CN202750382U - Graphene composite heat-radiation membrane - Google Patents
Graphene composite heat-radiation membrane Download PDFInfo
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- CN202750382U CN202750382U CN 201120481949 CN201120481949U CN202750382U CN 202750382 U CN202750382 U CN 202750382U CN 201120481949 CN201120481949 CN 201120481949 CN 201120481949 U CN201120481949 U CN 201120481949U CN 202750382 U CN202750382 U CN 202750382U
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Abstract
The utility model discloses a graphene composite heat-radiation membrane which is composed of a graphene layer (1), a bonding layer (2) and a protective layer (3). The graphene composite heat-radiation membrane is characterized in that the bonding layer is laid on the surface of the graphene layer. The graphene composite heat-radiation membrane of the utility model is a cheap heat-radiation membrane suitable for large scale production, adapts to severe heat-radiation requirements of novel ultrathin electronic terminal equipment and can be extensively used in equipment with a small space and high heat-radiation demands, e.g., smartphones, tablet PCs, notebook computers, etc.
Description
Technical field
The utility model relates to a kind of radiator, and especially a kind of have the extra-thin Graphene composite radiating of a high heat conduction film.
Background technology
Along with the electronic device microminiaturization develops rapidly, what especially highlight is that components and parts on the electronic circuit board are day by day intensive, so that the electronic product surface temperature is also raising, the thermal management of electronic product becomes product design and gets important topic.Along with the appearance of large-screen touch-control electronic equipment, consumption electronic product also begins brand-new design direction, smaller szie, thinner design is popular all the more.3G, 4G cell phone, panel computer, e-book, notebook computer etc., the intensive components and parts of this class of electronic devices bring the quick rising of product internal temperature, and components and parts also could move reliably in the urgent need to the environment of a relative low temperature, and this is the problem that cooling system need face solution.
Fan radiating system in the electronic product has no longer adapted to the design space of ultra-thin panel, so then needs to have a kind of new radiator product as an alternative.The Graphene heat dissipation film can evenly be delivered to heat in the surrounding environment, simultaneously can also guarantee that the electronic product casing temperature is in user's acceptable degree, the raising user's of peak efficiency comfort level, and, also reached and avoided the product different parts to have the excessive temperature difference.The natural graphite material and the artificial-synthetic stone's ink material that have used have at present had certain improvement.But, because material self restriction, the heat conduction of natural graphite material plane is lower than 600W/mk, thickness is difficult to be lower than 0.05mm, be difficult to use the demanding electronic equipment of some high power radiations, artificial-synthetic stone's China ink size has larger restriction, is difficult to be applied to size and surpasses on the electronic equipment of 30cmX30cm size.
Along with the development of making rapid progress of electronic product, need the functional heat sink material of excellent performance, we develop new composite material for the heat dissipation problem of the small space that solves electronic product, start new thermal management technology route.We have selected the heat conduction carbon fiber, CNT (carbon nano-tube), fullerene, Graphene, the high thermal conductivities such as diamond film, especially the highly-conductive hot carbon fiber is along axially having the highest 1200W/mk thermal conductivity, the high thermal conductivity coefficient 2200w/mk of diamond film, height lead Graphene along the anisotropic highly-conductive hot carbon fibre knitting cloth of the preferred thermal conductivity of the highest 3000-5600W/mk thermal conductivity of in-plane or, the application of thermal fiber composite material or big size graphene or Graphene high-heat-conductive composite material will be the trend of following electronic product thermal management development.
Graphene (Graphene), the planar structure of the hexangle type honeycomb lattice that basically is comprised of with the sp2 orbital mono-layer graphite (carbon atom) is a kind of two-dimensional material that is comprised of a carbon atom thickness.The two-dimensional structure of Graphene, be considered to the separately hypothetical structure of stable existence always, until 2004, the physicist An Deliehaimu of Univ Manchester UK (University of Manchester) (Andre Konstantin Geim) and Constantine Nuo Woxiaoluofu (Konstantin " Kostya " Novoselov), successfully from graphite, isolate Graphene, and confirming the fact that Graphene can individualism, this two people also thereby jointly obtains Nobel Prize in physics in 2010.Graphene be at present in the world the thinnest, also be the hardest nano material, only absorb 2.3% light, can say it almost is transparent; Simultaneously conductive coefficient is higher than nano carbon tubes and diamond up to 5300W/mK, and the electron mobility under the normal temperature just can surpass 15000cm2/Vs, and resistivity about 10-6 Ω cm only is the material of present world resistivity minimum.
