasting.
The utility model proposes nano-sized carbon without base material heat dissipation pad pasting use when：First release layer 2 is torn, heat dissipation film is reinforced
Layer 1 is attached to affixed object surface, and after being adjacent to completely with affixed object (>=30min), carrying film layer 3 is torn, and entire patch was tried
Journey is completed, and it is nano-sized carbon heat dissipation foil layer 4 to be contacted with air.
Nano-sized carbon provided by the utility model is described in detail without base material heat dissipation pad pasting above, above example
Explanation be merely used to help understand the technical solution of the utility model and its core concept, it is noted that for this technology lead
For the technical staff in domain, without departing from the principle of this utility model, several change can also be carried out to the utility model
Into and modification, modifications and modifications also fall within the protection scope of the claims of the utility model.
Claims (10)
1. a kind of nano-sized carbon is without base material heat dissipation pad pasting, it is characterised in that：Including heat dissipation film layer, it is set to the heat dissipation film layer one
The release layer in face and the carrying film layer for being set to the heat dissipation film layer another side, the heat dissipation film layer are nano-sized carbon heat dissipation film
Layer.
2. nano-sized carbon according to claim 1 is without base material heat dissipation pad pasting, it is characterised in that：The release layer and described
It is provided with heat dissipation film enhancement layer between nano-sized carbon heat dissipation film layer.
3. nano-sized carbon according to claim 2 is without base material heat dissipation pad pasting, it is characterised in that：The heat dissipation film enhancement layer is
Silica aerogel layer.
4. nano-sized carbon according to claim 2 is without base material heat dissipation pad pasting, it is characterised in that：The heat dissipation film enhancement layer
Thickness is 10~30 μm.
5. nano-sized carbon according to claim 1 or 2 is without base material heat dissipation pad pasting, it is characterised in that：The nano-sized carbon heat dissipation
The thickness of film layer is 10~50 μm.
6. nano-sized carbon according to claim 5 is without base material heat dissipation pad pasting, it is characterised in that：The nano-sized carbon heat dissipation film layer
Thickness be 10~30 μm.
7. nano-sized carbon according to claim 1 or 2 is without base material heat dissipation pad pasting, it is characterised in that：The release layer be from
Type paper or release film.
8. nano-sized carbon according to claim 1 or 2 is without base material heat dissipation pad pasting, it is characterised in that：The release layer thickness
It is 25~100 μm.
9. nano-sized carbon according to claim 1 or 2 is without base material heat dissipation pad pasting, it is characterised in that：The carrying film layer
Thickness is 25~125 μm.
10. nano-sized carbon according to claim 1 is without base material heat dissipation pad pasting, it is characterised in that：The carrying film layer is mist
Film layer or release film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820041637.9U CN208045477U (en) | 2018-01-10 | 2018-01-10 | A kind of nano-sized carbon radiates pad pasting without base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820041637.9U CN208045477U (en) | 2018-01-10 | 2018-01-10 | A kind of nano-sized carbon radiates pad pasting without base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208045477U true CN208045477U (en) | 2018-11-02 |
Family
ID=63956966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820041637.9U Expired - Fee Related CN208045477U (en) | 2018-01-10 | 2018-01-10 | A kind of nano-sized carbon radiates pad pasting without base material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208045477U (en) |
-
2018
- 2018-01-10 CN CN201820041637.9U patent/CN208045477U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518100 Houting Zhanqi Industrial Zone, Shajing Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Zhong Hanting Address before: 518100 Houhengzhanqi Industrial Zone, Shajing Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: Zhong Hanting |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181102 |