The utility model content
The technical problems to be solved in the utility model is to adjust consumption and the conjugation of Graphene, has overcome the attenuating that has caused heat conductivility in the graphene composite material because of incomplete structure between graphene layer, the high conductive graphite alkene of development of new composite radiating film.
A kind of Graphene composite radiating film is comprised of graphene layer (1), adhesive layer (2) and protective layer (3), it is characterized in that described graphene layer surface laid adhesive layer.
Further, the preferred thickness of described graphene layer (1) is 1.82nm.
Further, described adhesive layer (2) is pressure sensitive adhesive or PUR.
Further, described protective layer (3) is resin molding or metal film.
The beneficial effect that adopts technique scheme to produce is: a kind of low price is provided, is fit to the ultra-thin Graphene composite radiating of the high heat conduction film of large-scale production, adapt to the heat radiation requirement of novel super-thin electronic terminal equipment harshness.
Description of drawings
Fig. 1 is structural representation described in the utility model, and wherein: (1) is graphene layer, and (2) are adhesive layer, and (3) are protective layer
Embodiment
Realization of the present utility model has various ways, and following preference is better understood technology contents described in the utility model for the public, rather than to the restriction of described technology contents.In fact, the increase and decrease to any element of doing in not violating invention Spirit Essence described in the utility model, replacement and improvement are all within the utility model technical scheme required for protection.
Embodiment 1:
Adopt the 0.018mm Copper Foil as supporting layer, adopt CVD method deposition Graphene to copper foil surface control carbon-source gas content deposition graphene layer 0.007mm, be prepared into the graphene film with the copper supporting layer, at Graphene surface applying adhesive layer, adhesive layer adopts two-sided tape 0.005mm thickness, can buy Nitto 5600 two-sided tapes, thickness 0.005mm from NITTO company.The Graphene heat dissipation film gross thickness 0.03mm for preparing has ultra-thin thickness, good heat conduction hot property.The graphene layer thermal conductivity can reach 1000W/mk, has good machinability.
Can reach continuous copper foil by improvement CVD equipment and enter CVD deposition Graphene, form the package material, be convenient to large-scale mass production.
Embodiment 2:
Adopt the 0.018mm Copper Foil as supporting layer, adopt the synthetic 0.01mm of the generation China ink of CVD method alkene film on copper layer surface, thermal spraying mylar 0.005 alkene surface obtains copper, Graphene, resin compounded film 0.01mm thickness, erosion removal 0.018mm copper layer obtains the graphene layer 0.015mm of resin supporting layer, behind the applying 0.01mm adhesive layer, obtain 0.025mm Graphene heat dissipation film, graphene layer coefficient of heat conduction 1000W/mk
Embodiment 3:
The strong adhesive tape of single face that adopts adopts the standby Graphene of tape stripping legal system as supporting layer.The following employing thermal decomposition of implementation graphite TPG originates as Graphene, thermal decomposition graphite can be bought from General Electric Company, first pyrolytic graphite is fixed in the plane, the strong adhesive tape of applying single face, adhesive tape can adopt DAINIPPON INK ANDCHEMICALS company to buy LS-025H single face adhesive tape, thickness 0.05mm.Surperficial in pyrolytic graphite LS-025H single face adhesive tape gluing, after evenly exerting pressure with rubber roll, use Flat pressure machine to apply 300PSI pressure, and keep pressure state after 8 hours, then peel off the LS-025H adhesive tape by 180 ° and use dull and stereotyped press equipment to resulting single face adhesive tape and graphene complex, the control Graphene is 0.005mm～0.015mm.Make final Graphene and supporting layer gross thickness be stabilized in 0.06mm, applying Nitto 5601 adhesive tapes are combined into thickness 0.07mm Graphene heat dissipation film, graphene layer conductive coefficient 1750W/mk.
Graphene heat dissipation film cooling-down effect of the present invention is obvious, and can adopt industrialization production method significantly to reduce cost, and automated production can be widely used in going in the high radiating requirements equipment in little space such as smart mobile phone, panel computer, notebook computer.
Claims (4)
1. a Graphene composite radiating film is comprised of graphene layer (1), adhesive layer (2) and protective layer (3), it is characterized in that described graphene layer surface laid adhesive layer.
2. Graphene composite radiating film according to claim 1, the preferred thickness that it is characterized in that described graphene layer (1) is 1.82nm.
3. Graphene composite radiating film according to claim 1 is characterized in that described adhesive layer (2) is pressure sensitive adhesive or PUR.
4. Graphene composite radiating film according to claim 1 is characterized in that described protective layer (3) is resin molding or metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120481949 CN202750382U (en) | 2011-11-25 | 2011-11-25 | Graphene composite heat-radiation membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120481949 CN202750382U (en) | 2011-11-25 | 2011-11-25 | Graphene composite heat-radiation membrane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202750382U true CN202750382U (en) | 2013-02-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120481949 Expired - Fee Related CN202750382U (en) | 2011-11-25 | 2011-11-25 | Graphene composite heat-radiation membrane |
Country Status (1)
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| CN (1) | CN202750382U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103407268A (en) * | 2013-07-17 | 2013-11-27 | 苏州艾特斯环保材料有限公司 | Graphene-containing composite heat conduction film preparation method |
| CN105554189A (en) * | 2015-12-28 | 2016-05-04 | 东莞市青麦田数码科技有限公司 | Preparation method of heat radiating film of mobile phone rear cover |
| CN105592185A (en) * | 2015-12-28 | 2016-05-18 | 东莞市青麦田数码科技有限公司 | Method for preparing heat radiation film of cellphone rear cover |
| CN106113731A (en) * | 2016-06-23 | 2016-11-16 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
| CN106765472A (en) * | 2016-12-26 | 2017-05-31 | 杭州经世科技有限公司 | A kind of distributed solar energy warmer of the brilliant doping of graphene carbon |
-
2011
- 2011-11-25 CN CN 201120481949 patent/CN202750382U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103407268A (en) * | 2013-07-17 | 2013-11-27 | 苏州艾特斯环保材料有限公司 | Graphene-containing composite heat conduction film preparation method |
| CN105554189A (en) * | 2015-12-28 | 2016-05-04 | 东莞市青麦田数码科技有限公司 | Preparation method of heat radiating film of mobile phone rear cover |
| CN105592185A (en) * | 2015-12-28 | 2016-05-18 | 东莞市青麦田数码科技有限公司 | Method for preparing heat radiation film of cellphone rear cover |
| CN105554189B (en) * | 2015-12-28 | 2018-10-26 | 东莞市广信知识产权服务有限公司 | A kind of preparation method of cell phone rear cover heat dissipation film |
| CN106113731A (en) * | 2016-06-23 | 2016-11-16 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
| CN106765472A (en) * | 2016-12-26 | 2017-05-31 | 杭州经世科技有限公司 | A kind of distributed solar energy warmer of the brilliant doping of graphene carbon |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180611 Address after: 551700 D8 standard building, Bijie Economic Development Zone, Bijie, Guizhou. Patentee after: Guizhou Zhong Li Li Technology Co., Ltd. Address before: 518000 east 4, Bantian street and Hun Road, Longgang District, Shenzhen, Guangdong, 4 Patentee before: Shenzhen Ainuo Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191227 Address after: 341600 opposite the north gate of Nongfu mountain spring, Navel Orange Avenue, Chengbei Avenue, Xinfeng County, Ganzhou City, Jiangxi Province Patentee after: Jiangxi Xiwang New Material Co., Ltd Address before: 551700 D8 standard building, Bijie Economic Development Zone, Bijie, Guizhou. Patentee before: Guizhou Zhong Li Li Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 Termination date: 20201125 |
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| CF01 | Termination of patent right due to non-payment of annual fee |